CN109141531B - Monitoring device and method for installing monitoring device - Google Patents
Monitoring device and method for installing monitoring device Download PDFInfo
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- CN109141531B CN109141531B CN201811150973.8A CN201811150973A CN109141531B CN 109141531 B CN109141531 B CN 109141531B CN 201811150973 A CN201811150973 A CN 201811150973A CN 109141531 B CN109141531 B CN 109141531B
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- 238000012806 monitoring device Methods 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000523 sample Substances 0.000 claims abstract description 48
- 238000012544 monitoring process Methods 0.000 claims abstract description 22
- 230000000149 penetrating effect Effects 0.000 claims abstract description 6
- 238000012360 testing method Methods 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 238000009529 body temperature measurement Methods 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000007849 functional defect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
Abstract
The invention discloses a monitoring device, which is used for monitoring tested equipment and comprises: the mounting seat is internally provided with a connecting hole in a penetrating way; the shell is positioned at the upper end of the mounting seat, and a connecting groove facing the connecting hole is formed in the shell; and the first end of the temperature measuring probe is fixedly connected with the connecting groove, and the second end of the temperature measuring probe extends through the connecting hole and then abuts against the tested equipment. In addition, the invention also discloses a method for installing the monitoring device. The monitoring device provided by the invention has the advantages that the measured temperature data is more accurate and the timeliness is stronger.
Description
Technical Field
The invention relates to the technical field of on-line monitoring of mechanical equipment, in particular to a monitoring device.
Background
In industrial fields, on-line monitoring sensors are often arranged for key mechanical equipment so as to monitor the running state of the equipment at all times and perform predictive maintenance, thereby preventing major potential safety hazards or production stoppage accidents of the equipment. Among them, sensors having a complex function, such as vibration plus temperature measurement sensors, play an important role in device monitoring. The sensor integrates acceleration vibration and temperature measurement, and has high requirements on compact volume, overall reliability, environmental adaptability and the like. Since these sensors themselves also require periodic maintenance or calibration, it is desirable to have a structure that is easy to disassemble.
However, the mounting manner and mounting position of the sensor may vary depending on different devices to be tested, which are subject to complicated devices to be tested on site. In the process of designing and manufacturing the tested equipment, the installation position of the sensor is often not reserved in advance, and in addition, the operation of electric welding, mechanical drilling and the like on the important equipment is not allowed on site. Therefore, in view of the above factors, a mounting seat is usually fixed on the tested device through an adhesive, and then the sensor shell and the mounting seat are rigidly fixed through bolts, so that the sensor can be conveniently disassembled and replaced.
However, in the existing sensor connected to the mounting base, the temperature sensitive element is usually installed in the sensor housing, so that the heat energy on the surface of the device needs to pass through the adhesive, the whole mounting base and the housing of the sensor to be transferred to the temperature sensitive element in the housing, and then to the rest of the sensor and the environment. Therefore, heat energy passes through triple thermal resistance of three components before being transmitted to the temperature sensitive element, and each component has certain heat energy dissipation to the environment, so that on one hand, a relatively large temperature gradient and poor temperature response characteristics can be caused, and on the other hand, the heat energy is influenced by the ambient temperature, so that the accuracy and the sensitivity of equipment temperature monitoring are poor.
The temperature sensitive element is arranged outside the shell of the sensor and is in contact with tested equipment, so that a wire or a connector is required to be connected between the temperature sensitive element and the sensor, waterproof measures are required, the mechanical strength of the temperature sensitive element is poor, and further protection is required, so that the whole structure is relatively complex, the cost is high, and the maintenance is inconvenient.
Disclosure of Invention
To this end, the present invention provides a temperature probe to solve or at least alleviate the above-mentioned problems.
According to an aspect of the present invention, there is provided a monitoring apparatus for monitoring a device under test, comprising: the mounting seat is internally provided with a connecting hole in a penetrating way; the shell is positioned at the upper end of the mounting seat, and a connecting groove facing the connecting hole is formed in the shell; and the first end of the temperature measuring probe is fixedly connected with the connecting groove, and the second end of the temperature measuring probe extends through the connecting hole and then abuts against the tested equipment.
Optionally, in the monitoring device according to the present invention, the temperature probe includes: the first end of the hollow rod is fixedly connected with the connecting groove, and the second end of the hollow rod is fixedly connected with the connecting hole; the elastic piece is elastically propped between the lower end of the hollow rod and the tested equipment; and a temperature sensitive element arranged on the inner wall of the elastic piece.
Optionally, in the monitoring device according to the present invention, the hollow rod is a hollow screw, and the inner walls of the connecting hole and the connecting groove are provided with internal threads; the first end of the hollow screw rod is in threaded connection with the connecting groove, and the second end of the hollow screw rod is in threaded connection with the connecting hole.
Optionally, in the monitoring device according to the present invention, the elastic member includes a bottom plate, and the bottom plate abuts against the device under test; the temperature sensitive element is fixed on the bottom plate.
Optionally, in the monitoring device according to the present invention, the elastic member is ring-shaped, and an outer diameter of the elastic member is smaller than an inner diameter of the connection hole.
Optionally, in the monitoring device according to the present invention, the elastic member is a drum-shaped elastic ring.
Optionally, in the monitoring device according to the present invention, the elastic member is a metal bellows.
Optionally, in the monitoring device according to the present invention, the elastic member is welded to the lower end of the hollow rod.
Optionally, in the monitoring device according to the present invention, a limiting boss is protruding on an outer wall of the hollow screw, a limiting groove is provided at a junction of the housing and the mounting seat, and the limiting boss is clamped in the limiting groove.
Optionally, in the monitoring device according to the present invention, the first end of the hollow screw is provided with a linear groove that facilitates screwing into the connecting groove.
Optionally, in the monitoring device according to the invention, a second sensor is mounted inside the housing.
Optionally, in the monitoring device according to the present invention, the second sensor is a vibration sensor.
Optionally, in the monitoring device according to the present invention, the mounting base is fixed to the surface of the device under test by an adhesive layer; and a permanent magnet is arranged in the mounting seat.
According to yet another aspect of the present invention, there is also provided a method of installing a monitoring device, comprising the steps of:
s1: fixing the mounting seat on the surface of the tested equipment;
s2: fixedly connecting a first end of the temperature measurement probe with the shell so that the temperature measurement probe is fixedly arranged on the shell; and
s3: and fixedly connecting the second end of the temperature measuring probe with the mounting seat so that the shell connected with the temperature measuring probe is fixed on the mounting seat, and the second end extends to penetrate through the mounting seat and props against the tested equipment.
Optionally, in the method for installing the monitoring device according to the present invention, a connection hole is formed in the installation seat in a penetrating manner, and a connection groove facing the connection hole is formed in the housing; the first end of the temperature measuring probe is in threaded connection with the connecting groove, and the second end of the temperature measuring probe is in threaded connection with the connecting hole.
Optionally, in the method for installing the monitoring device according to the invention, the mounting seat is fixed on the surface of the tested device through glue application, and a glue layer is formed between the mounting seat and the surface of the tested device.
According to the technical scheme of the invention, the monitoring device comprises a shell, an installation seat and a temperature measuring probe, wherein the shell is fixedly connected with the installation seat through the temperature measuring probe, and the temperature measuring probe extends from the lower end of the shell to the position, which passes through the installation seat, and then is abutted against tested equipment, so that heat dissipation of heat in the installation seat is reduced. The temperature measuring probe comprises a hollow screw rod, an elastic piece elastically propped between the hollow screw rod and the tested equipment, and a temperature sensitive element tightly clung to the inner side of a bottom plate of the elastic piece, wherein the bottom plate of the elastic piece can tightly prop against the tested equipment, so that the thermal resistance between the tested equipment and the temperature sensitive element can be reduced to the greatest extent, and the heat dissipation is reduced, thereby the monitoring device of the invention monitors the temperature more accurately and has higher response speed. In addition, the monitoring device is stable in structure and convenient to install and maintain.
The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present invention more readily apparent.
Drawings
To the accomplishment of the foregoing and related ends, certain illustrative aspects are described herein in connection with the following description and the annexed drawings, which set forth the various ways in which the principles disclosed herein may be practiced, and all aspects and equivalents thereof are intended to fall within the scope of the claimed subject matter. The above, as well as additional objects, features, and advantages of the present disclosure will become more apparent from the following detailed description when read in conjunction with the accompanying drawings. Like reference numerals generally refer to like parts or elements throughout the present disclosure.
FIG. 1 shows a schematic structural diagram of a monitoring device according to one embodiment of the present invention;
fig. 2 shows a schematic structural diagram of a monitoring device according to a further embodiment of the invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As mentioned above, the monitoring sensor for monitoring equipment in the prior art has more or less certain functional defects during use, so the present invention proposes a monitoring device 100 for monitoring equipment with more optimized performance. Fig. 1 and 2 show schematic structural diagrams of a monitoring device 100, respectively, the monitoring device 100 being adapted to be mounted on a surface of a device 300 under test. The monitoring apparatus 100 includes a temperature probe 150 for monitoring the temperature of the device under test, and a second sensor 160 may be mounted within the monitoring apparatus 100 to synchronize other performance of the monitoring device while monitoring the temperature of the device. According to one embodiment, the second sensor 160 may be a vibration sensor, so that the acceleration of the device under test can be monitored by the vibration sensor, so that the monitoring apparatus 100 can monitor the temperature and the acceleration of the device under test at the same time. However, the present invention is not limited to the specific type of second sensing element 160, but may be a sensing element for monitoring other performance of the device, which is not shown here.
According to one embodiment, as shown in FIG. 1, the monitoring device 100 of the present invention includes a housing 110 for mounting a sensor, a mount 120, and a temperature probe 150. The mounting base 120 is used for mounting the housing 110 with the sensor mounted on the device 300 to be tested, the mounting base 120 is fixed on the surface of the device to be tested, the housing 110 is arranged at the upper end of the mounting base 120, and the housing 110 is fixedly connected with the mounting base 120 through the temperature measuring probe 150. The temperature probe 150 extends downward from the inside of the housing 110 to the inside of the mounting seat 120 for fixing, and the lower end of the temperature probe 150 extends to pass through the mounting seat 120, so that the temperature probe 150 can directly contact with the surface of the device under test, and more heat dissipation on the mounting seat 120 is avoided because heat is not required to be transferred through the mounting seat 120, so that the temperature probe 150 can monitor the temperature of the device under test 300 more accurately and sensitively.
Specifically, as shown in fig. 1, a connection hole 125 is formed through the center of the mounting base 120, and a connection groove 115 facing the connection hole 125 is formed at the lower end of the housing 110. The first end of the temperature probe 150 is fixedly connected with the connecting groove 115 of the housing 110, and the second end extends to the position where the second end abuts against the tested device 300 after passing through the connecting hole 125 of the mounting seat 120.
Further, the temperature probe 150 includes a hollow shaft 155 and a temperature sensing element 151 at a lower end of the hollow shaft 155, wherein a first end of the hollow shaft 155 is fixedly connected with the connection groove 115, and a second end of the hollow shaft 155 is fixedly connected with the connection hole 125. Preferably, the hollow shaft 155 is a hollow screw, the inner walls of the connecting groove 115 and the threaded hole 125 are provided with internal threads matched with external threads of the hollow screw, after the first end of the hollow screw 155 is in threaded connection with the connecting groove 115, the second end of the hollow screw 155 is in threaded connection with the connecting hole 125, so that the shell 110 can be stably and fixedly connected with the mounting seat 120 through the hollow screw 155, and the loss of vibration in the process of being transmitted to the shell 110 by the mounting seat 120 is avoided as much as possible, and the shell is convenient to detach in a threaded connection mode. In addition, by disposing the temperature sensing element 151 at the bottom surface of the interior of the hollow screw 155, the signal line of the temperature sensing element 151 is directly threaded into the housing 110 of the sensor to be coupled with the controller, thereby reducing thermal resistance during heat transfer from the device 300 under test to the temperature sensing element 151 as much as possible, and reducing heat dissipation. It can be seen that by the above arrangement, the loss of heat transfer and vibration transfer during monitoring of the device under test can be minimized, thereby enabling the monitoring apparatus 100 to monitor the temperature and acceleration of the device more accurately and sensitively.
In addition, as shown in fig. 1, a limiting boss 156 is convexly arranged on the outer wall of the hollow screw 155, a limiting groove suitable for being matched with the limiting boss 156 is arranged at the joint of the housing 110 and the mounting seat 120, and after the hollow screw 155 is respectively in threaded connection with the connecting groove 115 of the housing and the connecting hole 125 of the mounting seat, the limiting boss 156 is clamped with a stop in the limiting groove, so that the limiting protection effect can be achieved, and the situation that the temperature measuring probe 150 cannot be in close contact with tested equipment due to upward movement of the hollow screw 155 is avoided. The first end of the hollow screw 155 is further provided with a straight groove, and the hollow screw 155 is more conveniently screwed into the connecting groove 115 of the shell to be in threaded connection with the connecting groove by arranging the straight groove.
According to one embodiment, as shown in fig. 1 and 2, the temperature probe 150 further includes an elastic member 152, and the elastic member 152 is a hollow structure. The elastic member 152 elastically abuts against between the lower end of the hollow screw 155 and the tested device 300, wherein the upper end of the elastic member 152 is fixed at the lower end of the hollow screw 155 by welding, and the lower end of the elastic member 152 is provided with a bottom plate. The temperature sensing element 151 is disposed in the cavity of the elastic element 152 and is tightly attached to the bottom plate in the elastic element 152, so that the temperature sensing element 151 is sealed on the elastic element 152, and the elastic element 152 can play a certain role in protecting the temperature sensing element 151. It can be understood that, after the casing 110 is fixed on the mounting seat 120 by the threaded connection of the hollow screw 155 with the connection groove 115 of the casing 110 and the connection hole 125 of the mounting seat 120, the elastic member 152 generates elastic restoring force to the hollow screw 155 and the tested device 300 due to elastic deformation under the pressure action of the hollow screw 155 and the casing 110, so that the bottom plate at the lower end of the elastic member 152 can be tightly propped against the surface of the tested device 300 all the time, thereby avoiding heat dissipation caused by the gap with unsound adhesion.
The above arrangement allows the heat of the device under test to be transferred to the temperature sensitive element 151 only through the bottom plate of the elastic member 152, and the thickness of the bottom plate is less than 1mm, so that the thermal resistance between the heat transferred from the device under test 300 to the temperature sensitive element 151 can be reduced to the greatest extent; in addition, since the heat from the temperature sensing element 151 to the housing 110 needs to pass through the elastic member 152 and the hollow screw 155, and the elastic member 152 and the hollow screw 155 are hollow structures, the heat resistance of the heat from the temperature sensing element 151 to the housing 110 is large, so that the heat transferred into the housing 110 is very small, the relative equilibrium temperature deviation of the temperature sensing element 151 is small, and the temperature monitoring precision of the monitoring device 100 to the tested device 300 is higher and the response is faster.
Alternatively, the elastic member 152 is ring-shaped, and the outer diameter of the elastic member 152 is smaller than the inner diameter of the connection hole 125. In this way, when the elastic member 152 is deformed under pressure, enough space is provided in the connecting hole 125 of the mounting seat 120 to bear the deformation of the elastic member 152, so that the elastic member 152 has enough elastic restoring force and can stably prop against between the hollow screw 155 and the tested device 300, and the bottom plate pasted with the temperature sensitive element 151 can always tightly prop against the tested device 300.
In one embodiment, as shown in FIG. 1, the elastic member 152 is an elastic ring having a drum shape with compression elasticity. It will be appreciated that the maximum outer diameter of the elastic ring is located at the middle portion thereof, and the maximum outer diameter of the elastic ring is smaller than the inner diameter of the connection hole 125.
In yet another embodiment, as shown in FIG. 2, the elastic member 152 is a metal bellows having both compressive elasticity and tensile elasticity.
According to one embodiment, the mounting base 120 is adhered and fixed on the surface of the tested device 300 through an adhesive, however, a certain pressure is required to be applied to the mounting base 120 to enable the mounting base 120 to be completely fixed with the tested device 300 before the adhesive is not completely cured to reach a preset adhesive strength, so that the permanent magnet 124 is embedded in the mounting base 120, and the pressure is applied to the mounting base 120 through the magnetic force of the permanent magnet 124, so that the adhesive is cured to form the adhesive layer 123, and the mounting base 120 and the surface of the tested device 300 are fixed through the adhesive layer 123. The housing 110 is then fixedly mounted on the mount 120 by the hollow screw 155, thereby effecting the fixing of the entire monitoring device 100 to the surface of the device 300 under test. Here, the adhesive layer 123 stably fixes the mount 120 on the device 300 under test and makes seamless contact with the device 300 under test.
Specifically, the thickness of the adhesive layer 123 below the mounting seat 120 is about 0.05mm, but since the permanent magnet 124 is also installed in the mounting seat 120, the adhesive layer 123 will be subjected to the pressure exerted by the permanent magnet 124 during the construction process, so that the thickness of the adhesive layer 123 will be less than 0.05mm, and the thickness of the adhesive layer 123 is set to be D, and then 0 < D is less than or equal to 0.05mm. The thermal resistance of the adhesive layer 123 is very small, so that the influence of the adhesive layer 123 on the temperature measurement of the temperature sensitive element 151 is also very small and can be ignored.
It should be noted that the temperature probe 150 has adjustability in length, and the length of the entire temperature probe 150 can be increased by increasing the length of the hollow screw 155. In a specific implementation process, the surface of the tested device 300 can be perforated, so that by properly increasing the length of the hollow screw 155, the temperature probe 150 continues to extend downwards into the hole extending into the tested device 300 after passing through the mounting seat 120, and the temperature sensitive element 151 of the temperature probe 150 is closer to a heat source, so that the monitoring of the temperature change of the key part of the tested device 300 is more accurate.
According to yet another aspect of the present invention, there is also provided a method of installing the monitoring device 100, including the steps of:
s1: positioning the mounting base 120 on the surface of the tested device 300 through Shi Jiaogu, so that an adhesive layer 123 is formed between the mounting base 120 and the surface of the tested device 300;
s2: fixedly connecting a first end of the temperature probe 150 with the housing 110 through threads so as to fixedly mount the temperature probe 150 on the housing 110; and
s3: the second end of the temperature probe 150 is fixedly connected with the mounting seat 120 through threads, so that the housing 110 fixedly connected with the temperature probe 150 is also fixed on the mounting seat 120.
That is, the temperature probe 150 functions to connect the housing 110 and the mount 120, and at the same time, the temperature probe 150 has a temperature sensing element 151 sensing the temperature of the device 300 under test. Specifically, the temperature probe 150 includes a hollow screw 155, a connecting hole 125 is formed in the mounting seat 120, a connecting groove 115 facing the connecting hole 125 is formed in the housing 110, a first end of the hollow screw 155 is in threaded connection with the connecting hole 125, and a second end of the hollow screw 155 is in threaded connection with the connecting groove 115.
By the installation method, the monitoring device 100 can be conveniently installed on the tested equipment 300, and the whole structure of the monitoring device 100 is simple and stable and is very convenient to maintain.
A10, the monitoring device of A3 or A9, wherein a first end of the hollow screw is provided with a straight groove which is convenient to screw into the connecting groove. A11, the monitoring device of any of A1-a10, further comprising a second sensing element mounted within the housing. A12, the monitoring device of A11, wherein the second sensing element is a vibration sensing element. A13, the monitoring device of any one of A1-A12, wherein the mounting seat is fixed with the surface of the tested equipment through an adhesive layer; and a permanent magnet is arranged in the mounting seat. B15, a method for installing the monitoring device as described in B14, wherein a connecting hole is formed in the installation seat in a penetrating way, and a connecting groove facing the connecting hole is formed in the shell; the first end of the temperature measuring probe is in threaded connection with the connecting groove, and the second end of the temperature measuring probe is in threaded connection with the connecting hole. B16, the method for installing the monitoring device according to B14 or B15, wherein the mounting seat is fixed on the surface of the tested device through glue application, and a glue layer is formed between the mounting seat and the surface of the tested device.
In the description of the present specification, the terms "coupled," "fixed," and the like are to be construed broadly unless otherwise specifically indicated and defined. Furthermore, the terms "upper," "lower," "inner," "outer," "top," "bottom," and the like refer to an orientation or positional relationship based on that shown in the drawings, for convenience of description and simplicity of description, and do not denote or imply that the devices or units referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.
In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Claims (9)
1. A monitoring apparatus for monitoring a device under test, comprising:
the mounting seat is internally provided with a connecting hole in a penetrating way;
the shell is positioned at the upper end of the mounting seat, a connecting groove facing the connecting hole is formed in the shell, and internal threads are formed in the inner walls of the connecting hole and the connecting groove;
the second sensing element is arranged in the shell and is a vibration sensing element; the first end of the temperature measurement probe is fixedly connected with the connecting groove, the second end of the temperature measurement probe extends through the connecting hole and then abuts against the tested equipment, and the temperature measurement probe comprises:
the hollow rod is a hollow screw rod, the first end of the hollow screw rod is in threaded connection with the connecting groove, the second end of the hollow screw rod is in threaded connection with the connecting hole, a limiting boss is convexly arranged on the outer wall of the hollow screw rod, a limiting groove is formed at the joint of the shell and the mounting seat, and the limiting boss is clamped in the limiting groove;
the elastic piece is elastically propped between the lower end of the hollow rod and the tested equipment and comprises a bottom plate, and the bottom plate is propped against the tested equipment;
the temperature sensitive element is arranged on the inner wall of the elastic piece and is fixed on the bottom plate.
2. The monitoring device of claim 1, wherein:
the elastic piece is annular, and the outer diameter of the elastic piece is smaller than the inner diameter of the connecting hole.
3. The monitoring device of claim 2, wherein:
the elastic piece is a drum-shaped elastic ring.
4. The monitoring device of claim 2, wherein:
the elastic piece is a metal corrugated pipe.
5. The monitoring device of claim 1, wherein:
the elastic piece is welded and fixed at the lower end of the hollow rod.
6. The monitoring device of claim 1, wherein:
the first end of the hollow screw rod is provided with a straight groove which is convenient to screw into the connecting groove.
7. The monitoring device of claim 1, wherein:
the mounting seat is fixed with the surface of the tested equipment through an adhesive layer;
and a permanent magnet is arranged in the mounting seat.
8. A method of installing a monitoring device as claimed in any one of claims 1 to 7, the method comprising the steps of:
s1: fixing a mounting seat on the surface of tested equipment, wherein a connecting hole is formed in the mounting seat in a penetrating way;
s2: fixedly connecting the first end of the temperature measurement probe with a connecting groove in the shell so that the temperature measurement probe is fixedly arranged on the shell, wherein the connecting groove faces the connecting hole, and inner threads are arranged on the inner walls of the connecting hole and the connecting groove;
s3: the second end of the temperature measurement probe is fixedly connected with a connecting hole in the mounting seat, so that a shell connected with the temperature measurement probe is fixed on the mounting seat, the second end extends to penetrate through the connecting hole in the mounting seat and is propped against the tested equipment, the temperature measurement probe comprises a hollow rod, an elastic piece and a temperature sensitive element, the hollow rod is a hollow screw rod, the first end of the hollow screw rod is in threaded connection with the connecting groove, the second end of the hollow screw rod is in threaded connection with the connecting hole, a limit boss is convexly arranged on the outer wall of the hollow screw rod, a limit groove is formed in the joint of the shell and the mounting seat, the limit boss is clamped in the limit groove, the elastic piece elastically props against the lower end of the hollow rod and the tested equipment, the bottom plate is propped against the tested equipment, and the temperature sensitive element is arranged on the inner wall of the elastic piece and is fixed on the bottom plate.
9. The method of installing a monitoring device of claim 8, wherein:
the mounting seat is fixed on the surface of the tested equipment through glue application, and a glue layer is formed between the mounting seat and the surface of the tested equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811150973.8A CN109141531B (en) | 2018-09-29 | 2018-09-29 | Monitoring device and method for installing monitoring device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811150973.8A CN109141531B (en) | 2018-09-29 | 2018-09-29 | Monitoring device and method for installing monitoring device |
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| CN109141531A CN109141531A (en) | 2019-01-04 |
| CN109141531B true CN109141531B (en) | 2024-02-23 |
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