CN210939660U - Flushing channel device for integrated circuit chip - Google Patents
Flushing channel device for integrated circuit chip Download PDFInfo
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- CN210939660U CN210939660U CN201921692168.8U CN201921692168U CN210939660U CN 210939660 U CN210939660 U CN 210939660U CN 201921692168 U CN201921692168 U CN 201921692168U CN 210939660 U CN210939660 U CN 210939660U
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- guide rail
- integrated circuit
- die
- lower die
- flow channel
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Abstract
The utility model discloses a flow channel flushing device for an integrated circuit chip, which is characterized by comprising a frame body, a first guide rail, a flow channel flushing mould containing an upper mould and a lower mould, and a gripping device; the first guide rail and the upper die are respectively connected with the frame body, and the lower die is positioned on the first guide rail and can move along the first guide rail; the gripping device is connected with the frame body; the lower die can be respectively opposite to the upper die and the grabbing device. The flow channel flushing device for the integrated circuit chip is compact in structure, saves space and improves working efficiency.
Description
Technical Field
The utility model relates to a towards runner device for integrated circuit chip.
Background
Currently, the process work after the chip packaging is realized is completed by different dispersed devices. For example, the flow channel punching process is performed on the chip by a flow channel die. After the flow channel punching process, the finished product after the flow channel punching is manually placed in a finished product collecting device, or the finished product is taken out of the flow channel punching mold by a manipulator and then placed in the finished product collecting device. Because each device sets up alone, occupy more places on the one hand, secondly need more operating personnel to lead to product quality unstable, uncontrollable, production efficiency is low, with high costs.
Disclosure of Invention
The utility model provides a towards runner device for integrated circuit chip, compact structure practices thrift the space, improves work efficiency.
In order to solve the technical problem, the embodiment of the utility model provides an adopt following technical scheme:
a flow channel flushing device for an integrated circuit chip comprises a frame body, a first guide rail, a flow channel flushing mould containing an upper mould and a lower mould, and a grabbing device; the first guide rail and the upper die are respectively connected with the frame body, and the lower die is positioned on the first guide rail and can move along the first guide rail; the gripping device is connected with the frame body; the lower die can be respectively opposite to the upper die and the grabbing device.
As a preferred example, the flow channel device for an integrated circuit chip further comprises a power device, wherein the power device is connected with the lower die and drives the lower die to move along the first guide rail.
As a preferred example, the gripping device is used for gripping the die after the runner on the lower die.
As a preferred example, the flow channel device for the integrated circuit chip further comprises a waste collecting device, wherein the waste collecting device is opposite to the upper die and is positioned below the first guide rail.
Preferably, the gripping device comprises a robot.
As a preferred example, the gripping device further comprises a second guide rail; the second guide rail is connected with the frame body; the manipulator is positioned on the second guide rail and can move along the second guide rail.
Preferably, the second guide rail is perpendicular to the first guide rail.
As a preferred example, the flow channel device for the integrated circuit chip further comprises a finished product collecting device, and the finished product collecting device is located below the grabbing device.
As a preferred example, the flow channel device for the integrated circuit chip further comprises a lower die cleaning device, the lower die cleaning device is connected with the frame body, and the lower die cleaning device is positioned above the first guide rail; when in use, the lower die can be just opposite to the lower die cleaning device in the moving process.
As a preferred example, the flushing runner device for the integrated circuit chip further comprises a lower die cleaning device, and the lower die cleaning device is connected with the upper die.
Preferably, the lower die cleaning device comprises a negative pressure device and a first pipeline, and the upper end of the first pipeline is connected with an air inlet of the negative pressure device.
As a preferred example, the flow channel device for the integrated circuit chip further comprises a waste collecting device, wherein the waste collecting device is opposite to the upper die and is positioned below the first guide rail; the lower die cleaning device further comprises a second pipeline, one end of the second pipeline is connected with an air outlet of the negative pressure device, and the other end of the second pipeline is located in the waste collecting device.
As a preferred example, the lower end of the first pipeline is strip-shaped and is distributed along the longitudinal direction of the lower die; or the first pipelines are distributed along the longitudinal direction of the lower die.
Compared with the prior art, the utility model discloses the device compact structure of embodiment, area is little, and work efficiency is high. The utility model discloses device, including support body, first guide rail, dashing runner mould, grabbing device. The first guide rail and the upper die are respectively connected with the frame body, and the lower die is positioned on the first guide rail and can move along the first guide rail. The gripping device is connected with the frame body. The lower die can be respectively opposite to the upper die and the grabbing device. The device integrates a flow channel flushing process and a finished product collecting process. Compared with the existing distributed device, the device of the embodiment has compact structure and small floor area. Meanwhile, the flow channel flushing process and the finished product collecting process are connected compactly, and the working efficiency is improved.
Drawings
Fig. 1 is a front view of an embodiment of the invention;
fig. 2 is a perspective view of an embodiment of the present invention.
The figure shows that: the device comprises a frame body 1, a first guide rail 2, a flushing runner mold 3, an upper mold 301, a lower mold 302, a gripping device 4, a second guide rail 401, a manipulator 402, a waste collecting device 5, a finished product collecting device 6 and a lower mold cleaning device 7.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 and fig. 2, the embodiment of the present invention provides a flow channel device for an integrated circuit chip, which includes a frame body 1, a first guide rail 2, a flow channel mold 3 containing an upper mold 301 and a lower mold 302, and a gripping device 4. The first guide rail 2 and the upper die 301 are respectively connected with the frame body 1, and the lower die 302 is located on the first guide rail 2 and can move along the first guide rail 2. The gripping device 4 is connected with the frame body 1. The lower die 302 may be opposed to the upper die 301 and the grasping apparatus 4, respectively.
The device of the above embodiment integrates the flow channel process and the finished product collection process. Compared with the existing distributed device, the device of the embodiment has compact structure and small floor area. When in use, the packaged chip is placed on the lower die 302; then, the lower die 302 is moved so that the lower die 302 and the upper die 301 are opposed; then, the upper die 301 is started, the upper die 301 moves downwards, the upper die 301 and the lower die 302 begin to be matched, unnecessary waste materials on the product are punched, and a punching channel of the chip is realized; after the runner is finished, the upper die 301 is started to move upwards; subsequently, the lower mold 302 is moved in the first guide rail 2, and the chips on the lower mold 302 are taken out by the gripper 4, thereby collecting the finished products.
According to the embodiment, two functions of the runner and finished product collection are realized through one device. After the flow channel punching process is completed, the lower mold 302 moves along the first guide rail 2 and is separated from the position opposite to the upper mold 301, and the finished product collection process can be performed. The flow channel flushing process and the finished product collecting process are connected compactly, and the working efficiency is improved.
In order to further improve the working efficiency, the flow channel flushing device for the integrated circuit chip further comprises a power device, wherein the power device is connected with the lower die 302 and drives the lower die 302 to move along the first guide rail 2. The lower die 302 is located at different positions of the first guide rail 2 at the die runner station and the finished product collection station. The power device is used for driving the lower die 302 to move along the first guide rail 2, so that the lower die 302 can move, and the working efficiency can be improved.
In the above embodiment, the gripping device 4 is used for gripping the die after the runner on the lower die 302. The gripping device 4 can be a manipulator and can move up and down. Taking a mechanical arm as an example, when the chip needs to be grabbed, the mechanical arm moves downwards to grab the chip; after grabbing, the robot moves upward to place the chip in the finished product collection device.
In order to collect the waste generated in the runner process, it is preferable that the runner device for the ic chip further includes a waste collecting device 5, and the waste collecting device 5 is opposite to the upper mold 301 and is located below the first guide rail 2. In operation, the upper die 301 moves up and down without moving in the horizontal direction. Thus, the scrap collecting apparatus 5 is placed below the upper die 301. Thus, the scraps generated during the operation of the runner mold 3 fall into the scrap collecting device 5 to be collectively disposed.
Preferably, the gripping means 4 comprise a robot 402. In operation, the robot 402 is used to grasp the die after the upper die runner of the lower die 302. After the robot 402 has grasped the chip, the lower mold 302 is moved in the direction of the upper mold 301 along the first guide rail 2. Robot 402 then places the chip into a finished collection device. In the preferred embodiment, the robot 402 moves up and down. The finished product collection device is disposed below the first guide rail 2, and is opposed to the robot 402.
Preferably, the gripping device 4 comprises a second guide 401 and a robot arm 402. The second guide rail 401 is coupled to the frame body 1. The robot 402 is located on the second guide rail 401 and is movable along the second guide rail 401. In operation, the robot 402 is used to grasp the die after the upper die runner of the lower die 302. After grasping the chip, the robot 402 moves on the second guide rail 401 to place the chip in the product collecting device.
Preferably, the second guide rail 401 is perpendicular to the first guide rail 2 in order to avoid positional interference during operation. Thus, the gripper 4 moves in a different direction from the lower mold 302.
In order to collect the finished chips, it is preferable that the flow channel device for integrated circuit chips further comprises a finished product collecting device 6, and the finished product collecting device 6 is located below the gripping device 4. The gripping device 4 places the gripped chips into a finished product collection device 6. Of course, the finished product collecting device 6 and the frame 1 may not be connected.
In operation, after the gripping device 4 grips the finished chip, the lower mold 302 moves along the first guide rail 2 toward the upper mold 301. At this point, there may still be residual scrap on the lower mold 302. If the waste material is not cleaned, the placement of new chips in subsequent steps is affected, and the runner process is affected. Therefore, before the lower mold 302 carries a new packaged chip, it is necessary to clean the scrap from the surface of the lower mold 302.
As a preferred example, the flow channel device for the integrated circuit chip further comprises a lower die cleaning device 7, the lower die cleaning device 7 is connected with the frame body 1, and the lower die cleaning device 7 is positioned above the first guide rail 2; in use, the lower mold 302 may be moved in alignment with the lower mold cleaning device 7. Preferably, the lower mold cleaning device 7 is moved up and down by a cylinder.
As another preferred example, the flow channel device for the integrated circuit chip further comprises a lower die cleaning device 7, and the lower die cleaning device 7 is connected with the upper die 301. The lower die cleaning device 7 moves up and down with the upper die 301. Preferably, the lower mold cleaning device 7 is moved up and down by a cylinder.
In both preferred embodiments, the lower mold cleaning device 7 is connected at a different position. One is connected with the frame body 1, and the other is connected with the upper die 301.
Preferably, the lower mold cleaning device 7 comprises a negative pressure device and a first pipeline, and the upper end of the first pipeline is connected with an air inlet of the negative pressure device. In operation, the first pipe sucks waste on the surface of the lower mold 302 into the first pipe through negative pressure generated by the negative pressure device, so as to clean the surface of the lower mold 302.
Preferably, the lower mold cleaning device 7 further comprises a second duct. One end of the second pipeline is connected with the air outlet of the negative pressure device, and the other end of the second pipeline is positioned in the waste collecting device 5. Thus, the scraps on the surface of the lower mold 302 are fed to the scrap collecting apparatus 5 through the first and second pipes.
In order to improve the cleaning effect, preferably, the lower end of the first pipeline is strip-shaped and is arranged along the longitudinal direction of the lower die 302; alternatively, the first pipe is provided with a plurality of hoses arranged along the longitudinal direction of the lower die 302. Since the lower mold 302 moves horizontally along the first guide rail 2, the first duct is arranged in the preferred embodiment, and the waste material can be cleaned as much as possible during the horizontal movement of the lower mold 302.
In this embodiment, after all the products on the lower mold 302 are moved into the finished product collecting device by the manipulator, the lower mold 302 is moved to one side of the upper mold 301 again, the lower mold cleaning device 7 cleans and sucks away the impurities possibly remaining on the lower mold 302 during the moving process, and finally the lower mold 302 is moved to the initial position to wait for receiving the next new loading frame.
The flow channel flushing device for the integrated circuit chip integrates the flow channel flushing function, the product collecting function and the like on one device, and changes manual operation into mechanical automatic operation. The device saves space, reduces operating personnel, still can make product quality stable controllable, is showing and promotes work efficiency.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration only, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the claims and their equivalents.
Claims (13)
1. A flow channel flushing device for an integrated circuit chip is characterized by comprising a frame body (1), a first guide rail (2), a flow channel flushing mold (3) containing an upper mold (301) and a lower mold (302), and a grabbing device (4);
the first guide rail (2) and the upper die (301) are respectively connected with the frame body (1), and the lower die (302) is positioned on the first guide rail (2) and can move along the first guide rail (2); the gripping device (4) is connected with the frame body (1); the lower die (302) can respectively face the upper die (301) and the grabbing device (4).
2. The washrunner apparatus for integrated circuit chips as defined in claim 1, further comprising a power unit coupled to the lower mold (302) for driving the lower mold (302) along the first guide rail (2).
3. The die flow channel device for integrated circuit chips of claim 1 wherein said grasping means (4) is for grasping a die after the die flow channel on the lower die (302).
4. The device according to claim 1, further comprising a scrap collector (5), wherein the scrap collector (5) is opposite to the upper mold (301) and is located below the first guide rail (2).
5. The washrunner apparatus for integrated circuit chips of claim 1, wherein said grasping means (4) comprises a robot arm (402).
6. The washrunner apparatus for integrated circuit chips of claim 5, wherein said grasping means (4) further comprises a second guide rail (401); the second guide rail (401) is connected with the frame body (1); the manipulator (402) is located on the second guide rail (401) and is movable along the second guide rail (401).
7. The runner apparatus for integrated circuit chips of claim 6 wherein said second guide rail (401) is perpendicular to said first guide rail (2).
8. The device according to claim 5, 6 or 7, further comprising a product collection device (6), wherein the product collection device (6) is located below the grasping device (4).
9. The washrunner apparatus for integrated circuit chips as defined in claim 1, further comprising a lower mold cleaning device (7), the lower mold cleaning device (7) being connected to the frame body (1), the lower mold cleaning device (7) being located above the first guide rail (2); when in use, the lower die (302) can be opposite to the lower die cleaning device (7) in the moving process.
10. The washrunner apparatus for integrated circuit chips as defined in claim 1, further comprising a lower die cleaning device (7), the lower die cleaning device (7) being connected to the upper die (301).
11. The washrunner apparatus for integrated circuit chips as defined in claim 9 or 10, wherein the lower mold cleaning device (7) comprises a negative pressure device and a first duct, an upper end of the first duct being connected to an air inlet of the negative pressure device.
12. The device according to claim 11, further comprising a scrap collector (5), wherein said scrap collector (5) is opposite to said upper mold (301) and is located below said first guide rail (2);
the lower die cleaning device (7) further comprises a second pipeline, one end of the second pipeline is connected with an air outlet of the negative pressure device, and the other end of the second pipeline is located in the waste collecting device (5).
13. The washrunner apparatus for integrated circuit chips as defined in claim 11, wherein the lower end of said first conduit is strip-shaped and arranged in a longitudinal direction of the lower die (302); alternatively, the first and second electrodes may be,
the first pipelines are distributed along the longitudinal direction of the lower die (302).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921692168.8U CN210939660U (en) | 2019-10-10 | 2019-10-10 | Flushing channel device for integrated circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921692168.8U CN210939660U (en) | 2019-10-10 | 2019-10-10 | Flushing channel device for integrated circuit chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210939660U true CN210939660U (en) | 2020-07-07 |
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ID=71377846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921692168.8U Active CN210939660U (en) | 2019-10-10 | 2019-10-10 | Flushing channel device for integrated circuit chip |
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| Country | Link |
|---|---|
| CN (1) | CN210939660U (en) |
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2019
- 2019-10-10 CN CN201921692168.8U patent/CN210939660U/en active Active
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