CN210924463U - Front liquid-cooled air cooling device of portable liquid-cooled server - Google Patents
Front liquid-cooled air cooling device of portable liquid-cooled server Download PDFInfo
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- CN210924463U CN210924463U CN201922166415.7U CN201922166415U CN210924463U CN 210924463 U CN210924463 U CN 210924463U CN 201922166415 U CN201922166415 U CN 201922166415U CN 210924463 U CN210924463 U CN 210924463U
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- heat dissipation
- cooling device
- air cooling
- liquid
- heating panel
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Abstract
The utility model discloses a leading liquid cooling formula air cooling device of portable liquid cooling server, the load simulator comprises a case, the right side fixedly connected with curb plate of machine case, the utility model relates to an air cooling device technical field. This leading liquid cooling air cooling device of portable liquid cooling server, first mounting groove has been seted up in the left side through the curb plate, and the inside swing joint of first mounting groove has first heating panel and second heating panel, first movable groove has all been seted up to the left top of curb plate and bottom, and one side of two first movable groove inner walls is rotated and is connected with the dog, the second movable groove has all been seted up to the left top of first heating panel and bottom, utilize the movable dog that sets up on the left side of the curb plate, carry out the rigidity to first heating panel in first mounting groove, when having made things convenient for first heating panel and the inside trouble of second heating panel greatly, carry out dismouting change maintenance to first heating panel and second heating panel, the operation is comparatively convenient and simple.
Description
Technical Field
The utility model relates to an air cooling device technical field specifically is a leading liquid cooling type air cooling device of portable liquid cooling server.
Background
The liquid cooling server is a server which is used for injecting liquid into the server and dissipating heat through cold and heat exchange to carry the server, the eosin liquid cooling server is matched with a data center water system or a fluorine system indirect natural cooling technology, energy conservation is realized by reducing heat product level loss in a heat transfer process, and cooling liquid required by the liquid cooling server is cooling water at 35 ℃ provided by a cooling tower which is easy to obtain and can be obtained without a compressor for refrigeration cycle.
Current server water cooling technology, mainly adopt the water-cooling board that sets up on CPU directly with the CPU heat transfer, take away CPU's heat, in addition through set up fan unit in server inside, fan unit work blows in the inside of server with the air, utilize the air and the inside heat of server to carry out the heat transfer, then it discharges from the server rear end to have thermal air, such air cooling device is comparatively troublesome at the inside dismouting of server, when the inside trouble that breaks down of cooling device, it is comparatively troublesome to change the maintenance, in addition, it is relatively poor to carry out the cooling effect to the inside air of server, air cooling's efficiency is lower, cooling device practical effect is relatively poor.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to prior art, the utility model provides a leading liquid cooling formula air cooling device of portable liquid cooling server has solved current air cooling device and has comparatively trouble at the inside dismouting of server, and when the inside trouble that breaks down of cooling device, it is comparatively troublesome to change the maintenance, in addition, carries out the cooling effect relatively poor to the inside air of server, and air cooling's efficiency is lower, the relatively poor problem of cooling device practical effect.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a portable liquid cooling server front liquid cooling type air cooling device comprises a case, a side plate is fixedly connected with the right side of the case, a first mounting groove is arranged on the left side of the side plate, the first mounting groove is movably connected with a first heat dissipation plate and a second heat dissipation plate inside, the top and the bottom of the left side of the side plate are both provided with a first movable groove, and one side of the inner wall of the two first movable grooves is rotatably connected with a stop block, the top and the bottom of the left side of the first heat-dissipating plate are both provided with a second movable groove, the interiors of the two second movable grooves are respectively communicated with the interiors of the two first movable grooves, the surface of the stop block is in sliding connection with the inner wall of the second movable groove, the semiconductor cooler is movably connected to the top and the bottom of the left side of the inner wall of the first heat dissipation plate, and first through holes are formed in the top and the bottom of the left side of the first heat dissipation plate.
Preferably, the top and the bottom on the right side of the inner wall of the second heat dissipation plate are fixedly connected with installation frames, and the heat dissipation fans are fixedly connected in the two installation frames.
Preferably, the top and the bottom on the right side of the second heat dissipation plate are both provided with second through holes, and the insides of the two second through holes are both fixedly connected with protective nets.
Preferably, a second mounting groove is formed in the right side of the case, and one side of the inner wall of the second mounting groove is fixedly connected with one side of the side plate through a mounting screw.
Preferably, the right side of the first heat dissipation plate and the left side of the second heat dissipation plate are fixedly connected through mounting screws.
Preferably, the semiconductor refrigerator and the heat dissipation fan are electrically connected with the control element inside the case through wires.
Advantageous effects
The utility model provides a leading liquid cooling formula air cooling device of portable liquid cooling server. Compared with the prior art, the method has the following beneficial effects:
(1) the portable liquid cooling server front liquid cooling air cooling device is provided with a first mounting groove through the left side of a side plate, the inside of the first mounting groove is movably connected with a first heat dissipation plate and a second heat dissipation plate, the top and the bottom of the left side of the side plate are both provided with first movable grooves, one side of the inner wall of each of the two first movable grooves is rotatably connected with a stop dog, the top and the bottom of the left side of the first heat dissipation plate are both provided with second movable grooves, the interiors of the two second movable grooves are respectively communicated with the interiors of the two first movable grooves, the surface of the stop dog is in sliding connection with the inner wall of the second movable groove, the movable stop dog arranged at the left side of the side plate is utilized to fix the position of the first heat dissipation plate in the first mounting groove, the first heat dissipation plate and the second heat dissipation plate are greatly convenient to disassemble, replace and maintain the first heat dissipation, the operation is more convenient and simple.
(2) This leading liquid cooling formula air cooling device of portable liquid cooling server, there is semiconductor cooler through the equal swing joint in left top of first heating panel inner wall and bottom, and first through-hole has all been seted up with the bottom in the left top of first heating panel, the top on second heating panel inner wall right side and the equal fixedly connected with installing frame in bottom, and the equal fixedly connected with heat dissipation fan in inside of two installing frames, two sets of semiconductor cooler that utilize the inside setting of first heating panel can cool off the hot air of quick-witted incasement portion very effectually, and cooling efficiency is higher, in addition, the hot junction to semiconductor cooler dispels the heat through the heat dissipation fan can be fine, thereby better utilization semiconductor cooler carries out cooling work.
Drawings
FIG. 1 is a perspective view of the structure of the present invention;
fig. 2 is a side view of the side plate structure of the present invention;
fig. 3 is a cross-sectional view of the first and second heat dissipating plates of the present invention;
fig. 4 is a side view of the case structure of the present invention.
In the figure: the method comprises the following steps of 1-case, 2-side plate, 3-first mounting groove, 4-first cooling plate, 5-second cooling plate, 6-first movable groove, 7-stop block, 8-second movable groove, 9-semiconductor refrigerator, 10-first through hole, 11-mounting frame, 12-cooling fan, 13-second through hole, 14-protective net and 15-second mounting groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a portable liquid cooling server preposed liquid cooling air cooling device comprises a case 1, the inside of the case 1 can be provided with the liquid cooling device for a mainboard region, the right side of the case 1 is provided with a second mounting groove 15, one side of the inner wall of the second mounting groove 15 is fixedly connected with one side of a side plate 2 through a mounting screw, the right side of the case 1 is fixedly connected with the side plate 2, the left side of the side plate 2 is provided with a first mounting groove 3, the inside of the first mounting groove 3 is movably connected with a first heat dissipation plate 4 and a second heat dissipation plate 5, the right side of the first heat dissipation plate 4 is fixedly connected with the left side of the second heat dissipation plate 5 through the mounting screw, elements in the first heat dissipation plate 4 and the second heat dissipation plate 5 can be conveniently replaced and maintained, the top and the bottom of the right side of the inner wall of the second heat dissipation plate 5 are fixedly connected with mounting frames 11, and, the heat end of the semiconductor refrigerator 9 can be well radiated by the radiating fan 12, so that the semiconductor refrigerator 9 can be better utilized for cooling, the top and the bottom of the right side of the second radiating plate 5 are both provided with second through holes 13, the interiors of the two second through holes 13 are both fixedly connected with a protective net 14, the top and the bottom of the left side of the side plate 2 are both provided with first movable grooves 6, one side of the inner wall of each first movable groove 6 is rotatably connected with a stop 7, the top and the bottom of the left side of the first radiating plate 4 are both provided with second movable grooves 8, the interiors of the two second movable grooves 8 are respectively communicated with the interiors of the two first movable grooves 6, the surface of the stop 7 is slidably connected with the inner wall of the second movable groove 8, the top and the bottom of the left side of the inner wall of the first radiating plate 4 are both movably connected with the semiconductor refrigerator 9, and the interiors of the radiating fan 12 are both electrically, and the top and the bottom of the left side of the first heat dissipation plate 4 are both opened with first through holes 10, and the details not described in detail in this specification are all in the prior art well known to those skilled in the art.
When the cooling device is used, the control switch on the case 1 is operated to open the working switches of the heat dissipation fan 12 and the semiconductor refrigerator 9, the semiconductor refrigerator 9 is utilized to cool hot air in the case 1, meanwhile, the heat dissipation fan 12 can well dissipate heat of the hot end of the semiconductor refrigerator 9, so that the semiconductor refrigerator 9 can be better cooled, when the first heat dissipation plate 4 and the second heat dissipation plate 5 are installed, the first heat dissipation plate 4 and the second heat dissipation plate 5 are fixedly connected through the installation screws, then the first heat dissipation plate 4 and the second heat dissipation plate 5 are placed in the first installation groove 3 in the side plate 2, the stop blocks 7 in the four first movable grooves 6 are rotated, one side of each stop block 7 is rotated into the second movable groove 8 on the left side of the first heat dissipation plate 4, and the installation between the first heat dissipation plate 4, the second heat dissipation plate 5 and the side plate 2 is completed, finally, the side plate 2 is fixedly installed in the second installation groove 15 on the right side of the case 1 through installation screws.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a leading liquid cooling formula air cooling device of portable liquid cooling server, includes quick-witted case (1), the right side fixedly connected with curb plate (2) of quick-witted case (1), its characterized in that: a first mounting groove (3) is formed in the left side of the side plate (2), a first heat dissipation plate (4) and a second heat dissipation plate (5) are movably connected inside the first mounting groove (3), the top and the bottom of the left side of the side plate (2) are both provided with a first movable groove (6), and one side of the inner wall of the two first movable grooves (6) is rotationally connected with a stop block (7), the top and the bottom of the left side of the first heat dissipation plate (4) are both provided with a second movable groove (8), and the interiors of the two second movable grooves (8) are respectively communicated with the interiors of the two first movable grooves (6), the surface of the stop block (7) is in sliding connection with the inner wall of the second movable groove (8), the top and the bottom of the left side of the inner wall of the first heat dissipation plate (4) are both movably connected with a semiconductor refrigerator (9), and the top and the bottom of the left side of the first heat dissipation plate (4) are both provided with first through holes (10).
2. The portable liquid-cooled server front-mounted liquid-cooled air cooling device as claimed in claim 1, wherein: the top and the bottom on second heating panel (5) inner wall right side all fixedly connected with installing frame (11) to the inside all fixedly connected with heat dissipation fan (12) of two installing frames (11).
3. The portable liquid-cooled server front-mounted liquid-cooled air cooling device as claimed in claim 1, wherein: second through-hole (13) have all been seted up to top and bottom on second heating panel (5) right side to the equal fixedly connected with protection network (14) in inside of two second through-holes (13).
4. The portable liquid-cooled server front-mounted liquid-cooled air cooling device as claimed in claim 1, wherein: a second mounting groove (15) is formed in the right side of the case (1), and one side of the inner wall of the second mounting groove (15) is fixedly connected with one side of the side plate (2) through a mounting screw.
5. The portable liquid-cooled server front-mounted liquid-cooled air cooling device as claimed in claim 1, wherein: the right side of the first heat dissipation plate (4) is fixedly connected with the left side of the second heat dissipation plate (5) through mounting screws.
6. The portable liquid-cooled server front-mounted liquid-cooled air cooling device as claimed in claim 1, wherein: the semiconductor refrigerator (9) and the heat dissipation fan (12) are electrically connected with the control element inside the case (1) through wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922166415.7U CN210924463U (en) | 2020-05-09 | 2020-05-09 | Front liquid-cooled air cooling device of portable liquid-cooled server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922166415.7U CN210924463U (en) | 2020-05-09 | 2020-05-09 | Front liquid-cooled air cooling device of portable liquid-cooled server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210924463U true CN210924463U (en) | 2020-07-03 |
Family
ID=71350840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922166415.7U Expired - Fee Related CN210924463U (en) | 2020-05-09 | 2020-05-09 | Front liquid-cooled air cooling device of portable liquid-cooled server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210924463U (en) |
-
2020
- 2020-05-09 CN CN201922166415.7U patent/CN210924463U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200703 Termination date: 20210509 |
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| CF01 | Termination of patent right due to non-payment of annual fee |