CN216387952U - 2U cold drawing formula liquid cooling server - Google Patents
2U cold drawing formula liquid cooling server Download PDFInfo
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- CN216387952U CN216387952U CN202122602514.2U CN202122602514U CN216387952U CN 216387952 U CN216387952 U CN 216387952U CN 202122602514 U CN202122602514 U CN 202122602514U CN 216387952 U CN216387952 U CN 216387952U
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- 239000007788 liquid Substances 0.000 title claims abstract description 104
- 238000001816 cooling Methods 0.000 title claims abstract description 87
- 238000010622 cold drawing Methods 0.000 title description 3
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 230000033228 biological regulation Effects 0.000 claims description 5
- 238000004134 energy conservation Methods 0.000 abstract description 2
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The utility model relates to a 2U cold plate type liquid cooling server, which comprises a case, wherein a hard disk frame is arranged at the front end of the case, a hard disk back plate is arranged at the rear end of the hard disk frame, an air cooling device is arranged at the rear end of the hard disk back plate, a power panel and a plurality of groups of liquid cooling computing nodes are arranged at the rear end of the air cooling device, the air cooling device and the liquid cooling computing nodes are both connected to the power panel, and the power panel is connected with a power module; the liquid-cooled computing node comprises a node side plate, wherein a first end of the node side plate is connected with the hard disk back plate, a second end of the node side plate is connected with the main plate, and the main plate is provided with a liquid-cooled heat dissipation device; a plurality of groups of liquid cooling computing nodes are arranged in the space of the 2U case, so that the space utilization rate is higher while energy conservation and heat dissipation are realized, the density of a server in the cabinet is favorably improved, and the space cost is saved.
Description
Technical Field
The utility model belongs to the technical field of servers, and particularly relates to a 2U cold plate type liquid cooling server.
Background
Nowadays, more and more large enterprises begin to own their data centers, and with the increase of traffic, data center servers begin to increase, and the traditional air-cooled heat dissipation mode has the disadvantages of high cooling energy consumption, high noise, low equipment density and the like, so how to realize the energy-saving heat dissipation of the servers becomes a difficult problem.
The liquid cooling server is a server which is injected with liquid and dissipates heat by carrying away the heat of the server through cold and heat exchange, and is divided into a cold plate type liquid cooling server and a fully immersed type liquid cooling server in terms of physical form of the server; the internal space of the server is limited, a large amount of space in the case needs to be occupied by the liquid cooling device in the existing liquid cooling server, the density of devices in the case is low, the space utilization rate is low, the number of the liquid cooling servers which can be placed in the case is limited, and the space cost is high.
In view of this, the present invention provides a 2U cold plate type liquid cooling server to solve the defects in the prior art, which is very necessary.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides the 2U cold plate type liquid cooling server, the occupied space of the liquid cooling computing node is small, the space utilization rate is higher while the server realizes energy conservation and heat dissipation, the density of the server in the cabinet is favorably improved, and the space cost is saved.
In order to achieve the purpose, the utility model provides the following technical scheme:
A2U cold plate type liquid cooling server comprises a case, wherein a hard disk frame is arranged at the front end of the case, a hard disk back plate is arranged at the rear end of the hard disk frame, an air cooling device is arranged at the rear end of the hard disk back plate, a power panel and a plurality of groups of liquid cooling computing nodes are arranged at the rear end of the air cooling device, the air cooling device and the liquid cooling computing nodes are both connected to the power panel, and the power panel is connected with a power module; the liquid cooling calculation node comprises a node side plate, a first end of the node side plate is connected with the hard disk back plate, a second end of the node side plate is connected with the main plate, and a liquid cooling heat dissipation device is installed on the main plate.
Preferably, a plurality of hard disk brackets are arranged in the hard disk frame, and hard disks are arranged in the hard disk brackets; a plurality of hard disk brackets are arranged in the hard disk frame, and a plurality of hard disks can be simultaneously installed on the case.
Preferably, the liquid-cooled heat dissipation device comprises a liquid inlet pipe, the liquid inlet pipe is fixed on the pipeline support, the liquid inlet pipe is communicated with the hollow liquid-cooled frame, the liquid-cooled frame is communicated with a first liquid outlet pipe, the first liquid outlet pipe is connected with a hollow first heat-conducting plate, the first heat-conducting plate is connected with a second liquid outlet pipe, the second liquid outlet pipe is connected with a hollow second heat-conducting plate, the second heat-conducting plate is connected with a third liquid outlet pipe, the third liquid outlet pipe is fixed on the pipeline support, and the first heat-conducting plate and the second heat-conducting plate are both arranged in the middle of the liquid-cooled frame; a voltage regulation module radiator is arranged between the first heat conduction plate and the second heat conduction plate, and memory radiators are arranged on the left side and the right side of the liquid cooling frame; the first heat conducting plate and the second heat conducting plate are used for radiating heat of a CPU on the mainboard, the voltage adjusting module radiator is used for radiating heat of the CPU voltage adjusting module, the memory radiator is used for radiating heat of a memory on the mainboard, and the liquid cooling radiating device can be used for radiating heat of high-power-consumption devices such as the CPU, the CPU voltage adjusting module and the memory at the same time, so that the occupied space is small, and space resources in the server are effectively saved.
Preferably, the OCP network card and the PCIE network card are installed on the mainboard, the OCP network card is installed at the rear end of the mainboard, and the PCIE network card is located above the OCP network card.
Preferably, the air cooling device comprises a fan frame, and a fan module is arranged in the fan frame; the air cooling device is matched with the liquid cooling device to dissipate heat of the server at the same time.
Preferably, the left end of the hard disk frame is connected with a left box lug, and the right end of the hard disk frame is connected with a right box lug; set up left case ear and right case ear respectively in the both sides of quick-witted case, conveniently pull the machine case in the rack.
Preferably, the top of the case is provided with a case upper cover; after the components in the case are assembled, the upper cover of the case is assembled on the case to prevent dust from falling into the case.
The liquid cooling heat dissipation device has the advantages that the CPU heat dissipation, the CPU voltage regulation module heat dissipation and the memory heat dissipation are designed into a whole through the liquid cooling heat dissipation device, energy-saving heat dissipation is carried out on high-power-consumption devices on the mainboard, the liquid cooling heat dissipation device is small in size, and the internal space of a server can be effectively saved; this scheme is equipped with a plurality of liquid cooling calculation nodes in quick-witted box space, the 2U cold drawing liquid cooling server that this scheme of use provided, more multiunit liquid cooling calculation node can be placed to a 42U standard rack, but every liquid cooling calculation node independent operation has realized the design of super high density server, effectively improves space utilization, can pack into more servers in the limited space of rack, improves server density in the rack, saves space cost.
Therefore, compared with the prior art, the utility model has substantive characteristics and progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a 2U cold plate type liquid cooling server according to an embodiment of the present invention.
Fig. 2 is a front view of fig. 1.
Fig. 3 is a rear view of fig. 1.
FIG. 4 is a top view of a liquid-cooled computing node.
Fig. 5 is a schematic view of the structure of the liquid-cooled heat sink plate.
Fig. 6 is an assembly schematic of a 2U cold plate liquid cooling server.
Fig. 7 is an external structural schematic diagram of a 2U cold plate liquid cooling server.
Wherein, 1-power frame, 2-air cooling device, 3-hard disk frame, 4-power panel, 5-liquid cooling computing node, 6-left box ear, 7-right box ear, 8-hard disk bracket, 9-OCP network card, 10-PCIE network card, 11-liquid inlet pipe, 12-1+1 redundant power supply, 13-third liquid outlet pipe, 14-node side plate, 15-mainboard, 16-liquid cooling heat sink, 17-memory heat sink, 18-pipeline bracket, 19-voltage regulation module heat sink, 20-first heat conducting plate, 21-hard disk backboard, 22-fan frame, 23-fan module, 24-case upper cover, 25-case, 26-second heat conducting plate, 27-liquid cooling frame, 28-first liquid outlet pipe, 29-second outlet pipe.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 7, an embodiment of the present invention provides a 2U cold plate type liquid cooling server, including a chassis 25, where the chassis 25 is a 2U chassis, a hard disk frame 3 is disposed at a front end of the chassis 25, 24 hard disk brackets 8 are disposed in the hard disk frame 3, and a 2.5-inch hard disk is mounted in each hard disk bracket 8; the case 25 can be simultaneously provided with 24 2.5-inch hard disks; the rear end of the hard disk frame 3 is provided with a hard disk back plate 21, the rear end of the hard disk back plate 21 is provided with an air cooling device 2, the air cooling device 2 comprises a fan frame 22, and 4 fan modules 23 are arranged in the fan frame 22; the rear end of the air cooling device 2 is provided with a power panel 4 and 4 groups of liquid cooling computing nodes 5, the air cooling device 2 and the liquid cooling computing nodes 5 are connected to the power panel 4, the power panel 4 is connected with a power module, the power module comprises a power frame 1, and 1+1 redundant power supplies 12 are installed in the power frame 1; the liquid cooling computing node 5 comprises a node side plate 14, a first end of the node side plate 14 is connected with a hard disk back plate 21, a second end of the node side plate 14 is connected with a main plate 15, and signals on the main plate 15 are connected and transmitted with the hard disk back plate 21 through the node side plate 14; an OCP network card 9 and a PCIE network card 10 are installed on the mainboard 15, the OCP network card 9 is installed at the rear end of the mainboard 15, and the PCIE network card 10 is located above the OCP network card 9; the liquid cooling heat dissipation device 16 is mounted on the main board 15, the liquid cooling heat dissipation device 16 is locked and attached to the main board 15 through screws, the liquid cooling heat dissipation device 16 comprises a liquid inlet pipe 11, the liquid inlet pipe 11 is fixed on the pipeline support 18, the liquid inlet pipe 11 is communicated with a hollow liquid cooling frame 27, the liquid cooling frame 27 is communicated with a first liquid outlet pipe 28, the first liquid outlet pipe 28 is connected with a hollow first heat conduction plate 20, the first heat conduction plate 20 is connected with a second liquid outlet pipe 29, the second liquid outlet pipe 29 is connected with a hollow second heat conduction plate 26, the second heat conduction plate 26 is connected with a third liquid outlet pipe 13, the third liquid outlet pipe 13 is fixed on the pipeline support 18, and the first heat conduction plate 20 and the second heat conduction plate 26 are both arranged in the middle of the liquid cooling frame 27; the liquid cooling medium enters through the liquid inlet pipe 11, then flows into the liquid cooling frame 27, flows into the first liquid outlet pipe 28 after passing through the liquid cooling frame 27, then sequentially passes through the first heat conduction plate 20, the second liquid outlet pipe 29 and the second heat conduction plate 26, and flows out through the third liquid outlet pipe 13. A voltage regulation module radiator 19 is arranged between the first heat conduction plate 20 and the second heat conduction plate 26, and memory radiators 17 are arranged on the left side and the right side of the liquid cooling frame 27; the first heat conducting plate 20 and the second heat conducting plate 26 are used for radiating heat for a CPU on the mainboard 15, the voltage regulating module radiator 19 is used for radiating heat for a CPU voltage regulating module, the memory radiator 17 is used for radiating heat for a memory on the mainboard 15, and the liquid cooling heat radiating device 16 can be used for radiating heat for high-power-consumption devices such as the CPU, the CPU voltage regulating module and the memory at the same time, so that the occupied space is small, and space resources in a server are effectively saved. The left end of the hard disk frame 3 is connected with a left box lug 6, the right end of the hard disk frame is connected with a right box lug 7, and the left box lug 6 and the right box lug 7 are respectively arranged on two sides of the case 25, so that the case 25 can be conveniently pulled and pulled in the cabinet; the top of the chassis 25 is assembled with the upper chassis cover 24, and after the components in the chassis 25 are assembled, the upper chassis cover 24 is assembled on the chassis 25 to prevent dust from falling into the interior of the chassis 25.
The liquid cooling computing node 5 in the server can be assembled in 2.5 disk and 3.5 disk cases, so that the cases with different configurations can be flexibly matched, and the server has strong compatibility.
The assembly process of the server is as follows: the hard disk back plate 21 is arranged in the case 25 and fixed on the case 25 through hand-screwed screws; the fan frame 22 is arranged in the case 25 and fixed on the case 25 through screws, and the 4 fan modules 23 are arranged in the fan frame 22, so that the fan frame is free of tool disassembly and assembly and convenient to maintain; the power panel 4 is arranged in the case 25 and is locked and fixed through screws, the assembly is firm, the 1+1 redundant power supply 12 is arranged in the power frame 1 and is fixed through a buckle, and the maintenance is convenient; the liquid cooling heat sink 16 is locked and fixed on the main board 15 in the case 25 by screws; finally, the case top 24 is assembled to the case 25.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention.
Claims (7)
1. A2U cold plate type liquid cooling server is characterized by comprising a case, wherein a hard disk frame is arranged at the front end of the case, a hard disk back plate is arranged at the rear end of the hard disk frame, an air cooling device is arranged at the rear end of the hard disk back plate, a power panel and a plurality of groups of liquid cooling computing nodes are arranged at the rear end of the air cooling device, the air cooling device and the liquid cooling computing nodes are both connected to the power panel, and the power panel is connected with a power module; the liquid cooling calculation node comprises a node side plate, a first end of the node side plate is connected with the hard disk back plate, a second end of the node side plate is connected with the main plate, and a liquid cooling heat dissipation device is installed on the main plate.
2. A 2U cold plate liquid cooling server according to claim 1, wherein a plurality of hard disk holders are provided in the hard disk frame, and hard disks are provided in the hard disk holders.
3. The 2U cold plate type liquid cooling server according to claim 1 or 2, wherein the liquid cooling heat sink comprises a liquid inlet pipe fixed on the pipe support, the liquid inlet pipe is communicated with the hollow liquid cooling frame, the liquid cooling frame is communicated with a first liquid outlet pipe, the first liquid outlet pipe is connected with a hollow first heat conducting plate, the first heat conducting plate is connected with a second liquid outlet pipe, the second liquid outlet pipe is connected with a hollow second heat conducting plate, the second heat conducting plate is connected with a third liquid outlet pipe, the third liquid outlet pipe is fixed on the pipe support, and the first heat conducting plate and the second heat conducting plate are both arranged in the middle of the liquid cooling frame; a voltage regulation module radiator is arranged between the first heat conduction plate and the second heat conduction plate, and memory radiators are arranged on the left side and the right side of the liquid cooling frame.
4. The 2U cold-plate liquid cooling server of claim 3, wherein an OCP network card and a PCIE network card are installed on the mainboard, the OCP network card is installed at the rear end of the mainboard, and the PCIE network card is located above the OCP network card.
5. A2U cold plate liquid cooling server according to claim 4, wherein the air cooling device comprises a fan frame, and a fan module is installed in the fan frame.
6. A2U cold plate type liquid cooling server according to claim 5, wherein the left end of the hard disk frame is connected with a left box lug, and the right end of the hard disk frame is connected with a right box lug.
7. A2U cold plate liquid cooling server as claimed in claim 6 wherein the top of the enclosure is fitted with an enclosure top cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122602514.2U CN216387952U (en) | 2021-10-27 | 2021-10-27 | 2U cold drawing formula liquid cooling server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122602514.2U CN216387952U (en) | 2021-10-27 | 2021-10-27 | 2U cold drawing formula liquid cooling server |
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| Publication Number | Publication Date |
|---|---|
| CN216387952U true CN216387952U (en) | 2022-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122602514.2U Active CN216387952U (en) | 2021-10-27 | 2021-10-27 | 2U cold drawing formula liquid cooling server |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115361825A (en) * | 2022-07-28 | 2022-11-18 | 苏州浪潮智能科技有限公司 | Air-cooling and liquid-cooling universal case structure |
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2021
- 2021-10-27 CN CN202122602514.2U patent/CN216387952U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115361825A (en) * | 2022-07-28 | 2022-11-18 | 苏州浪潮智能科技有限公司 | Air-cooling and liquid-cooling universal case structure |
| CN115361825B (en) * | 2022-07-28 | 2024-01-16 | 苏州浪潮智能科技有限公司 | Air-cooled and liquid-cooled universal case structure |
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