CN210897258U - Heat dissipation power component and electronic equipment - Google Patents

Abstract

The application discloses heat dissipation power component and electronic equipment, wherein, heat dissipation power component includes: a plurality of transistors arranged in parallel; the heat radiators and the transistors are alternately arranged side by side, and two sides of each transistor are arranged close to the heat radiators; and each transistor is in heat conduction contact with each radiator in a pressing mode through the flexible insulating heat conduction film. Because the transistor both sides all are compressed tightly the parcel by the radiator, have promoted the radiating effect, and directly compress tightly the laminating through flexible insulating heat conduction membrane with radiator and transistor, have saved the spring clamping for whole inside has almost no vacant space, very big reduction the subassembly volume, promote power density.

Description

Heat dissipation power component and electronic equipment

Technical Field

The utility model relates to an electronic equipment technical field, in particular to heat dissipation power component. The utility model discloses still relate to an electronic equipment who contains this heat dissipation power component.

Background

The power component in the electronic equipment mainly comprises a single-tube parallel module, wherein the single-tube parallel module comprises a transistor, a capacitor and a driving circuit board which are connected in parallel, and the conventional single-tube parallel module, particularly a high-power single-tube parallel module, needs to use a laminated bus to connect the transistor, the capacitor and the driving circuit board and is used for current transmission of a main power loop. The power density of the single-tube parallel module is related to the size, weight and layout of the parts, and the heat dissipation requirement of the single-tube parallel module influences the layout of the parts.

The heat dissipation form of the existing single-tube parallel module is as follows: the single-tube parallel module dissipates heat through the radiator, the ceramic wafer is placed between the radiator and the transistor, the transistor is compressed tightly by the elastic clamp, the transistor adopts a vertical layout with double-sided heat dissipation, and the elastic clamp occupies more space, so that the power density of the single-tube parallel module is reduced.

In summary, how to compress the space size of the single-tube parallel module and improve the heat dissipation efficiency of the single-tube parallel module becomes a problem to be solved urgently by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In view of this, an object of the present invention is to provide a heat dissipation power module to improve the heat dissipation efficiency of a single-tube parallel module while compressing the space size of the single-tube parallel module.

Another object of the present invention is to provide an electronic device including the heat dissipation power module, which can improve the heat dissipation efficiency of the single-tube parallel module when compressing the space size of the single-tube module.

In order to achieve the above purpose, the utility model provides the following technical scheme:

a heat dissipating power assembly comprising:

a plurality of transistors arranged in parallel;

the heat radiators and the transistors are alternately arranged side by side, and two sides of each transistor are arranged close to the heat radiators;

and each transistor is in heat conduction contact with each radiator in a pressing mode through the flexible insulating heat conduction film.

Preferably, in the above heat dissipation power module, the heat dissipation power module further includes a laminated bus bar, the laminated bus bar covers a plane where an end face of one side of the transistor, where the lead is provided, is located, the lead of the transistor passes through a through hole of the laminated bus bar and is connected with a bent pin of the laminated bus bar, and the heat sink and the laminated bus bar are in contact heat conduction through the flexible insulating heat conduction film.

Preferably, in the above heat dissipation power module, the flexible insulating heat conduction film is a U-shaped film, and each U-shaped film covers a surface of the heat spreader adjacent to the transistor and the laminated bus bar.

Preferably, in the above heat dissipation power module, at least one side surface of the flexible insulating heat conduction film is provided with an adhesive.

Preferably, in the above heat dissipation power module, the flexible insulating heat conduction film is a heating phase change material, and is tightly attached to the heat sink and the transistor by heating deformation.

Preferably, in the above heat dissipation power module, the laminated bus bar is further provided with a bent heat dissipation plate, and the bent heat dissipation plate is used for contacting with the outer side surface of the heat sink on one side edge to conduct heat through the flexible insulating heat conduction film.

Preferably, in the above heat dissipation power assembly, a capacitor is further included, the capacitor is located on one side of the heat sink away from the laminated bus bar, and the capacitor bus bar of the capacitor is in contact with the outer side surface of the heat sink located on the other side edge to conduct heat through the flexible insulating heat conduction film.

Preferably, in the above heat dissipation power assembly, the laminated bus bar includes at least three laminated bus bar layers, each of the bus bar layers is provided with a bending pin, and the bending pin includes a first bending pin connected to a lead of the transistor and a second bending pin connected to a capacitor bus bar of the capacitor.

Preferably, in the heat dissipation power module, the radiators arranged in parallel are connected in series through a water inlet pipe to form a water inlet channel, and the radiators arranged in parallel are connected in series through a water outlet pipe to form a water outlet channel.

The utility model also provides an electronic equipment, include as above arbitrary the heat dissipation power component.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model provides a heat dissipation power component, which comprises a plurality of transistors, a plurality of radiators and a flexible insulating heat conduction film, wherein the transistors and the radiators are all arranged in parallel and are alternately arranged side by side, and two sides of each transistor are arranged close to the radiators; each transistor is in heat conduction contact with each radiator in a pressing mode through a flexible insulating heat conduction film. Because the transistor both sides all are compressed tightly the parcel by the radiator, have promoted the radiating effect, and directly compress tightly the laminating through flexible insulating heat conduction membrane with radiator and transistor, have saved the spring clamping for whole inside has almost no vacant space, very big reduction the subassembly volume, promote power density.

The utility model provides an electronic equipment is owing to adopted the heat dissipation power component in this application, consequently, has the same technological effect with above, no longer gives unnecessary details here.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a heat dissipation power module according to an embodiment of the present invention;

fig. 2 is a schematic view of a split assembly structure of a heat dissipation power module according to an embodiment of the present invention;

fig. 3 is an exploded schematic view of a heat dissipation module according to an embodiment of the present invention;

fig. 4 is an exploded schematic view of a laminated bus bar of a heat dissipation power module according to an embodiment of the present invention.

The device comprises a laminated bus 1, a bent pin 11, a first bent pin 111, a second bent pin 112, a bent heat dissipation plate 12, a first bus 13, a second bus 14, a third bus 15, a capacitor 2, a capacitor bus 21, a transistor 3, a lead 31, a flexible insulating heat conduction film 4, a radiator 5, a water inlet pipe 51 and a water outlet pipe 52.

Detailed Description

The core of the utility model is to provide a heat dissipation power component promotes the radiating efficiency of the parallelly connected module of single tube when can compress the space size of the parallelly connected module of single tube.

The utility model also provides an electronic equipment who contains this heat dissipation power subassembly promotes the radiating efficiency of the parallelly connected module of single tube when can compress the space size of single tube module.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 3, an embodiment of the present invention provides a heat dissipation power assembly, which includes a plurality of transistors 3, a plurality of heat sinks 5, and a plurality of flexible insulating heat conduction films 4; the transistors 3 and the radiators 5 are arranged in parallel, the transistors 3 and the radiators 5 are alternately arranged side by side, two sides of each transistor 3 are arranged adjacent to the radiators 5, and the two radiators 5 are located on the outermost side; each transistor 3 is in pressed heat conducting contact with each heat sink 5 through a flexible insulating heat conducting film 4. The transistor 3, the heat sink 5 and the flexible insulating heat-conducting film 4 form a single-tube parallel module.

Because 3 both sides of transistor are all compressed tightly the parcel by radiator 5, have promoted the radiating effect, and directly compress tightly the laminating with radiator 5 and transistor 3 through flexible insulating thermal film 4, no longer have the ann rule problem, when having ensured reliable heat dissipation contact, saved the spring clamping for whole inside has almost no vacant space, very big reduction the subassembly volume, promote power density. And the flexible insulating heat-conducting film 4 can play a certain buffering effect, so that the damage of the shell of the transistor 3 caused by overlarge pressure is prevented.

In this embodiment, the heat dissipation power module further includes a laminated bus bar 1, the laminated bus bar 1 covers a plane where one side end surface of the transistor 3 where the lead 31 is disposed is located, fig. 1-3 show that the laminated bus bar 1 covers upper ends of the transistor 3 and the heat sink 5, the lead 31 of the transistor 3 passes through a through hole of the laminated bus bar 1 and is connected with the bent pin 11 of the laminated bus bar 1, and the heat sink 5 and the laminated bus bar 1 are in contact heat conduction through the flexible insulating heat conduction film 4. Specifically, the bending pin 11 of the laminated bus bar 1 is bent upward and is turned and bent from left to right, and the lead of the transistor 3 is parallel to the bending pin 11 and is connected into a whole by welding. The laminated bus 1 is pressed and contacted with the upper end of the radiator 5 for heat conduction through the flexible insulating heat conduction film 4, the radiating surface of the radiator 5 is further utilized, and the radiating effect of the radiating power component is improved.

Further, as shown in fig. 2 and 3, the flexible insulating heat-conducting film 4 is a U-shaped film, each U-shaped film covers the surface of the heat sink 5 adjacent to the transistor 3 and the laminated bus bar 1, that is, two side surfaces of the U-shaped film are respectively in contact with two side surfaces of the transistor 3, and the sealed end surface of the U-shaped film is in contact with the upper end of the heat sink 5. During assembly, the U-shaped film is directly sleeved outside the radiator 5 from the upper part of the radiator 5, then the transistor 3 is tightly pressed with the radiator 5, and the middle part of the U-shaped film is in heat conduction contact with the radiator 5 through the flexible insulating heat conduction film 4. So set up, make things convenient for the installation of flexible insulating thermal film 4 fixed, simple structure. Of course, the flexible insulating thermal conductive film 4 may have other shapes, such as a plate shape, one plate-shaped flexible insulating thermal conductive film 4 is disposed between each transistor 3 and each heat sink 5, and one plate-shaped flexible insulating thermal conductive film 4 is disposed between the upper end of each heat sink 5 and the laminated bus bar 1, which can also achieve the effect of saving space, but the installation and fixation are not as convenient as the U-shaped film.

Furthermore, in the present embodiment, at least one side surface of the flexible insulating thermal conductive film 4 is provided with an adhesive, and after the flexible insulating thermal conductive film 4 is mounted in place, the flexible insulating thermal conductive film 4 is fixedly adhered to the heat sink 3, the transistor 5 and the laminated bus bar 1, so that the fixing reliability of the flexible insulating thermal conductive film 4 is improved.

As optimizing, in this embodiment, flexible insulating thermal film 4 is heating phase change material, and flexible insulating thermal film 4 is through heating deformation and radiator 5 and the transistor 3 closely laminating, so set up, has further improved fixed fastness and has compressed the space.

As shown in fig. 2 to 4, in the present embodiment, the laminated bus bar 1 is further provided with a bent heat dissipation plate 12, and the bent heat dissipation plate 12 is used for heat conduction in contact with the outer side surface of the heat sink 5 located at one side edge through the flexible insulating heat conduction film 4. The heat radiation plate 12 is bent to conduct heat with the outside of the outermost heat sink 5, thereby further improving the heat radiation effect of the laminated bus bar 1 and further utilizing the heat radiation surface of the outermost heat sink 5. The flexible insulating heat conducting film 4 is used for enabling the bent heat dissipation plate 12 of the laminated bus 1 to be tightly attached to the radiator 5 for heat transfer, specifically, the flexible insulating heat conducting film 4 is a U-shaped film, the U-shaped film is sleeved at the upper end of the radiator 5, the two sides and the upper end of the radiator 5 are wrapped, and the bent heat dissipation plate 12 is tightly attached to one side surface of the U-shaped film exposed to the outside.

In the present embodiment, the heat dissipation power assembly further includes a capacitor 2, the capacitor 2 is located on one side of the heat sink 5 far away from the laminated bus bar 1, that is, as shown in fig. 1-3, the capacitor 2 is located at the lower end of the heat sink 5, and the capacitor bus bar 21 of the capacitor 2 is in contact with the outer side surface of the heat sink 5 located at the edge of the other side to conduct heat through the flexible insulating heat conduction film 4. The capacitor bus 21 is bent upwards relative to the capacitor 2, the top of the capacitor bus 21 is provided with a welding pin, and the welding pin is connected with the bent pin 11 of the laminated bus 1 in a welding mode. Alternatively, the capacitor bus bar 21 may be connected to the laminated bus bar 1 by a screw, but the stray inductance is relatively large. The capacitor bus 21 is parallel to the outer side surface of the radiator 5, and heat is conducted through the capacitor bus 21 and the outer side surface of the radiator 5 located on the other outermost side, so that the heat dissipation effect of the capacitor 2 is improved, and the utilization rate of the heat dissipation surface of the radiator 5 is further improved. Make electric capacity generating line 21 and radiator 5 paste through flexible insulating heat conduction membrane 4 and tightly conduct heat, specifically, flexible insulating heat conduction membrane 4 is the U-shaped membrane, and the U-shaped membrane overlaps in the upper end of radiator 5, wraps up the both sides and the upper end of radiator 5, and electric capacity generating line 21 pastes tightly with the one side surface of the U-shaped membrane that exposes in the outside.

The heat radiator 5 of the heat dissipation power component maximizes the heat dissipation utilization rate, and almost all devices of the power loop can have heat dissipation effects, so that the temperature rise of the whole heat dissipation power component is reduced, and the cost of the whole system can be indirectly reduced. Materials of the laminated bus 1, the input and output copper bars and the capacitor core package can be properly reduced, and the weight and the cost of a product are reduced; because the laminated bus bar 1 is directly attached to the radiator 5, the length of the lead 31 of the transistor 3 can be reduced, the transistor 3 with shorter lead length can be compatible, and the application range of products is expanded.

As shown in fig. 2, the assembly process of the heat dissipation power assembly is as follows:

during final assembly, a single-tube parallel module formed by compressing the transistor 3, the radiator 5 and the flexible insulating heat-conducting film 4 is firstly arranged on a positioning plastic piece, the capacitor 2 is pushed into the plastic piece from bottom to top, and then the radiating surface of the capacitor bus 21 is attached to and compressed on the flexible insulating heat-conducting film 4 from right to left and is locked. And then, the laminated bus 1 is placed on the single-tube parallel module from top to bottom, the lead 31 of the single crystal tube 3 and the capacitance bus 21 penetrate through the open hole on the laminated bus 1, and then the bent heat dissipation plate 12 of the laminated bus 1 is attached to and pressed against the flexible insulating heat conduction film 4 on the other side of the single-tube parallel module from left to right, so that the assembly is completed.

As shown in fig. 4, the laminated bus bar 1 is optimized, and in the present embodiment, the laminated bus bar 1 includes at least three laminated bus bar layers, each of which is provided with the bending pin 11, and the bending pin 11 includes a first bending pin 111 connected to the lead 31 of the transistor 3 and a second bending pin 112 connected to the capacitor bus bar 21 of the capacitor 2. The three layers of bus layers are taken as an example for explanation, the three layers of bus layers are a first bus layer 13, a second bus layer 14 and a third bus layer 15 respectively, wherein the first bus layer 13 and the second bus layer 14 are both direct current bus layers, the third bus layer 15 is an alternating current bus layer, and the direct current bus layer and the alternating current bus layer are connected to the input end and the output end of the electronic device respectively and serve as one of the most main current transmission devices of the power circuit. The first and second bus layers 13 and 14 are provided with first and second bending pins 111 and 112, and the third bus layer 15 is provided with only the first bending pins 111. The first bent leg 111 is welded to the lead wire 31 of the transistor 3, and the second bent leg 112 is welded to the capacitor bus bar 21. Of course, the laminated bus bar 1 may further include four, five, and more bus bar layers as needed.

Further, in the present embodiment, the bending direction of each bending pin 11 is the same. Namely, the bending directions of the first bending pin 111 and the second bending pin 112 on each layer of bus layer are the same, and because the bending directions of all the bending pins 11 on the laminated bus 1 are the same, when the laminated bus 1 is moved to enable the bent radiating surface 12 to be attached to the radiator 5, all the bending pins 11 on the laminated bus 1 are attached to the corresponding lead 31 of the transistor 3 or the corresponding pins of the capacitor bus 21, and then the next welding process can be performed, so that the welding operation is convenient.

As shown in fig. 2 and fig. 3, in the present embodiment, the radiators 5 arranged in parallel are connected in series through a water inlet pipe 51 to form a water inlet channel, and the radiators 5 arranged in parallel are connected in series through a water outlet pipe 52 to form a water outlet channel. After the radiators 5 are connected through the water inlet pipe 51 and the water outlet pipe 52, a parallel fluid channel is formed, which is convenient for the fluid of the radiators 5 to circulate and radiate integrally. Of course, each radiator 5 can also be in individual fluid communication with the outside. The heat sink 5 is preferably a closed flat tube structure, the inside of the heat sink 5 is used for circulating liquid, and the inside of the heat sink 5 is provided with heat dissipation teeth, and specifically, the heat dissipation teeth can be a double-sided heat dissipation tooth structure or a single-sided heat dissipation tooth structure.

The utility model provides a transistor 3 is the IGBT preferably, and the tight heat radiation structure of double-sided water-cooling single tube IGBT parallel structure still can be applicable to the both sides of transistor 3 clamp.

Based on the heat dissipation power component described in any of the above embodiments, the embodiment of the present invention further provides an electronic device, which includes the heat dissipation power component described in any of the above embodiments.

Because 3 both sides of transistor are all compressed tightly the parcel by radiator 5, have promoted the radiating effect, and directly compress tightly the laminating with radiator 5 and transistor 3 through flexible insulating thermal film 4, when having ensured reliable heat dissipation contact, saved the spring clamping for whole inside has almost no vacant space, very big reduction the subassembly volume, promotes power density. And the flexible insulating heat-conducting film can play a certain buffering effect, and prevent that the too big casing of transistor 3 that leads to of pressure from being damaged. The heat radiator 5 of the electronic equipment has the maximum heat radiation utilization rate, and can play a heat radiation effect for almost all devices of a power loop, thereby reducing the temperature rise of the whole heat radiation power component and indirectly reducing the cost of the whole system. Materials of the laminated bus 1, the input and output copper bars and the capacitor core package can be properly reduced, and the weight and the cost of a product are reduced; because the laminated bus bar 1 is directly attached to the radiator 5, the length of the lead 31 of the transistor 3 can be reduced, the transistor 3 with shorter lead length can be compatible, and the application range of products is expanded.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A heat dissipating power module, comprising:

a plurality of transistors (3) arranged in parallel;

a plurality of radiators (5) arranged in parallel, wherein the radiators (5) and the transistors (3) are alternately arranged side by side, and two sides of each transistor (3) are arranged adjacent to the radiators (5);

and the transistors (3) are in heat conduction contact with the radiators (5) through the flexible insulating heat conduction film (4).

2. The heat dissipation power assembly according to claim 1, further comprising a laminated bus bar (1), wherein the laminated bus bar (1) covers a plane of a side end face of the transistor (3) where the lead (31) is disposed, the lead (31) of the transistor (3) passes through a through hole of the laminated bus bar (1) and is connected with the bent pin (11) of the laminated bus bar (1), and the heat sink (5) and the laminated bus bar (1) are in contact heat conduction through the flexible insulating heat conduction film (4).

3. The heat dissipating power assembly of claim 2, wherein the flexible insulating thermally conductive film (4) is a U-shaped film, each covering a surface of the heat spreader (5) immediately adjacent to the transistor (3) and the laminated bus bar (1).

4. The heat dissipating power assembly of claim 1, wherein at least one side surface of the flexible insulating and heat conducting film (4) is provided with an adhesive glue.

5. The heat dissipating power assembly of claim 1, wherein the flexible insulating heat conducting film (4) is a heating phase change material, and is closely attached to the heat sink (5) and the transistor (3) by deformation under heating.

6. The heat dissipating power assembly according to claim 2, wherein the laminated bus bar (1) is further provided with a bent heat dissipating plate (12), the bent heat dissipating plate (12) being adapted to conduct heat in contact with an outer side surface of the heat sink (5) at one side edge through the flexible insulating heat conductive film (4).

7. The heat dissipating power assembly of claim 6, further comprising a capacitor (2), wherein the capacitor (2) is located on one side of the heat sink (5) away from the laminated bus bar (1), and wherein the capacitor bus bar (21) of the capacitor (2) is in contact with the outer side surface of the heat sink (5) located on the other side edge to conduct heat through the flexible insulating heat conducting film (4).

8. The heat dissipating power assembly of claim 7, wherein the laminated busbar (1) comprises at least three superimposed busbar layers, each of which is provided with bending pins (11), the bending pins (11) comprising a first bending pin (111) connected to the lead (31) of the transistor (3) and a second bending pin (112) connected to the capacitor busbar (21) of the capacitor (2).

9. The heat dissipating power module of any one of claims 1 to 8, wherein the heat sinks (5) arranged in parallel are connected in series through a water inlet pipe (51) to form a water inlet passage, and the heat sinks (5) arranged in parallel are connected in series through a water outlet pipe (52) to form a water outlet passage.

10. An electronic device comprising the heat dissipating power module according to any one of claims 1 to 9.

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