CN210897230U

CN210897230U - Wafer transmission device of semiconductor machine

Info

Publication number: CN210897230U
Application number: CN201921632740.1U
Authority: CN
Inventors: 王天奇
Original assignee: Tianjin Xiaochuan Filter Equipment Development Co ltd
Current assignee: Tianjin Xiaochuan Filter Equipment Development Co ltd
Priority date: 2019-09-28
Filing date: 2019-09-28
Publication date: 2020-06-30
Anticipated expiration: 2029-09-28

Abstract

The utility model discloses a semiconductor board wafer transmission, including base, motor and belt pulley, the inside fixed mounting in left side of base has the motor, and the output fixed mounting of motor has the belt pulley, conveyer has been cup jointed to the outer wall of belt pulley, the right-hand member fixed mounting of belt pulley has the connecting rod, the top both sides all fixed mounting of base has the bracing piece, and the inside of bracing piece has seted up logical groove, the inside of leading to the groove is inserted and is equipped with the inserted bar, the left end fixed mounting of inserted bar has the commentaries on classics piece. The utility model discloses be provided with locating plate and foam-rubber cushion, the locating plate with carry out the positioning action to the wafer, make the driven precision of wafer more increase, the inserted bar can be adjusted the locating plate, the wafer of convenient equidimension not advances line location transmission, the connecting rod can concentrate on conveyer's inside with the heat that the motor produced, makes heat transfer to conveyer's surface, makes the wafer can not receive the cold broken condition of emergence.

Description

Wafer transmission device of semiconductor machine

Technical Field

The utility model relates to a transmission technical field specifically is a semiconductor board wafer transmission.

Background

With the continuous development of the society and the continuous progress of the industry, a wafer is a product in the semiconductor industry, and generally, in the transmission of the wafer, a mechanical arm and an inductor are needed to position and transmit the wafer so as to transmit the wafer to a specified position.

However, in the conventional wafer transmission, the wafer is often crushed and damaged by the mechanical arm when being positioned, which wastes the production cost and is inconvenient to use, so that a wafer transmission device of a semiconductor machine is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor board wafer transmission to the wafer that proposes in solving above-mentioned background art takes place damaged and cracked condition easily in the transmission, has wasted manufacturing cost, uses inconvenient scheduling problem.

In order to achieve the above object, the utility model provides a following technical scheme: a wafer transmission device of a semiconductor machine table comprises a base, a motor and a belt pulley, wherein the motor is fixedly installed inside the left side of the base, the belt pulley is fixedly installed at the output end of the motor, a conveying belt is sleeved on the outer wall of the belt pulley, a connecting rod is fixedly installed at the right end of the belt pulley, supporting rods are fixedly installed on two sides of the top end of the base, a through groove is formed in each supporting rod, an inserting rod is inserted into each through groove, a rotating block is fixedly installed at the left end of each inserting rod, a fixing rod is inserted into the top end of each supporting rod, a fixing block is fixedly installed at the top end of each fixing rod, a spring is sleeved on the outer wall of each fixing rod, a fixing groove is formed in the outer wall of each inserting rod, a positioning plate is fixedly installed at the top, the bottom fixed mounting of locating plate has the slider, the spout has been seted up on the top of base.

Preferably, the belt pulleys are provided with two groups, the connecting rods are provided with six groups, and the two ends of the six groups of connecting rods are fixedly welded with the belt pulleys.

Preferably, the outer wall of inserted bar is provided with the external screw thread, the inside that leads to the groove is provided with the internal thread, inserted bar and logical groove threaded connection.

Preferably, the diameter of the outer wall of the fixing rod is equal to the diameter of the inner wall of the fixing groove, the fixing rod is inserted into the fixing groove, and the fixing rod and the fixing groove form an embedded structure.

Preferably, one end of the spring is fixedly welded with the fixing rod, the other end of the spring is fixedly welded with the supporting rod, and the spring and the fixing block form an elastic structure.

Preferably, the diameter of the outer wall of the sliding block is equal to the diameter of the inner wall of the sliding groove, the sliding block is inserted into the sliding groove, and the sliding block and the sliding groove form a sliding structure.

Compared with the prior art, the beneficial effects of the utility model are that: this semiconductor board wafer transmission is provided with locating plate and foam-rubber cushion, the locating plate with carry out the positioning action to the wafer, make the driven precision of wafer more increase, the inserted bar can be adjusted the locating plate, make things convenient for the not wafer of equidimension to carry out the transmission of fixing a position, the connecting rod can concentrate the heat that the motor produced in conveyer's inside, make heat transfer to conveyer's surface, make the wafer can not receive the cold condition of taking place the breakage.

(1) The device is provided with locating plate and foam-rubber cushion, and the wafer is at the transmission in-process, and the wafer enters into in the middle of two sets of locating plates, and the removal position of locating plate control wafer afterwards, and then fixes a position the transmission of wafer, makes the precision of wafer in the transmission in-process better afterwards, convenient to use.

(2) The device is provided with the inserted bar, the pulling fixed block, make the fixed block drive the dead lever and remove, make the dead lever break away from the inside of fixed slot afterwards, rotate the commentaries on classics piece afterwards, the commentaries on classics piece drives the inserted bar and rotates, make the inserted bar remove through helicitic texture afterwards, and then drive the locating plate and remove, conveniently adjust the position of locating plate, can adjust according to the wafer of equidimension not, make things convenient for the wafer of equidimension not to carry out the transmission location, and easy operation, convenient to use.

(3) The device is provided with the motor, and the motor is at the during operation, because the heat transfer that the friction produced to the top of connecting rod, makes the heat concentrate on conveyer's inside afterwards, and the heat transfer on the connecting rod is to conveyer's surface afterwards, when making the wafer convey on conveyer, can not lead to the impaired condition of wafer because of catching a cold, has reduced the driven damage rate of wafer, makes the manufacturing cost reduction of wafer, convenient to use.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

fig. 2 is a schematic side view of the cross-sectional structure of the present invention;

fig. 3 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.

In the figure: 1. a base; 2. a motor; 3. a belt pulley; 4. a conveyor belt; 5. a connecting rod; 6. a support bar; 7. rotating the block; 8. inserting a rod; 9. a slot; 10. positioning a plate; 11. a sponge cushion; 12. fixing the rod; 13. a fixed block; 14. a spring; 15. fixing grooves; 16. a through groove; 17. a slider; 18. a chute.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides an embodiment: a semiconductor machine wafer transmission device comprises a base 1, a motor 2 and a belt pulley 3, wherein the motor 2 is fixedly installed inside the left side of the base 1, the belt pulley 3 is fixedly installed at the output end of the motor 2, the type of the motor 2 can be Y90S-2, a transmission belt 4 is sleeved on the outer wall of the belt pulley 3, connecting rods 5 are fixedly installed at the right end of the belt pulley 3, two groups of belt pulleys 3 are arranged, six groups of connecting rods 5 are arranged, two ends of the six groups of connecting rods 5 are fixedly welded with the belt pulley 3, heat generated by friction is transmitted to the upper portion of the connecting rods 5, then the heat is concentrated inside the transmission belt 4, and then the heat on the connecting rods 5 is transmitted to the surface of the transmission belt 4, so that when wafers are transmitted on the transmission belt 4, the wafer damage caused by cooling is avoided, and the wafer transmission damage rate is reduced, the production cost of the wafer is reduced, and the use is convenient.

All fixed mounting in base 1's top both sides has bracing piece 6, and logical groove 16 has been seted up to the inside of bracing piece 6, the inside of leading to groove 16 is inserted and is equipped with inserted bar 8, the left end fixed mounting of inserted bar 8 has commentaries on classics piece 7, the outer wall of inserted bar 8 is provided with the external screw thread, the inside that leads to groove 16 is provided with the internal thread, inserted bar 8 and the 16 threaded connection that leads to the groove, rotate commentaries on classics piece 7, commentaries on classics piece 7 drives inserted bar 8 and rotates, through the helicitic texture, can make inserted bar 8 remove in the inside that leads to groove 16, and then make inserted bar 8 drive locating plate 10 and remove, can change the position of locating plate 10, make things convenient for locating plate 10 to carry out.

The top of bracing piece 6 is inserted and is equipped with dead lever 12, and the top fixed mounting of dead lever 12 has fixed block 13, spring 14 has been cup jointed to the outer wall of dead lever 12, spring 14's one end and the fixed welding of dead lever 12, spring 14's the other end and the fixed welding of bracing piece 6, spring 14 constitutes elastic construction with fixed block 13, pulling fixed block 13, fixed block 13 drives dead lever 12 and removes, make dead lever 12 break away from inside fixed slot 15 afterwards, and then can make inserted bar 8 rotate, adjust locating plate 10 afterwards, after the regulation is accomplished, loosen fixed block 13, spring 14 drives the inside that dead lever 12 embedded into fixed slot 15 and fixes, and then make inserted bar 8 unable rotation, thereby fix the position of locating plate 10, and is simple in operation and convenient to use.

Fixed slot 15 has been seted up to the outer wall of inserted bar 8, the outer wall diameter of dead lever 12 equals with the inner wall diameter size of fixed slot 15, dead lever 12 inserts the inside of establishing at fixed slot 15, dead lever 12 constitutes embedded structure with fixed slot 15, when dead lever 12 embedding is in the inside of fixed slot 15, inserted bar 8 can't rotate, and then make locating plate 10 can't remove, can carry out the fixed position transmission to the wafer, high durability and convenient use, break away from the inside of fixed slot 15 when dead lever 12, can make inserted bar 8 rotate, and then can adjust the position of locating plate 10, make things convenient for locating plate 10 to carry out the transmission location according to the wafer of equidimension not, and is simple to operate, and convenient to.

Motor 2's top fixed mounting has locating plate 10, and slot 9 has been seted up on the left side of locating plate 10, the right-hand member fixed mounting of locating plate 10 has foam-rubber cushion 11, the bottom fixed mounting of locating plate 10 has slider 17, spout 18 has been seted up on base 1's top, slider 17's outer wall diameter equals with the inner wall diameter size of spout 18, slider 17 inserts the inside of establishing at spout 18, slider 17 constitutes the slidingtype structure with spout 18, it changes piece 7 to rotate, can make locating plate 10 adjust, locating plate 10 is when removing, the slider 17 at locating plate 10 both ends slides in the inside of spout 18, and then fix the direction of locating plate 10, avoid the condition that locating plate 10 takes place the slope, make locating plate 10's location transmission effect better, and is simple in operation, high durability and convenient.

The working principle is as follows: when the device is used, the wafer enters the upper part of the conveying belt 4, the motor 2 starts to work through the power supply of a semiconductor machine, the motor 2 drives the belt pulley 3 to rotate, the belt pulley 3 drives the conveying belt 4 to rotate, so that the wafer on the conveying belt 4 moves, then the fixed block 13 is pulled, the fixed block 13 drives the fixed rod 12 to move, then the fixed rod 12 is separated from the inside of the fixed groove 15, then the rotating block 7 is rotated, the rotating block 7 drives the inserted rod 8 to rotate, then the inserted rod 8 moves through the threaded structure, so that the positioning plate 10 is driven to move, the position of the positioning plate 10 is convenient to adjust, the device can adjust according to wafers with different sizes, the wafers with different sizes can be conveniently positioned in a transmission way, the wafer enters the middle of the two groups of positioning plates 10, and then the positioning plate 10 controls the moving direction of the wafer, and then the transmission of the wafer is positioned, and then the precision of the wafer in the transmission process is better, and the use is convenient.

When the motor 2 works, heat generated by friction is transferred to the upper part of the connecting rod 5, then the heat is concentrated in the conveying belt 4, and then the heat on the connecting rod 5 is transferred to the surface of the conveying belt 4, so that the wafer cannot be damaged due to cooling when being conveyed on the conveying belt 4, the damage rate of the wafer transmission is reduced, the production cost of the wafer is reduced, and the use is convenient.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a semiconductor board wafer transmission, includes base (1), motor (2) and belt pulley (3), its characterized in that: the automatic belt conveyor is characterized in that a motor (2) is fixedly mounted inside the left side of a base (1), a belt pulley (3) is fixedly mounted at the output end of the motor (2), a conveying belt (4) is sleeved on the outer wall of the belt pulley (3), a connecting rod (5) is fixedly mounted at the right end of the belt pulley (3), supporting rods (6) are fixedly mounted on two sides of the top end of the base (1), a through groove (16) is formed in the supporting rods (6), an inserting rod (8) is inserted into the through groove (16), a rotating block (7) is fixedly mounted at the left end of the inserting rod (8), a fixing rod (12) is inserted into the top end of the supporting rod (6), a fixing block (13) is fixedly mounted at the top end of the fixing rod (12), a spring (14) is sleeved on the outer wall of the fixing rod (12), and a, the top fixed mounting of motor (2) has locating plate (10), and slot (9) have been seted up in the left side of locating plate (10), the right-hand member fixed mounting of locating plate (10) has foam-rubber cushion (11), the bottom fixed mounting of locating plate (10) has slider (17), spout (18) have been seted up on the top of base (1).

2. The apparatus of claim 1, wherein: the belt pulley (3) is provided with two sets, the connecting rod (5) is provided with six sets, and six sets the both ends of connecting rod (5) all with belt pulley (3) fixed weld.

3. The apparatus of claim 1, wherein: the outer wall of inserted bar (8) is provided with the external screw thread, the inside that leads to groove (16) is provided with the internal thread, inserted bar (8) and logical groove (16) threaded connection.

4. The apparatus of claim 1, wherein: the diameter of the outer wall of the fixing rod (12) is equal to the diameter of the inner wall of the fixing groove (15), the fixing rod (12) is inserted into the fixing groove (15), and the fixing rod (12) and the fixing groove (15) form an embedded structure.

5. The apparatus of claim 1, wherein: one end of the spring (14) is fixedly welded with the fixing rod (12), the other end of the spring (14) is fixedly welded with the supporting rod (6), and the spring (14) and the fixing block (13) form an elastic structure.

6. The apparatus of claim 1, wherein: the diameter of the outer wall of the sliding block (17) is equal to the diameter of the inner wall of the sliding groove (18), the sliding block (17) is inserted into the sliding groove (18), and the sliding block (17) and the sliding groove (18) form a sliding structure.