CN210867498U - Power adjusting device, motor control circuit and air conditioner - Google Patents

Abstract

The utility model provides a power adjusting device, motor control circuit and air conditioner. Wherein, power adjusting device includes: a circuit board; the power correction circuit is arranged on the circuit board and is configured to perform power correction on electric energy of the external alternating-current power supply; the inverter circuit is arranged on the circuit board, connected to the power correction circuit and configured to acquire power-corrected electric energy and respond to a control signal to control the load according to the electric energy; the packaging frame is connected with the circuit board, the packaging frame is configured to package the power correction circuit and the inverter circuit which are arranged on the circuit board, the circuit board is provided with a plurality of packaging pins, and any packaging pin is connected with the power correction circuit or the inverter circuit. The power correction circuit and the inverter circuit are integrally packaged, so that on one hand, the cost of independent packaging is saved, the total area of the electric control board is reduced, on the other hand, the exposed connection points of the circuit are reduced, and the reliability of the circuit is improved.

Description

Power adjusting device, motor control circuit and air conditioner

Technical Field

The utility model relates to an air conditioner technical field particularly, relates to a power adjusting device, motor control circuit and air conditioner.

Background

In the control of the air conditioner, in order to meet the requirements of harmonic waves and power factors on the input side, a PFC (power factor Correction) circuit is required to improve the harmonic waves and the power factors, and in order to control the variable-frequency operation of the compressor, the variable-frequency output needs to be realized through an inverter circuit. In the related art, these circuits use discrete devices, which occupy a large area on the circuit board, increasing the difficulty of the application end.

SUMMERY OF THE UTILITY MODEL

The present invention aims at least solving one of the technical problems existing in the prior art or the related art.

To this end, an aspect of the present invention is to provide a power regulating device.

Another aspect of the present invention is to provide a motor control circuit.

Yet another aspect of the present invention is to provide an air conditioner.

In view of this, according to an aspect of the present invention, there is provided a power adjusting apparatus, including: a circuit board; the power correction circuit is arranged on the circuit board and is configured to perform power correction on electric energy of the external alternating-current power supply; the inverter circuit is arranged on the circuit board, connected to the power correction circuit and configured to acquire power-corrected electric energy and respond to a control signal to control the load according to the electric energy; the packaging frame is connected with the circuit board, the packaging frame is configured to package the power correction circuit and the inverter circuit which are arranged on the circuit board, the circuit board is provided with a plurality of packaging pins, and any packaging pin is connected with the power correction circuit or the inverter circuit.

The utility model provides a power regulating device utilizes the encapsulation frame to encapsulate power correction circuit, inverter circuit on the circuit board, and the circuit board is provided with a plurality of encapsulation pins, and the one end and the power correction circuit or the inverter circuit of arbitrary encapsulation pin are connected, and the other end can with external contact. The technical scheme of the utility model, power correction circuit and inverter circuit are encapsulated in integration has saved the cost of independent encapsulation on the one hand, has reduced the total area of automatically controlled board. On the other hand, the exposed connecting points of the circuit are reduced, and the reliability of the circuit is improved.

According to the utility model discloses an above-mentioned power adjusting device can also have following technical characterstic:

in the above technical solution, the method further comprises: the first control circuit is arranged on the circuit board and packaged by the packaging frame, connected to the power correction circuit and connected with an external controller through packaging pins.

In the technical scheme, the first control circuit is connected with the power correction circuit and the external controller, and the power correction circuit is controlled to work by receiving a control signal of the external controller, so that the commercial power current changes along with the voltage, the current and the voltage keep the same phase, and no obvious waveform distortion exists any more, so that the power factor of the circuit is close to 1.

In any of the above technical solutions, the method further includes: and the second control circuit is arranged on the circuit board and packaged by the packaging frame, is connected to the inverter circuit and is connected with the external controller through a packaging pin.

In the technical scheme, the second control circuit is connected to the inverter circuit and the external controller, and the inverter circuit is controlled to work by receiving a control signal of the external controller, so that direct current is converted into alternating current for a load to use.

In any one of the above technical solutions, the power correction circuit includes: the first transistor circuit is connected to the first control circuit; the second transistor circuit is connected with the inverter circuit, the first transistor circuit and the first control circuit; a first switching device connected to the first transistor circuit and the first power supply package pin; a second switching device connected to the first switching device, the second transistor circuit, and the first power supply package pin.

In the technical scheme, as the boost active PFC in the related art needs to be connected into a rectifier bridge, obvious conduction loss exists, the overall efficiency of the circuit is reduced, under the condition of the same power and full load, the lower the input voltage is, the input current is increased, the conduction loss on a current path is larger, and higher heating is caused. Utility model's power correction circuit is totem pole bridgeless PFC, and totem pole bridgeless PFC is a low-loss circuit topology to power adjusting device's loss has been reduced.

The first switching device and the second switching device may be diodes or switching tubes.

In any one of the above aspects, the first transistor circuit includes: the grid electrode of the first transistor is connected to the first control circuit, the source electrode of the first transistor is connected to the first voltage input packaging pin, and the drain electrode of the first transistor is connected to the second power supply packaging pin; and the anode of the first diode is connected with the source electrode of the first transistor, and the cathode of the first diode is connected with the drain electrode of the first transistor.

In any of the above aspects, the second transistor circuit includes: a gate of the second transistor is connected to the first control circuit, a source of the second transistor is connected to a drain of the first transistor and the second power supply packaging pin, and a drain of the second transistor is connected to the inverter circuit and the second voltage input packaging pin; and the anode of the second diode is connected to the source electrode of the second transistor, and the cathode of the second diode is connected to the drain electrode of the second transistor.

In the technical solution, when the PFC operates in a Current Continuous Mode (CCM), a parasitic body diode of a MOS (Metal oxide semiconductor) transistor is required to provide a freewheeling path. Generally, the diode characteristics of the MOS tube are very poor, a large reverse recovery process and a large reverse recovery charge exist, and the MOS tube can be burnt when the circuit runs in a CCM. Therefore the utility model discloses well first transistor and second transistor are the GaN transistor, and the GaN transistor is for the Si MOSFET among the correlation technique, and on-resistance is littleer, and break-make speed is faster, is applicable to higher operating frequency to parasitic capacitance is also littleer, has littleer switching loss. More importantly, the reverse recovery charge of the GaN transistor is only dozens of nano coulombs, the reverse recovery time is very short, and the GaN transistor is suitable for being applied to a totem-pole bridgeless PFC circuit.

In addition, the gate threshold voltage of the GaN transistor is small, and it is easily interfered by the circuit to cause misconduction, thereby burning the device. In the related art circuit, each GaN transistor is individually packaged and then soldered to an electronic control board, so that long wires are inevitably arranged among devices, parasitic inductance and capacitance are increased, and oscillation is large in the switching process. For devices such as GaN transistors that are sensitive, these oscillations may cause misconduction. The utility model discloses in through the encapsulation of integration and bind the line and connect, contract each GaN transistor and with the distance between the control chip to the shortest, reduce parasitic parameter by a wide margin to it is more stable to make the system operation.

In any one of the above technical solutions, the first control circuit includes: the first sub-control circuit is connected to the grid electrode of the first transistor and is connected with an external controller through a first control packaging pin; and the second sub-control circuit is connected to the grid electrode of the second transistor and is connected with an external controller through a second control packaging pin.

In the technical scheme, the first transistor and the second transistor are controlled by different control circuits, so that the problem of inaccurate control caused by mutual influence is avoided.

In any one of the above technical solutions, the inverter circuit includes: a base electrode of the third transistor circuit is connected to the first output end of the second control circuit, and a collector electrode of the third transistor circuit is connected to the power correction circuit; a base electrode of the fourth transistor circuit is connected to the second output end of the second control circuit, and a collector electrode of the fourth transistor circuit is connected to the power correction circuit; a base electrode of the fifth transistor circuit is connected to the third output end of the second control circuit, and a collector electrode of the fifth transistor circuit is connected to the power correction circuit; a base electrode of the sixth transistor circuit is connected to the fourth output end of the second control circuit, and a collector electrode of the sixth transistor circuit is connected to an emitter electrode of the third transistor circuit; a base electrode of the seventh transistor circuit is connected to the fifth output end of the second control circuit, and a collector electrode of the seventh transistor circuit is connected to an emitter electrode of the fourth transistor circuit; and a base of the eighth transistor circuit is connected to the sixth output end of the second control circuit, and a collector of the eighth transistor circuit is connected to an emitter of the fifth transistor circuit.

In the technical scheme, the inverter circuit is a three-phase bridge inverter circuit, and converts direct current output by the power correction circuit into alternating current for load use.

In any of the above technical solutions, an emitter of the sixth transistor circuit is connected to the first voltage reference package pin; an emitter of the seventh transistor circuit is connected to the second voltage reference package pin; the emitter of the eighth transistor circuit is connected to the third voltage reference package pin.

In the technical scheme, a first voltage reference packaging pin, a second voltage reference packaging pin and a third voltage reference packaging pin are respectively used as three-phase low-voltage reference ends.

In any of the above technical solutions, an input terminal of the second control circuit is connected to a third control package pin; a seventh output end of the second control circuit is connected with an emitter of the third transistor circuit, a collector of the sixth transistor circuit and a packaging pin of a negative end of the first power supply; an eighth output end of the second control circuit is connected with an emitter of the fourth transistor circuit, a collector of the seventh transistor circuit and a packaging pin of a negative end of the second power supply; and a ninth output end of the second control circuit is connected with an emitter of the fifth transistor circuit, a collector of the eighth transistor circuit and a packaging pin of a negative end of the third power supply.

In the technical scheme, the second control circuit comprises six input ends which are correspondingly connected with six third control packaging pins, and the six third control packaging pins are respectively used as the input ends of a three-phase upper bridge arm and a three-phase lower bridge arm of the power regulating device.

In any of the above technical solutions, the tenth output terminal of the second control circuit is connected to the positive terminal package pin of the first power supply; an eleventh output end of the second control circuit is connected to a second power supply positive end packaging pin; and the twelfth output end of the second control circuit is connected to the packaging pin of the positive end of the third power supply.

In the technical scheme, a first power supply positive terminal packaging pin, a second power supply positive terminal packaging pin and a third power supply positive terminal packaging pin are respectively used as the high-voltage area power supply positive terminals of the power regulating device.

In any of the above technical solutions, the third transistor circuit includes a first insulated gate bipolar transistor and a first fast recovery diode, a cathode of the first fast recovery diode is connected to a collector of the first insulated gate bipolar transistor, and an anode of the first fast recovery diode is connected to an emitter of the first insulated gate bipolar transistor; the fourth transistor circuit comprises a second insulated gate bipolar transistor and a second fast recovery diode, wherein the cathode of the second fast recovery diode is connected with the collector of the second insulated gate bipolar transistor, and the anode of the second fast recovery diode is connected with the emitter of the second insulated gate bipolar transistor; the fifth transistor circuit comprises a third insulated gate bipolar transistor and a third fast recovery diode, wherein the cathode of the third fast recovery diode is connected with the collector of the third insulated gate bipolar transistor, and the anode of the third fast recovery diode is connected with the emitter of the third insulated gate bipolar transistor; the sixth transistor circuit comprises a fourth insulated gate bipolar transistor and a fourth fast recovery diode, wherein the cathode of the fourth fast recovery diode is connected with the collector of the fourth insulated gate bipolar transistor, and the anode of the fourth fast recovery diode is connected with the emitter of the fourth insulated gate bipolar transistor; the seventh transistor circuit comprises a fifth insulated gate bipolar transistor and a fifth fast recovery diode, wherein the cathode of the fifth fast recovery diode is connected with the collector of the fifth insulated gate bipolar transistor, and the anode of the fifth fast recovery diode is connected with the emitter of the fifth insulated gate bipolar transistor; the eighth transistor circuit comprises a sixth insulated gate bipolar transistor and a sixth fast recovery diode, wherein the cathode of the sixth fast recovery diode is connected with the collector of the sixth insulated gate bipolar transistor, and the anode of the sixth fast recovery diode is connected with the emitter of the sixth insulated gate bipolar transistor.

According to another aspect of the utility model, a motor control circuit is proposed, include: according to the power adjusting device of any one of the above technical solutions, the power adjusting device is connected to the motor.

In the technical scheme, an inverter circuit of the power regulating device is powered by a PFC circuit and an external large capacitor through a high-voltage input end, and the operation of a motor is controlled through PWM modulation. When the rotating speed of the motor is accurately controlled, on one hand, the cost of independent packaging is saved, the total area of the electric control board is reduced, on the other hand, the exposed connecting points of the circuit are reduced, and the reliability of the circuit is improved.

In any of the above technical solutions, the method further includes: a capacitive element connected to the power conditioning device, the capacitive element configured to supply power to the motor; an inductive element connected to the power conditioning device, the inductive element configured to charge the capacitive element through the power conditioning device.

In the technical scheme, a power supply packaging pin of the power regulating device is connected with an external alternating current power supply and an inductance element. In the positive half cycle of the alternating current (with the second power supply packaging pin as the positive direction), when the first transistor circuit is conducted, the current charges the inductance element, and the load is powered by the capacitance element; when the first transistor circuit is turned off, the current flowing through the first transistor circuit is transferred to the parasitic body diode of the second transistor circuit, and the power is supplied to the capacitive element and the inverter circuit. In the negative half cycle of the alternating current, when the second transistor circuit is conducted, the current charges the inductance element, and the load is powered by the capacitance element; when the second transistor circuit is turned off, the current flowing through the second transistor circuit is transferred to the parasitic body diode of the first transistor circuit, and the power is supplied to the capacitive element and the inverter circuit.

According to another aspect of the present invention, an air conditioner is provided, which includes a power adjusting device according to any one of the above technical solutions; or a motor control circuit according to any of the above-mentioned solutions.

The utility model provides an air conditioner, which comprises a power adjusting device according to any one of the technical schemes; or the motor control circuit according to any of the above-described embodiments, all of the advantageous technical effects of the power adjusting device according to any of the above-described embodiments or the motor control circuit according to any of the above-described embodiments can be achieved.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 shows a schematic view of a power conditioning device of a first embodiment of the invention;

fig. 2 shows a schematic diagram of a power conditioning device of a second embodiment of the invention;

FIG. 3 shows a schematic diagram of a boost circuit;

fig. 4 shows a schematic view of a power conditioning device of a third embodiment of the invention;

fig. 5 shows a schematic diagram of a motor control circuit of a first embodiment of the present invention;

fig. 6 shows a schematic diagram of a motor control circuit according to a second embodiment of the present invention.

Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 6 is:

100 power regulating device, 202HVIC tube, 204 first IC tube, 206 second IC tube, 2802U phase upper arm IGBT tube, 2804V phase upper arm IGBT tube, 2806W phase upper arm IGBT tube, 2808U phase lower arm IGBT tube, 2810V phase lower arm IGBT tube, 2812W phase lower arm IGBT tube, 2814 first FRD tube, 2816 second FRD tube, 2818 third FRD tube, 2820 fourth FRD tube, 2822 fifth FRD tube, 2824 sixth FRD tube, 2102 first MOS tube, 2104 second MOS tube, 2106 first diode, 2108 second diode, 2110 third diode, 2112 fourth diode and 300 motor control circuit.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.

The embodiment of the first aspect of the present invention provides a power adjusting device, which is described in detail by the following embodiments.

First embodiment, fig. 1 shows a schematic diagram of a power conditioning device 100 according to a first embodiment of the present invention. Wherein, this power adjusting device 100 includes:

a circuit board 102;

a power correction circuit 104 disposed on the circuit board 102, the power correction circuit 104 being configured to perform power correction on the electric energy of the external ac power supply;

the inverter circuit 106 is arranged on the circuit board 102, the inverter circuit 106 is connected to the power correction circuit 104, and the inverter circuit 106 is configured to obtain power corrected electric energy and respond to a control signal to control a load according to the electric energy;

a package frame (not shown) connected to the circuit board 102, the package frame being configured to package the power correction circuit 104 and the inverter circuit 106 disposed on the circuit board 102, the circuit board 102 having a plurality of package pins (not shown), any of the package pins being connected to the power correction circuit 104 or the inverter circuit 106.

The utility model provides a power regulating device 100 utilizes the encapsulation frame to encapsulate power correction circuit 104, inverter circuit 106 on circuit board 102, and circuit board 102 is provided with a plurality of encapsulation pins, and the one end of arbitrary encapsulation pin is connected with power correction circuit 104 or inverter circuit 106, and the other end can with the external contact. The embodiment of the utility model provides a, power correction circuit 104 and inverter circuit 106 are packaged to the integration, have saved the cost of independent encapsulation on the one hand, have reduced the total area of automatically controlled board. On the other hand, the exposed connecting points of the circuit are reduced, and the reliability of the circuit is improved.

Second embodiment, fig. 2 shows a schematic diagram of a power conditioning device 100 according to a second embodiment of the present invention. Wherein, this power adjusting device 100 includes:

a circuit board 102;

a power correction circuit 104 disposed on the circuit board 102, the power correction circuit 104 being configured to perform power correction on the electric energy of the external ac power supply;

the inverter circuit 106 is arranged on the circuit board 102, the inverter circuit 106 is connected to the power correction circuit 104, and the inverter circuit 106 is configured to obtain power corrected electric energy and respond to a control signal to control a load according to the electric energy;

a package frame (not shown) connected to the circuit board 102, the package frame being configured to package the power correction circuit 104 and the inverter circuit 106 disposed on the circuit board 102, the circuit board 102 being provided with a plurality of package pins (not shown), any of the package pins being connected to the power correction circuit 104 or the inverter circuit 106;

a first control circuit 108 disposed on the circuit board 102 and encapsulated by the encapsulation frame, wherein the first control circuit 108 is connected to the power calibration circuit 104 and connected to an external controller through an encapsulation pin;

the second control circuit 110 is disposed on the circuit board 102 and encapsulated by the encapsulation frame, and the second control circuit 110 is connected to the inverter circuit 106 and connected to the external controller through the encapsulation pin.

In this embodiment, the first control circuit 108 is connected to the power correction circuit 104 and the external controller, and controls the power correction circuit 104 to operate by receiving a control signal from the external controller, so that the mains current follows the voltage variation, and the current and the voltage are kept in the same phase, and no waveform distortion is obvious any more, thereby making the power factor of the circuit close to 1. The second control circuit 110 is connected to the inverter circuit 106 and the external controller, and receives a control signal from the external controller to control the inverter circuit 106 to operate, so as to convert the dc power into ac power for the load.

In a third embodiment, the PFC of the household electrical appliance such as an air conditioner may adopt a boost circuit form: as shown in fig. 3, a boost circuit (including a switch tube Q1 and a diode D5) is inserted between the rectifier bridge (including D1, D2, D3 and D4) and the large electrolytic capacitor C1, and the forced current follows the voltage. From the working principle of the boost circuit, the current of the inductor L1 works in a continuous mode and can be modulated in the whole power frequency period, so that the circuit can reach a higher power factor. Because the traditional boost active PFC needs to be connected into a rectifier bridge, the circuit working principle can show that three semiconductor devices are arranged on a current path at any time of working, wherein two devices belong to the rectifier bridge, so that obvious conduction loss exists, and the overall efficiency of the circuit is reduced. At the same power condition and full load condition, the lower the input voltage, the higher the input current will increase and the higher the conduction loss in the current path will be, resulting in higher heat generation.

Fig. 4 shows a schematic diagram of a power conditioning device 100 (smart power module) according to a third embodiment of the present invention. Wherein, this power adjusting device 100 includes: an HVIC (high voltage integrated circuit) tube 202, a first IC tube 204, a second IC tube 206, a three-phase inverter circuit and a totem-pole bridgeless PFC circuit. The devices forming these circuits are mounted on a substrate or a metal frame and encapsulated by a molding compound, leaving only the leads in contact with the outside.

The three-phase inverter circuit includes: a U-phase upper arm IGBT (Insulated Gate Bipolar Transistor) tube 2802, a V-phase upper arm IGBT tube 2804, a W-phase upper arm IGBT tube 2806, a U-phase lower arm IGBT tube 2808, a V-phase lower arm IGBT tube 2810, a W-phase lower arm IGBT tube 2812, a first FRD (fast recovery diode) tube 2814, a second FRD tube 2816, a third FRD tube 2818, a fourth FRD tube 2820, a fifth FRD tube 2822, and a sixth FRD tube 2824.

The totem-pole bridgeless PFC circuit comprises: a first MOS transistor 2102, a second MOS transistor 2104, a first diode 2106, a second diode 2108, a third diode 2110, and a fourth diode 2112. A totem-pole bridgeless PFC circuit replaces a traditional boost active PFC circuit, a rectifier bridge does not need to be connected, and conduction loss is avoided.

The VCC terminal of the HVIC tube 202 is used as the positive terminal VDD of the low-voltage power supply of the power conditioning apparatus 100, and VDD is generally 15V; the GND terminal of the HVIC tube 202 serves as the low-voltage area power supply negative terminal COM of the power conditioning device 100.

The HIN1 end of the HVIC tube 202 serves as the U-phase upper arm input end UHIN of the power conditioning device 100; the HIN2 end of the HVIC tube 202 is used as the V-phase upper bridge arm input end VHIN of the power regulating device 100; the HIN3 end of the HVIC tube 202 serves as the W-phase upper bridge arm input end WHIN of the power regulating device 100; the LIN1 end of the HVIC tube 202 serves as the U-phase lower bridge arm input end ULINs of the power conditioning device 100; the LIN2 end of the HVIC tube 202 serves as the V-phase lower bridge arm input terminal VLIN of the power conditioning device 100; the LIN3 terminal of the HVIC tube 202 serves as the W-phase lower arm input terminal WLIN of the power conditioner 100, and here, the U, V, W three-phase six-way input of the power conditioner 100 receives input signals of 0V to 5V.

The VB1 end of the HVIC tube 202 is used as a positive end UVB of a power supply of a U-phase high-voltage area of the power regulating device 100; the HO1 end of the HVIC tube 202 is connected with the grid electrode of the U-phase upper bridge arm IGBT tube 2802; the VS1 end of the HVIC tube 202 is connected to the emitter of the U-phase upper arm IGBT tube 2802, the anode of the first FRD tube 2814, the collector of the U-phase lower arm IGBT tube 2808, and the cathode of the fourth FRD tube 2820, and serves as the negative terminal UVS of the U-phase high voltage region power supply of the power conditioning device 100.

The VB2 end of the HVIC tube 202 is used as a positive end VVB of a V-phase high-voltage area power supply source of the power regulating device 100; the HO2 end of the HVIC tube 202 is connected with the grid electrode of the V-phase upper bridge arm IGBT tube 2804; the VS2 end of the HVIC tube 202 is connected to the emitter of the V-phase upper arm IGBT tube 2804, the anode of the second FRD tube 2816, the collector of the V-phase lower arm IGBT tube 2810, and the cathode of the fifth FRD tube 2822, and serves as the negative terminal VVS of the W-phase high voltage area power supply of the power conditioning device 100.

The VB3 end of the HVIC tube 202 is used as a W-phase high-voltage area power supply positive end WVB of the power regulating device 100; the HO3 end of the HVIC tube 202 is connected with the grid of the W-phase upper bridge arm IGBT tube 2806; the VS3 end of the HVIC tube 202 is connected to the emitter of the W-phase upper arm IGBT tube 2806, the anode of the third FRD tube 2818, the collector of the W-phase lower arm IGBT tube 2812, and the cathode of the sixth FRD tube 2824, and serves as the negative end WVS of the W-phase high-voltage area power supply of the power conditioning device 100.

The LO1 end of the HVIC tube 202 is connected with the grid of the U-phase lower bridge arm IGBT tube 2808; the LO2 end of the HVIC tube 202 is connected with the grid of the V-phase lower bridge arm IGBT tube 2810; the LO3 terminal of the HVIC tube 202 is connected to the gate of the W-phase lower arm IGBT tube 2812.

An emitter of the U-phase lower bridge arm IGBT tube 2808 is connected to an anode of the fourth FRD tube 2820, and serves as a U-phase low-voltage reference end UN of the power conditioning device 100; the emitter of the V-phase lower arm IGBT tube 2810 is connected to the anode of the fifth FRD tube 2822, and serves as a V-phase low-voltage reference terminal VN of the power conditioning apparatus 100; the emitter of the W-phase lower arm IGBT pipe 2812 is connected to the anode of the sixth FRD pipe 2824, and serves as a W-phase low-voltage reference terminal WN of the power conditioning apparatus 100.

The collector of the U-phase upper arm IGBT tube 2802, the cathode of the first FRD tube 2814, the collector of the V-phase upper arm IGBT tube 2804, the cathode of the second FRD tube 2816, the collector of the W-phase upper arm IGBT tube 2806, and the cathode of the third FRD tube 2818 are connected to each other, and serve as a high-voltage input terminal P of the power conditioning apparatus 100, and P is generally connected to 300V.

The HVIC tube 202 is used for transmitting logic signals of 0V to 5V from input terminals HIN1, HIN2, HIN3, LIN1, LIN2 and LIN3 to output terminals HO1, HO2, HO3, LO1, LO2 and LO3, wherein HO1, HO2 and HO3 are logic signals of VS to VS +15V, and LO1, LO2 and LO3 are logic signals of 0V to 15V.

The VCC end of the first IC tube 204 and the VCC end of the second IC tube 206 are both supplied by the positive end VDD of the low-voltage area power supply; the IN end of the first IC tube 204 and the IN end of the second IC tube 206 are respectively connected with the first MOS tube 2102 and the control end PFCIN1 and PFCIN2 of the totem-pole bridgeless PFC circuit; the OUT terminal of the first IC tube 204 and the OUT terminal of the second IC tube 206 are connected to the gate of the first MOS tube 2102 and the gate of the second MOS tube 2104, respectively.

The first diode 2106 is a parasitic diode of the first MOS transistor 2102, and both of them are actually the same device; the second diode 2108 is a parasitic body diode of the second MOS transistor 2104, and both are substantially the same device.

The source of the first MOS transistor 2102, the anode of the first diode 2106 and the anode of the third diode 2110 are connected, and serve as the negative terminal P-of the totem-pole bridgeless PFC circuit of the power conditioning device 100; the drain of the first MOS transistor 2102, the source of the second MOS transistor 2104, the cathode of the first diode 2106 and the anode of the second diode 2108 are connected to each other and serve as an AC input terminal AC1 of the power conditioning apparatus 100.

The drain of the second MOS transistor 2104, the cathode of the second diode 2108 and the cathode of the fourth diode 2112 are connected and serve as a high voltage input terminal P of the power conditioning device 100; the cathode of the third diode 2110 is connected to the anode of the fourth diode 2112 and serves as the AC input terminal AC2 of the power conditioning device 100.

The first IC tube 202 and the second IC tube 206 are used for transmitting the logic signals of 0V to 5V from the input terminals PFCIN1 and PFCIN2 to the output terminal OUT, wherein OUT is a logic signal of-5V to 10V.

The embodiment of the second aspect of the present invention provides a motor control circuit, which is described in detail through the following embodiments.

First embodiment, fig. 5 shows a schematic diagram of a motor control circuit 300 according to a first embodiment of the present invention. The motor control circuit 300 includes the power conditioning device 100 according to any of the above embodiments, and the power conditioning device 100 is connected to a motor.

In this embodiment, the inverter circuit of the power conditioning apparatus 100 is powered by the PFC circuit and the external large capacitor through the high voltage input terminal, and the operation of the motor is controlled through PWM modulation. When the rotating speed of the motor is accurately controlled, on one hand, the cost of independent packaging is saved, the total area of the electric control board is reduced, on the other hand, the exposed connecting points of the circuit are reduced, and the reliability of the circuit is improved.

In any of the above embodiments, further comprising: a capacitive element 302 connected to the power conditioning apparatus 100, the capacitive element 302 being configured to supply power to the motor; an inductive element 304 coupled to the power regulation device 100, the inductive element 304 configured to charge the capacitive element 302 through the power regulation device 100.

In this embodiment, the power supply package pins of the power regulating device 100 are connected to an external ac power source and the inductive element 304. In the positive half cycle of the alternating current (with the second power supply packaging pin as the positive direction), when the first transistor circuit is conducted, the current charges the inductance element 304, and the load is powered by the capacitance element 302; when the first transistor circuit is turned off, the current flowing through the first transistor circuit is transferred to the parasitic body diode of the second transistor circuit, providing power to the capacitive element 302 and the inverter circuit. In the negative half cycle of the ac, when the second transistor circuit is turned on, the current charges the inductive element 304 and the load is powered by the capacitive element 302; when the second transistor circuit is turned off, the current flowing through the second transistor circuit is transferred to the parasitic body diode of the first transistor circuit, providing power to the capacitive element 302 and the inverter circuit.

Second embodiment, fig. 6 shows a schematic diagram of a motor control circuit 300 according to a second embodiment of the present invention. The motor control circuit 300 includes the power conditioning device 100 according to any of the above embodiments, and the power conditioning device 100 is connected to the motor M.

The AC1 and the AC2 of the power conditioning device 100 are connected to an external alternating current power supply (MCU) and an inductor L. In the positive half cycle of the alternating current (with the AC1 end as the positive direction), the first MOS transistor 2102 is switched on at a high frequency, when the first MOS transistor 2102 is switched on, the current charges the external inductor through the first MOS transistor 2102 and the third diode 2110, and the load is powered by the capacitor C; when the first MOS transistor 2102 is turned off, the current flowing through the first MOS transistor 2102 is converted to the parasitic body diode 2108 of the second MOS transistor 2104, so as to supply power to the capacitor C and the three-phase inverter circuit. In the negative half cycle of the alternating current, the second MOS tube 2104 is switched in a high frequency mode, when the second MOS tube 2104 is turned on, the current charges the inductor L through the second MOS tube 2104 and the fourth diode 2112, and the load is supplied with power by the capacitor C; when the second MOS transistor 2104 is turned off, the current flowing through the second MOS transistor 2104 is converted to the parasitic body diode first diode 2106 of the first MOS transistor 2102, and power is supplied to the capacitor C and the three-phase inverter circuit.

When the totem-pole bridgeless PFC circuit operates in a Current Continuous Mode (CCM), a parasitic body diode of the first MOS tube 2102 or the second MOS tube 2104 is required to provide a freewheeling path. The parasitic body diode of the general MOS tube has very poor characteristics, a large reverse recovery process and reverse recovery charges exist, and the MOS tube can be burnt when the circuit operates in CCM. Therefore, in the present invention, the first MOS transistor 2102 or the second MOS transistor 2104 adopt a GaN transistor. Compared with the traditional Si MOSFET, the GaN transistor has smaller on-resistance and faster on-off speed, and is suitable for higher working frequency; and the parasitic capacitance is also smaller, and the switching loss is smaller. More importantly, the reverse recovery charge of the GaN device is only dozens of nano coulombs, the reverse recovery time is very short, and the GaN device is very suitable for being applied to a totem-pole bridgeless PFC circuit.

The GaN device has a small gate threshold voltage and is easily interfered by a circuit to cause misconduction, so that the device is burnt. In a traditional circuit, each GaN device is packaged independently and then welded on an electric control board, so that long wiring is inevitably arranged among the devices, parasitic inductance and capacitance are increased, and oscillation is large in the switching process. For devices such as GaN transistors that are sensitive, these oscillations may cause misconduction. The utility model discloses in through the encapsulation of integration and bind the line and connect, contract each GaN device and with the distance between the control chip to the shortest, reduce parasitic parameter by a wide margin to it is more stable to make the system operation.

In order to further improve the efficiency, the third diode 2110 and the fourth diode 2112 may be replaced by switching tubes.

The three-phase inverter circuit is powered by a totem-pole bridgeless PFC circuit and an external capacitor C through a P terminal, and the operation of a motor M is controlled through PWM modulation.

An embodiment of a third aspect of the present invention provides an air conditioner, including the power adjusting device according to any of the above embodiments; or a motor control circuit as in any of the embodiments described above.

The utility model provides an air conditioner, which comprises a power adjusting device according to any one of the above embodiments; or the motor control circuit according to any of the above embodiments, it is possible to achieve all the advantageous technical effects of including the power adjusting apparatus according to any of the above embodiments or the motor control circuit according to any of the above embodiments.

In the description herein, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance unless explicitly stated or limited otherwise; the terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (15)

1. A power regulating device, comprising:

a circuit board;

the power correction circuit is arranged on the circuit board and is configured to perform power correction on electric energy of an external alternating current power supply;

the inverter circuit is arranged on the circuit board, connected to the power correction circuit and configured to acquire the power corrected electric energy and respond to a control signal to control a load according to the electric energy;

the package frame is connected with the circuit board and is configured to package the power correction circuit and the inverter circuit which are arranged on the circuit board, the circuit board is provided with a plurality of package pins, and any one of the package pins is connected with the power correction circuit or the inverter circuit.

2. The power conditioning device of claim 1, further comprising:

the first control circuit is arranged on the circuit board and packaged by the packaging frame, is connected to the power correction circuit and is connected with an external controller through the packaging pins.

3. The power conditioning device of claim 1, further comprising:

and the second control circuit is arranged on the circuit board and packaged by the packaging frame, is connected to the inverter circuit and is connected with an external controller through the packaging pins.

4. The power regulating device of claim 2, wherein the power correction circuit comprises:

a first transistor circuit connected to the first control circuit;

a second transistor circuit connected to the inverter circuit, the first transistor circuit, and the first control circuit;

a first switching device connected to the first transistor circuit and a first power supply package pin;

a second switching device connected to the first switching device, the second transistor circuit, and the first power supply package pin.

5. The power regulating device of claim 4, wherein the first transistor circuit comprises:

a gate of the first transistor is connected to the first control circuit, a source of the first transistor is connected to a first voltage input package pin, and a drain of the first transistor is connected to a second power supply package pin;

and the anode of the first diode is connected to the source electrode of the first transistor, and the cathode of the first diode is connected to the drain electrode of the first transistor.

6. The power regulating device according to claim 5, wherein the second transistor circuit comprises:

a second transistor, a gate of which is connected to the first control circuit, a source of which is connected to a drain of the first transistor and the second power supply package pin, and a drain of which is connected to the inverter circuit and the second voltage input package pin;

and the anode of the second diode is connected to the source electrode of the second transistor, and the cathode of the second diode is connected to the drain electrode of the second transistor.

7. The power regulating device of claim 6, wherein the first control circuit comprises:

the first sub-control circuit is connected to the grid electrode of the first transistor and is connected with the external controller through a first control packaging pin;

and the second sub-control circuit is connected to the grid electrode of the second transistor and is connected with the external controller through a second control packaging pin.

8. The power conditioning apparatus of claim 3, wherein the inverter circuit comprises:

a third transistor circuit having a base connected to the first output terminal of the second control circuit and a collector connected to the power correction circuit;

a fourth transistor circuit, a base of which is connected to the second output terminal of the second control circuit, and a collector of which is connected to the power correction circuit;

a fifth transistor circuit, a base of which is connected to the third output terminal of the second control circuit, and a collector of which is connected to the power correction circuit;

a sixth transistor circuit having a base connected to the fourth output terminal of the second control circuit and a collector connected to the emitter of the third transistor circuit;

a seventh transistor circuit, a base of which is connected to the fifth output terminal of the second control circuit, and a collector of which is connected to an emitter of the fourth transistor circuit;

and a base of the eighth transistor circuit is connected to the sixth output end of the second control circuit, and a collector of the eighth transistor circuit is connected to an emitter of the fifth transistor circuit.

9. The power conditioning device of claim 8,

an emitter of the sixth transistor circuit is connected to the first voltage reference package pin;

an emitter of the seventh transistor circuit is connected to a second voltage reference package pin;

an emitter of the eighth transistor circuit is connected to a third voltage reference package pin.

10. The power conditioning device of claim 8,

the input end of the second control circuit is connected to a third control packaging pin;

a seventh output end of the second control circuit is connected with an emitter of the third transistor circuit, a collector of the sixth transistor circuit and a packaging pin of a negative end of the first power supply;

an eighth output end of the second control circuit is connected with an emitter of the fourth transistor circuit, a collector of the seventh transistor circuit and a packaging pin of a negative end of a second power supply;

and a ninth output end of the second control circuit is connected with an emitter of the fifth transistor circuit, a collector of the eighth transistor circuit and a packaging pin of a negative end of a third power supply.

11. The power conditioning device of claim 8,

a tenth output end of the second control circuit is connected to a positive end packaging pin of the first power supply;

an eleventh output end of the second control circuit is connected to a second power supply positive end packaging pin;

and the twelfth output end of the second control circuit is connected to the packaging pin of the positive end of the third power supply.

12. The power conditioning device of claim 8,

the third transistor circuit comprises a first insulated gate bipolar transistor and a first fast recovery diode, wherein the cathode of the first fast recovery diode is connected to the collector of the first insulated gate bipolar transistor, and the anode of the first fast recovery diode is connected to the emitter of the first insulated gate bipolar transistor;

the fourth transistor circuit comprises a second insulated gate bipolar transistor and a second fast recovery diode, wherein the cathode of the second fast recovery diode is connected to the collector of the second insulated gate bipolar transistor, and the anode of the second fast recovery diode is connected to the emitter of the second insulated gate bipolar transistor;

the fifth transistor circuit comprises a third insulated gate bipolar transistor and a third fast recovery diode, wherein the cathode of the third fast recovery diode is connected to the collector of the third insulated gate bipolar transistor, and the anode of the third fast recovery diode is connected to the emitter of the third insulated gate bipolar transistor;

the sixth transistor circuit comprises a fourth insulated gate bipolar transistor and a fourth fast recovery diode, wherein the cathode of the fourth fast recovery diode is connected to the collector of the fourth insulated gate bipolar transistor, and the anode of the fourth fast recovery diode is connected to the emitter of the fourth insulated gate bipolar transistor;

the seventh transistor circuit comprises a fifth insulated gate bipolar transistor and a fifth fast recovery diode, wherein the cathode of the fifth fast recovery diode is connected to the collector of the fifth insulated gate bipolar transistor, and the anode of the fifth fast recovery diode is connected to the emitter of the fifth insulated gate bipolar transistor;

the eighth transistor circuit comprises a sixth insulated gate bipolar transistor and a sixth fast recovery diode, wherein the cathode of the sixth fast recovery diode is connected to the collector of the sixth insulated gate bipolar transistor, and the anode of the sixth fast recovery diode is connected to the emitter of the sixth insulated gate bipolar transistor.

13. A motor control circuit, comprising:

a power conditioning device according to any of claims 1 to 12, connected to the electrical machine.

14. The motor control circuit of claim 13, further comprising:

a capacitive element connected to the power conditioning device, the capacitive element configured to supply power to the motor;

an inductive element connected to the power conditioning device, the inductive element configured to charge the capacitive element through the power conditioning device.

15. An air conditioner, comprising:

the power conditioning device of any one of claims 1 to 12; or

A motor control circuit according to claim 13 or 14.

Images