CN110798062A - Power regulation module, drive circuit and air conditioner - Google Patents

Power regulation module, drive circuit and air conditioner Download PDF

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Publication number
CN110798062A
CN110798062A CN201911206805.0A CN201911206805A CN110798062A CN 110798062 A CN110798062 A CN 110798062A CN 201911206805 A CN201911206805 A CN 201911206805A CN 110798062 A CN110798062 A CN 110798062A
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China
Prior art keywords
diode
pin
power
transistor component
driver
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Pending
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CN201911206805.0A
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Chinese (zh)
Inventor
苏宇泉
冯宇翔
马博斌
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Midea Group Co Ltd
GD Midea Air Conditioning Equipment Co Ltd
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Midea Group Co Ltd
GD Midea Air Conditioning Equipment Co Ltd
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Priority to CN201911206805.0A priority Critical patent/CN110798062A/en
Publication of CN110798062A publication Critical patent/CN110798062A/en
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/42—Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
    • H02M1/4208—Arrangements for improving power factor of AC input
    • H02M1/4225—Arrangements for improving power factor of AC input using a non-isolated boost converter
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • H02M7/53871—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration with automatic control of output voltage or current
    • H02M7/53875—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration with automatic control of output voltage or current with analogue control of three-phase output
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
    • H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
    • H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters
    • H02P27/08—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters with pulse width modulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Abstract

The invention provides a power regulating module, a driving circuit and an air conditioner. Wherein, power regulation module includes: a substrate; the power factor correction circuit comprises a plurality of paths of power factor correction circuits which are independently controlled and are arranged on a substrate, wherein each path of power factor correction circuit comprises a controller and a power factor correction unit which are electrically connected; the inverter circuit is arranged on the substrate and comprises a driver and an inverter which are electrically connected, the inverter is also connected with the power factor correction circuit, and the inverter is configured to obtain an inversion signal after power correction and respond to a control signal of the driver so as to control a load according to the inversion signal; the package frame is connected with the substrate so as to configure a plurality of package pins on the substrate, and any one of the package pins is connected with the power factor correction circuit or the inverter. According to the technical scheme of the invention, on one hand, the cost of independent packaging is saved, on the other hand, the exposed connection points of the circuit are reduced, the reliability of the circuit is improved, and the electromagnetic interference is favorably reduced.

Description

Power regulation module, drive circuit and air conditioner
Technical Field
The invention relates to the technical field of air conditioners, in particular to a power regulation module, a driving circuit and an air conditioner.
Background
In the control of the air conditioner, a boosting power factor correction circuit needs to select a device with larger rated current, a switching tube and a rectifier diode in the circuit can bear larger switching stress, the loss of a converter is increased, great heat is generated, the efficiency of the system is reduced, and in addition, serious electromagnetic interference can be caused by switching under large current, and the problem of EMI is caused.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
To this end, an aspect of the present invention is to propose a power conditioning module.
Another aspect of the present invention is to provide a driving circuit.
Yet another aspect of the present invention is to provide an air conditioner.
In view of the above, according to one aspect of the present invention, there is provided a power conditioning module, comprising: a substrate; the power factor correction circuit comprises a plurality of paths of power factor correction circuits which are independently controlled and are arranged on a substrate, wherein each path of power factor correction circuit comprises a controller and a power factor correction unit which are electrically connected; the inverter circuit is arranged on the substrate and comprises a driver and an inverter which are electrically connected, the inverter is also connected with the power factor correction circuit, and the inverter is configured to obtain an inversion signal after power correction and respond to a control signal of the driver so as to control a load according to the inversion signal; the packaging frame is connected with the substrate and is configured to package the power factor correction circuit and the inverter which are arranged on the substrate so as to configure a plurality of packaging pins on the substrate, and any packaging pin is connected with the power factor correction circuit or the inverter.
The power regulating module provided by the invention utilizes the packaging frame to package the power factor correction circuit and the inverter on the substrate so as to configure a plurality of packaging pins on the substrate, one end of any packaging pin is connected with the power factor correction circuit or the inverter, and the other end of any packaging pin can be in contact with the outside. According to the technical scheme, the multi-path power factor correction circuit and the inverter are integrally packaged, so that on one hand, the cost of independent packaging is saved, and the total area of the electric control board is reduced. On the other hand, the exposed connecting points of the circuit are reduced, the reliability of the circuit is improved, and the electromagnetic interference is reduced.
In addition, the multi-path power factor correction module is adopted to replace a single-path power factor correction module in the related technology, so that the current is shunted, and the phenomenon of local overheating is favorably improved.
The power regulation module according to the present invention may further have the following technical features:
in the above technical solution, the plurality of package pins include a power supply pin and a plurality of control signal input pins, and both a power supply terminal of the driver and a power supply terminal of the controller are connected to the power supply pin; the input end of each path of controller is correspondingly connected to a control signal input pin and used for receiving a control signal of an external controller; the output end of the controller is connected to the corresponding power factor correction unit and used for outputting a switching signal to the power factor correction unit according to the control signal.
In any of the above technical solutions, the plurality of package pins further include a ground pin, a plurality of inductor connection pins, and a bus capacitor pin, and the power factor correction unit includes: the switch unit comprises a first switch tube and a first diode, wherein the control electrode of the first switch tube is connected to the output end of the connected controller, the collector electrode of the first switch tube is connected to the cathode of the first diode, the emitter electrode of the first switch tube is connected to the anode of the first diode, the emitter electrode of the first switch tube is connected to the grounding pin, and the collector electrode of the first switch tube is connected to the corresponding inductance connecting pin; and the anodes of the second diodes are connected to the cathodes of the first diodes, and the cathodes of the multiple paths of second diodes are connected and connected to the bus capacitor connecting pin.
In the technical scheme, each inductor connecting pin corresponds to an inductor connected in series, a plurality of control ends are arranged on a control chip, each control end is connected with one path of power factor correction module, the multiple paths of power factor correction modules are controlled independently, the multiple power factor correction modules operate independently, an inductor is arranged at the front end of each path of power factor correction module, the current input to the multiple paths of power factor correction modules is the sum of the currents of the multiple inductors, control signals are reasonably output through the control chip, the conduction time of a switch tube in each path of power factor correction module is controlled, the currents of the multiple inductors are staggered, current ripples can be reduced after superposition, and the stability of the circuit is improved.
In any one of the above technical solutions, the inverter is connected to the bus capacitor connection pin, and the inverter includes: a control electrode of the third transistor component is connected to the first output end of the driver, and a collector electrode of the third transistor component is connected to the bus capacitor connecting pin; a control electrode of the fourth transistor component is connected to the second output end of the driver, and a collector electrode of the fourth transistor component is connected to the bus capacitor connecting pin; a control electrode of the fifth transistor component is connected to the third output end of the driver, and a collector electrode of the fifth transistor component is connected to the bus capacitor connecting pin; a control electrode of the sixth transistor component is connected to the fourth output end of the driver, and a collector electrode of the sixth transistor component is connected to an emitter electrode of the third transistor component; a control electrode of the seventh transistor component is connected to the fifth output end of the driver, and a collector electrode of the seventh transistor component is connected to an emitter electrode of the fourth transistor component; and a control electrode of the eighth transistor component is connected to the sixth output end of the driver, and a collector electrode of the eighth transistor component is connected to an emitter electrode of the fifth transistor component.
In the technical scheme, the inverter is a three-phase bridge inverter and converts direct current output by the power factor correction circuit into alternating current used by a load.
In any of the above technical solutions, the plurality of package pins further include a voltage reference pin, and an emitter of the sixth transistor element is connected to the first voltage reference pin; an emitter of the seventh transistor component is connected to the second voltage reference pin; an emitter of the eighth transistor element is connected to the third voltage reference pin.
In the technical scheme, a first voltage reference pin, a second voltage reference pin and a third voltage reference pin are respectively used as three-phase low-voltage reference ends.
In any of the above technical solutions, the plurality of package pins further includes a power supply negative terminal package pin, and an input terminal of the driver is connected to the three-phase bridge arm input pin; a seventh output end of the driver is connected with an emitter of the third transistor component, a collector of the sixth transistor component and a packaging pin of a negative end of the first power supply; an eighth output end of the driver is connected with an emitter of the fourth transistor component, a collector of the seventh transistor component and a packaging pin of a negative end of the second power supply; and a ninth output end of the driver is connected with an emitter of the fifth transistor component, a collector of the eighth transistor component and a packaging pin of a negative end of the third power supply.
In the technical scheme, the driver comprises six input ends which are correspondingly connected with six three-phase bridge arm input pins, and the six three-phase bridge arm input pins are respectively used as the input ends of a three-phase upper bridge arm and a three-phase lower bridge arm of the power regulating module.
In any of the above technical solutions, the plurality of package pins further includes a power supply positive terminal package pin, and the tenth output terminal of the driver is connected to the first power supply positive terminal package pin; the eleventh output end of the driver is connected to the second power supply positive terminal packaging pin; the twelfth output terminal of the driver is connected to the third power supply positive terminal package pin.
In the technical scheme, a first power supply positive terminal packaging pin, a second power supply positive terminal packaging pin and a third power supply positive terminal packaging pin are respectively used as the high-voltage region power supply positive terminals of the power regulating module.
In any of the above technical solutions, the third transistor component includes a first triode and a third diode, a cathode of the third diode is connected to a collector of the first triode, and an anode of the third diode is connected to an emitter of the first triode; the fourth transistor component comprises a second triode and a fourth diode, the cathode of the fourth diode is connected with the collector of the second triode, and the anode of the fourth diode is connected with the emitter of the second triode; the fifth transistor component comprises a third triode and a fifth diode, the cathode of the fifth diode is connected with the collector of the third triode, and the anode of the fifth diode is connected with the emitter of the third triode; the sixth transistor component comprises a fourth triode and a sixth diode, the cathode of the sixth diode is connected to the collector of the fourth triode, and the anode of the sixth diode is connected to the emitter of the fourth triode; the seventh transistor component comprises a fifth triode and a seventh diode, the cathode of the seventh diode is connected with the collector of the fifth triode, and the anode of the seventh diode is connected with the emitter of the fifth triode; the eighth transistor component comprises a sixth triode and an eighth diode, wherein the cathode of the eighth diode is connected with the collector of the sixth triode, and the anode of the eighth diode is connected with the emitter of the sixth triode.
In any of the above technical solutions, the multiple independently controlled power factor correction circuits include three independently controlled power factor correction circuits, so as to configure three inductive connection pins.
Specifically, taking three independently controlled power factor correction circuits as an example, after alternating current is converted into direct current through a rectifier, the direct current passes through three inductors connected in parallel and is respectively connected to three inductor connection pins PFC1, PFC2 and PFC3, the external controller MCU controls three switching units through PFCIN1, PFCIN2 and PFCIN3, so that three boost type power factor correction units (i.e., boost-PFC units) operate independently, and input current is the sum of three inductor currents.
The current of the three PFC circuits is detected by three independent sampling resistors through a grounding terminal and fed back to an external controller MCU in real time, and the ripple of the input current can be reduced to the minimum by only controlling the conduction time of three switches to enable three inductive currents to be staggered.
In addition, since the three boost units are independent of each other, only one or two of them may be used.
The three units need to select devices with the same specification, and current sharing can be achieved.
Input peak average current I of each path of PFCiavgThe design of the input circuit, such as a rectifier bridge, an EMC part of the circuit input, etc., can be modeled based on this computed value, calculated by the following equation.
By determining the input peak average current I of each PFC pathiavgThe circuit device model selection is performed based on the obtained input peak average current.
Figure BDA0002297103590000051
Wherein, IiavgIs the average value of the peak value of the input current, PoutTo output the total power, UiminFor the minimum value of the input voltage, η is the operating efficiency of the power factor correction module.
The current is output to the inverter circuit after passing through the PFC circuit and is connected with the external large capacitor through the bus capacitor pin, and the inverter is powered by the PFC circuit and the external large capacitor through the bus capacitor pin and is controlled to operate through PWM modulation.
According to another aspect of the present invention, there is provided a driving circuit including: a motor; according to the power regulating module of any one of the technical schemes, the power regulating module is connected with the motor.
In the technical scheme, an inverter of the power regulation module is powered by a PFC circuit and an external large capacitor through a high-voltage input end, and the operation of a motor is controlled through PWM modulation. When the rotating speed of the motor is accurately controlled, on one hand, the cost of independent packaging is saved, the total area of the electric control board is reduced, on the other hand, the exposed connecting points of the circuit are reduced, the reliability of the circuit is improved, and the electromagnetic interference is favorably reduced.
In any of the above technical solutions, the method further includes: a capacitive element connected to the power conditioning module, the capacitive element configured to supply power to the motor; an inductive element coupled to the power conditioning module, the inductive element configured to charge the capacitive element through the power conditioning module.
In the technical scheme, a power supply packaging pin of the power regulating module is connected with an external alternating current power supply and an inductance element. In the positive half cycle of the alternating current (taking the second power supply packaging pin as the positive direction), when the first transistor component is conducted, the current charges the inductance element, and the load is powered by the capacitance element; when the first transistor element is turned off, the current flowing through the first transistor element is transferred to the parasitic body diode of the second transistor element, providing an inversion signal to the capacitive element and the inverter. In the negative half cycle of the alternating current, when the second transistor component is conducted, the current charges the inductance element, and the load is powered by the capacitance element; when the second transistor element is turned off, the current flowing through the second transistor element is transferred to the parasitic body diode of the first transistor element, providing an inversion signal to the capacitive element and the inverter.
According to another aspect of the present invention, an air conditioner is provided, which includes the power conditioning module according to any one of the above technical solutions; or a drive circuit according to any of the above-mentioned solutions.
The air conditioner provided by the invention comprises the power adjusting module in any technical scheme; or the driver circuit according to any of the above-mentioned technical aspects, all advantageous technical effects including the power conditioning module according to any of the above-mentioned technical aspects or the driver circuit according to any of the above-mentioned technical aspects can be achieved.
When the PFC circuit is applied to the air conditioner, in order to enable the air conditioner to work in the highest efficiency state in each load stage, one path of PFC can be closed or only one path of PFC can be opened when the air conditioner works in the low-frequency light load condition, and the opening phase of each path of PFC is changed into 180 degrees under the condition of two paths of PFC so as to reduce circuit ripples.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 shows a schematic diagram of a power conditioning module of one embodiment of the present invention;
FIG. 2 shows a schematic diagram of a boost circuit;
FIG. 3 shows a schematic diagram of a power conditioning module of another embodiment of the present invention;
FIG. 4 shows a schematic diagram of a drive circuit of yet another embodiment of the present invention;
fig. 5 shows a schematic diagram of a driver circuit of yet another embodiment of the invention.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 5 is:
100 power regulating module, 202A first IC tube, 202B second IC tube, 202B third IC tube, 204A first MOS tube, 204B second MOS tube, 204C third MOS tube, 206A first switching diode, 206B second switching diode, 206C second switching diode, 208A first boost diode, 208B second boost diode, 208C second boost diode, 210HVIC tube, 212U phase upper arm IGBT tube, 216V phase upper arm IGBT tube, 220W phase upper arm IGBT tube, 224U phase lower arm IGBT tube, 228V phase lower arm IGBT tube, 232W phase lower arm IGBT tube, 214 first FRD tube, 218 second FRD tube, 222 third FRD tube, 226 fourth FRD tube, 230 fifth FRD tube, 234 sixth FRD tube, 300 driving circuit, capacitive element 302, and inductive element 304.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.
Embodiments of the first aspect of the present invention provide a power conditioning module, which is described in detail by the following embodiments.
Example one
Fig. 1 shows a schematic diagram of a power conditioning module 100 of a first embodiment of the invention. Wherein the power conditioning module 100 comprises: the circuit board comprises a substrate 102, a plurality of paths of independently controlled power factor correction circuits, an inverter circuit and a packaging frame.
The power factor correction circuits are disposed on the substrate 102, and each power factor correction circuit includes a controller 104 and a power factor correction unit 106 electrically connected to each other.
And the inverter circuit is arranged on the substrate and comprises a driver 108 and an inverter 110 which are electrically connected, the inverter is also connected with the power factor correction circuit, and the inverter is configured to obtain an inversion signal after power correction and respond to a control signal of the driver so as to control a load according to the inversion signal.
The packaging frame is connected with the substrate and is configured to package the power factor correction circuit and the inverter which are arranged on the substrate so as to configure a plurality of packaging pins on the substrate, and any packaging pin is connected with the power factor correction circuit or the inverter.
The power regulating module provided by the invention utilizes the packaging frame to package the power factor correction circuit and the inverter on the substrate so as to configure a plurality of packaging pins on the substrate, one end of any packaging pin is connected with the power factor correction circuit or the inverter, and the other end of any packaging pin can be in contact with the outside. According to the embodiment of the invention, the multi-path power factor correction circuit and the inverter are integrally packaged, so that on one hand, the cost of independent packaging is saved, and the total area of the electric control board is reduced. On the other hand, the exposed connecting points of the circuit are reduced, the reliability of the circuit is improved, and the electromagnetic interference is reduced.
In addition, the multi-path power factor correction module is adopted to replace a single-path power factor correction module in the related technology, so that the current is shunted, and the phenomenon of local overheating is favorably improved.
As shown in fig. 2, a boost circuit is inserted between the rectifier bridge (including D1, D2, D3, D4) and the large electrolytic capacitor C1, forcing the current to follow the voltage change. From the working principle of the boost circuit, the current of the inductor L1 works in a continuous mode and can be modulated in the whole power frequency period, so that the circuit can reach a higher power factor. Because the traditional boost active PFC needs to be connected into a rectifier bridge, the circuit working principle can show that three semiconductor devices are arranged on a current path at any time of working, wherein two devices belong to the rectifier bridge, so that obvious conduction loss exists, and the overall efficiency of the circuit is reduced. At the same power condition and full load condition, the lower the input voltage, the higher the input current will increase and the higher the conduction loss in the current path will be, resulting in higher heat generation.
The plurality of package pins include a power supply pin and a plurality of control signal input pins.
The connection mode of pin and device in the power regulation module specifically includes: the power supply end of the driver and the power supply end of the controller are both connected to the power supply pin; the input end of each path of controller is correspondingly connected to a control signal input pin and used for receiving a control signal of an external controller; the output end of the controller is connected to the corresponding power factor correction unit and used for outputting a switching signal to the power factor correction unit according to the control signal.
The plurality of package pins further include a ground pin, a plurality of inductor connection pins, and a bus capacitor pin.
The power factor correction unit includes: and the switch unit comprises a first switch tube and a first diode, wherein the control electrode of the first switch tube is connected to the output end of the connected controller, the collector electrode of the first switch tube is connected to the cathode of the first diode, and the emitter electrode of the first switch tube is connected to the anode of the first diode.
The connection mode of pin and device in the power regulation module specifically still includes: an emitter of the first switching tube is connected to the grounding pin, and a collector of the first switching tube is connected to the corresponding inductance connecting pin; and the anodes of the second diodes are connected to the cathodes of the first diodes, and the cathodes of the multiple paths of second diodes are connected and connected to the bus capacitor connecting pin.
In this embodiment, each inductor connection pin is connected with an inductor in series correspondingly, a plurality of control terminals are arranged on the control chip, each control terminal is connected with one path of power factor correction module to realize that the plurality of paths of power factor correction modules are controlled independently, so that the plurality of power factor correction modules operate independently, and an inductor is arranged at the front end of each path of power factor correction module, so that the current input to the plurality of paths of power factor correction modules is the sum of the currents of the plurality of inductors, a control signal is reasonably output through the control chip to control the conduction time of a switch tube in each path of power factor correction module, so that the currents of the plurality of inductors are staggered, the current ripple can be reduced after superposition, and the circuit stability is improved.
The connection mode of pin and device in the power regulation module specifically still includes: an inverter is connected to the bus capacitor connection pin, the inverter including: a control electrode of the third transistor component is connected to the first output end of the driver, and a collector electrode of the third transistor component is connected to the bus capacitor connecting pin; a control electrode of the fourth transistor component is connected to the second output end of the driver, and a collector electrode of the fourth transistor component is connected to the bus capacitor connecting pin; a control electrode of the fifth transistor component is connected to the third output end of the driver, and a collector electrode of the fifth transistor component is connected to the bus capacitor connecting pin; a control electrode of the sixth transistor component is connected to the fourth output end of the driver, and a collector electrode of the sixth transistor component is connected to an emitter electrode of the third transistor component; a control electrode of the seventh transistor component is connected to the fifth output end of the driver, and a collector electrode of the seventh transistor component is connected to an emitter electrode of the fourth transistor component; and a control electrode of the eighth transistor component is connected to the sixth output end of the driver, and a collector electrode of the eighth transistor component is connected to an emitter electrode of the fifth transistor component.
In this embodiment, the inverter is a three-phase bridge inverter that converts the dc power output by the power factor correction circuit into ac power for use by the load.
The plurality of package pins further includes a voltage reference pin.
The connection mode of pin and device in the power regulation module specifically still includes: an emitter of the sixth transistor component is connected to the first voltage reference pin; an emitter of the seventh transistor component is connected to the second voltage reference pin; an emitter of the eighth transistor element is connected to the third voltage reference pin.
In this embodiment, the first voltage reference pin, the second voltage reference pin, and the third voltage reference pin are respectively used as three-phase low voltage reference terminals.
The plurality of package pins further includes a power supply negative terminal package pin.
The connection mode of pin and device in the power regulation module specifically still includes: the input end of the driver is connected with the three-phase bridge arm input pin; a seventh output end of the driver is connected with an emitter of the third transistor component, a collector of the sixth transistor component and a packaging pin of a negative end of the first power supply; an eighth output end of the driver is connected with an emitter of the fourth transistor component, a collector of the seventh transistor component and a packaging pin of a negative end of the second power supply; and a ninth output end of the driver is connected with an emitter of the fifth transistor component, a collector of the eighth transistor component and a packaging pin of a negative end of the third power supply.
The connection mode of pin and device in the power regulation module specifically still includes: the driver comprises six input ends which are correspondingly connected with six three-phase bridge arm input pins, and the six three-phase bridge arm input pins are respectively used as the input ends of a three-phase upper bridge arm and a three-phase lower bridge arm of the power regulating module.
In any of the above embodiments, the plurality of package pins further includes a positive power supply terminal package pin, and the tenth output terminal of the driver is connected to the first positive power supply terminal package pin; the eleventh output end of the driver is connected to the second power supply positive terminal packaging pin; the twelfth output terminal of the driver is connected to the third power supply positive terminal package pin.
In this embodiment, the first positive power supply terminal package pin, the second positive power supply terminal package pin, and the third positive power supply terminal package pin are respectively used as the positive terminals of the high voltage region power supply of the power conditioning module.
In any of the above embodiments, the third transistor assembly includes the first transistor and a third diode, a cathode of the third diode is connected to the collector of the first transistor, and an anode of the third diode is connected to the emitter of the first transistor; the fourth transistor component comprises a second triode and a fourth diode, the cathode of the fourth diode is connected with the collector of the second triode, and the anode of the fourth diode is connected with the emitter of the second triode; the fifth transistor component comprises a third triode and a fifth diode, the cathode of the fifth diode is connected with the collector of the third triode, and the anode of the fifth diode is connected with the emitter of the third triode; the sixth transistor component comprises a fourth triode and a sixth diode, the cathode of the sixth diode is connected to the collector of the fourth triode, and the anode of the sixth diode is connected to the emitter of the fourth triode; the seventh transistor component comprises a fifth triode and a seventh diode, the cathode of the seventh diode is connected with the collector of the fifth triode, and the anode of the seventh diode is connected with the emitter of the fifth triode; the eighth transistor component comprises a sixth triode and an eighth diode, wherein the cathode of the eighth diode is connected with the collector of the sixth triode, and the anode of the eighth diode is connected with the emitter of the sixth triode.
In any of the above embodiments, the plurality of independently controlled power factor correction circuits includes three independently controlled power factor correction circuits configured to have three inductive connection pins.
Example two
As shown in fig. 3, specifically, taking three independently controlled power factor correction circuits as an example, after an alternating current is converted into a direct current through a rectifier, the direct current passes through three parallel inductors and is respectively connected to three inductor connection pins PFC1, PFC2 and PFC3, the external controller MCU controls three switching units through PFCIN1, PFCIN2 and PFCIN3, so that three boost-type power factor correction units (i.e., boost-PFC units) operate independently, and an input current is the sum of three inductor currents.
The current of the three PFC circuits is detected by three independent sampling resistors through a grounding terminal and fed back to an external controller MCU in real time, and the ripple of the input current can be reduced to the minimum by only controlling the conduction time of three switches to enable three inductive currents to be staggered.
In addition, since the three boost units are independent of each other, only one or two of them may be used.
The three units need to select devices with the same specification, and current sharing can be achieved.
Input peak average current I of each path of PFCiavgThe design of the input circuit, such as a rectifier bridge, an EMC part of the circuit input, etc., can be modeled based on this computed value, calculated by the following equation.
By determining the input peak average current I of each PFC pathiavgThe circuit device model selection is performed based on the obtained input peak average current.
Figure BDA0002297103590000111
Wherein, IiavgIs the average value of the peak value of the input current, PoutTo output the total power, UiminFor the minimum value of the input voltage, η is the operating efficiency of the power factor correction module.
The current is output to the inverter circuit after passing through the PFC circuit and is connected with the external large capacitor through the bus capacitor pin, and the inverter is powered by the PFC circuit and the external large capacitor through the bus capacitor pin and is controlled to operate through PWM modulation.
EXAMPLE III
Fig. 3 shows a schematic diagram of a power conditioning module 100 (smart power module) according to a second embodiment of the present invention, taking a three-way independently controlled power factor correction circuit as an example, the power conditioning module 100 includes: three-way interleaved boost-PFC, HVIC tube (driver) 202 and three-phase inverter, each boost-PFC includes IC and power factor correction unit, the device of these circuits is pasted on the base plate or metal frame, and is packaged by plastic package material, only the package pin is left to contact with exterior.
Wherein the plurality of package pins include: the power supply circuit comprises a power supply pin (VDD), three control signal input pins (PFCIN1, PFCIN2 and PFCIN3), three ground pins (GND1, GND 2 and GND3), three inductance connection pins (PFC1, PFC2 and PFC3), a bus capacitor pin (P), voltage reference pins (UN, VN and WN), negative power supply terminal packaging pins (UVS, VVS and WVS), three-phase bridge arm input pins (HIN1, HIN2, HIN3 and LIN1, LIN2 and LIN3) and positive power supply terminal packaging pins (UVB, VVB and WVB).
Specifically, the multiple independently controlled power factor correction circuits are three power factor correction circuits, which form an interleaved boost-PFC circuit, and each power factor correction circuit includes: the controller is specifically an IC tube, the switch tube is an MOS tube, the first diode is a switch diode, the second diode is a boost diode, and the three circuits are distinguished by adopting A, B and C.
As shown in fig. 3, VCC terminals of the first IC transistor 202A, the second IC transistor 202B and the third IC transistor 202B are powered by the module VDD.
An IN end of the first channel of IC transistor 202A is connected to the control signal input pin PFCIN1, an OUT end of the first channel of IC transistor 202A is connected to a control electrode of the first MOS transistor 204A, an emitter of the first MOS transistor 204A is connected to an anode of the first channel of switching diode 206A and is connected to the first ground pin, and a collector of the first MOS transistor 204A, a cathode of the first channel of switching diode 206A and an anode of the first channel of boost diode 208A are connected to the first inductor connection pin PFC 1.
The IN end of the second channel IC tube 202B is connected to the control signal input pin PFCIN2, the OUT end of the second channel IC tube 202B is connected to the control electrode of the second MOS tube 204B, the emitter of the second MOS tube 204B is connected to the anode of the second channel switching diode 206B and to the second ground pin, the collector of the second MOS tube 204B, the cathode of the second channel switching diode 206B and the anode of the second channel boost diode 208B are connected to the second inductor connection pin PFC 2.
The IN terminal of the third IC tube 202C is connected to the control signal input pin PFCIN3, the OUT terminal of the third IC tube 202C is connected to the control electrode of the third MOS tube 204C, the emitter of the third MOS tube 204C is connected to the anode of the third switching transistor 206C and to the third ground pin, and the collector of the third MOS tube 204C, the cathode of the third switching transistor 206C and the anode of the third boost diode 208C are connected to the third inductor connection pin PFC 3.
The three- way boost diodes 208A, 208B are connected to the cathodes of 208C and to the bus capacitor pin P and to the inverter circuit bus.
The triode among the transistor module is the IGBT, and the diode is the FRD pipe, and the three-phase inverter includes: a U-phase upper arm IGBT (Insulated Gate Bipolar Transistor) tube 212, a V-phase upper arm IGBT tube 216, a W-phase upper arm IGBT tube 220, a U-phase lower arm IGBT tube 224, a V-phase lower arm IGBT tube 228, a W-phase lower arm IGBT tube 232, a first FRD (fast recovery diode) tube 214, a second FRD tube 218, a third FRD tube 222, a fourth FRD tube 226, a fifth FRD tube 230, and a sixth FRD tube 234.
The VCC terminal of the HVIC tube 210 is used as the positive terminal VDD of the low-voltage power supply of the power conditioning module 100, and VDD is generally 15V; the GND terminal of the HVIC tube 210 serves as the negative terminal COM of the low-voltage power supply of the power conditioning module 100.
The HIN1 end of the HVIC tube 210 serves as the U-phase upper bridge arm input end UHIN of the power conditioning module 100; the HIN2 end of the HVIC tube 210 serves as the V-phase upper bridge arm input end VHIN of the power regulation module 100; the HIN3 end of the HVIC tube 210 serves as the W-phase upper bridge arm input end WHIN of the power regulation module 100; the LIN1 end of the HVIC tube 210 serves as the U-phase lower bridge arm input end ULINs of the power regulating module 100; the LIN2 end of the HVIC tube 210 serves as the V-phase lower bridge arm input end VLIN of the power regulation module 100; the LIN3 terminal of the HVIC transistor 210 serves as the W-phase lower arm input terminal WLIN of the power conditioning module 100, where the U, V, W three-phase six-way input of the power conditioning module 100 receives input signals of 0V to 5V.
The VB1 end of the HVIC tube 210 is used as a positive end UVB of a power supply of a U-phase high-voltage area of the power regulation module 100; the HO1 end of the HVIC tube 210 is connected with the control electrode of the U-phase upper bridge arm IGBT tube 212; the VS1 end of the HVIC tube 210 is connected to the emitter of the U-phase upper arm IGBT tube 212, the anode of the first FRD tube 214, the collector of the U-phase lower arm IGBT tube 224, and the cathode of the fourth FRD tube 226, and serves as the negative terminal UVS of the U-phase high voltage region power supply of the power conditioning module 100.
The VB2 end of the HVIC tube 210 is used as the positive end VVB of the V-phase high-voltage area power supply source of the power regulation module 100; the HO2 end of the HVIC tube 210 is connected with the control electrode of the V-phase upper bridge arm IGBT tube 216; the VS2 end of the HVIC tube 210 is connected to the emitter of the V-phase upper arm IGBT tube 216, the anode of the second FRD tube 218, the collector of the V-phase lower arm IGBT tube 228, and the cathode of the fifth FRD tube 230, and serves as the negative end VVS of the W-phase high voltage area power supply of the power conditioning module 100.
The VB3 end of the HVIC tube 210 is used as a W-phase high-voltage area power supply positive end WVB of the power regulation module 100; the HO3 end of the HVIC tube 210 is connected with the control electrode of the W-phase upper bridge arm IGBT tube 220; the VS3 end of the HVIC tube 210 is connected to the emitter of the W-phase upper arm IGBT tube 220, the anode of the third FRD tube 222, the collector of the W-phase lower arm IGBT tube 232, and the cathode of the sixth FRD tube 234, and serves as the negative end WVS of the W-phase high voltage area power supply of the power conditioning module 100.
The LO1 end of the HVIC tube 210 is connected with the control electrode of the U-phase lower bridge arm IGBT tube 224; the LO2 end of the HVIC tube 210 is connected with the control electrode of the V-phase lower bridge arm IGBT tube 228; the LO3 end of the HVIC tube 210 is connected to the gate of the W-phase lower arm IGBT tube 232.
The emitter of the U-phase lower bridge arm IGBT tube 224 is connected to the anode of the fourth FRD tube 226, and serves as a U-phase low-voltage reference end UN of the power conditioning module 100; the emitter of the V-phase lower bridge arm IGBT tube 228 is connected to the anode of the fifth FRD tube 230, and serves as the V-phase low-voltage reference terminal VN of the power conditioning module 100; the emitter of the W-phase lower arm IGBT tube 232 is connected to the anode of the sixth FRD tube 234, and serves as a W-phase low-voltage reference terminal WN of the power conditioning module 100.
The collector of the U-phase upper arm IGBT tube 212, the cathode of the first FRD tube 214, the collector of the V-phase upper arm IGBT tube 216, the cathode of the second FRD tube 218, the collector of the W-phase upper arm IGBT tube 220, and the cathode of the third FRD tube 222 are connected to each other, and serve as a high-voltage input end P of the power conditioning module 100, where P is generally connected to 300V.
The HVIC tube 210 is used for transmitting logic signals of 0V to 5V from input terminals HIN1, HIN2, HIN3, LIN1, LIN2 and LIN3 to output terminals HO1, HO2, HO3, LO1, LO2 and LO3, wherein HO1, HO2 and HO3 are logic signals of VS to VS +15V, and LO1, LO2 and LO3 are logic signals of 0V to 15V.
Example four
The driving circuit according to the embodiment of the present invention is described in detail by the following embodiment.
Fig. 4 shows a schematic diagram of a driving circuit 300 of a first embodiment of the invention. The driving circuit 300 includes the power conditioning module 100 of any of the above embodiments, and the power conditioning module 100 is connected to a specified load.
Wherein the designated load may specifically be an electric motor.
In this embodiment, the inverter of the power conditioning module 100 is powered by the PFC circuit and the external large capacitor through the high voltage input terminal, and is PWM-modulated to control the operation of the motor. When the rotating speed of the motor is accurately controlled, on one hand, the cost of independent packaging is saved, the total area of the electric control board is reduced, on the other hand, the exposed connecting points of the circuit are reduced, the reliability of the circuit is improved, and the electromagnetic interference is favorably reduced.
In any of the above embodiments, further comprising: a capacitive element 302 coupled to the power conditioning module 100, the capacitive element 302 configured to provide power to the motor; an inductive element 304 coupled to the power conditioning module 100, the inductive element 304 configured to charge the capacitive element 302 through the power conditioning module 100.
In this embodiment, the power supply package pins of the power conditioning module 100 are connected to an external ac power source and the inductive element 304. In the positive half cycle of the alternating current (with the second power supply package pin as the positive direction), when the first transistor element is turned on, the current charges the inductance element 304, and the load is powered by the capacitance element 302; when the first transistor element is turned off, the current flowing through the first transistor element is transferred to the parasitic body diode of the second transistor element, providing an inverted signal to the capacitive element 302 and the inverter. During the negative half cycle of the ac power, when the second transistor element is turned on, the current charges the inductive element 304 and the load is powered by the capacitive element 302; when the second transistor element is turned off, the current flowing through the second transistor element is transferred to the parasitic body diode of the first transistor element, providing an inverted signal to the capacitive element 302 and the inverter.
EXAMPLE five
Fig. 5 shows a schematic diagram of a driving circuit of a second embodiment of the present invention. The driving circuit 300 includes the power conditioning module 100 according to any of the above embodiments, and the power conditioning module 100 is connected to the motor M, the inductive element 304 (including 304A, 304B, and 304C, respectively), and the capacitive element 302 in the manner shown in fig. 5.
After the alternating current is converted into direct current through the rectifier, the direct current passes through three parallel inductive elements 304 and is respectively connected to three inductive connection pins PFC1, PFC2 and PFC3, the external controller MCU controls three switching units through PFCIN1, PFCIN2 and PFCIN3, so that three boost-type power factor correction units (i.e., boost-PFC units) operate independently, and the input current is the sum of three inductive currents.
The current of the three PFC circuits is detected by three independent sampling resistors through a grounding terminal and fed back to an external controller MCU in real time, and the ripple of the input current can be reduced to the minimum by only controlling the conduction time of three switches to enable three inductive currents to be staggered.
In order to further improve the efficiency, the first boost diode 208A, the second boost diode 208B, and the first boost diode 208C may also be replaced by switching tubes.
The three-phase inverter is powered by the staggered boost-PFC circuit and the external capacitor C through a P pin, and the operation of the motor M is controlled through PWM modulation.
The air conditioner comprises the power adjusting module of any one of the embodiments; or a drive circuit as in any of the embodiments described above.
The invention provides an air conditioner, which comprises a power regulating module of any one embodiment; or the drive circuit of any of the embodiments described above, it is possible to achieve all the advantageous technical effects of including the power conditioning module of any of the embodiments described above or the drive circuit of any of the embodiments described above.
In the description herein, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance unless explicitly stated or limited otherwise; the terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (12)

1. A power conditioning module, comprising:
a substrate;
the power factor correction circuits are independently controlled in multiple ways and are arranged on the substrate, and each power factor correction circuit comprises a controller and a power factor correction unit which are electrically connected;
the inverter circuit is arranged on the substrate and comprises a driver and an inverter which are electrically connected, the inverter is also connected with the power factor correction circuit, and the inverter is configured to obtain the inverted signal after power correction and respond to a control signal so as to control a load according to the inverted signal;
the package frame is connected with the substrate and is configured to package the power factor correction circuit and the inverter which are arranged on the substrate so as to configure a plurality of package pins on the substrate, and any one of the package pins is connected with the power factor correction circuit or the inverter.
2. The power conditioning module of claim 1, wherein the plurality of package pins include a power supply pin and a plurality of control signal input pins,
the power supply end of the driver and the power supply end of the controller are both connected to the power supply pin;
the input end of each path of controller is correspondingly connected to one control signal input pin and used for receiving a control signal of an external controller;
the output end of the controller is connected to the corresponding power factor correction unit and used for outputting a switching signal to the power factor correction unit according to the control signal.
3. The power conditioning module of claim 2, wherein the plurality of package pins further comprise a ground pin, a plurality of inductive connection pins, and a bus capacitor pin, and wherein the power factor correction unit comprises:
the switch unit comprises a first switch tube and a first diode, wherein a control electrode of the first switch tube is connected to the output end of the connected controller, a collector electrode of the first switch tube is connected to the cathode of the first diode, an emitter electrode of the first switch tube is connected to the anode of the first diode, the emitter electrode of the first switch tube is connected to the grounding pin, and the collector electrode of the first switch tube is connected to the corresponding inductance connecting pin;
and the anode of the second diode is connected to the cathode of the first diode, and the cathodes of the multiple paths of second diodes are connected and are connected to the bus capacitor connecting pin.
4. The power conditioning module of claim 3, wherein the inverter is connected to the bus capacitor connection pin, the inverter comprising:
a third transistor component, a control electrode of the third transistor component is connected to the first output end of the driver, and a collector electrode of the third transistor component is connected to the bus capacitor connecting pin;
a control electrode of the fourth transistor component is connected to the second output end of the driver, and a collector electrode of the fourth transistor component is connected to the bus capacitor connection pin;
a control electrode of the fifth transistor component is connected to the third output end of the driver, and a collector electrode of the fifth transistor component is connected to the bus capacitor connection pin;
a sixth transistor element, a control electrode of which is connected to the fourth output end of the driver, and a collector electrode of which is connected to the emitter electrode of the third transistor element;
a control electrode of the seventh transistor component is connected to the fifth output end of the driver, and a collector electrode of the seventh transistor component is connected to an emitter electrode of the fourth transistor component;
and a control electrode of the eighth transistor component is connected to the sixth output end of the driver, and a collector electrode of the eighth transistor component is connected to an emitter electrode of the fifth transistor component.
5. The power conditioning module of claim 4, wherein the plurality of package pins further comprise a voltage reference pin,
an emitter of the sixth transistor component is connected to a first voltage reference pin;
an emitter of the seventh transistor component is connected to a second voltage reference pin;
an emitter of the eighth transistor element is connected to a third voltage reference pin.
6. The power conditioning module of claim 4, wherein the plurality of package pins further comprises a power supply negative terminal package pin,
the input end of the driver is connected with the three-phase bridge arm input pin;
a seventh output end of the driver is connected with an emitter of the third transistor component, a collector of the sixth transistor component and a first power supply negative end packaging pin;
an eighth output end of the driver is connected with an emitter of the fourth transistor component, a collector of the seventh transistor component and a second power supply negative end packaging pin;
and a ninth output end of the driver is connected with an emitter of the fifth transistor component, a collector of the eighth transistor component and a third power supply negative end packaging pin.
7. The power conditioning module of claim 4, wherein the plurality of package pins further comprises a positive power supply terminal package pin,
the tenth output end of the driver is connected to the first power supply positive terminal packaging pin;
the eleventh output end of the driver is connected to a second power supply positive terminal packaging pin;
and the twelfth output end of the driver is connected to the packaging pin of the positive end of the third power supply.
8. The power conditioning module of claim 4,
the third transistor component comprises a first triode and a third diode, the cathode of the third diode is connected with the collector of the first triode, and the anode of the third diode is connected with the emitter of the first triode;
the fourth transistor component comprises a second triode and a fourth diode, the cathode of the fourth diode is connected with the collector of the second triode, and the anode of the fourth diode is connected with the emitter of the second triode;
the fifth transistor component comprises a third triode and a fifth diode, the cathode of the fifth diode is connected with the collector of the third triode, and the anode of the fifth diode is connected with the emitter of the third triode;
the sixth transistor component comprises a fourth triode and a sixth diode, the cathode of the sixth diode is connected to the collector of the fourth triode, and the anode of the sixth diode is connected to the emitter of the fourth triode;
the seventh transistor component comprises a fifth triode and a seventh diode, the cathode of the seventh diode is connected to the collector of the fifth triode, and the anode of the seventh diode is connected to the emitter of the fifth triode;
the eighth transistor component comprises a sixth triode and an eighth diode, wherein the cathode of the eighth diode is connected to the collector of the sixth triode, and the anode of the eighth diode is connected to the emitter of the sixth triode.
9. The power conditioning module of any of claims 3-8,
the power factor correction circuit comprises three independently controlled power factor correction circuits so as to configure three inductive connection pins.
10. A driver circuit, comprising:
the power conditioning module of any of claims 1 to 9, the power conditioning module being configured to drive a specified load operation.
11. The driving circuit according to claim 10, further comprising:
a capacitive element connected to the power conditioning module, the capacitive element configured to supply power to the load;
an inductive element connected to the power conditioning module, the inductive element configured to charge the capacitive element through the power conditioning module.
12. An air conditioner, comprising:
the power conditioning module of any of claims 1 to 9; or
A driver circuit as claimed in claim 10 or 11.
CN201911206805.0A 2019-11-29 2019-11-29 Power regulation module, drive circuit and air conditioner Pending CN110798062A (en)

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CN113777934A (en) * 2021-08-03 2021-12-10 广东职业技术学院 Automatic indoor temperature and humidity and illumination adjusting system

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CN103516228A (en) * 2012-06-18 2014-01-15 珠海格力电器股份有限公司 Power conversion module of inverter air conditioner
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Application publication date: 20200214