CN210467834U - Intelligent power module and electric appliance with same - Google Patents
Intelligent power module and electric appliance with same Download PDFInfo
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- CN210467834U CN210467834U CN201921783534.0U CN201921783534U CN210467834U CN 210467834 U CN210467834 U CN 210467834U CN 201921783534 U CN201921783534 U CN 201921783534U CN 210467834 U CN210467834 U CN 210467834U
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- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
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Abstract
The utility model discloses an intelligent power module and have its electrical apparatus, intelligent power module includes: the compressor module is arranged on the substrate and comprises a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor and a compressor controller, wherein the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor and the sixth transistor are respectively connected with the compressor and the compressor controller; the fan module is arranged on the substrate and comprises a fan controller, the fan controller is connected with the fan, and the compressor module and the fan module are integrally packaged. The compressor module saves original FRD power device in the intelligent power module, 6 IGBTs and 6 FRD power devices of original use have been saved to the fan module to compressor module and fan module integrated package, thereby can reduce the encapsulation cost when reducing intelligent power module volume.
Description
Technical Field
The utility model belongs to the domestic appliance field, concretely relates to intelligent power module and have its electrical apparatus.
Background
An intelligent Power module, i.e., ipm (intelligent Power module), is a Power driving product combining Power electronics and integrated circuit technology. The intelligent power module integrates a power switch device and a high-voltage driving circuit and is internally provided with fault detection circuits such as overvoltage, overcurrent and overheat. The intelligent power module receives a control signal of the MCU to drive a subsequent circuit to work on one hand, and sends a state detection signal of the system back to the MCU on the other hand. Compared with the traditional discrete scheme, the intelligent power module wins a bigger and bigger market with the advantages of high integration degree, high reliability and the like, is particularly suitable for a frequency converter of a driving motor and various inverter power supplies, and is an ideal power electronic device for variable-frequency speed regulation, metallurgical machinery, electric traction, servo drive and variable-frequency household appliances.
In practical application, the compressor module and the fan module work in the same principle, but the compressor module generally has a current capacity of tens of a to tens of a, the fan module generally has a few a, the two modules generally use two inverter modules with different specifications, each inverter module at least comprises one HVIC, 6 IGBTs and 6 FRDs, and because the fan module and the compressor module are both larger in single size and the packaging technology is limited in size, an independent packaging mode is generally adopted, that is, the fan inverter module and the compressor are respectively located in one inverter module, the packaged intelligent power module is larger in size and higher in packaging cost.
Therefore, the existing smart power module is to be improved.
SUMMERY OF THE UTILITY MODEL
The present invention aims at solving at least one of the technical problems in the related art to a certain extent. For this reason, an object of the utility model is to provide an intelligent power module and have its electrical apparatus, original FRD power device has been saved to compressor module among this intelligent power module, and 6 pieces of IGBT and 6 pieces of FRD power device of original use have been saved to the fan module to compressor module and fan module integrated encapsulation, thereby can reduce the encapsulation cost when reducing intelligent power module volume.
In one aspect of the present invention, the utility model provides an intelligent power module. According to the utility model discloses an embodiment, intelligent power module includes:
a substrate;
a compressor module disposed on the substrate and including a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, and a compressor controller, wherein the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor, and the sixth transistor are respectively connected to a compressor and the compressor controller;
a fan module disposed on the substrate and including a fan controller connected to a fan,
wherein, the compressor module and the fan module are packaged in an integrated manner.
The compressor module in the intelligent power module according to the embodiment of the invention comprises the compressor controller and the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor and the sixth transistor, thus omitting the original FRD power device, reducing the area of the compressor module, and the fan module comprises a fan controller, 6 IGBT and 6 FRD power devices which are used originally are saved, the area of the fan module is also reduced, and the compressor module and the fan module are integrally packaged, compared with the traditional compressor module and the traditional fan module which respectively use inverter modules with different specifications and adopt independent packaging, the intelligent power module not only reduces the packaging cost, and the volume of the intelligent power module is reduced by more than 50%, thereby being beneficial to the popularization of the intelligent power module in the low-end field.
In addition, according to the utility model discloses above-mentioned embodiment's intelligent power module can also have following additional technical characteristics:
optionally, the first gate of the first transistor is connected to the HO1 terminal of the compressor controller, the second gate of the second transistor is connected to the HO2 terminal of the compressor controller, the third gate of the third transistor is connected to the HO3 terminal of the compressor controller, the fourth gate of the fourth transistor is connected to the LO1 terminal of the compressor controller, the fifth gate of the fifth transistor is connected to the LO2 terminal of the compressor controller, the sixth gate of the sixth transistor is connected to the LO3 terminal of the compressor controller, the first collector of the first transistor, the second collector of the second transistor, and the third collector of the third transistor are connected to the high voltage input terminal of the compressor, the first emitter of the first transistor is connected to the fourth collector of the fourth transistor and to the VS1 terminal of the compressor controller and to the UVS terminal of the compressor, the second emitter of the second transistor is connected with the fifth collector of the fifth transistor and is connected with the VS2 end of the compressor controller and the VVS end of the compressor, the third emitter of the third transistor is connected with the sixth collector of the sixth transistor and is connected with the VS3 end of the compressor controller and the WVS end of the compressor, the fourth emitter of the fourth transistor is connected with the UN end of the compressor, the fifth emitter of the fifth transistor is connected with the VN end of the compressor, and the sixth emitter of the sixth transistor is connected with the WN end of the compressor.
Optionally, the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor, and the sixth transistor are all silicon carbide transistors.
Optionally, the fan controller is a silicon-insulated intelligent power controller. Therefore, the area of the fan module can be obviously reduced.
Optionally, the smart power module comprises: a power factor corrector disposed on the substrate, and the power factor corrector, the compressor module, and the fan module are integrally packaged. Therefore, the packaging cost of the intelligent power module can be reduced.
Optionally, the power factor corrector comprises a high electron mobility transistor HEMT. From this, can realize the low pressure drive, save FRD, further reduce intelligent power module volume.
Optionally, the high electron mobility transistor HEMT is of a GaN material.
Optionally, the compressor controller includes a bootstrap circuit.
Optionally, the bootstrap circuit includes a first bootstrap diode, a second bootstrap diode, and a third bootstrap diode, wherein an anode of the first bootstrap diode, an anode of the second bootstrap diode, and an anode of the third bootstrap diode are respectively connected to the VCC terminal of the compressor controller, a cathode of the first bootstrap diode is connected to the pin VB1 of the compressor controller, a cathode of the second bootstrap diode is connected to the pin VB2 of the compressor controller, and a cathode of the third bootstrap diode is connected to the pin VB3 of the compressor controller.
In another aspect of the present invention, the present invention provides an electrical appliance. According to the utility model discloses an embodiment, electrical apparatus includes foretell intelligent power module. Therefore, the intelligent power module with small volume and low packaging cost is used on the electric appliance, so that the volume of the circuit substrate in the electric appliance can be obviously reduced, the reliability of the electric appliance is improved, and the production cost is reduced.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of an intelligent power module according to an embodiment of the present invention;
fig. 2 is a partial circuit diagram of a smart power module according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In one aspect of the present invention, the utility model provides an intelligent power module. According to an embodiment of the present invention, referring to fig. 1, the smart power module includes a substrate 100, a compressor module 200, and a fan module 300.
According to the embodiment of the present invention, the substrate 100 is made of a conventional material in the field, and will not be described herein.
According to an embodiment of the present invention, referring to fig. 1, the compressor module 200 is disposed on the substrate 100, and the compressor module 200 includes a first transistor 21, a second transistor 22, a third transistor 23, a fourth transistor 24, a fifth transistor 25, a sixth transistor 26, and a compressor controller 27, the first transistor 21, the second transistor 22, the third transistor 23, the fourth transistor 24, the fifth transistor 25, and the sixth transistor 26 are connected to a compressor (not shown), preferably, the first transistor 21, the second transistor 22, the third transistor 23, the fourth transistor 24, the fifth transistor 25, and the sixth transistor 26 are silicon carbide transistors, and the compressor controller 27 is connected to the first transistor 21, the second transistor 22, the third transistor 23, the fourth transistor 24, the fifth transistor 25, and the sixth transistor 26 for driving the first transistor 21, The second transistor 22, the third transistor 23, the fourth transistor 24, the fifth transistor 25 and the sixth transistor 26, that is, the compressor module 200 includes only 1 compressor controller, 6 transistors and a partial capacitor (not shown), and at the same time, since the transistors have gate resistors, the compressor module does not need to additionally arrange the gate resistors, and the compressor module omits the original FRD power device, thereby reducing the area of the compressor module.
Specifically, referring to fig. 2, a VCC end of the compressor controller 27 serves as a positive end VDD of a low-voltage power supply of the intelligent power module, VDD is generally 15V, and a HIN1 end of the compressor controller 27 serves as an upper bridge arm input end UHIN of a U-phase of the compressor of the intelligent power module; the HIN2 end of the compressor controller 27 serves as the input end VHIN of the upper bridge arm of the V phase of the compressor of the intelligent power module; the HIN3 end of the compressor controller 27 serves as the upper bridge arm input end WHIN of the W phase of the compressor of the intelligent power module; the LIN1 end of the compressor controller 27 is used as the input end ULIN of the U-phase lower bridge arm of the compressor of the intelligent power module; the LIN2 end of the compressor controller 27 serves as the input end VLIN of the V-phase lower bridge arm of the compressor of the intelligent power module; the LIN3 end of the compressor controller 27 is used as the W-phase lower bridge arm input end WLIN of the compressor of the intelligent power module; the six inputs of UHIN, VHIN, WHIN, ULIN, VLIN and WLIN of the intelligent power module receive 0V or 5V input signals; the GND end of the compressor controller 27 is used as the negative end COM of the low-voltage power supply of the intelligent power module; the VB1 end of the compressor controller 27 is connected with one end of the first capacitor 1131 and is used as the positive end UVB of the power supply of the U-phase high-voltage area of the compressor of the intelligent power module; the HO1 end of the compressor controller 27 is connected to the first gate 211 of the first transistor 21 of the upper arm of the compressor U phase; the HO2 end of the compressor controller 27 is connected to the second gate 221 of the second transistor 22 of the upper arm of the U phase of the compressor; the VS1 end of the compressor controller 27 is connected to the first emitter 213 of the first transistor 21 of the upper arm of the U-phase of the compressor, the fourth collector 242 of the fourth transistor 24 of the lower arm of the U-phase of the compressor, and the other end of the first capacitor 1131, and is used as the negative end UVS of the power supply of the high-voltage area of the U-phase of the compressor of the intelligent power module; a VB2 end of the compressor controller 27 is connected to one end of the second capacitor 1132, and serves as a positive end VVB of a power supply of the U-phase high-voltage region of the compressor of the intelligent power module; the HO3 end of the compressor controller 27 is connected to the third gate 231 of the third transistor 23 of the upper arm of the phase of the compressor W; the VS2 end of the compressor controller 27 is connected to the second emitter 223 of the second transistor 22, the fifth collector 252 of the fifth transistor 25 of the V-phase lower bridge arm of the compressor, and the other end of the second capacitor 1132, and is used as the negative end VVS of the V-phase high-voltage region power supply of the compressor of the intelligent power module; the VB3 end of the compressor controller 27 is connected to one end of the third capacitor 1133, and serves as the positive end WVB of the power supply of the W-phase high-voltage region of the compressor of the intelligent power module; the HO3 end of the compressor controller 27 is connected to the third gate 231 of the third transistor 23 of the upper arm of the phase of the compressor W; the VS3 end of the compressor controller 27 is connected to the third emitter 233 of the third transistor 23, the sixth collector 262 of the sixth transistor 26 of the W-phase lower bridge arm of the compressor, and the other end of the third capacitor 1133, and is used as the negative end WVS of the W-phase high-voltage area power supply of the compressor of the intelligent power module; the LO1 terminal of the compressor controller 27 is connected to the fourth gate 241 of the fourth transistor 24; the LO2 terminal of the compressor controller 27 is connected to the fifth gate 251 of the fifth transistor 25; the LO3 terminal of the compressor controller 27 is connected to the sixth gate 261 of the sixth transistor 26; a fourth emitter 243 of the fourth transistor 24 is a compressor U-phase low-voltage reference end UN of the smart power module; a fifth emitter 253 of the fifth transistor 25 serves as a compressor V-phase low-voltage reference terminal VN of the intelligent power module; a sixth emitter 263 of the sixth transistor 26 is a W-phase low-voltage reference terminal WN of the compressor of the smart power module; the first collector electrode 212 of the first transistor 21, the second collector electrode 222 of the second transistor 22, and the third collector electrode 232 of the third transistor 23, and the high voltage input terminal of the compressor, and serve as the high voltage input terminal P of the smart power module, where P is generally connected to 300V.
Further, referring to fig. 2, the compressor controller 27 includes a bootstrap circuit 271. Specifically, the bootstrap circuit 271 inside the compressor controller 27 includes a first bootstrap diode 2711, a second bootstrap diode 2712, and a third bootstrap diode 2713, the VCC terminal of the compressor controller 27 is connected to the anode of the first bootstrap diode 2711, the anode of the second bootstrap diode 2712, and the anode of the third bootstrap diode 2713, the cathode of the first bootstrap diode 2711 is connected to the pin VB1 of the compressor controller 27, the cathode of the second bootstrap diode 2712 is connected to the pin VB2 of the compressor controller 27, and the cathode of the third bootstrap diode 2713 is connected to the pin VB3 of the compressor controller 27.
According to the embodiment of the utility model, refer to fig. 1, fan module 300 sets up on base plate 100 to fan module 300 includes fan controller 31, and this fan controller 31 links to each other with fan (not shown), and fan module 300 of this application has only adopted fan controller 31 promptly, has saved 6 pieces of IGBT and 6 pieces of FRD of original use, thereby has reduced fan module area, has increased the wiring area, thereby has improved the reliability of the wiring that produces the connection between components and parts. Preferably, the fan controller 31 is a silicon-insulated intelligent power controller. Specifically, referring to fig. 2, the VCC terminal of the fan controller 31 is connected to the reference voltage terminal VREF of the compressor controller 27; a bootstrap circuit, an HVIC and an MOS are integrated in the fan controller 31; here, the six inputs FUHIN, FVHIN, FWHIN, FULIN, FVLIN, FWLIN of the smart power module receive input signals of 0V or 5V; the GND terminal of the fan controller 31 is used as the negative terminal COM of the low-voltage power supply of the intelligent power module; the fan controller 31 is connected to the high voltage input P.
According to the utility model discloses an embodiment, compressor module 200 and fan module 300 integrated packaging. From this, for fan module and compressor module current difference among the prior art and both need use the dc-to-ac converter module of different specifications, make fan module and compressor module single size all great among the prior art, consequently fan module and compressor module among the prior art can only adopt the mode of independent encapsulation, and innovative carry out the bold exploration research to fan module and compressor module in this application, finally found the compressor module and can save original FRD power device, fan module can save original 6 pieces of IGBT and 6 pieces of FRD power device, thereby compressor module and fan module block size have been reduced respectively, make the integrated encapsulation of compressor module and fan module become possible, and then through the integrated encapsulation with compressor module and fan module, can show and reduce the encapsulation cost.
The compressor module in the intelligent power module according to the embodiment of the invention comprises the compressor controller and the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor and the sixth transistor, thus omitting the original FRD power device, reducing the area of the compressor module, and the fan module comprises a fan controller, 6 IGBT and 6 FRD power devices which are used originally are saved, the area of the fan module is also reduced, and the compressor module and the fan module are integrally packaged, compared with the traditional compressor module and the traditional fan module which respectively use inverter modules with different specifications and adopt independent packaging, the intelligent power module not only reduces the packaging cost, and the volume of the intelligent power module is reduced by more than 50%, thereby being beneficial to the popularization of the intelligent power module in the low-end field.
According to the utility model discloses an embodiment, above-mentioned intelligent power module further includes power factor corrector (not shown), and this power factor corrector is established in base plate 100 top, and wherein, power factor corrector encapsulates with compressor module 200 and fan module 300 integration to can show reduction encapsulation cost. Further, the power factor corrector includes a high electron mobility transistor HEMT (not shown) having a low voltage driving characteristic, so that the power factor corrector can be directly driven by the MCU signal, the original FRD power device is omitted, and a freewheeling diode does not need to be connected in parallel, thereby further reducing the size of the intelligent power module. Preferably, the high electron mobility transistor HEMT is a GaN material.
In another aspect of the present invention, the present invention provides an electrical appliance. According to the utility model discloses an embodiment, the electrical apparatus has preceding intelligent power module. Therefore, the intelligent power module with small volume and low packaging cost is used on the electric appliance, so that the volume of the circuit substrate in the electric appliance can be obviously reduced, the reliability of the electric appliance is improved, and the production cost is reduced. It should be noted that the features and advantages described above for the smart power module are also applicable to the electrical appliance, and are not described herein again.
According to the utility model discloses an embodiment, above-mentioned electrical apparatus can be air conditioner and refrigerator etc.. According to the utility model discloses a specific embodiment to the air conditioner is as an example, and the air conditioner can also include the necessary structure or the part of conventional air conditioners such as fan, compressor, heat exchanger, throttle subassembly, wind-guiding part, chassis, panel except including preceding intelligent power module, no longer has too much repeated description here. According to the utility model discloses an embodiment, the kind of air conditioner can be for hanging, cabinet type etc..
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (10)
1. A smart power module, comprising:
a substrate;
a compressor module disposed on the substrate and including a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, and a compressor controller, wherein the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor, and the sixth transistor are respectively connected to a compressor and the compressor controller;
a fan module disposed on the substrate and including a fan controller connected to a fan,
wherein, the compressor module and the fan module are packaged in an integrated manner.
2. The smart power module of claim 1, wherein the first gate of the first transistor is connected to the HO1 terminal of the compressor controller, the second gate of the second transistor is connected to the HO2 terminal of the compressor controller, the third gate of the third transistor is connected to the HO3 terminal of the compressor controller, the fourth gate of the fourth transistor is connected to the LO1 terminal of the compressor controller, the fifth gate of the fifth transistor is connected to the LO2 terminal of the compressor controller, the sixth gate of the sixth transistor is connected to the LO3 terminal of the compressor controller, the first collector of the first transistor, the second collector of the second transistor, and the third collector of the third transistor are connected to the high voltage input terminal of the compressor, the first emitter of the first transistor is connected to the fourth collector of the fourth transistor and to the VS1 terminal of the compressor controller and the VS1 terminal of the compressor controller The UVS terminal is connected to the second emitter of the second transistor, the second emitter of the second transistor is connected to the fifth collector of the fifth transistor, the VS2 terminal of the compressor controller and the VVS terminal of the compressor, the third emitter of the third transistor is connected to the sixth collector of the sixth transistor, the VS3 terminal of the compressor controller and the WVS terminal of the compressor, the fourth emitter of the fourth transistor is connected to the UN terminal of the compressor, the fifth emitter of the fifth transistor is connected to the VN terminal of the compressor, and the sixth emitter of the sixth transistor is connected to the WN terminal of the compressor.
3. The smart power module of claim 1, wherein the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor, and the sixth transistor are all silicon carbide transistors.
4. The smart power module of claim 1 wherein the fan controller is a silicon-on-insulator smart power controller.
5. The smart power module of claim 1, comprising:
a power factor corrector disposed on the substrate, and the power factor corrector, the compressor module, and the fan module are integrally packaged.
6. The smart power module of claim 5 wherein the power factor corrector comprises a High Electron Mobility Transistor (HEMT).
7. The smart power module of claim 6 wherein the High Electron Mobility Transistor (HEMT) is a GaN material.
8. The smart power module of claim 1 wherein the compressor controller comprises a bootstrap circuit.
9. The smart power module of claim 8 wherein the bootstrap circuit includes a first bootstrap diode, a second bootstrap diode, and a third bootstrap diode,
the anode of the first bootstrap diode, the anode of the second bootstrap diode and the anode of the third bootstrap diode are respectively connected to the VCC terminal of the compressor controller, the cathode of the first bootstrap diode is connected to the pin VB1 of the compressor controller, the cathode of the second bootstrap diode is connected to the pin VB2 of the compressor controller, and the cathode of the third bootstrap diode is connected to the pin VB3 of the compressor controller.
10. An appliance, characterized in that the appliance comprises a smart power module according to any one of claims 1-9.
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CN110634855A (en) * | 2019-10-22 | 2019-12-31 | 广东美的制冷设备有限公司 | Intelligent power module and electric appliance with same |
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