CN210834704U - Defect detection device for semiconductor chip - Google Patents
Defect detection device for semiconductor chip Download PDFInfo
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- CN210834704U CN210834704U CN201921602351.4U CN201921602351U CN210834704U CN 210834704 U CN210834704 U CN 210834704U CN 201921602351 U CN201921602351 U CN 201921602351U CN 210834704 U CN210834704 U CN 210834704U
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Abstract
The utility model relates to a semiconductor chip's defect detecting device, include: a transfer device on which the semiconductor chips are transported; the infrared camera and/or the common optical lens are arranged above the transmission device; the infrared light source is arranged on the infrared camera and is opposite to the semiconductor chip on the transmission device; the image analysis device is connected with the infrared camera; the alarm device is connected with the image analysis device; when the semiconductor chip is transmitted on the transmission device, the infrared camera acquires an image of the semiconductor chip and transmits the image to the image analysis device, and when the image analysis device judges that the appearance of the semiconductor chip has defects, the alarm device gives an alarm. The defect detection device of the semiconductor chip with the structure can automatically detect the semiconductor chip, and has high accuracy and strong reliability.
Description
Technical Field
The utility model relates to a semiconductor chip field specifically indicates a semiconductor chip's defect detecting device.
Background
At present, electronic component packaging is rapidly developed towards miniaturization, sheet type and high performance, the defect detection of component pins is a necessary premise for correct packaging, and the detection of other appearance defects is the quality guarantee of packaged components. At present, traditional manual visual inspection detection is still adopted on a plurality of production lines, and unqualified products are manually rejected after defects are found. The existing quality detection mode has the following problems: due to the fact that the production quantity of the chip is large, an operator can work continuously on a continuous production line in a working period, visual fatigue is prone to being caused after the operator uses eyes for a long time, the quality consistency of electronic elements is difficult to guarantee, and defective products are prone to entering the market.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the shortcoming of above-mentioned prior art, provide a defect detecting device of high, the automatic semiconductor chip of accuracy.
In order to realize the above purpose, the utility model discloses the technical scheme who adopts is:
the defect detection device of the semiconductor chip comprises the following components:
a transfer device on which the semiconductor chips are transported;
the infrared camera and/or the common optical lens are arranged above the transmission device;
the infrared light source is arranged on the infrared camera and is opposite to the semiconductor chip on the transmission device;
the image analysis device is connected with the infrared camera;
the alarm device is connected with the image analysis device;
when the semiconductor chip is transmitted on the transmission device, the infrared camera acquires an image of the semiconductor chip and transmits the image to the image analysis device, and when the image analysis device judges that the appearance of the semiconductor chip has defects, the alarm device gives an alarm.
In one embodiment, the alarm device is a display.
In one embodiment, the infrared camera further comprises a visible light LED light source, wherein the visible light LED light source is arranged on the infrared camera and the common optical lens and is opposite to the semiconductor chip on the transmission device.
In one embodiment, the infrared light source adopts backward illumination, and the visible light LED light source adopts forward illumination; the infrared light source adopts a plurality of thermal radiation infrared light source luminous bodies, and the visible light LED light source adopts a plurality of LED luminous bodies with different colors and high irradiation intensity.
In one embodiment, the image analysis apparatus includes:
the input end of the image recognition unit is connected with the infrared camera;
the input end of the defect positioning unit is connected with the output end of the image recognition unit;
and the input end of the defect judging unit is connected with the output end of the defect positioning unit, and the output end of the defect judging unit is connected with the input end of the alarm device.
In one embodiment, the defect locating unit includes:
a pin position detection subunit, an input end of which is connected with an output end of the image recognition unit;
the chip surface position detection subunit, the input end of the chip surface position detection subunit is connected with the output end of the image recognition unit;
and the input end of the defect positioning subunit is respectively connected with the output end of the pin position detection subunit and the output end of the chip surface position detection subunit, and the output end of the defect positioning subunit is connected with the input end of the defect judging unit.
In one embodiment, the transmission device includes a transmission module, a shunting module, and a control module, the transmission module is connected to the shunting module, the transmission module, the shunting module are connected to the control module, and the control module is connected to the image analysis device.
In one embodiment, the infrared camera is remotely connected to the image analysis device.
Adopted semiconductor chip's among this utility model defect detecting device, compared with the prior art, had following profitable technological effect:
the utility model discloses can carry out automated inspection to semiconductor chip appearance imperfections, safety, accuracy, and detection efficiency is high, can detect the small defect that the people's eye is difficult to detect through computer automatic identification system simultaneously, and is efficient.
Drawings
Fig. 1 is a schematic diagram of the defect detecting apparatus for semiconductor chips according to the present invention.
Detailed Description
In order to more clearly describe the technical content of the present invention, the following further description is given with reference to specific embodiments.
Referring to fig. 1, fig. 1 is a schematic diagram of a defect detection apparatus for a semiconductor chip according to the present invention. The defect detection device of the semiconductor chip comprises:
a transfer device on which the semiconductor chips are transported;
the infrared camera and/or the common optical lens are arranged above the transmission device; the infrared lens can acquire the infrared image of the component with high contrast in the space with insufficient light, and the defect condition of the chip can be judged quickly.
The infrared light source is arranged on the infrared camera and is opposite to the semiconductor chip on the transmission device; the infrared light source is used for enhancing the temperature difference and the radiation difference of different positions of the components and the parts and highlighting the image target characteristics.
The image analysis device is connected with the infrared camera;
the alarm device is connected with the image analysis device;
when the semiconductor chip is transmitted on the transmission device, the infrared camera acquires an image of the semiconductor chip and transmits the image to the image analysis device, and when the image analysis device judges that the appearance of the semiconductor chip has defects, the alarm device gives an alarm.
The utility model discloses can carry out automated inspection to semiconductor chip appearance imperfections, safety, accuracy, and detection efficiency is high, can detect the small defect that the people's eye is difficult to detect through computer automatic identification system simultaneously, and is efficient.
In one embodiment, the alarm device is a display. For example, when two chips are defective in a picture obtained by a certain infrared camera, for example, when 9 chips are present in a picture, and the image analysis device determines that the 3 rd chip and the 4 th chip of the 9 chips are defective, the corresponding positions of the two chips on the display will be either highlighted, red (or other colors) will be marked, or will be in a flashing state to give an indication.
In one embodiment, the infrared camera further comprises a visible light LED light source, wherein the visible light LED light source is arranged on the infrared camera and the common optical lens and is opposite to the semiconductor chip on the transmission device. Therefore, the shadow of the camera can be prevented from appearing on the chip, and the image analysis device can be prevented from analyzing wrongly. The visible light LED light source is simultaneously used for supplementing light when being matched with a common optical lens for photographing. The visible light LED light source may be white or other light sources with higher illumination intensity (such as red, blue, etc.). Wherein, the infrared light source needs to be preheated before the device formally carries out detection work, so that the detection environment is kept at a certain temperature.
In one embodiment, the system further comprises a common optical lens, wherein the common optical lens is used for being matched with the visible light LED light source to work synchronously, and one image is obtained by flashing at a time. The device can be used for detecting the infrared image of the target component through the infrared lens independently, and can also be used for fusing the infrared image of the infrared lens and the visible light image shot by the common optical lens to detect the fused image.
In one embodiment, the infrared light source adopts backward illumination, and the visible light LED light source adopts forward illumination; the infrared light source adopts a plurality of thermal radiation infrared light source luminous bodies, and the visible light LED light source adopts a plurality of LED luminous bodies with different colors and high irradiation intensity.
In one embodiment, the image analysis apparatus includes:
the input end of the image recognition unit is connected with the infrared camera;
the input end of the defect positioning unit is connected with the output end of the image recognition unit;
and the input end of the defect judging unit is connected with the output end of the defect positioning unit, and the output end of the defect judging unit is connected with the input end of the alarm device.
In this embodiment, the defect locating unit first roughly determines the position of the defect, and then the defect judging unit judges whether the defect exists, for example, the defect locating unit may roughly determine that the defect may exist at the pin, and then the defect judging unit compares the defect with the standard template to determine whether the defect is within a tolerable range.
In one embodiment, the defect locating unit includes: a pin position detection subunit, an input end of which is connected with an output end of the image recognition unit; the chip surface position detection subunit, the input end of the chip surface position detection subunit is connected with the output end of the image recognition unit; and the input end of the defect positioning subunit is respectively connected with the output end of the pin position detection subunit and the output end of the chip surface position detection subunit, and the output end of the defect positioning subunit is connected with the input end of the defect judging unit.
In one embodiment, the transmission device is a transmission device with a shunting function, and comprises a transmission module for transmitting the semiconductor chip, a shunting module for transmitting and shunting the semiconductor chip, and a control module, wherein the transmission module is connected with the shunting module, the transmission module and the shunting module are connected with the control module, and the control module is connected with the image analysis device.
In one embodiment, the infrared camera is remotely connected to the image analysis device.
Specifically, the utility model discloses a defect detection method of semiconductor chip, it includes following step:
irradiating infrared light onto a workpiece to be detected of a transmission device, wherein the workpiece is a semiconductor chip;
acquiring an infrared image of a workpiece by using an infrared camera, or acquiring the infrared image and a common optical image of the workpiece by using the infrared camera and a common optical lens simultaneously to serve as an image to be detected;
and transmitting the acquired image to be detected to an image analysis device for analyzing and judging whether the workpiece has defects, and giving an alarm by the alarm device when the image analysis device judges that the workpiece has defects in appearance.
In one embodiment, the determining whether the workpiece has a defect according to the image to be detected includes:
the position of the defect is roughly determined by a defect positioning unit, and then whether the defect exists in the position is determined by comparing the defect positioning unit with a standard template.
In one embodiment, when the infrared camera and the common optical lens are adopted to simultaneously acquire the infrared image and the common optical image of the workpiece, the visible light LED light source needs to be started;
and fusing the infrared image acquired by the infrared camera with the visible light image shot by the common optical lens, and detecting the fused image.
The utility model discloses an among the technical scheme of semiconductor chip's defect detecting device, each functional module and the modular unit that wherein include all can correspond to specific hardware circuit in the integrated circuit structure, consequently only relate to the improvement of specific hardware circuit, and the hardware part is not only the carrier that carries out control software or computer program, consequently solves corresponding technical problem and obtains corresponding technological effect and does not relate to the application of any control software or computer program yet, that is to say, the utility model discloses only utilize the improvement in the hardware circuit structure that these modules and units relate to can solve the technical problem that will solve to obtain corresponding technological effect, and need not assist and can realize corresponding function with specific control software or computer program.
The above-mentioned embodiments are preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and those skilled in the art should understand that they can make modifications, changes, combinations, substitutions, etc. without departing from the spirit of the present invention, which is also within the scope of the present invention as claimed in the appended claims.
In this specification, the invention has been described with reference to specific embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
Claims (8)
1. An apparatus for detecting defects of a semiconductor chip, the apparatus comprising:
a transfer device on which the semiconductor chips are transported;
the infrared camera and/or the common optical lens are arranged above the transmission device;
the infrared light source is arranged on the infrared camera and is opposite to the semiconductor chip on the transmission device;
the image analysis device is connected with the infrared camera;
the alarm device is connected with the image analysis device;
the semiconductor chip is transmitted on the transmission device, the infrared camera acquires an image of the semiconductor chip and transmits the image to the image analysis device, and when the image analysis device judges that the appearance of the semiconductor chip has defects, the alarm device gives an alarm.
2. The apparatus of claim 1, wherein the alarm device is a display.
3. The apparatus of claim 1, further comprising a visible light LED light source, wherein the visible light LED light source is disposed on the infrared camera and the common optical lens, and faces the semiconductor chip on the transmission device.
4. The apparatus of claim 3, wherein the infrared light source is back-illuminated and the visible LED light source is front-illuminated; the infrared light source adopts a plurality of thermal radiation infrared light source luminous bodies, and the visible light LED light source adopts a plurality of LED luminous bodies with different colors and high irradiation intensity.
5. The apparatus for detecting defects of a semiconductor chip according to claim 1, wherein said image analyzing means comprises:
the input end of the image recognition unit is connected with the infrared camera;
the input end of the defect positioning unit is connected with the output end of the image recognition unit;
and the input end of the defect judging unit is connected with the output end of the defect positioning unit, and the output end of the defect judging unit is connected with the input end of the alarm device.
6. The apparatus of claim 5, wherein the defect locating unit comprises:
a pin position detection subunit, an input end of which is connected with an output end of the image recognition unit;
the chip surface position detection subunit, the input end of the chip surface position detection subunit is connected with the output end of the image recognition unit;
and the input end of the defect positioning subunit is respectively connected with the output end of the pin position detection subunit and the output end of the chip surface position detection subunit, and the output end of the defect positioning subunit is connected with the input end of the defect judging unit.
7. The apparatus of claim 1, wherein the transport device comprises a transport module, a shunting module, and a control module, the transport module is connected to the shunting module, the transport module, the shunting module, and the control module are connected to the image analysis device.
8. The apparatus of claim 1, wherein the infrared camera is remotely connected to the image analysis device.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921602351.4U CN210834704U (en) | 2019-09-25 | 2019-09-25 | Defect detection device for semiconductor chip |
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| CN201921602351.4U CN210834704U (en) | 2019-09-25 | 2019-09-25 | Defect detection device for semiconductor chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110596141A (en) * | 2019-09-25 | 2019-12-20 | 无锡乐东微电子有限公司 | Defect detection device and method for semiconductor chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110596141A (en) * | 2019-09-25 | 2019-12-20 | 无锡乐东微电子有限公司 | Defect detection device and method for semiconductor chip |
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