CN210796602U

CN210796602U - Protection baffle for chip secondary photoetching evaporation

Info

Publication number: CN210796602U
Application number: CN201921616504.0U
Authority: CN
Inventors: 周新华
Original assignee: Xiangyang Saipuer Electronics Co ltd
Current assignee: Xiangyang Saipuer Electronics Co ltd
Priority date: 2019-09-26
Filing date: 2019-09-26
Publication date: 2020-06-19
Anticipated expiration: 2029-09-26

Abstract

The utility model relates to a chip economizes protection separation blade that secondary photoetching evaporated usefulness, including the separation blade body of locating silicon chip one side on the chip, the separation blade body includes outside ring support piece and the shielding part that is used for hiding the photoetching pattern on the chip in the middle of, link together through a plurality of bellied muscle between middle shielding part and the outside ring support piece. The utility model provides a chip economizes the protection separation blade that secondary photoetching evaporated usefulness, and the photoetching pattern on the protection chip that can be fine when aluminium evaporates avoids evaporating aluminium, has saved subsequent secondary photoetching technology, has reduced process cost and time cost.

Description

Protection baffle for chip secondary photoetching evaporation

Technical Field

The utility model relates to a semiconductor manufacturing technology field especially relates to the protection separation blade that the chip economized secondary photoetching and evaporation used.

Background

Aluminum evaporation is an extremely important process in the chip manufacturing process, the quality of the process can directly relate to the yield of chips and the reliability of subsequent finished products, in the existing chip manufacturing process, because the aluminum evaporation can cause that photoetching patterns in the middle of the chips cannot be protected, aluminum is evaporated, secondary photoetching is needed to strip residual aluminum after evaporation, and the subsequent process cost and time cost are increased.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned not enough of prior art, the utility model provides a chip economizes the protection separation blade that secondary photoetching evaporated usefulness, solves current chip and can't protect the photoetching pattern when evaporating, needs the technical problem of secondary photoetching incremental cost.

The utility model discloses a realize through following technical scheme:

the chip saves the protection separation blade that the secondary photoetching evaporated usefulness, including the separation blade body of locating silicon chip one side on the chip, the separation blade body includes outside annular backing sheet and the shielding part that is used for hiding the photoetching pattern on the chip in the middle of, link together through a plurality of bellied muscle between middle shielding part and the outside annular backing sheet.

Furthermore, the middle shielding part and the outer annular supporting sheet are in the same plane.

Furthermore, the chip comprises a molybdenum sheet, a silicon sheet and an aluminum foil arranged between the molybdenum sheet and the silicon sheet, wherein a positioning ring for placing the separation blade body is arranged on the silicon sheet, and when the separation blade body is placed in the positioning ring, each side wall of the separation blade body is tightly attached to the ring wall of the positioning ring.

Furthermore, the middle shielding part is connected with the outer annular supporting sheet through three convex ribs.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model provides a chip economizes the protection separation blade that secondary photoetching evaporated usefulness, and the photoetching pattern on the protection chip that can be fine when aluminium evaporates avoids evaporating aluminium, has saved subsequent secondary photoetching technology, has reduced process cost and time cost.

Drawings

FIG. 1 is a schematic structural view of a protection barrier sheet for chip-saving secondary photolithography evaporation according to an embodiment of the present invention;

FIG. 2 is a schematic structural view of a chip with a protection barrier sheet for secondary photolithography evaporation;

fig. 3 is a front view of a chip according to an embodiment of the present invention;

fig. 4 is a top view of a chip according to an embodiment of the present invention.

In the figure:

1. a baffle plate body; 2. an annular support sheet; 3. a shielding portion; 4. a raised rib; 5. a chip; 6. photoetching a pattern; 7. a silicon wafer; 8. aluminum foil; 9. a molybdenum sheet; 10. and (3) silicon rubber.

Detailed Description

The following examples are presented to illustrate certain embodiments of the invention and should not be construed as limiting the scope of the invention. The present disclosure may be modified from materials, methods, and reaction conditions at the same time, and all such modifications are intended to be within the spirit and scope of the present disclosure.

As shown in fig. 1-4, the protective barrier for chip omitting secondary photolithography evaporation includes a barrier body 1 disposed on one side of a silicon wafer 7 on a chip 5, where the barrier body 1 includes an outer annular support sheet 2 and a shielding portion 3 in the middle for shielding a photolithography pattern 6 on the chip 5, the shielding portion 3 in the middle and the outer annular support sheet 2 are connected together by three raised ribs 4, the shielding portion 3 in the middle and the outer annular support sheet 2 are on the same plane, and the thickness is 0.2 mm; the width of the raised ribs 4 is 0.5-0.8mm, and the height is 1-1.5 mm.

In this embodiment, the chip 5 includes a molybdenum sheet 9, a silicon sheet 7 and an aluminum foil 8 disposed between the molybdenum sheet 9 and the silicon sheet 7, the silicon sheet 7 is further provided with a positioning ring for placing the baffle body 1, when the baffle body 1 is placed in the positioning ring, each side wall of the baffle body 1 is tightly attached to the ring wall of the positioning ring, and when aluminum is evaporated, the aluminum is not evaporated by the lithography pattern 6 covered by the baffle body 1 on the evaporation pan, so that subsequent secondary lithography is avoided, and the process cost and the time cost are reduced.

The traditional chip manufacturing process comprises the following steps: the method comprises the following steps of silicon wafer gallium diffusion, silicon wafer oxidation, silicon wafer primary photoetching, silicon wafer phosphorus diffusion, silicon wafer rounding, sintering (a layer of thin aluminum foil is sandwiched between a silicon wafer and a molybdenum sheet and is heated at a high temperature in a vacuum state, and the aluminum foil is melted to stick the silicon wafer and the molybdenum sheet together), aluminum evaporation, alloy, secondary photoetching, angle grinding and corrosion (angle grinding surface chemical corrosion and silicon-coated rubber 10); after the protective separation blade is adopted in the aluminum evaporation stage, secondary photoetching is omitted, and the specific process flow is as follows: the method comprises the following steps of silicon wafer gallium diffusion, silicon wafer oxidation, silicon wafer primary photoetching, silicon wafer phosphorus diffusion, silicon wafer rounding, sintering (a layer of thin aluminum foil is sandwiched between a silicon wafer and a molybdenum sheet and is heated at a high temperature in a vacuum state, and the aluminum foil is melted to stick the silicon wafer and the molybdenum sheet together), aluminum evaporation, alloying, angle grinding and corrosion (angle grinding surface chemical corrosion and silicon-coated rubber 10); to sum up, the protection separation blade for aluminum evaporation of the application can well protect the photoetching pattern on the chip during aluminum evaporation, avoid evaporating aluminum, save subsequent secondary photoetching process and reduce process cost and time cost.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. The chip saves protection separation blade that secondary photoetching evaporated usefulness, its characterized in that, including separation blade body (1) of locating silicon chip (7) one side on chip (5), separation blade body (1) is used for hiding shielding portion (3) of photoetching pattern (6) on chip (5) including outside annular backing sheet (2) and middle, link together through a plurality of bellied muscle (4) between shielding portion (3) in the middle and the outside annular backing sheet (2).

2. The chip-saving secondary lithography evaporation protective barrier according to claim 1, characterized in that the intermediate shielding portion (3) is coplanar with the outer annular support sheet (2).

3. The chip-saving secondary photolithography evaporation protective barrier according to claim 1, wherein the chip (5) comprises a molybdenum sheet (9), a silicon sheet (7) and an aluminum foil (8) disposed between the molybdenum sheet (9) and the silicon sheet (7), the silicon sheet (7) is further provided with a positioning ring for placing the barrier body (1), and when the barrier body (1) is placed in the positioning ring, each sidewall of the barrier body (1) is tightly attached to the ring wall of the positioning ring.

4. The protection baffle for chip-saving secondary lithography evaporation according to any one of claims 1-2, wherein the middle shielding part (3) and the outer annular support sheet (2) are connected together by three raised ribs (4).