CN108998773A - Mask plate and preparation method thereof, sealed in unit - Google Patents
Mask plate and preparation method thereof, sealed in unit Download PDFInfo
- Publication number
- CN108998773A CN108998773A CN201810845859.0A CN201810845859A CN108998773A CN 108998773 A CN108998773 A CN 108998773A CN 201810845859 A CN201810845859 A CN 201810845859A CN 108998773 A CN108998773 A CN 108998773A
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- CN
- China
- Prior art keywords
- mask plate
- mask
- thickness
- strips
- plate framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
Abstract
The present invention provides a kind of mask plates and preparation method thereof, sealed in unit, belong to field of display technology.Wherein, mask plate, including mask plate framework and the mask strips being welded on the mask plate framework, the mask strips include with to the first part and the second part in addition to the first part with the mask plate frame welding, and the thickness of the first part is less than the thickness of the second part.Technical solution of the present invention can be improved the yield and service life of mask plate framework, reduce CVD process costs.
Description
Technical field
The present invention relates to field of display technology, a kind of mask plate and preparation method thereof, sealed in unit are particularly related to.
Background technique
In the packaging technology of flexible OLED (organic electroluminescent LED) device, CVD (chemical vapor deposition) Mask
(mask plate) is one of most important device, and the consuming of Mask also accounts for great specific gravity in CVD process costs how
The consuming for reducing Mask becomes letter problem to be solved.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of mask plates and preparation method thereof, sealed in unit, can be improved
The yield and service life of mask plate framework reduce CVD process costs.
In order to solve the above technical problems, the embodiment of the present invention offer technical solution is as follows:
On the one hand, a kind of mask plate is provided, including mask plate framework and the mask strips that are welded on the mask plate framework,
The mask strips include and to the first parts with the mask plate frame welding and second in addition to the first part
Point, the thickness of the first part is less than the thickness of the second part.
Further, the first part includes opposite first surface and second surface, and the second part includes phase
The first surface and second surface of back, the first surface of the first part are welded on the mask plate framework, and described second
Partial first surface protrudes from the first surface of the first part.
Further, the second surface of the first part is flushed with the second surface of the second part.
Further, the thickness of the first part is 50-100um smaller than the thickness of the second part.
The embodiment of the invention also provides a kind of production methods of mask plate, comprising:
Mask strips and mask plate framework to be welded are provided, the mask strips include to the mask plate frame welding
First part and the second part in addition to the first part；
The thickness of the first part of the mask strips is thinned；
The first part of the mask strips is welded on the mask plate framework.
Further, the thickness of the first part that the mask strips are thinned includes:
Photoresist is coated on the first surface of the mask strips, forms photoetching after being exposed development to the photoresist
Glue removes region and photoresist retention area, and photoresist removal region corresponds to the first part, and the photoresist retains
Region corresponds to the second part；
Etch away a part of the first part.
Further, the first part by the mask strips, which is welded on the mask plate framework, includes:
The first surface of the first part is welded on the mask plate framework.
Further, the part that the first part is etched away with a thickness of 50-100um.
The embodiment of the invention also provides a kind of sealed in unit, including mask plate as described above.
The embodiment of the present invention has the advantages that
In above scheme, mask plate includes mask plate framework and the mask strips that are welded on the mask plate framework, described
Mask strips include and to the first part and the second part in addition to the first part with the mask plate frame welding, institutes
The thickness for stating first part is less than the thickness of the second part, in this way mask plate overall thickness it is constant, simultaneously do not influence exposure mask
In the case where body portion thickness, the thickness of mask plate framework can be improved, the raising of mask plate frame thickness can increase
Yield during mask plate frame manufacture, and mask plate framework can be allowed to have more repetitions under same technique for grinding
CVD process costs are reduced using number so as to improve the service life of mask plate framework.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of existing mask plate；
Fig. 2 is the structural schematic diagram of mask plate of the embodiment of the present invention.
Appended drawing reference
1 mask plate framework
2 mask strips
21 first parts
22 second parts
Specific embodiment
To keep the embodiment of the present invention technical problems to be solved, technical solution and advantage clearer, below in conjunction with
Drawings and the specific embodiments are described in detail.
The consuming of CVD Mask is mainly determined by the service life of cost of manufacture and Mask.Mask includes Mask Frame
(mask plate framework) and the sheet (mask strips) being welded on Mask Frame, wherein Mask Frame is due to its special construction
May be repeated utilization, the principle of recycling is the sheet on Mask Frame to be torn after CVDMask reaches the service life
It removes, polishing then is re-started to Mask Frame, if Mask Frame is still able to satisfy requirement (thickness is greater than after polishing
Equal to setting value) if, it can utilize again, the number and its thickness of recycling have much relations.
In order to match with sealed in unit, the overall thickness of mask plate is certain, while in order to guarantee carrying out CVD technique
When, mask strips 2 will not be pressed on substrate, and the thickness of mask plate framework 1 has to be larger than equal to certain value.As shown in Figure 1, mask plate
Frame 1 with a thickness of y, mask strips 2 with a thickness of x, the distance between mask strips 2 to substrate are z, wherein y=z, in order to avoid
Mask strips 2 are pressed on substrate, and y must not drop below certain value, and the difference between y and the definite value is bigger, then the weight of mask plate framework 1
It is more using number again, but in existing mask plate, since the overall thickness of mask plate is certain value, the thickness of mask strips is also relatively more solid
It is fixed, thus the thickness of mask plate framework 1 can not design it is bigger.
The embodiment of the present invention provides a kind of mask plate and preparation method thereof, sealed in unit, can increase Mask process
In yield and increase Mask Frame recycling number.
The embodiment of the present invention provides a kind of mask plate, as shown in Fig. 2, including mask plate framework 1 and being welded on described cover
Mask strips 2 on template framework 1, the mask strips 2 include with to be welded with the mask plate framework 1 first part 21 and
Second part 22 in addition to the first part 21, the thickness of the first part 21 are less than the thickness of the second part 22.
In the present embodiment, mask plate includes mask plate framework and the mask strips that are welded on the mask plate framework, described
Mask strips include and to the first part and the second part in addition to the first part with the mask plate frame welding, institutes
The thickness for stating first part is less than the thickness of the second part, in this way mask plate overall thickness it is constant, simultaneously do not influence exposure mask
In the case where body portion thickness, the thickness of mask plate framework can be improved, the raising of mask plate frame thickness can increase
Yield during mask plate frame manufacture, and mask plate framework can be allowed to have more repetitions under same technique for grinding
CVD process costs are reduced using number so as to improve the service life of mask plate framework.Wherein, it is set on second part 22
The performance of mask plate will not be impacted in respect of mask pattern since the thickness of second part 22 can remain unchanged.
In one specific embodiment, as shown in Fig. 2, the first part 21 includes opposite first surface and second surface,
The second part 22 includes opposite first surface and second surface, and the first surface of the first part 21 is welded on described
On mask plate framework, the first surface of the second part 22 protrudes from the first surface of the first part 21.In this way can
In the case where the second part 22 of mask strips 2 and substrate distance z constant, the design height of mask plate framework 1 can be increased.
Preferably, the second surface of the first part 21 is flushed with the second surface of the second part 22, is covered in this way
The increased design height of template framework 1 is equal to the thickness difference of first part 21 and second part 22, can maximize increase mask
The design height of plate framework 1, so that mask plate framework has more recycling numbers under same technique for grinding, so as to
To improve the service life of mask plate framework, CVD process costs are reduced；And the increase of mask plate frame thickness, also helps
Improve the product yield during mask plate frame manufacture.
Specifically, the thickness of the first part 21 can be 50-100um smaller than the thickness of the second part 22, in this way
The design height of mask plate framework 1 can increase accordingly 50-100um, and mask plate framework 1 is enabled to have more recyclings
Number.
In one specific embodiment, as shown in Fig. 2, the thickness of first part 21 can be the one of the thickness of second part 22
Half, the consistency of thickness of the thickness of second part 22 and existing mask strips, for x, first part 21 with a thickness of x/2, then guaranteeing
The second part 22 of mask strips 2 at a distance from substrate for z is constant and the overall thickness of mask plate is constant in the case where, mask sheet frame
The thickness of frame 1 can increase to y ', y '=y+x/2.In this way by the mask on mask plate framework 1 after CVD Mask reaches the service life
Item 2 removes, and re-starts polishing to mask plate framework, if mask plate framework remains to meet requirement (guarantee mask after polishing
The distance between item 2 and substrate are not less than z), then mask plate framework can still utilize again, due to the present embodiment mask plate framework 1
Thickness y ' be greater than existing mask plate framework thickness y, therefore, the mask plate framework of the present embodiment can bear more numbers
Polishing can have more recycling numbers.
The embodiment of the invention also provides a kind of production methods of mask plate, comprising:
Mask strips and mask plate framework to be welded are provided, the mask strips include to the mask plate frame welding
First part and the second part in addition to the first part；
The thickness of the first part of the mask strips is thinned；
The first part of the mask strips is welded on the mask plate framework.
In the present embodiment, mask plate includes mask plate framework and the mask strips that are welded on the mask plate framework, described
Mask strips include and to the first part and the second part in addition to the first part with the mask plate frame welding, institutes
The thickness for stating first part is less than the thickness of the second part, in this way mask plate overall thickness it is constant, simultaneously do not influence exposure mask
In the case where body portion thickness, the thickness of mask plate framework can be improved, the raising of mask plate frame thickness can increase
Yield during mask plate frame manufacture, and mask plate framework can be allowed to have more repetitions under same technique for grinding
CVD process costs are reduced using number so as to improve the service life of mask plate framework.
Wherein, design has mask pattern on second part, will not since the thickness of second part can remain unchanged
The performance of mask plate is impacted.
Further, the thickness of the first part that the mask strips are thinned includes:
Photoresist is coated on the first surface of the mask strips, forms photoetching after being exposed development to the photoresist
Glue removes region and photoresist retention area, and photoresist removal region corresponds to the first part, and the photoresist retains
Region corresponds to the second part；
The a part for etching away the first part can use wet since mask strips are generally made of metal
Method etching removes a part of the first part.
Further, the first part by the mask strips, which is welded on the mask plate framework, includes:
The first surface of the first part is welded on the mask plate framework.
It is illustrated in figure 2 the mask plate of the present embodiment production, the first part 21 includes opposite first surface and the
Two surfaces, the second part 22 include opposite first surface and second surface, and the first surface of the first part 21 welds
It connecing on the mask plate framework, the first surface of the second part 22 protrudes from the first surface of the first part 21,
The second surface of the first part 21 is flushed with the second surface of the second part 22, in this way can be the of mask strips 2
In the case that two parts 22 and substrate distance z are constant, the design height of mask plate framework 1 can be increased, mask plate framework 1 increases
The design height added is equal to the thickness difference of first part 21 and second part 22, so that mask plate framework is in same technique for grinding
Under there are more recycling numbers to reduce CVD process costs so as to improve the service life of mask plate framework；And
The increase of mask plate frame thickness also advantageously improves the product yield during mask plate frame manufacture.
Specifically, the thickness of the first part 21 can be 50-100um smaller than the thickness of the second part 22, in this way
The design height of mask plate framework 1 can increase accordingly 50-100um, and mask plate framework 1 is enabled to have more recyclings
Number.
In one specific embodiment, as shown in Fig. 2, the thickness of first part 21 can be the one of the thickness of second part 22
Half, the consistency of thickness of the thickness of second part 22 and existing mask strips, for x, first part 21 with a thickness of x/2, then guaranteeing
The second part 22 of mask strips 2 at a distance from substrate for z is constant and the overall thickness of mask plate is constant in the case where, mask sheet frame
The thickness of frame 1 can increase to y ', y '=y+x/2.In this way by the mask on mask plate framework 1 after CVD Mask reaches the service life
Item 2 removes, and re-starts polishing to mask plate framework, if mask plate framework remains to meet requirement (guarantee mask after polishing
The distance between item 2 and substrate are not less than z), then mask plate framework can still utilize again, due to the present embodiment mask plate framework 1
Thickness y ' be greater than existing mask plate framework thickness y, therefore, the mask plate framework of the present embodiment can bear more numbers
Polishing can have more recycling numbers.
The embodiment of the invention also provides a kind of sealed in unit, including mask plate as described above.The mask of the present embodiment
Plate includes mask plate framework and the mask strips that are welded on the mask plate framework, the mask strips include with to be covered with described
The first part of template framework welding and the second part in addition to the first part, the thickness of the first part are less than described
The thickness of second part can in this way in the case where mask plate overall thickness is constant while not influencing mask strip body portion thickness
To improve the thickness of mask plate framework, the raising of mask plate frame thickness can increase good during mask plate frame manufacture
Rate, and mask plate framework can be allowed to have more recycling numbers under same technique for grinding, it is covered so as to improve
The service life of template framework reduces CVD process costs.Wherein, design has mask pattern on second part, due to second part
Thickness can remain unchanged, therefore the performance of mask plate will not be impacted.
Unless otherwise defined, the technical term or scientific term that the disclosure uses should be tool in fields of the present invention
The ordinary meaning for thering is the personage of general technical ability to be understood." first ", " second " used in the disclosure and similar word are simultaneously
Any sequence, quantity or importance are not indicated, and are used only to distinguish different component parts." comprising " or "comprising" etc.
Similar word means that the element or object before the word occur covers the element or object for appearing in the word presented hereinafter
And its it is equivalent, and it is not excluded for other elements or object.The similar word such as " connection " or " connected " is not limited to physics
Or mechanical connection, but may include electrical connection, it is either direct or indirectly."upper", "lower",
"left", "right" etc. is only used for indicating relative positional relationship, and after the absolute position for being described object changes, then the relative position is closed
System may also correspondingly change.
It is appreciated that ought such as layer, film, region or substrate etc element be referred to as be located at another element "above" or "below"
When, which " direct " can be located at "above" or "below" another element, or may exist intermediary element.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (9)
1. a kind of mask plate, including mask plate framework and the mask strips being welded on the mask plate framework, which is characterized in that institute
State mask strips include with to the first part and the second part in addition to the first part with the mask plate frame welding,
The thickness of the first part is less than the thickness of the second part.
2. mask plate according to claim 1, which is characterized in that the first part includes opposite first surface and
Two surfaces, the second part include opposite first surface and second surface, and the first surface of the first part is welded on
On the mask plate framework, the first surface of the second part protrudes from the first surface of the first part.
3. mask plate according to claim 2, which is characterized in that the second surface of the first part and described second
The second surface divided flushes.
4. mask plate according to claim 1, which is characterized in that the thickness of the first part is than the second part
The small 50-100um of thickness.
5. a kind of production method of mask plate characterized by comprising
Mask strips and mask plate framework to be welded are provided, the mask strips include to the mask plate frame welding
A part and the second part in addition to the first part；
The thickness of the first part of the mask strips is thinned；
The first part of the mask strips is welded on the mask plate framework.
6. the production method of mask plate according to claim 5, which is characterized in that described to be thinned the first of the mask strips
Partial thickness includes:
Photoresist is coated on the first surface of the mask strips, the photoresist is exposed and forms photoresist after development
Except region and photoresist retention area, photoresist removal region corresponds to the first part, the photoresist retention area
The corresponding second part；
Etch away a part of the first part.
7. the production method of mask plate according to claim 6, which is characterized in that first by the mask strips
Divide to be welded on the mask plate framework and includes:
The first surface of the first part is welded on the mask plate framework.
8. the production method of mask plate according to claim 6, which is characterized in that the portion that the first part is etched away
Point with a thickness of 50-100um.
9. a kind of sealed in unit, which is characterized in that including mask plate such as of any of claims 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810845859.0A CN108998773B (en) | 2018-07-27 | 2018-07-27 | Mask plate, manufacturing method thereof and packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810845859.0A CN108998773B (en) | 2018-07-27 | 2018-07-27 | Mask plate, manufacturing method thereof and packaging equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108998773A true CN108998773A (en) | 2018-12-14 |
| CN108998773B CN108998773B (en) | 2023-08-18 |
Family
ID=64598124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810845859.0A Active CN108998773B (en) | 2018-07-27 | 2018-07-27 | Mask plate, manufacturing method thereof and packaging equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN108998773B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020192420A1 (en) * | 2019-03-28 | 2020-10-01 | 京东方科技集团股份有限公司 | Mask and manufacturing method therefor, and mask assembly |
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| JP2001131744A (en) * | 1999-10-29 | 2001-05-15 | Miyota Kk | Thin film deposition |
| JP2001254169A (en) * | 2000-03-13 | 2001-09-18 | Optonix Seimitsu:Kk | Metal mask for vapor deposition, and its manufacturing method |
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| CN101650526A (en) * | 2008-08-13 | 2010-02-17 | 北京京东方光电科技有限公司 | Mask and production method thereof |
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| CN107523788A (en) * | 2017-08-31 | 2017-12-29 | 京东方科技集团股份有限公司 | A kind of mask plate and preparation method thereof |
| CN107904554A (en) * | 2018-01-02 | 2018-04-13 | 京东方科技集团股份有限公司 | Mask plate and its manufacture method, mask assembly and evaporation coating device |
| CN108315712A (en) * | 2018-02-05 | 2018-07-24 | 京东方科技集团股份有限公司 | Mask plate |
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2018
- 2018-07-27 CN CN201810845859.0A patent/CN108998773B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001131744A (en) * | 1999-10-29 | 2001-05-15 | Miyota Kk | Thin film deposition |
| JP2001254169A (en) * | 2000-03-13 | 2001-09-18 | Optonix Seimitsu:Kk | Metal mask for vapor deposition, and its manufacturing method |
| JP2008031528A (en) * | 2006-07-28 | 2008-02-14 | Kyocera Corp | Mask for cvd, and method for producing display produced using the same |
| CN101650526A (en) * | 2008-08-13 | 2010-02-17 | 北京京东方光电科技有限公司 | Mask and production method thereof |
| CN104611668A (en) * | 2015-01-29 | 2015-05-13 | 京东方科技集团股份有限公司 | Mask plate frame and mask plate |
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| CN107904554A (en) * | 2018-01-02 | 2018-04-13 | 京东方科技集团股份有限公司 | Mask plate and its manufacture method, mask assembly and evaporation coating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020192420A1 (en) * | 2019-03-28 | 2020-10-01 | 京东方科技集团股份有限公司 | Mask and manufacturing method therefor, and mask assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108998773B (en) | 2023-08-18 |
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