CN210778115U - Damp-proof heat dissipation patch inductor - Google Patents
Damp-proof heat dissipation patch inductor Download PDFInfo
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- CN210778115U CN210778115U CN201922295488.6U CN201922295488U CN210778115U CN 210778115 U CN210778115 U CN 210778115U CN 201922295488 U CN201922295488 U CN 201922295488U CN 210778115 U CN210778115 U CN 210778115U
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- heat dissipation
- coil
- lid
- bottom plate
- louvre
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Abstract
The utility model discloses a dampproofing heat dissipation paster inductance, including epoxy shell, cooling lid and louvre, epoxy shell upper end middle part is provided with the cooling lid, cooling lid below is provided with heat dissipation cream layer, the cooling lid top is provided with the louvre, the cooling lid with the epoxy shell passes through the draw-in groove and connects, heat dissipation cream layer with the cooling lid bonds, the louvre shaping in the cooling lid. Has the advantages that: the utility model discloses a set up heat dissipation lid, heat dissipation cream layer and louvre, can make the coil when the operation, avoid the coil because of receiving the strong current and cause the coil inductance that generates heat impaired, improved the radiating efficiency of paster inductance.
Description
Technical Field
The utility model relates to a paster inductance art field, concretely relates to dampproofing heat dissipation paster inductance.
Background
An Inductor (Inductor) is a component that can convert electrical energy into magnetic energy for storage, and is similar in structure to a transformer, but has only one winding, and the Inductor has a certain inductance that only hinders the change of current, and if the Inductor is in a state where no current flows through it will try to hinder the current from flowing through it when the circuit is on, and if the Inductor is in a state where current flows through it will try to keep the current constant when the circuit is off.
At present, the structure of sealed is adopted to current paster inductance majority, because paster inductance when moving, meets the strong current and causes the coil to generate heat, makes the inductance impaired, has reduced paster inductance radiating efficiency, secondly owing to receive weather variation, makes paster inductance wet easily, causes paster inductance function to descend, has slowed down the life-span that paster inductance used.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In order to overcome the defects of the prior art, the moistureproof heat dissipation patch inductor is provided, and the problems that the coil generates heat when the patch inductor runs due to the strong current, the inductor is damaged, and the heat dissipation efficiency of the patch inductor is reduced in the conventional patch inductor are solved.
(II) technical scheme
The utility model discloses a following technical scheme realizes: the utility model provides a dampproofing heat dissipation paster inductance, including epoxy shell, cooling lid and louvre, epoxy shell upper end middle part is provided with the cooling lid, cooling lid below is provided with the heat dissipation cream layer, the cooling lid top is provided with the louvre, the cooling lid with the epoxy shell passes through the draw-in groove and connects, the heat dissipation cream layer with the cooling lid bonds, the louvre shaping in the cooling lid.
Furthermore, an insulating skin is arranged below the heat dissipation paste layer, and a framework is arranged on one side of the insulating skin.
By adopting the technical scheme, the insulating skin can avoid the damage of the inductor caused by electric leakage due to damp when the framework runs.
Further, skeleton one side is provided with the magnetic powder layer, insulating skin middle part is provided with the coil, the coil below is provided with the silica gel bottom plate, silica gel bottom plate below one side is provided with connects guide piece one, it is provided with connects guide piece two to connect guide piece one side.
Through adopting above-mentioned technical scheme, through connect guide vane two can conveniently be connected with the circuit board.
Furthermore, the insulating skin is spliced with the epoxy resin shell, and the framework is bonded with the insulating skin.
Through adopting above-mentioned technical scheme, through the epoxy shell can avoid the coil wets.
Furthermore, the magnetic powder layer is in lap joint with the framework, and the coil is wound on the insulating skin.
By adopting the technical scheme, the inductor can normally run through the coil.
Furthermore, the silica gel bottom plate is connected with the epoxy resin shell through a clamping groove, and the connecting guide sheet penetrates through the silica gel bottom plate.
Through adopting above-mentioned technical scheme, through the silica gel bottom plate can avoid the inside tide of inductor and cause inductor coil operating power to descend, satisfies the dampproofing user demand of paster inductor.
Furthermore, the connecting guide sheet II penetrates through the silica gel bottom plate, and the connecting guide sheet I and the connecting guide sheet II are both electrically connected with the coil.
Through adopting above-mentioned technical scheme, through connect the guide vane one and can make things convenient for inductor and circuit board to be connected.
(III) advantageous effects
Compared with the prior art, the utility model, following beneficial effect has:
1. for solving current paster inductance majority and adopting sealed structure, because paster inductance when moving, meet the strong current and cause the coil to generate heat, make the inductance impaired, reduced paster inductance radiating efficiency's problem, the utility model discloses a set up radiator cap, heat dissipation cream layer and louvre, can make the coil when moving, avoid the coil to cause the coil inductance of generating heat impaired because of receiving the strong current, improved paster inductance radiating efficiency.
2. Install on the circuit board for solving current paster inductance is mostly open, owing to receive weather variation, make paster inductance wet easily, cause paster inductance function to descend, slowed down paster inductance life's problem, the utility model discloses a set up silica gel bottom plate and epoxy shell, can make paster inductance when the operation, avoid making paster inductance wet because of receiving weather variation, cause paster inductance function to descend, prolonged the life-span that paster inductance used.
Drawings
Fig. 1 is a main sectional view of a moisture-proof heat dissipation patch inductor according to the present invention;
fig. 2 is a cross-sectional view of the moisture-proof heat dissipation patch inductor of the present invention;
fig. 3 is a bottom view of the moistureproof heat dissipation patch inductor of the present invention.
The reference numerals are explained below:
1. an epoxy resin housing; 2. a heat dissipation cover; 3. a heat dissipating paste layer; 4. heat dissipation holes; 5. an insulating skin; 6. a framework; 7. a magnetic powder layer; 8. a coil; 9. a silica gel base plate; 10. connecting the first guide sheet; 11. and connecting the second guide vane.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1-3, the damp-proof heat dissipation patch inductor in this embodiment comprises an epoxy resin case 1, a heat dissipation cover 2 and heat dissipation holes 4, wherein the heat dissipation cover 2 is disposed at the middle of the upper end of the epoxy resin case 1, a heat dissipation paste layer 3 is disposed below the heat dissipation cover 2, the heat dissipation holes 4 are disposed above the heat dissipation cover 2, an insulating layer 5 is disposed below the heat dissipation paste layer 3, a framework 6 is disposed at one side of the insulating layer 5, the framework 6 can be prevented from being damaged due to electric leakage caused by moisture when the framework 6 is operated by the insulating layer 5, a magnetic powder layer 7 is disposed at one side of the framework 6, a coil 8 is disposed at the middle of the insulating layer 5, a silicone bottom plate 9 is disposed below the coil 8, a first connection guide piece 10 is disposed at one side of the silicone bottom plate 9, a second connection guide piece 11 is disposed at one side of the first connection guide piece 10, and can be conveniently, skeleton 6 bonds with insulating skin 5, can avoid coil 8 to wet through epoxy shell 1, and magnetic powder layer 7 and 6 overlap joints of skeleton, and coil 8 twines on insulating skin 5, can make inductor normal operating through coil 8, connects guide two 11 and runs through silica gel bottom plate 9, connects guide one 10 and connects guide two 11 and all be connected with coil 8 electricity, can make things convenient for the inductor to be connected with the circuit board through connecting guide one 10.
As shown in fig. 1 and fig. 2, in this embodiment, the heat dissipation cover 2 is connected to the epoxy resin housing 1 through the slot, the heat dissipation paste layer 3 is bonded to the heat dissipation cover 2, and the heat dissipation holes 4 are formed in the heat dissipation cover 2, so that when the coil 8 is operated, the coil 8 is prevented from being damaged due to the heating inductance of the coil 8 caused by the strong current, and the heat dissipation efficiency of the chip inductor is improved.
As shown in fig. 1 and fig. 3, in this embodiment, the silicone bottom plate 9 is connected to the epoxy resin housing 1 through the clamping groove, and the first connecting guide piece 10 penetrates through the silicone bottom plate 9, so that when the chip inductor operates, it is avoided that the chip inductor is affected with damp due to weather changes, the function of the chip inductor is reduced, and the service life of the chip inductor is prolonged.
The specific implementation process of this embodiment is as follows: the first connecting guide sheet 10 and the second connecting guide sheet 11 of the chip inductor are well bonded with a chip on a circuit board, the circuit board is started to run, when the coil 8 is subjected to strong current, in order to avoid the coil 8 from generating heat, the coil 8 is radiated through the radiating paste layer 3, the heat inside the chip inductor is radiated outwards through the radiating holes 4, so that the chip inductor is cooled, when the weather changes, the circuit board is easy to damp, the chip inductor can prevent moisture through the epoxy resin shell 1 and the silica gel bottom plate 9, so that the chip inductor can maintain the function, the chip inductor is convenient to install, by arranging the radiating cover 2, the radiating paste layer 3 and the radiating holes 4, the coil 8 can be prevented from being damaged due to the strong current, the radiating efficiency of the chip inductor is improved, and secondly, by arranging the silica gel bottom plate 9 and the epoxy resin shell 1, the chip inductor can run, the function of the chip inductor is prevented from being reduced due to the fact that the chip inductor is affected with damp due to weather changes, and the service life of the chip inductor is prolonged.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the spirit and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made by the technical solution of the present invention by those skilled in the art should fall into the protection scope of the present invention, and the technical contents claimed by the present invention have been fully recorded in the claims.
Claims (7)
1. The utility model provides a dampproofing heat dissipation paster inductance which characterized in that: including epoxy shell (1), heat dissipation lid (2) and louvre (4), epoxy shell (1) upper end middle part is provided with heat dissipation lid (2), heat dissipation lid (2) below is provided with heat dissipation cream layer (3), heat dissipation lid (2) top is provided with louvre (4), heat dissipation lid (2) with epoxy shell (1) is connected through the draw-in groove, heat dissipation cream layer (3) with heat dissipation lid (2) bond, louvre (4) the shaping in heat dissipation lid (2).
2. The moisture-proof heat dissipation patch inductor according to claim 1, wherein: an insulating skin (5) is arranged below the heat dissipation paste layer (3), and a framework (6) is arranged on one side of the insulating skin (5).
3. The moisture-proof heat dissipation patch inductor according to claim 2, wherein: skeleton (6) one side is provided with magnetic powder layer (7), insulating skin (5) middle part is provided with coil (8), coil (8) below is provided with silica gel bottom plate (9), silica gel bottom plate (9) below one side is provided with connects guide piece one (10), it is provided with connects guide piece two (11) to connect guide piece one (10) one side.
4. The moisture-proof heat dissipation patch inductor according to claim 2, wherein: the insulating skin (5) is spliced with the epoxy resin shell (1), and the framework (6) is bonded with the insulating skin (5).
5. The moisture-proof heat dissipation patch inductor according to claim 3, wherein: the magnetic powder layer (7) is in lap joint with the framework (6), and the coil (8) is wound on the insulating skin (5).
6. The moisture-proof heat dissipation patch inductor according to claim 3, wherein: silica gel bottom plate (9) with epoxy shell (1) passes through the draw-in groove and connects, connect guide card one (10) and run through silica gel bottom plate (9).
7. The moisture-proof heat dissipation patch inductor according to claim 3, wherein: connect guide vane two (11) and run through silica gel bottom plate (9), connect guide vane one (10) and connect guide vane two (11) all with coil (8) electricity is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922295488.6U CN210778115U (en) | 2019-12-19 | 2019-12-19 | Damp-proof heat dissipation patch inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922295488.6U CN210778115U (en) | 2019-12-19 | 2019-12-19 | Damp-proof heat dissipation patch inductor |
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| Publication Number | Publication Date |
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| CN210778115U true CN210778115U (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922295488.6U Active CN210778115U (en) | 2019-12-19 | 2019-12-19 | Damp-proof heat dissipation patch inductor |
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| CN (1) | CN210778115U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112116929A (en) * | 2020-09-15 | 2020-12-22 | 陆进文 | Protection device of computer storage module |
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2019
- 2019-12-19 CN CN201922295488.6U patent/CN210778115U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112116929A (en) * | 2020-09-15 | 2020-12-22 | 陆进文 | Protection device of computer storage module |
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