CN215578500U - High-power three-phase full-bridge rectifier bridge module - Google Patents
High-power three-phase full-bridge rectifier bridge module Download PDFInfo
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- CN215578500U CN215578500U CN202121549963.9U CN202121549963U CN215578500U CN 215578500 U CN215578500 U CN 215578500U CN 202121549963 U CN202121549963 U CN 202121549963U CN 215578500 U CN215578500 U CN 215578500U
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Abstract
The utility model discloses a high-power three-phase full-bridge rectifier bridge module, relates to the technical field of electrical equipment, and aims to solve the problem that the electrode leading-out position of a module circuit in the prior art is small. Its technical scheme main points are that there is the rectifier diode chip on the surface welding of base plate, there is the copper sheet rectifier diode chip's last surface welding, the bonding has the copper line on the copper sheet, the rectifier diode chip is including the chip bonding wire, the chip bonding wire is connected to input/output terminal through the copper line, input/output terminal is the parallelly connected setting of multiterminal, the casing of moulding plastics is used for fixing input/output terminal perpendicular to pottery and covers the copper base plate, the casing top of moulding plastics is equipped with the apron of moulding plastics, the rectifier diode chip, copper line and copper sheet all encapsulate between apron and pottery cover copper base plate, the input/output terminal top is passed the apron of moulding plastics and is stretched out the casing of moulding plastics. The utility model can increase the contact area of bonding and improve the stability and reliability of the module.
Description
Technical Field
The utility model relates to the technical field of electrical equipment, in particular to a high-power three-phase full-bridge rectifier bridge module.
Background
The three-phase rectifier bridge is a three-phase bridge rectifier circuit in which 6 rectifier diodes are formed in a predetermined circuit order, and is intended to convert an input ac voltage into an output dc voltage.
Along with the development of power electronic technology, the high-power and modularized design is continuously required, so that the requirements of the high-power three-phase rectifier module in the fields of frequency converters, high-power high-frequency power supplies, direct-current welding machines and the like are continuously expanded, and meanwhile, higher requirements are provided for the density, reliability and stability of the module. However, the lead-out position of the conventional high-power three-phase rectification module circuit electrode on the market is small, and the reliability of the module is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a high-power three-phase full-bridge rectifier bridge module which has the effect of improving the stability and reliability of the module.
The above object of the present invention is achieved by the following technical solutions:
the utility model provides a high-power three-phase full-bridge rectifier bridge module, is including moulding plastics casing and base plate, the skin weld has the rectifier diode chip on the base plate, the last skin weld of rectifier diode chip has the copper sheet, the bonding has the copper line on the copper sheet, the rectifier diode chip is including the chip bonding wire, the chip bonding wire passes through copper connection to input/output terminal, input/output terminal is the parallelly connected setting of multiterminal, the casing of moulding plastics is used for fixed input/output terminal perpendicular to pottery to cover the copper base plate, the casing top of moulding plastics is equipped with the apron of moulding plastics, rectifier diode chip, copper line and copper sheet all encapsulate between apron and pottery cover the copper base plate, the input/output terminal top is passed the apron of moulding plastics and is stretched out the casing of moulding plastics.
The utility model is further configured to: a plurality of mounting holes are formed in the periphery of the base plate.
The utility model is further configured to: the substrate comprises an electroplated copper substrate and a ceramic copper-clad substrate welded above the electroplated copper substrate, a copper-clad area is arranged on the upper surface of the ceramic copper-clad substrate, and the rectifier diode chip is located in the copper-clad area.
The utility model is further configured to: the injection molding shell is a PBT plastic shell.
The utility model is further configured to: the injection molding cover plate is a PBT plastic cover plate.
The utility model is further configured to: the edge of the copper sheet is arranged in a corner cut mode, and a concave cutting groove is formed in the middle line of the copper sheet in the length direction.
In conclusion, the beneficial technical effects of the utility model are as follows:
1. through the arrangement of the copper sheets and the copper wires, the bonding area of the chip can be effectively increased, the strength of the chip is improved, the heat conduction efficiency is improved, and the stability and the reliability of connection are ensured;
2. through the setting of electroplating copper base plate and pottery copper-clad base plate, can improve the heat dissipation of module, guarantee the stability and the reliability of module.
Drawings
FIG. 1 is a cross-sectional view of an embodiment of the present invention.
In the figure, 1, a copper electroplating substrate; 2. a ceramic copper-clad substrate; 3. a rectifier diode chip; 4. a copper sheet; 5. a copper wire;
6. an input/output terminal; 7. injection molding a cover plate; 8. and (5) injection molding the shell.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, the module of the high-power three-phase full-bridge rectifier bridge disclosed by the utility model comprises a substrate, a rectifier diode chip 3, a copper sheet 4 and a copper wire 5 from bottom to top, and further comprises an input/output terminal 6, an injection molding shell 8 and an injection molding cover plate 7.
The base plate covers copper base plate 2 including electroplate layer base plate and pottery, and wherein electroplate copper base plate 1 is located the below of module, and the copper base plate is produced for pure copper material, can provide the joint support, effectively ensures the timely heat dissipation of module, and the surface is electroplated simultaneously and can effectively prevent the base plate oxidation, improves the stability of module. The electroplated copper substrate 1 is provided with a welding area, the ceramic copper-clad substrate 2 is welded above the copper substrate through welding flux, heat generated by the module is conveniently conducted to a radiator connected with the module, and meanwhile, the ceramic copper-clad substrate 2 has very good heat conductivity, weldability and insulativity, so that the module can have the characteristic of voltage insulation and resistance of 2500V or more. The installation holes are formed in the periphery of the base plate, so that the module can be conveniently installed, the base plate is pre-bent and protruded in a certain radian, and can be fully contacted with the radiator, and the thermal resistance of the module is reduced.
The ceramic copper-clad substrate 2 is provided with a copper-clad area above, the rectifier diode chip 3 with a proper specification is selected and welded in the copper-clad area, and the copper-clad area not only provides a welding foundation, but also can play a certain electrical performance connection role, so that welding and bonding processes are simplified.
Copper sheet 4 adopts pure copper material, through tin cream lug weld on rectifier diode chip 3 surface, can effectively improve the bonding area of chip, improves rectifier diode chip 3's intensity, improves heat conduction efficiency. The edge of the copper sheet 4 is arranged as a chamfer, and a concave cutting groove is arranged on the middle line of the copper sheet 4 along the length direction.
And a chip bonding wire on the rectifier diode chip 3 is connected to the input and output terminal 6 through a copper wire 5, so that the circuit function of the three-phase full-bridge rectifier bridge module is realized. In addition, the multi-terminal parallel design is adopted, and the installation and production of external components are facilitated.
The input and output terminal 6 is fixed in the injection molding shell 8 in a manner of being perpendicular to the substrate in an inserting mode, the injection molding shell 8 is made of PBT material of high-strength flame retardant material, can resist high temperature, has less deformation, is tightly assembled with the electroplated copper substrate 1 and the input and output terminal 6, and is well matched. The injection molding cover plate 7 is arranged above the injection molding shell body 8, holes for the input and output terminals 6 to pass through are reserved on the periphery of the injection molding cover plate 7, the injection molding cover plate 7 and the injection molding shell body 8 are made of the same material, the assembly is tight, and no gap is formed in the tilting mode.
Compare with present conventional high-power three-phase full-bridge rectifier bridge module design, this novel design can improve the heat dissipation of module, guarantees the stability and the reliability of module. Meanwhile, the copper sheet 4 is designed in the module and is reflow-welded on the chip, so that the strength of the chip can be effectively improved, the contact area of bonding is increased, and the heat conduction of a bonding wire is accelerated. The design of the total module can meet the application of a high-power three-phase full-bridge rectifier bridge and the requirements of customers on the market.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered by the protection scope of the utility model.
Claims (6)
1. The utility model provides a high-power three-phase full-bridge rectifier bridge module, includes casing (8) and the base plate of moulding plastics, its characterized in that: the upper surface of the substrate is welded with a rectifier diode chip (3), the upper surface of the rectifier diode chip (3) is welded with a copper sheet (4), a copper wire (5) is bonded on the copper sheet (4), the rectifier diode chip (3) comprises a chip bonding wire, the chip bonding wire is connected to an input/output terminal (6) through a copper wire (5), the input and output terminals (6) are arranged in parallel, the injection molding shell (8) is used for fixing the input and output terminals (6) to be vertical to the ceramic copper-clad substrate (2), an injection molding cover plate (7) is assembled above the injection molding shell (8), the rectifier diode chip (3), the copper wire (5) and the copper sheet (4) are all packaged between the cover plate and the ceramic copper-clad substrate (2), the top end of the input/output terminal (6) penetrates through the injection molding cover plate (7) and extends out of the injection molding shell (8).
2. The high-power three-phase full-bridge rectifier bridge module according to claim 1, wherein: a plurality of mounting holes are formed in the periphery of the base plate.
3. The high-power three-phase full-bridge rectifier bridge module according to claim 2, wherein: the substrate comprises an electroplated copper substrate (1) and a ceramic copper-clad substrate (2) welded above the electroplated copper substrate (1), wherein a copper-clad area is arranged on the upper surface of the ceramic copper-clad substrate (2), and the rectifier diode chip (3) is positioned in the copper-clad area.
4. The high-power three-phase full-bridge rectifier bridge module according to claim 3, wherein: the injection molding shell (8) is a PBT plastic shell.
5. The high-power three-phase full-bridge rectifier bridge module according to claim 4, wherein: the injection molding cover plate (7) is a PBT plastic cover plate.
6. The high-power three-phase full-bridge rectifier bridge module according to claim 5, wherein: the edge of the copper sheet (4) is arranged in a corner cut mode, and a concave cutting groove is formed in the middle line of the copper sheet (4) in the length direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121549963.9U CN215578500U (en) | 2021-07-08 | 2021-07-08 | High-power three-phase full-bridge rectifier bridge module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121549963.9U CN215578500U (en) | 2021-07-08 | 2021-07-08 | High-power three-phase full-bridge rectifier bridge module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215578500U true CN215578500U (en) | 2022-01-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121549963.9U Active CN215578500U (en) | 2021-07-08 | 2021-07-08 | High-power three-phase full-bridge rectifier bridge module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215578500U (en) |
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2021
- 2021-07-08 CN CN202121549963.9U patent/CN215578500U/en active Active
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