CN216528863U - A high-power single-arm rectifier diode module - Google Patents
A high-power single-arm rectifier diode module Download PDFInfo
- Publication number
- CN216528863U CN216528863U CN202123284088.9U CN202123284088U CN216528863U CN 216528863 U CN216528863 U CN 216528863U CN 202123284088 U CN202123284088 U CN 202123284088U CN 216528863 U CN216528863 U CN 216528863U
- Authority
- CN
- China
- Prior art keywords
- chips
- rectifier diode
- diode module
- plastic
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004033 plastic Substances 0.000 claims abstract description 22
- 238000007789 sealing Methods 0.000 abstract description 12
- 230000006698 induction Effects 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Rectifiers (AREA)
Abstract
本实用新型公开了一种大功率单臂整流二极管模块，涉及二极管技术领域，包括芯片电极片和塑封体，芯片和电极片封装于塑封体内，芯片连接于电极片上，芯片上连接有连接条，连接条将芯片与引线框架相接，塑封体上连接有接线部，接线部设有若干个，均连接于塑封体上，接线部底侧设有引线框架，接线部一端穿过引线框架，并固定于塑封体内；芯片、接线部、引线框架的数量相对应，芯片、引线框架、接线部依次设置、连接。本实用新型单臂整流二极管模块设有三个芯片，三个芯片的面积加大，三个芯片相连接，三个芯片叠加，具有放大电流、电压的作用，能够通过更大的电流、电压，能够适应新能源汽车充电器、电磁炉等大功率电器。
The utility model discloses a high-power single-arm rectifier diode module, which relates to the technical field of diodes. The connecting bar connects the chip with the lead frame, the plastic sealing body is connected with a wiring part, and the wiring part is provided with several parts, all of which are connected to the plastic sealing body. It is fixed in the plastic package; the number of chips, wiring parts and lead frames is corresponding, and the chips, lead frames and wiring parts are arranged and connected in sequence. The single-arm rectifier diode module of the utility model is provided with three chips, the area of the three chips is enlarged, the three chips are connected, and the three chips are superimposed, which has the function of amplifying current and voltage, and can pass larger current and voltage, and can Adapt to high-power electrical appliances such as new energy vehicle chargers and induction cookers.
Description
技术领域technical field
本实用新型涉及二极管技术领域，具体是一种大功率单臂整流二极管模块。The utility model relates to the technical field of diodes, in particular to a high-power single-arm rectifier diode module.
背景技术Background technique
单臂整流模块具有体积小、重量轻、结构紧凑、外接线简单、便于维护和安装等优点，其结构一般包括在同一金属底板上分别焊接的多个二极管芯片，与相对的二极管芯片顶面连接的电极端子，以及封装用的塑壳、硅凝胶和环氧树脂。The single-arm rectifier module has the advantages of small size, light weight, compact structure, simple external wiring, easy maintenance and installation. electrode terminals, as well as plastic case, silicone gel and epoxy resin for encapsulation.
随着新能源汽车充电器、电磁炉等大功率电器的出现，现有的二极管整流模块能够通过的电流、电压不够大，难以适应这些大功率电器，不能适应社会发展的需求。With the emergence of high-power electrical appliances such as new energy vehicle chargers and induction cookers, the current and voltage that the existing diode rectifier modules can pass are not large enough to adapt to these high-power electrical appliances and cannot meet the needs of social development.
实用新型内容Utility model content
本实用新型的目的在于提供一种大功率单臂整流二极管模块，具有能够通过更大的电流、电压，能够适应新能源汽车充电器、电磁炉等大功率电器的有益效果，以解决上述背景技术中提出的问题。The purpose of this utility model is to provide a high-power single-arm rectifier diode module, which has the beneficial effects of being able to pass larger currents and voltages, and being able to adapt to high-power electrical appliances such as new energy vehicle chargers and induction cookers, so as to solve the problems in the above background technology. proposed question.
为实现上述目的，本实用新型提供如下技术方案：To achieve the above object, the utility model provides the following technical solutions:
一种大功率单臂整流二极管模块，包括芯片、电极片和塑封体，所述芯片设有若干个，所述芯片和电极片封装于所述塑封体内，所述芯片连接于所述电极片上，所述芯片上连接有连接条，所述连接条将芯片与引线框架相接，所述塑封体上连接有接线部，所述接线部设有若干个，均连接于所述塑封体上，所述接线部底侧设有引线框架，所述接线部一端穿过所述引线框架，并固定于所述塑封体内。A high-power single-arm rectifier diode module includes a chip, an electrode sheet and a plastic sealing body, the chips are provided with several pieces, the chip and the electrode sheet are packaged in the plastic sealing body, and the chip is connected to the electrode sheet, The chip is connected with a connecting bar, the connecting bar connects the chip with the lead frame, the plastic sealing body is connected with a wiring part, and the wiring part is provided with several, all of which are connected to the plastic sealing body, so A lead frame is provided on the bottom side of the wiring portion, and one end of the wiring portion passes through the lead frame and is fixed in the plastic package.
作为本实用新型再进一步的方案：所述芯片、接线部、引线框架的数量相对应，所述芯片、引线框架、接线部依次设置、连接。As a further solution of the present invention, the number of the chips, the wiring parts and the lead frames is corresponding, and the chips, the lead frames and the wiring parts are arranged and connected in sequence.
作为本实用新型再进一步的方案：所述芯片的数量为三个，所述接线部、引线框架的数量对应为三个。As a further solution of the present invention, the number of the chips is three, and the number of the wiring parts and the lead frame corresponds to three.
作为本实用新型再进一步的方案：所述引线框架上设有定位槽，所述接线部一端穿过所述定位槽，并与塑封体连接。As a further solution of the present invention, the lead frame is provided with a positioning groove, and one end of the wiring portion passes through the positioning groove and is connected with the plastic sealing body.
作为本实用新型再进一步的方案：所述塑封体端部设有定位孔。As a further solution of the present invention, the end of the plastic sealing body is provided with a positioning hole.
与现有技术相比，本实用新型的有益效果是：Compared with the prior art, the beneficial effects of the present utility model are:
本实用新型单臂整流二极管模块设有三个芯片，三个芯片的面积加大，三个芯片相连接，三个芯片叠加，具有放大电流、电压的作用，能够通过更大的电流、电压，能够适应新能源汽车充电器、电磁炉等大功率电器。The single-arm rectifier diode module of the utility model is provided with three chips, the area of the three chips is enlarged, the three chips are connected, and the three chips are superimposed, which has the function of amplifying current and voltage, and can pass larger current and voltage, and can Adapt to high-power electrical appliances such as new energy vehicle chargers and induction cookers.
附图说明Description of drawings
图1为本实用新型单臂整流二极管模块的结构示意图。FIG. 1 is a schematic structural diagram of a single-arm rectifier diode module of the present invention.
图2为本实用新型单臂整流二极管模块的内部结构示意图。FIG. 2 is a schematic diagram of the internal structure of the single-arm rectifier diode module of the present invention.
图中标识：Marked in the picture:
1、芯片；2、塑封体；3、接线部；4、引线框架；5、定位孔；6、电极片；7、连接条。1. Chip; 2. Plastic body; 3. Wiring part; 4. Lead frame; 5. Positioning hole; 6. Electrode sheet; 7. Connecting bar.
具体实施方式Detailed ways
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.
请参阅附图1～2，本实用新型实施例中，一种大功率单臂整流二极管模块，包括芯片1电极片6和塑封体2，芯片1设有若干个，芯片1和电极片6封装于塑封体2内，芯片6连接于电极片6上，芯片6上连接有连接条7，连接条7将芯片6与引线框架4相接，塑封体2上连接有接线部3，接线部3设有若干个，均可拆卸地连接于塑封体2上，接线部3底侧设有引线框架4，接线部3一端穿过引线框架4，并固定于塑封体2内；通过接线部3可以连接导线，并通过引线框架4进一步固定；进一步地，塑封体2端部设有定位孔5，通过定位孔5可以将塑封体2固定。本实用新型单臂整流二极管模块设有三个芯片1，三个芯片1的面积加大，三个芯片1相连接，三个芯片1叠加，具有放大电流、电压的作用，能够通过更大的电流、电压，能够适应新能源汽车充电器、电磁炉等大功率电器，模块能通过的峰值电流为393A，峰值电压为2500V。Please refer to Figures 1 to 2. In an embodiment of the present invention, a high-power single-arm rectifier diode module includes a chip 1, an
本实用新型中一个较佳的实施例，芯片1、接线部3、引线框架4的数量相对应，芯片1、引线框架4、接线部3依次设置、连接；进一步地，芯片1的数量为三个，接线部3、引线框架4的数量对应为三个，通过三个芯片1叠加，能够通过更大的电流、电压，能够适应新能源汽车充电器、电磁炉等大功率电器。In a preferred embodiment of the present invention, the number of chips 1,
本实用新型中一个较佳的实施例，引线框架4上设有定位槽，接线部3一端穿过定位槽，并与塑封体2连接。In a preferred embodiment of the present invention, the
本实用新型单臂整流二极管模块设有三个芯片1，三个芯片1的面积加大，三个芯片1相连接，三个芯片1叠加，具有放大电流、电压的作用，能够通过更大的电流、电压，能够适应新能源汽车充电器、电磁炉等大功率电器。The single-arm rectifier diode module of the utility model is provided with three chips 1, the area of the three chips 1 is enlarged, the three chips 1 are connected, and the three chips 1 are superimposed, which has the function of amplifying the current and voltage, and can pass a larger current , voltage, can adapt to new energy vehicle chargers, induction cookers and other high-power appliances.
尽管参照前述实施例对本实用新型进行了详细的说明，对于本领域的技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换，凡在本实用新型的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本实用新型的保护范围之内。Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Within the spirit and principle of the present invention, any modifications, equivalent replacements, improvements, etc. made should be included within the protection scope of the present invention.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123284088.9U CN216528863U (en) | 2021-12-24 | 2021-12-24 | A high-power single-arm rectifier diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123284088.9U CN216528863U (en) | 2021-12-24 | 2021-12-24 | A high-power single-arm rectifier diode module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216528863U true CN216528863U (en) | 2022-05-13 |
Family
ID=81503429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123284088.9U Active CN216528863U (en) | 2021-12-24 | 2021-12-24 | A high-power single-arm rectifier diode module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216528863U (en) |
-
2021
- 2021-12-24 CN CN202123284088.9U patent/CN216528863U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MX2023000952A (en) | PHOTOVOLTAIC MODULES. | |
| CN102263094A (en) | Non-interconnected multi-chip package diode | |
| CN213635985U (en) | Power module and chip packaging structure thereof | |
| CN104425478B (en) | Multi-chip packaging structure | |
| CN102739069B (en) | Power semiconductor module and power electronic device applying same | |
| CN108566159B (en) | Rapid processing method of chip low-voltage encapsulated junction box for solar power modules | |
| CN103928447B (en) | A kind of high-power complete airtight semiconductor module encapsulating structure | |
| US6791172B2 (en) | Power semiconductor device manufactured using a chip-size package | |
| EP3514949B1 (en) | Electrically conductive module of solar cell terminal box | |
| CN216528863U (en) | A high-power single-arm rectifier diode module | |
| CN212461690U (en) | TVS suppression protection and follow current protection type rectifier bridge integrated packaging module | |
| CN212408591U (en) | A fully integrated solar panel and a solar lamp using the fully integrated solar panel | |
| CN108389853A (en) | A kind of full-wave rectification bridge structure of integrated form antisurge | |
| CN111710666A (en) | A rectifier bridge circuit module with rear TVS protection diode | |
| CN111863798B (en) | A TVS suppression protection and freewheeling protection type rectifier bridge integrated packaging module | |
| CN216625600U (en) | Rectifier bridge stack and electronic equipment | |
| CN208337498U (en) | Multichannel power management module | |
| CN212209485U (en) | A rectifier bridge circuit module with rear TVS protection diode | |
| CN214068731U (en) | Integrated circuit packaging element, LED constant current driving circuit and LED system | |
| CN205810838U (en) | A kind of photovoltaic module of built-in intelligence chip | |
| CN207781590U (en) | High reliability compact rectifier bridge structure | |
| CN208337497U (en) | Intelligent wiring box with multichannel power management module | |
| CN108566160B (en) | Intelligent junction box with multichannel power management module | |
| CN112510007B (en) | A DC drive protection power supply integrated package chip | |
| CN111510064A (en) | Integrated bypass protection device for solar field and process method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 301, Building 1, No. 3 Dayuan Road, Zhangcun, Dongcheng Street, Dongguan City, Guangdong Province 523109 Patentee after: Guangdong Newair Electronic Technology Co.,Ltd. Country or region after: China Address before: No. 701-06, 7th Floor, Dongsheng Building, Dongcheng South Road, Dongguan City, Guangdong Province Patentee before: Dongguan Newair Electronics Co.,Ltd. Country or region before: China |