CN211047612U

CN211047612U - Power chip packaging structure

Info

Publication number: CN211047612U
Application number: CN201922203574.XU
Authority: CN
Inventors: 邹芹; 谈晓东; 谈心语
Original assignee: Shenzhen Elanpo Electronic Technology Co ltd
Current assignee: Shenzhen Elanpo Electronic Technology Co ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-07-17
Anticipated expiration: 2029-12-11

Abstract

The utility model discloses a power chip packaging structure, which relates to the technical field of power chip packaging, comprising a base, wherein the top of the base is provided with a sealing cover, and both sides of the sealing cover are all provided with grooves, the inside of the base is provided with a plastic frame, and one side of the plastic frame is provided with a silica gel plate, one side of the silica gel plate is provided with a clamping hole, the top of the sealing cover is provided with a hollow tube, and the bottoms of both ends of the hollow tube are both fixedly connected with a solid tube through bolts, the top of the silica gel plate is provided with a power chip body, and both sides of the power chip body are both provided with pins, the bottom of the power chip body is provided with a mounting plate, the utility model solves the problems that the packaging structure is small in size and is not beneficial to element installation through the plastic frame and the silica gel plate, and solves the problem that the, leading to a problem of a rapid aging speed of internal components.

Description

Power chip packaging structure

Technical Field

The utility model belongs to the technical field of the power chip encapsulation, concretely relates to power chip packaging structure.

Background

The power chip packaging is a technology of packaging the power chip in an insulator after the power chip is assembled, the power chip is a chip which is arranged on a circuit board in an electronic equipment system and takes charge of conversion, distribution, detection and other electric energy management of electric energy, the power chip is an important element in the electronic equipment, the power chip cannot be directly arranged on the circuit board, the power chip needs to be packaged and insulated, then the pins on the power chip are welded on the connection points on the circuit board, when other elements except the power chip are arranged in the packaging structure of the prior power chip, the elements need to be fixed by fasteners, the packaging structure has small volume and is not beneficial to element installation, and the heat dissipation speed in the packaging structure is low, so that the aging speed of internal elements is high, the long-term use is not facilitated, and the power chip packaging structure is provided based on the problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a power chip packaging structure to the packaging structure who provides in solving above-mentioned background art is small, is unfavorable for the component installation, and packaging structure inside heat gives off slowly, leads to the fast problem of internal component ageing speed.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a power chip packaging structure, includes the base, sealed lid is installed at the top of base, and the both sides of sealed lid all set up flutedly, the internally mounted of base has the plastics frame, and one side of plastics frame installs the silica gel board, the card hole has been seted up to one side of silica gel board.

Preferably, the top of the sealing cover is provided with a hollow pipe, and the bottoms of the two ends of the hollow pipe are fixedly connected with a solid pipe through bolts.

Preferably, the power chip body is installed at the top of silica gel board, and the pin is all installed to the both sides of power chip body, the mounting panel is installed to the bottom of power chip body.

Preferably, two transverse plates are symmetrically arranged on two sides of the base, and the bolts are arranged at four corners of the bottom of the base.

Preferably, the top of the hollow pipe is provided with a hole, and the outer wall of the hollow pipe is coated with an insulating coating.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses a plastic frame and silica gel board, the installation piece snap-on of inside power chip body and other electronic component bottoms is downthehole at the card in the plastic frame, need not fix with the fastener, has saved installation time, has reduced the operation degree of difficulty, has solved packaging structure and has small, is unfavorable for the problem of component installation.

(2) The utility model discloses a hollow tube and solid core pipe, inside the solid core pipe direction packaging structure, with heat conduction to hollow tube, the heat of hollow tube is favorable to deriving the inside heat of packaging structure in quick conduction to the air, and it is slow to have solved the inside heat diffusion rate of packaging structure, leads to the fast problem of internal element ageing speed.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a top view of the present invention;

fig. 3 is a top view of the base and the power chip body of the present invention;

fig. 4 is a cross-sectional view of the base and the power chip body of the present invention;

FIG. 5 is a schematic structural view of the plastic frame of the present invention;

in the figure: 1-hollow tube; 2-a solid tube; 3, inserting a pin; 4-a groove; 5-sealing cover; 6-a base; 7-a transverse plate; 8-pin; 9-plastic frame; 10-power chip body; 101-mounting plate; 11-a clamping hole; 12-silica gel plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides the following technical solutions: the utility model provides a power chip packaging structure, the on-line screen storage device comprises a base 6, sealed lid 5 is installed at the top of base 6, and sealed lid 5's both sides all seted up recess 4, the internally mounted of base 6 has plastics frame 9, and one side of plastics frame 9 installs silica gel plate 12, card hole 11 has been seted up to one side of silica gel plate 12, silica gel plate 12 is provided with ten at least, silica gel plate 12 is horizontal and the intensive net of vertical distribution constitution, the mesh is card hole 11, the card hole 11 can be gone into to the plastics collets of electronic component bottom, the outside of plastics collets and the inner wall laminating of card hole 11, be favorable to electronic component's quick fixed.

Further, hollow tube 1 is installed at the top of sealed lid 5, and all there is solid pipe 2 through bolt fixedly connected with hollow tube 1's both ends bottom, and hollow tube 1 and solid pipe 2 all adopt the silica gel material to make, and silica gel can high-efficient heat conduction, and the outer wall of solid pipe 2 can closely laminate with the trompil department of sealed lid 5 simultaneously, and sealing performance is good.

Further, power chip body 10 is installed at the top of silica gel plate 12, and pin 8 is all installed to the both sides of power chip body 10, and pin 8 is the lead wire of fixing on power chip body 10, has electrically conductive function, and pin 8 outside is scribbled and is equipped with insulating coating simultaneously, avoids the circuit board short circuit.

Mounting panel 101 is installed to the bottom of power chip body 10, and mounting panel 101 is the insulating supporting shoe of fixing in power chip body 10 bottom, and the main function separates two power chip bodies 10 and base, avoids direct contact, and the power chip body 10 of being convenient for simultaneously is fixed on silica gel board 12.

Further, two transverse plates 7 are symmetrically installed on two sides of the base 6, and the bolts 3 are installed at four corners of the bottom of the base 6.

Furthermore, the top of the hollow tube 1 is provided with a hole, and the outer wall of the hollow tube 1 is coated with an insulating coating.

The utility model discloses a theory of operation and use flow: during the use, the user places plastic frame 9 inside base 6, then insert the 101 mounting panel of power chip body 10 bottom in the card hole 11, stimulate pin 8 to the outer wall of base 6, utilize the bolt fastening between hollow tube 1 and the solid tube 2, then insert sealed lid 5 with solid tube 2, cover sealed lid 5 on base 6, it is fixed to bond the junction of sealed lid 5 and base 6 with glue at last, insert bolt 3 in the circuit board of electronic equipment, diaphragm 7 is kept flat on the circuit board, simultaneously with the welder with pin 8 welding on the contact on the circuit board, after the circuit board circular telegram, power chip body 10 uses the electric work simultaneously, the heat conduction is to solid tube 2, conduct to hollow tube 1 again, give off in the air at last.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a power chip packaging structure, includes base (6), sealed lid (5) are installed at the top of base (6), and the both sides of sealed lid (5) all set up fluted (4), its characterized in that: the novel LED lamp is characterized in that a plastic frame (9) is arranged inside the base (6), a silica gel plate (12) is arranged on one side of the plastic frame (9), and a clamping hole (11) is formed in one side of the silica gel plate (12).

2. The power chip package structure of claim 1, wherein: the top of the sealing cover (5) is provided with a hollow pipe (1), and the bottoms of the two ends of the hollow pipe (1) are fixedly connected with a solid pipe (2) through bolts.

3. The power chip package structure of claim 1, wherein: power chip body (10) are installed at the top of silica gel board (12), and pin (8) are all installed to the both sides of power chip body (10), mounting panel (101) are installed to the bottom of power chip body (10).

4. The power chip package structure of claim 1, wherein: two transverse plates (7) are symmetrically installed on two sides of the base (6), and the bolts (3) are installed at four corners of the bottom of the base (6).

5. The power chip package structure of claim 2, wherein: the top of the hollow pipe (1) is provided with a hole, and the outer wall of the hollow pipe (1) is coated with an insulating coating.