CN210765575U - Electrolytic reaction control structure and electrolytic device using same - Google Patents
Electrolytic reaction control structure and electrolytic device using same Download PDFInfo
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- CN210765575U CN210765575U CN201921456339.7U CN201921456339U CN210765575U CN 210765575 U CN210765575 U CN 210765575U CN 201921456339 U CN201921456339 U CN 201921456339U CN 210765575 U CN210765575 U CN 210765575U
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Abstract
The utility model belongs to electrolytic etching device field, concretely relates to electrolysis reaction control structure and electrolytic device who uses thereof. An electrolytic reaction control structure comprises a liquid level meter, a liquid level meter and a liquid level controller, wherein the liquid level meter is arranged in electrolyte and used for measuring the liquid level height of the electrolyte and sending a liquid supplementing signal when the liquid level height is lower than a preset height; the control structure is used for receiving a liquid supplementing signal sent by the liquid level meter and controlling the pump to supplement the electrolyte; the shielding structure comprises a shielding unit which is arranged between the end part of the cathode piece and the end part of the piece to be etched so as to reduce the flow speed of electrolyte between the end part of the cathode piece and the end part of the piece to be etched, and the piece to be etched is connected with an anode wire. The liquid level meter enables the electrolyte to be always in a required range, and the risk that the reaction at the top of the piece to be etched is stopped due to too low electrolyte level is reduced; on the premise that the electrolyte is always sufficient, the edge effect of the power lines at the top and the bottom of the piece to be etched is weakened, so that the etching effect on the whole piece to be etched tends to be uniform.
Description
Technical Field
The utility model relates to an electrolytic etching technical field, concretely relates to electrolysis reaction control structure and electrolytic device who uses thereof.
Background
Electrolytic etching refers to the electrolysis of the PCB, and the specific method comprises the following steps: taking a plate to be etched as an anode, taking a stainless steel plate or a pure copper plate as a cathode, connecting the anode with the positive pole of a power supply, connecting the cathode with the negative pole of the power supply, and immersing the anode and the cathode in an electrolyte solution. When current passes through the electrode and the electrolyte solution, electrochemical reaction occurs on the surface of the electrode and in the electrolyte solution, and partial copper layer to be dissolved and removed is removed by utilizing the electrochemical reaction, so that the aim of etching is fulfilled. When the electrolytic etching apparatus is powered on, an oxidation reaction occurs at the anode and a reduction reaction occurs at the cathode. As a result of the anodic reaction, the metal at the site to be etched is oxidized to become metal ions into the electrolyte solution.
In the electrolytic etching process, the liquid level of the electrolyte is consumed along with the increase of the etching reaction time, and the to-be-etched piece moves in the electrolyte and is easy to drive the liquid level of the electrolyte to fluctuate. The requirements for the electrolyte level are typically: the height of the bottom of the conductive clip holding the piece to be etched is 2-3mm upwards. If the liquid level is lower than the expected height, the top of the piece to be etched may be exposed to the liquid level of the electrolyte during the flowing process of the electrolyte, which affects the uniformity of the whole electrolysis.
In order to solve the above technical problem, chinese patent document CN205171008U discloses a plating bath liquid level control system, wherein the liquid level control is realized by a liquid level sensor, a microprocessor and a controller, an instruction sent by the liquid level sensor is transmitted to the controller, and the controller controls a circulating pump to pump plating solution to achieve the purpose of adjusting the liquid level.
Because the top and the bottom of the piece to be etched are easy to generate the edge effect of the power line in the electrolytic etching process, if the liquid level of the electrolyte always meets the requirement that the height of the bottom of the conductive clamp clamping the piece to be etched is 2-3mm upwards, the top and the bottom of the piece to be etched simultaneously generate the edge effect of the power line, and the electrolytic speed is higher than the middle position of the piece to be etched; when the liquid level of the electrolyte is lower than the expected requirement and even lower than the top of the to-be-etched piece, the electrolytic reaction of the top of the to-be-etched piece is stopped, but the electrolytic reaction of the bottom of the to-be-etched piece still occurs at the moment, the etching speed of the bottom is higher than that of the middle position, and the etching speed of the middle position is higher than that of the top, so that the etching effect is uneven, and the final etching effect cannot be ensured only by adjusting the liquid level through the liquid level sensor.
SUMMERY OF THE UTILITY MODEL
Therefore, the technical problem to be solved by the present invention is to overcome the phenomenon that the etching effect of the etching object to be etched is easily affected by the liquid level and the edge effect and is not uniform in the prior art, thereby providing an electrolytic reaction control structure.
An electrolytic reaction control structure comprising:
the liquid level meter is arranged in the electrolyte and used for measuring the liquid level height of the electrolyte and sending a liquid supplementing signal when the liquid level height is lower than a preset height;
the control structure is used for receiving a liquid supplementing signal sent by the liquid level meter and controlling the pump to supplement the electrolyte;
a shielding structure comprising:
and the shielding unit is arranged between the end part of the cathode piece and the end part of the piece to be etched so as to reduce the flow speed of the electrolyte between the end part of the cathode piece and the end part of the piece to be etched, and the piece to be etched is connected with the anode lead.
Further, the shielding unit includes:
a first shielding plate positioned between the top end of the cathode piece and the top end of the piece to be etched,
and the second shielding plate is positioned between the bottom end of the cathode piece and the bottom end of the piece to be etched.
Furthermore, the first shielding plate is fixedly arranged, and the second shielding plate can move along the vertical direction.
Furthermore, a connecting rod is arranged between the first shielding plate and the second shielding plate, an opening allowing electrolyte to flow is formed among the connecting rod, the first shielding plate and the second shielding plate, and a cation membrane or filter cloth allowing cation to flow in a single direction is arranged at the opening.
Furthermore, the bottom of the second shielding plate is provided with a limiting cushion block for adjusting the vertical height of the second shielding plate, the limiting cushion block is provided with a plurality of limiting grooves for accommodating the second shielding plate, and the depth of the limiting grooves is different.
Furthermore, the top of the first shielding plate is higher than the joint of the piece to be etched and the anode lead.
Further, the device also comprises a floating shielding unit, wherein the floating shielding unit is connected with a lifting unit so as to adjust the blocking position in a lifting motion manner between the cathode piece and the piece to be etched under the driving of the lifting unit.
Further, the liquid level meter is arranged at the edge position of the tank body filled with the electrolyte.
Furthermore, the piece to be etched is a PCB, and the cathode piece is a stainless steel plate or a pure copper plate.
There is also provided an electrolysis apparatus including the electrolysis reaction control structure of any one of the above.
The utility model discloses technical scheme has following advantage:
1. the utility model provides an electrolysis reaction control structure, because the liquid level of electrolyte requires mostly to exceed the top of treating the etching piece, consequently in case the condition that the liquid level reduces appears, need in time supply electrolyte, otherwise treat that the reaction rate at etching piece top receives the influence, the etching effect at its top just is difficult to be close with the etching effect at other positions. And the liquid level change can be known in time by arranging the liquid level meter, the electrolyte is supplemented in time, and the etching effect is guaranteed. The shielding unit shields between the to-be-etched piece and the cathode piece, so that the flowing of the electrolyte is blocked, the free speed and range of ions in the electrolyte are blocked, and the etching speed of the part, corresponding to the to-be-etched piece, of the shielding unit is slowed down. Because the top and the bottom of the piece to be etched are easy to generate the edge effect of the power lines, namely the power lines are denser at the two positions and the reaction speed is higher, the shielding positions are mainly positioned at the two positions, so that the etching speed of the whole piece to be etched tends to be close to the middle part of the piece to be etched, and the etching effect on the same piece of the piece to be etched is uniform within the same reaction time. Therefore, the liquid level meter and the shielding unit act together, the liquid level meter enables the electrolyte to be always in a required range, and the risk that the reaction at the top of the piece to be etched is stopped due to too low electrolyte level is reduced; on the premise that the electrolyte is always sufficient, the edge effect of the power lines at the top and the bottom of the piece to be etched is weakened, so that the etching effect on the whole piece to be etched tends to be uniform.
2. The utility model provides an electrolysis reaction control structure, the first shield plate and the second shield plate that shield the unit can enough be mutually independent, also can be the linkage. Since the shielding plate with higher vertical position always shields the top of the piece to be etched, and the top of the piece to be etched is connected with the anode, the first shielding plate is specially used for improving the etching uniformity of the top of the piece to be etched, and the second shielding plate is specially used for improving the etching uniformity of the bottom of the piece to be etched. The first and second shielding plates are set to different heights according to different heights of the anode plate to be etched, so as to achieve the purpose of uniform electrolysis of the whole plate to be etched. If the etching object to be electrolyzed is higher, the distance between the bottom of the etching object to be electrolyzed and the bottom of the electrolytic tank is smaller, namely, the shielding plate with lower vertical height should sink to cover the bottom of the etching object to be etched, thereby ensuring the etching effect.
3. The utility model provides an electrolysis reaction control structure for the connecting rod of connecting first shield plate and second shield plate has formed a frame with first shield plate, second shield plate, and first shield plate and second shield plate are independent at the removal in-process, consequently can effectively play the restriction and treat etching piece both ends reaction rate's effect from top to bottom.
The frame part formed by the shielding unit can be provided with a cationic membrane or special filter cloth in the middle. The cation membrane and the filter cloth can block fine copper particles, and meanwhile, the cation membrane can only allow cations to flow in a single direction, so that the decomposed cations on the piece to be etched cannot return to the piece to be etched again after flowing through the ion membrane, and are distributed on the cathode piece in a concentrated manner, and are convenient to adsorb on the cathode piece.
4. The utility model provides an electrolytic reaction control structure, the border position of the cell body that is equipped with electrolyte is arranged in to the level gauge, because the electrolyte that is equipped with the corner position of the cell body of electrolyte flows and receives the restriction of cell wall easily, and the velocity of flow can be slower for the cell body intermediate position, and the liquid level is just also more stable. The liquid level height measured by the liquid level meter is more accurate than the liquid level height measured by the liquid level meter arranged at the middle position of the tank body.
5. The utility model provides an electrolytic device, through adopting foretell electrolysis reaction control structure, can effective control one treat etching speed of each department on the etching piece, make it tend to unanimity.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is obvious that the drawings in the following description are some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic view of an electrolytic reaction control structure of the present invention;
FIG. 2 is a schematic diagram of the relative positions of the shield unit and the floating shield unit;
fig. 3 is a front view of the shielding unit;
fig. 4 is a schematic structural view of the lifting unit.
Description of reference numerals:
1-a liquid level meter; 2-a shielding structure; 21-a shielding unit; 211-a first shield plate; 212-a second shield plate; 213-a connecting rod; 214-an opening; 215-cationic membrane; 22-a limit cushion block; 23-a floating shield unit; 3-steel wire; 4-lifting the outer pipe; 5, lifting the inner pipe; 6-floating plate; 7-a frame.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
An electrolysis device comprises an electrolytic tank, wherein electrolyte is contained in the electrolytic tank. The electrolysis trough is mostly the cube setting, and in this embodiment, the electrolysis trough sets up to the cuboid, and wherein the intermediate position is equipped with the piece of waiting to etch that is connected with the positive pole, waits to etch a both sides and is equipped with the negative pole piece. The positive pole with treat to adopt electrically conductive clamp centre gripping to link to each other between the etching piece, the electrolyte liquid level requires to be higher than electrically conductive double-layered face stopper 2 ~ 3mm, adopts 2.5mm in this embodiment.
In this embodiment, the member to be etched is a PCB, and the exposed copper surface of the PCB is required to be etched. The cathode part adopts a plate structure and can be made of a stainless steel plate or a pure copper plate. When the electrolytic reaction occurs, copper ions are decomposed on the bare copper surface of the PCB and attached to the negative plate to form metal copper, the metal copper is accumulated for a long time to reach a copper shell, and the copper shell is taken down in a mode that a worker manually peels off by a knife.
An electrolytic reaction control structure for controlling the etching uniformity of the piece to be etched is arranged in the electrolytic bath. The electrolytic reaction control structure comprises a liquid level meter 1 for monitoring the liquid level in real time, and in order to measure more accurate results, the liquid level meter 1 is arranged at the edge position of the electrolytic cell, such as the top corner of the electrolytic cell. Once the liquid level in the electrolytic cell changes, the liquid level meter 1 sends out a liquid supplementing signal after sensing, the signal is transmitted to the control structure, and the control structure controls the pump to supplement electrolyte after receiving the liquid supplementing signal; the control structure in this embodiment employs a PLC. The type 1 of the liquid level meter adopts a kirschner analog liquid level meter 1.
The shielding structure 2 includes a shielding unit 21 and a floating shielding unit 23. The relative position between the shielding unit 21 and the electrolytic cell is generally kept constant, between the cathode member and the member to be etched. The shielding unit 21 includes a first shielding plate 211 having a high vertical height and a second shielding plate 212 having a low vertical height, and the first shielding plate 211 and the second shielding plate 212 are located in the same vertical plane and connected to each other by a connecting rod 213. The first shielding plate 211 and the second shielding plate 212 have the same width, and the connection rod 213 is vertically disposed, so that the first shielding plate 211, the second shielding plate 212, and the connection rod 213 constitute a frame-like structure with an opening 214 formed therebetween to allow the flow of the electrolyte. In order to concentrate the decomposed cations as much as possible at the cathode member, a layer of filter cloth or cation membrane 215 is provided at the position of the opening 214, and the cation membrane 215 is used in this embodiment.
As an optimized embodiment, a limit cushion block 22 is further arranged at the second shielding plate 212, and the limit cushion block 22 is mainly used for limiting the cathode plate, and can also limit the second shielding plate 212 on the limit cushion block at the same time. The relative position between the limiting cushion block 22 and the bottom of the electrolytic cell is kept unchanged, at least two limiting grooves with different depths are arranged at the top of the limiting cushion block 22, and the second shielding plate 212 is clamped and embedded in one of the limiting grooves and limited by the limiting groove. The selection of the limiting groove is related to the height of the top of the to-be-etched piece, and since the first shielding plate 211 is used for shielding the top end of the cathode piece and the top end of the to-be-etched piece, the higher the top end of the to-be-etched piece is, the shallower the limiting groove where the second shielding plate 212 is located is; the lower the top end of the member to be etched, the deeper the limiting groove in which the second shielding plate 212 is located. In order to make the first shielding plate 211 always cover the top of the position limiting member and block the edge effect of the top of the position limiting member, the top of the first shielding plate 211 is always required to be higher than the position where the member to be etched and the anode are electrically connected.
As another alternative embodiment, the first shielding plate 211 and the second shielding plate 212 are independent from each other, the first shielding plate 211 is fixedly connected with the electrolytic cell by welding or fastening; only the second shield plate 212 can achieve the movement in the vertical direction. The second shielding plate 212 can be moved by a winch to be lifted and released or placed in the limiting grooves of different depths on the limiting cushion block 22.
The floating shielding unit 23 is used for shielding the bottom edge position of the piece to be etched and relieving the electric line edge effect of the bottom edge position of the piece to be etched.
The unit 23 is shielded in the floating mode can move up and down in the vertical direction, the unit 23 is shielded in the floating mode and is set to be a cubic rectangle with two hollow-out structures, a gap is reserved between the two cubic rectangles, and the floating shielding unit can move in a gap between the two cubic rectangles due to the fact that the piece to be etched is a plate. One surface of the hollow structure facing to the piece to be etched is a solid plate so as to achieve the purpose of blocking the flow of the electrolyte.
The structure driving the floating shielding unit 23 is a lifting unit including a rotation driving device for providing power, such as a motor, a winch; a rope or a steel wire 3 is connected to a rotating shaft or a rotating wheel of the rotation driving device, and the steel wire 3 is adopted in the embodiment; at least one telescopic tube structure is connected between the rotary driving device and the floating shielding unit 23, in this embodiment, three groups of telescopic tube structures are adopted, and a linear array is arranged on the top surface of the floating shielding unit 23. Each telescopic pipe structure comprises a lifting outer pipe 4 and a lifting inner pipe 5 or an inner rod sleeved in the lifting outer pipe 4, and the lifting inner pipe 5 or the inner rod and the lifting outer pipe 4 can move in a relative telescopic mode. In order to save cost and reduce the load on the rotary drive device, the inner tube 5 or the inner rod is a tubular body in this embodiment. The lifting outer pipe 4 or the lifting inner pipe 5 or the inner rod is fixedly connected with the top of the floating shielding unit 23, and the floating shielding unit 23 is in a plate shape, namely a floating plate 6; in this embodiment, adopt the structure that floats to shield unit 23 and lift outer tube 4 fixed connection, steel wire 3 deviates from rotary drive device one end and links to each other with lift outer tube 4 top. One end of the lifting outer pipe 4 close to the ground is fixedly connected with the floating plate 6 by screws, two ends of the lifting inner pipe 5 or the inner rod are respectively welded and connected with the bottom of the electrolytic cell and the position of the frame 7 higher than the electrolytic cell, and the lifting inner pipe 5 or the inner rod is vertically arranged.
When the floating shielding unit 23 needs to be pulled to move upwards, the rotary driving device rotates to drive the steel wire 3 to be wound, and the steel wire 3 pulls the floating shielding unit 23 to drive the floating shielding unit 23 to move upwards to a desired height. The higher the floating shielding unit 23 moves up, the more suitable for the small-sized to-be-etched piece; when the floating shielding unit 23 needs to be lowered, the rotary driving device rotates reversely to release the steel wire 3, and the floating shielding unit 23 sinks, so that the device is suitable for a large-size workpiece to be etched. Since the top of the piece to be etched is always limited at the same height, the floating shielding unit 23 only needs to be matched with the pieces to be etched with different sizes and shield the bottom of the piece to be etched.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (9)
1. An electrolytic reaction control structure, comprising:
the liquid level meter (1) is arranged in the electrolyte and used for measuring the liquid level height of the electrolyte and sending a liquid supplementing signal when the liquid level height is lower than a preset height,
the control structure is used for receiving a liquid supplementing signal sent by the liquid level meter (1) and controlling the pump to supplement electrolyte;
shielding structure (2) comprising:
and the shielding unit (21) is arranged between the end part of the cathode piece and the end part of the piece to be etched so as to reduce the flow speed of the electrolyte between the end part of the cathode piece and the end part of the piece to be etched, and the piece to be etched is connected with an anode lead.
2. The electrolytic reaction control structure according to claim 1, wherein the shielding unit (21) includes:
a first shielding plate (211) positioned between the top end of the cathode piece and the top end of the piece to be etched,
and the second shielding plate (212) is positioned between the bottom end of the cathode piece and the bottom end of the piece to be etched.
3. The electrolytic reaction control structure according to claim 2, wherein the first shielding plate (211) is fixedly disposed, and the second shielding plate (212) is movable in a vertical direction.
4. The electrolytic reaction control structure according to claim 2 or 3, wherein a connecting rod (213) is disposed between the first shielding plate (211) and the second shielding plate (212), an opening (214) allowing an electrolyte to flow is formed between the connecting rod (213) and the first shielding plate (211) and the second shielding plate (212), and a cation membrane (215) or a filter cloth allowing a cation to flow in a single direction is disposed at the opening (214).
5. The electrolytic reaction control structure according to claim 2 or 3, wherein the top of the first shielding plate (211) is disposed higher than a place where the member to be etched is connected to an anode wire.
6. An electrolytic reaction control structure according to any one of claims 1 to 3, further comprising a floating shield unit (23), wherein the floating shield unit (23) is connected to a lifting unit to adjust a blocking position by lifting and lowering movement between the cathode member and the member to be etched under the driving of the lifting unit.
7. An electrolytic reaction control structure according to any one of claims 1 to 3, characterized in that the liquid level meter (1) is disposed at an edge position of a tank body containing an electrolytic solution.
8. The electrolytic reaction control structure according to any one of claims 1 to 3, wherein the member to be etched is a PCB plate, and the cathode member is a stainless steel plate or a pure copper plate.
9. An electrolysis apparatus, characterized by: comprising the electrolytic reaction control structure according to any one of claims 1 to 8.
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| CN201921456339.7U CN210765575U (en) | 2019-09-03 | 2019-09-03 | Electrolytic reaction control structure and electrolytic device using same |
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| CN201921456339.7U CN210765575U (en) | 2019-09-03 | 2019-09-03 | Electrolytic reaction control structure and electrolytic device using same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110592654A (en) * | 2019-09-03 | 2019-12-20 | 昆山东威科技股份有限公司 | Electrolytic reaction control structure and electrolytic device using same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592654A (en) * | 2019-09-03 | 2019-12-20 | 昆山东威科技股份有限公司 | Electrolytic reaction control structure and electrolytic device using same |
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