CN210743943U - SMD multicolor LED lamp bead support - Google Patents
SMD multicolor LED lamp bead support Download PDFInfo
- Publication number
- CN210743943U CN210743943U CN201922497541.0U CN201922497541U CN210743943U CN 210743943 U CN210743943 U CN 210743943U CN 201922497541 U CN201922497541 U CN 201922497541U CN 210743943 U CN210743943 U CN 210743943U
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- China
- Prior art keywords
- light
- led lamp
- lamp bead
- metal base
- sub
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000011324 bead Substances 0.000 title claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 58
- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 238000004806 packaging method and process Methods 0.000 claims abstract description 15
- 235000012431 wafers Nutrition 0.000 claims description 36
- 239000003292 glue Substances 0.000 claims description 20
- 239000000084 colloidal system Substances 0.000 claims description 12
- 238000000926 separation method Methods 0.000 claims description 8
- 239000003086 colorant Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 9
- 238000009434 installation Methods 0.000 description 9
- 238000012856 packing Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
A SMD multi-color LED lamp bead support relates to the technical field of lamp bead supports. It includes: a stent body; the dam assembly is arranged on the bracket body, encloses the mounting surface of the bracket body into a mounting area and divides the mounting area into a plurality of sub-areas; the light-emitting chips are arranged on the bracket body and correspondingly arranged in the sub-areas; the metal base is arranged on the bracket body, one end of the metal base penetrates through the bracket body to extend to the mounting area and is electrically connected with the light-emitting wafer, the metal base is partially used for mounting the light-emitting wafer, and the metal base is also used for being externally connected with a power supply and leading heat generated by the light-emitting wafer out of the bracket body in a heat conduction mode; and a wire having one end connected to the light emitting chip and the other end connected to the metal base. The LED lamp bead support adopting the technical scheme has the advantages of convenient adjustment of light intensity or color, small lamp bead volume, small occupied area during lamp bead assembly, high assembly efficiency, standard product packaging and high yield.
Description
Technical Field
The utility model relates to a lamp pearl support technical field, concretely relates to SMD multicolour LED lamp pearl support.
Background
The LED lamp has the advantages of environmental protection, long service life, energy conservation, high reliability, good lighting effect, small volume and the like, and is widely applied. And the light emitting source is a light emitting diode.
The LED lamp bead light-emitting principle is as follows: the terminal voltage of the PN junction forms a certain potential barrier, when a forward bias voltage is applied, the potential barrier is lowered, and most carriers in the P region and the N region diffuse to each other. Since electron mobility is much greater than hole mobility, a large number of electrons will diffuse into the P region, constituting an injection of minority carriers into the P region. These electrons recombine with holes in the valence band and the energy obtained during recombination is released as light energy to form the light emitting source.
The color of the single lamp bead of the existing LED lamp bead is only one or more than one plane, the standard controllable sphere cannot be manufactured during packaging, especially the sphere cannot be controlled during white light manufacturing, the effect is poor in the use field of the lighting angle required by certain finished product installation, the colorful lamp with adjustable color is provided with a plurality of LED lamp beads with different colors on the lamp body, and the color of the light can be adjusted by controlling the opening and closing of the LED lamp beads with different colors. The lamp that sets up like this, its LED lamp pearl's installation area is big, and simultaneously, LED lamp pearl is at the point in-process, often appears flowing glue, is climbed gluey problem, seriously influences the colour temperature uniformity of whole batch lamp pearl, consequently, remains to improve.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to prior art's defect and not enough, a SMD multicolour LED lamp pearl support is provided, it can be at a plurality of luminous wafers of shelf location, make this LED lamp pearl can open or close through the luminous wafer of control difference, realize light colour transform or light intensity's adjustment, and the setting of accessible box dam subassembly, when packing the encapsulation and gluing, not only can effectively avoid the gumming, climb the problem of gluing, and can guarantee that the colloid after the point is glued presents hemispherical, it is convenient to have light intensity or colour adjustment, the lamp pearl is small, area occupied when the lamp pearl assembles is little, packaging efficiency is high, product packaging standard, the advantage that the yields is high.
In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a SMD multicolour LED lamp pearl support, includes: a stent body; the dam assembly is arranged on the bracket body, encloses the mounting surface of the bracket body into a mounting area and divides the mounting area into a plurality of sub-areas; the plurality of light-emitting wafers are arranged on the bracket body, correspondingly arranged in the sub-areas and used for emitting light after being electrified; the metal base is arranged on the bracket body, one end of the metal base penetrates through the bracket body to extend to the mounting area and is electrically connected with the light-emitting wafer, the metal base is partially used for mounting the light-emitting wafer, and the metal base is also used for being externally connected with a power supply and leading heat generated by the light-emitting wafer out of the bracket body in a heat conduction mode; and a wire having one end connected to the light emitting chip and the other end connected to the metal base.
Further, be provided with bowl cup groove on the support body, the box dam subassembly includes: the bowl cup piece is arranged in the bowl cup groove and used for accommodating the luminous wafer; the separation box dam is arranged in the bowl cup piece and used for separating the space in the bowl cup into four sub-areas and preventing glue solutions in the four sub-areas from being mutually adhered when packaging glue is filled; and the annular dam is arranged on the support body, is positioned at the cup opening of the bowl cup piece and is used for forming an annular dam at the cup opening of the bowl cup so as to prevent glue liquid from flowing out when the packaging glue is filled.
Furthermore, the separating box dams are distributed in a crisscross mode, and are used for separating an installation area surrounded by the annular box dams into four sub areas distributed in a shape like a Chinese character 'tian'; the annular dam is used for enclosing the colloid to form a semi-sphere when the packaging adhesive is filled.
Further, the metal base passes through the bracket body and extends within the bowl.
Furthermore, the metal bases are provided with two groups, the two groups of metal bases are respectively arranged on two side walls of the support body, one group of the two groups of metal bases is a positive plate, the other group of metal bases is a negative plate, and each group is provided with four metal bases.
Furthermore, the number of the light-emitting chips is four, and the light-emitting chips are located in the four sub-regions respectively.
Furthermore, the light emitted by the four light-emitting chips has at least two colors.
Furthermore, the wire is a gold wire or a copper wire.
Furthermore, a fixing hole is formed in one side, far away from the light-emitting wafer, of the metal base, and a fixing column assembled with the fixing hole is arranged on the support body.
After the technical scheme is adopted, the utility model discloses beneficial effect does:
1. different light-emitting wafers are arranged on the same LED lamp bead product, and different light-emitting wafers are LED out through different metal bases to form pins, so that one LED lamp bead can share a plurality of light-emitting wafers, the area occupied by the LED lamp bead in the subsequent assembly of a finished product structure is saved, and the efficiency in the subsequent assembly of the finished product structure is improved; and a plurality of luminous wafers can be controlled alone to guaranteed that LED lamp pearl can be through controlling opening or closing of different luminous wafers, control the luminous colour of LED lamp pearl or luminous intensity.
2. Through the separation box dam that sets up, with four subregions that the space separation in the bowl cup spare becomes field style of calligraphy and distributes, and install different luminous wafer in four subregions, make when the packing encapsulation is glued in the intussuseption of bowl cup spare, the condition of mutual adhesion does not appear in the glue solution in four regions, and when the box dam is separated to the glue solution full play, through the annular box dam that sets up, supplementary encapsulation colloid is moulding to become hemispherical, thereby make LED lamp pearl encapsulate into the hemisphere shape more standard with the encapsulation colloid, and then the uniformity and the yields of product when having promoted LED lamp pearl encapsulation colloid.
3. The fixing holes in the fixing columns and the metal base are assembled, the assembling stability between the metal base and the support body is improved, meanwhile, the metal base can be used for fixing the light-emitting wafer and can be connected with an external power supply, the light-emitting wafer is electrified, meanwhile, the metal base can lead out bowl-shaped pieces through a heat conduction mode with heat generated when the light-emitting wafer emits light, and the support is simple in wafer installation and long in service life.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a front view of the present embodiment;
FIG. 2 is a left side view of the present embodiment;
FIG. 3 is a rear view of the present embodiment;
fig. 4 is a schematic view of a metal base in the present embodiment.
Description of reference numerals: 1. a stent body; 11. an installation area; 12. a sub-region; 13. fixing a column; 2. a box dam assembly; 21. a bowl piece; 22. separating the box dam; 23. an annular box dam; 3. a light emitting chip; 4. a metal base; 5. and (4) conducting wires.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment as required without making a contribution, but all the embodiments are protected by the patent law within the scope of the claims of the present invention.
The embodiment relates to a SMD multicolour LED lamp pearl support, as shown in fig. 1-4, include: the bracket comprises a bracket body 1, a dam component 2, a light emitting chip 3 and a lead 5. Wherein, SMDLED lamp pearl is SMD LED lamp pearl.
Specifically, the holder body 1 is used for mounting the dam assembly 2, the light emitting chip 3 and the wires 5. The dam assembly 2 is arranged on the support body 1, the dam assembly 2 is used for enclosing the installation surface of the support body 1 into an installation area 11, and meanwhile, the area is divided into a plurality of sub-areas 12, so that the light-emitting wafer 3 is convenient to install. The plurality of light emitting chips 3 are disposed on the bracket body 1 and correspondingly mounted in the plurality of sub-regions 12, and the plurality of light emitting chips 3 are used for emitting light after being electrified. The metal base 4 is disposed on the support body 1, and one end of the metal base 4 passes through the support body 1 and extends to the mounting region 11 and is electrically connected to the light emitting chip 3. Part of the metal base 4 is used for mounting the light emitting chip 3, and the metal base 4 is also used for externally connecting a power supply and guiding heat generated by the light emitting chip 3 out of the bracket body 1 in a heat conduction manner. One end of the wire 5 is connected to the light emitting chip 3, and the other end is connected to the metal base 4.
It should be noted that, as shown in fig. 1 to 3, a bowl groove is provided on the bracket body 1, and the dam assembly 2 is installed in the bowl groove. The support body 1 is cuboid, and the length of support body 1 is 5 millimeters, and the width is 5 millimeters, and thickness 2 degrees is 1.1 millimeters. The bowl cup groove sets up in the front of support body 1, and metal base 4 distributes on the back of support body 1. In other embodiments, the rack body 1 has a length of 5.3 mm, a width of 5.1 mm, and a thickness of 1.1 mm.
Further, as shown in fig. 1-3, the dam assembly 2 includes: a bowl 21, a dividing dam 22 and an annular dam 23. The bowl piece 21 is installed in the bowl groove, and the bowl piece 21 is used for accommodating the light emitting chip 3 and filling the packaging glue. The separating box dam 22 is arranged in the bowl cup piece 21, and the separating box dam 22 is used for separating the space in the bowl cup into the four sub-areas 12 and preventing glue solutions in the four sub-areas 12 from being adhered to each other when packaging glue is filled. The annular dam 23 is arranged on the bracket body 1 and located at the cup opening of the bowl cup 21, and the annular dam 23 is used for forming the annular dam at the cup opening of the bowl cup, so that glue liquid is prevented from flowing out when the packaging glue is filled.
It is worth noting that when the glue solution is full of the separating box dam 22, the auxiliary packaging colloid is shaped into a semi-sphere shape through the arranged annular box dam 23, so that the LED lamp beads package the packaging colloid into a semi-sphere shape which is more standard, and the consistency and the yield of products are improved when the LED lamp beads package the colloid.
Preferably, as shown in fig. 1 to 3, the dividing dams 22 are distributed in a criss-cross manner, and the dividing dams 22 are used for dividing the installation area 11 surrounded by the annular dams 23 into four sub-areas 12 distributed in a grid shape. The bowl member 21, the separating dam 22 and the annular dam 23 are all made of PCT material.
Specifically, as shown in fig. 4, the metal base 4 passes through the holder body 1 and extends inside the bowl 21. The metal bases 4 are provided with two groups, the two groups of metal bases 4 are respectively arranged on two sides of the back face of the support body 1, one group of the two groups of metal bases 4 is a positive electrode metal base, the other group of metal bases is a negative electrode metal base, and each group is provided with four metal bases 4. In this embodiment, the four negative electrode metal bases are respectively labeled from top to bottom: A. b, C, D, the four positive electrode metal bases are respectively marked as follows from top to bottom: a. b, c and d. Wherein the light emitting chip is mounted on the positive electrode metal base (b, c).
Preferably, as shown in fig. 1 to 4, four light emitting chips 3 are correspondingly arranged and respectively located in four sub-areas 12, and the light emitting chips 3 in each area are controlled by using a single circuit. The light emitted by the four light emitting chips 3 has at least two colors. The lead 5 is a gold wire, a copper wire or an alloy wire. In the present embodiment, the wires 5 are gold wires, and the four light emitting chips 3 are different in color and are red, white, blue and yellow.
Further, as shown in fig. 1 to 4, a fixing hole is disposed on a side of the metal base 4 away from the light emitting chip 3, and a fixing post 13 assembled with the fixing hole is disposed on the support body 1. Assemble through the fixed column 13 that sets up and the fixed orifices on the metal base 4, and then promoted the steadiness of assembly between metal base 4 and the support body 1, and simultaneously, the metal base 4 that sets up not only can be used for fixed luminous wafer 3, and can external power supply, realize luminous wafer 3's circular telegram, and simultaneously, metal base 4 can derive bowl cup spare 21 through heat-conducting mode with the heat that produces when luminous wafer 3 is luminous, the support that sets up like this has the wafer installation simply, wafer long service life's advantage.
The design principle of the present embodiment is roughly as follows: different light-emitting wafers 3 are arranged on the same LED lamp bead product, and different light-emitting wafers 3 are LED out through different metal bases 4 to form pins, so that one LED lamp bead can have a plurality of light-emitting wafers 3 in total, the occupied area of the LED lamp bead during subsequent assembly of a finished product structure is saved, and the efficiency during subsequent assembly of the finished product structure is improved; moreover, the plurality of light-emitting wafers 3 can be controlled independently, so that the LED lamp bead can be controlled to emit light in color or intensity by controlling the on or off of different light-emitting wafers 3; in addition, through the separation box dam 22 that sets up, become four subregion 12 that field style of calligraphy distributes with the space separation in the bowl cup 21, and install different luminescent wafer 3 in four subregion 12, make when packing the encapsulation glue in bowl cup 21 intussuseption, the condition of mutual adhesion does not appear in the glue solution in four regions, and when the separation box dam 22 was filled out to the glue solution, annular box dam 23 through setting up, supplementary encapsulation colloid is moulding hemispherical, thereby make LED lamp pearl encapsulate into the hemisphere shape more standard with the encapsulation colloid, and then the uniformity and the yields of product when having promoted LED lamp pearl encapsulation colloid.
The above description is only for the purpose of illustration and not limitation, and other modifications or equivalent replacements made by those skilled in the art to the technical solution of the present invention should be covered by the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.
Claims (9)
1. The utility model provides a SMD multicolour LED lamp pearl support which characterized in that includes:
a stent body (1);
a dam assembly (2) which is provided on the bracket body (1), and which encloses a mounting surface of the bracket body (1) into a mounting area (11) and divides the area into a plurality of sub-areas (12);
the plurality of luminous wafers (3) are arranged on the support body (1), correspondingly arranged in the plurality of sub-areas (12) and used for emitting light after being electrified;
the metal base (4) is arranged on the support body (1), one end of the metal base penetrates through the support body (1) to extend to the mounting area (11) and is electrically connected with the light-emitting wafer (3), the metal base (4) is partially used for mounting the light-emitting wafer (3), and the metal base (4) is also used for being externally connected with a power supply and conducting heat generated by the light-emitting wafer (3) out of the support body (1) in a heat conduction mode; and the number of the first and second groups,
a wire (5) with one end connected with the luminous wafer (3) and the other end connected with the metal base (4).
2. The SMD multi-color LED lamp bead support according to claim 1, wherein said support body (1) is provided with a bowl groove, and said dam assembly (2) comprises:
a bowl cup piece (21) which is arranged in the bowl cup groove and is used for accommodating the luminous wafer (3);
the separating dam (22) is arranged in the bowl cup piece (21) and used for separating the space in the bowl cup into the four sub-areas (12) and preventing glue solutions in the four sub-areas (12) from being mutually adhered when packaging glue is filled;
and the annular dam (23) is arranged on the support body (1) and is positioned at the cup opening of the bowl cup piece (21) and used for forming an annular dam at the cup opening of the bowl cup so as to prevent glue liquid from flowing out when the packaging glue is filled.
3. The SMD multi-color LED lamp bead holder as claimed in claim 2, wherein said separation box dams (22) are arranged in a criss-cross pattern, said separation box dams (22) being adapted to separate a mounting area (11) enclosed by said annular box dam (23) into four said sub-areas (12) arranged in a grid pattern; the annular dam (23) is used for enclosing the colloid to form a semi-sphere shape when the packaging adhesive is filled.
4. The SMD multi-color LED lamp bead holder according to claim 2 or 3, wherein said metal base (4) passes through said holder body (1) and extends inside said bowl-shaped member (21).
5. The SMD multi-color LED lamp bead support according to claim 4, wherein said metal bases (4) are provided in two groups, two groups of said metal bases (4) are respectively provided on two side walls of said support body (1), one group of said two groups of said metal bases (4) is a positive plate, the other group is a negative plate, and each group is provided with four said metal bases (4).
6. The SMD multi-color LED lamp bead support according to claim 5, characterized in that said light emitting chips (3) are correspondingly arranged in four, and respectively located in four said sub-areas (12).
7. The SMD multi-color LED lamp bead support of claim 6, wherein said four light emitting chips (3) emit light of at least two colors.
8. The SMD multi-color LED lamp bead support of claim 7, wherein said wire (5) is gold or copper wire.
9. The SMD multi-color LED lamp bead support according to any one of claims 5-8, characterized in that a fixing hole is provided on one side of said metal base (4) away from said light emitting chip (3), and a fixing post (13) fitted with said fixing hole is provided on said support body (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201922497541.0U CN210743943U (en) | 2019-12-31 | 2019-12-31 | SMD multicolor LED lamp bead support |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201922497541.0U CN210743943U (en) | 2019-12-31 | 2019-12-31 | SMD multicolor LED lamp bead support |
Publications (1)
Publication Number | Publication Date |
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CN210743943U true CN210743943U (en) | 2020-06-12 |
Family
ID=71011752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201922497541.0U Expired - Fee Related CN210743943U (en) | 2019-12-31 | 2019-12-31 | SMD multicolor LED lamp bead support |
Country Status (1)
Country | Link |
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CN (1) | CN210743943U (en) |
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2019
- 2019-12-31 CN CN201922497541.0U patent/CN210743943U/en not_active Expired - Fee Related
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200612 |