CN210736927U - High-performance PCB electroplating device - Google Patents
High-performance PCB electroplating device Download PDFInfo
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- CN210736927U CN210736927U CN201921241548.XU CN201921241548U CN210736927U CN 210736927 U CN210736927 U CN 210736927U CN 201921241548 U CN201921241548 U CN 201921241548U CN 210736927 U CN210736927 U CN 210736927U
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- electroplating
- electroplating bath
- copper
- cross beam
- basket
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Abstract
The utility model discloses a high-performance PCB electroplating device, which comprises an electroplating bath, a copper basket, a guide rail, a cross beam, a turbulent air pipe and an air pump; a placing frame is arranged on the side wall of the electroplating bath; the copper basket is arranged in the placement frame; the guide rail is arranged on the edge of the opening of the electroplating bath; the cross beam is used for suspending a workpiece to be electroplated and is slidably arranged on the guide rail; one end of the turbulent air pipe extends into the electroplating bath from the opening edge of the electroplating bath; the air pump is arranged on the cross beam, and the other end of the turbulent air pipe is connected with the air pump; the placing frame and the copper basket are made of metal materials and are electrically connected with the anode of the power supply after being electrically connected, and the cross beam is made of metal materials and is electrically connected with the cathode of the power supply. The three steps of disturbance are carried out synchronously, so that the uniformity of the concentration of electroplating liquid in the electroplating process is ensured, and the uniformity of the electroplated copper layer on the surface of the workpiece is correspondingly improved.
Description
Technical Field
The utility model relates to a circuit board manufacture equipment technical field, in particular to device is plated to high performance PCB board.
Background
The PCB (circuit board) is an important raw material in modern electronic industry, and the prior process of PCB production is electroplating, i.e. electroplating a copper layer on the surface of the PCB. In electroplating, the PCB is generally placed in an electroplating solution in an electroplating tank, and by using the principle of electroplating, copper balls are dissolved into copper ions at an anode, and the copper ions are reattached to the PCB connected with a cathode to form a copper layer.
However, the concentration distribution of the electroplating solution in the electroplating bath is not uniform due to local consumption in the electroplating process, so that the electroplating layer of the PCB is not uniform, and the quality of the PCB is affected.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an aim at solves one of the technical problem that exists among the prior art at least, provides a high performance PCB board electroplating device, can promote the degree of consistency of PCB board electroplating layer.
In a first aspect, the utility model provides a device is plated to high performance PCB board, include:
the side wall of the electroplating bath is provided with a placing frame;
the copper basket is arranged in the placement frame;
the guide rail is arranged on the edge of the opening of the electroplating bath;
the cross beam is used for suspending a workpiece to be electroplated and is slidably arranged on the guide rail;
one end of the turbulent air pipe extends into the electroplating bath from the opening edge of the electroplating bath;
the air pump is arranged on the cross beam, and the other end of the turbulent air pipe is connected with the air pump;
the placing frame and the copper basket are made of metal materials and are electrically connected with the anode of the power supply after being electrically connected, and the cross beam is made of metal materials and is electrically connected with the cathode of the power supply.
Has the advantages that: the utility model provides a high-performance PCB electroplating device, which comprises an electroplating bath, a copper basket, a guide rail, a cross beam, a turbulent air pipe and an air pump; a placing frame is arranged on the side wall of the electroplating bath; the copper basket is arranged in the placement frame; the guide rail is arranged on the edge of the opening of the electroplating bath; the cross beam is used for suspending a workpiece to be electroplated and is slidably arranged on the guide rail; one end of the turbulent air pipe extends into the electroplating bath from the opening edge of the electroplating bath; the air pump is arranged on the cross beam, and the other end of the turbulent air pipe is connected with the air pump; the placing frame and the copper basket are made of metal materials and are electrically connected with the anode of the power supply after being electrically connected, and the cross beam is made of metal materials and is electrically connected with the cathode of the power supply. In order to improve the uniformity of the electroplating solution in the electroplating bath and provide the uniformity of the electroplated copper layer on the surface of the workpiece to be electroplated, the concentration of the electroplating solution in the electroplating bath needs to be ensured to be uniform, so that when electroplating is performed: the cross beam slides along the guide rail so as to drive the workpiece to move in the electroplating solution, and the first-step disturbance is realized; the air pump inputs air into the electroplating solution through the turbulent flow guide pipe to realize the second-step disturbance; the vibration generated when the air pump works can be transmitted to the workpiece through the cross beam, so that the third step of disturbance is realized; through the synchronous implementation of the three steps of disturbance, the uniformity of the concentration of electroplating liquid in the electroplating process is ensured, and therefore the uniformity of the electroplated copper layer on the surface of the workpiece is correspondingly improved. And the kinetic energy of vibration generated when the air pump works is reasonably utilized, and the energy is not required to be consumed additionally to generate vibration for the cross beam, so that the energy is greatly saved.
As the further improvement of the scheme, the device further comprises an air pipe support frame arranged at the edge of the opening of the electroplating bath, an elastic clamping groove made of rubber or silica gel is arranged on the air pipe support frame, the turbulent air pipe is clamped in the elastic clamping groove, and the two side walls of the elastic clamping groove clamp the turbulent air pipe together. The elastic clamping groove is arranged, so that the turbulent air pipe is convenient to fix on the electroplating bath, and the depth of one end of the turbulent air pipe extending into the electroplating bath is convenient to adjust.
As a further improvement of the scheme, a gas one-way valve is arranged at the position of the turbulent gas pipe, which is higher than the opening of the electroplating bath. The gas check valve is arranged to only allow gas to be conveyed into the electroplating bath from the gas pump, so that the gas carrying electroplating solution is prevented from flowing back to the gas pump, the maintenance cost of the gas pump is reduced, and the service life of the gas pump is prolonged.
As a further improvement of the scheme, the placing frame is a metal rod, two ends of the metal rod are respectively fixed on two opposite side walls of the electroplating bath, and a plurality of limiting grooves are axially and equidistantly formed in the surface of the metal rod;
the copper basket comprises a hook made of metal and a basket body made of metal and electrically connected with the hook, the basket body comprises an accommodating cavity for accommodating a copper ball, and mesh holes are formed in the side wall of the basket body for enclosing the accommodating cavity;
the copper basket is hung at the position of the limiting groove of the metal rod through the hook to realize the electric connection between the copper basket and the limiting groove. Set up the fixed copper basket of couple mode and conveniently get and put, promote the efficiency that the copper ball was placed, set up along axial equidistance simultaneously on the metal pole and be used for the spacing groove of couple, further promoted the degree of consistency of copper ion in the plating solution to promote electroplating quality.
In a further improvement of the above scheme, an insulating mounting seat is arranged at the top of the cross beam, a plurality of grooves are formed in the top of the mounting seat, a plurality of protruding blocks matched with the grooves in shape and at positions are arranged at the bottom of the air pump, and the air pump is embedded into the grooves through the protruding blocks and fixed on the cross beam. The mode of matching through recess and lug is convenient for the dismouting of air pump, has promoted production efficiency.
Drawings
The present invention will be further described with reference to the accompanying drawings and examples;
fig. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a cross-sectional view of an elastic groove according to an embodiment of the present invention;
fig. 3 is a top plan view of a mounting base according to an embodiment of the present invention;
FIG. 4 is a bottom view of the air pump bottom according to the embodiment of the present invention;
in the figure, 100-electroplating bath, 110-guide rail, 200-cross beam, 210-mounting seat, 211-groove, 300-air pump, 301-lug, 310-turbulent air pipe, 320-air pipe support frame, 400-elastic clamping groove, 500-copper basket, 510-hook, 520-basket body, 521-mesh hole and 600-metal rod.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1, the utility model provides a high performance PCB electroplating apparatus, which comprises an electroplating bath 100, a copper basket 500, a guide rail 110, a beam 200, a turbulent air pipe 310 and an air pump 300; a placing frame is arranged on the side wall of the electroplating bath 100; the copper basket 500 is arranged in the placement frame; the guide rail 110 is arranged at the opening edge of the electroplating bath 100; the beam 200 is used for suspending a workpiece to be plated and is slidably disposed on the guide rail 110, and specifically, a lead screw pair or an air cylinder (not shown in the figure) may be provided to drive the beam 200 to slide along the guide rail 110; one end of turbulent gas pipe 310 extends into plating bath 100 from the opening edge of plating bath 100; the air pump 300 is arranged on the cross beam 200, the other end of the turbulent air pipe 310 is connected with the air pump 300, and specifically, the number of the turbulent air pipes 310 is multiple; the placing frame and the copper basket 500 are made of metal and electrically connected with the anode of the power supply, and the beam 200 is made of metal and electrically connected with the cathode of the power supply.
The working principle is as follows: the copper basket 500 is soaked in the electroplating solution and the copper ball is arranged in the copper basket 500, and the copper ball is electrically connected with the anode, so that copper ions of the copper ball are dissolved in the electroplating solution to become copper ions; and the part of the workpiece needing electroplating is soaked in the electroplating solution of the electric contact, one end of the workpiece is hung on the beam 200 and is electrically connected with the beam 200, the workpiece is electrically connected with the cathode of the power supply to obtain electrons, and copper ions in the solution can obtain the electrons on the surface of the workpiece and are gathered on the surface of the workpiece to form a copper layer. In the electroplating process, the generation and consumption of copper ions in the electroplating solution can cause local non-uniformity, so that the thickness of a copper layer of an electroplated workpiece is non-uniform, and the quality requirement of a high-performance PCB (printed circuit board) cannot be met. And through vortex trachea 310 to inputing the air in the plating solution, crossbeam 200 drives the work piece round trip movement in the plating solution and the kinetic energy of the vibrations that reasonable air pump 300 during operation produced and drives the work piece irregular vibrations in the plating solution along guide rail 110, through the stack of these three disturbances, guarantees that the concentration of plating solution in the electroplating process position everywhere is even to provide the guarantee for realizing the PCB board of high performance.
Referring to fig. 1 and 2, in order to fix the turbulent air tube 310 at the edge of the electroplating bath 100, in one embodiment, a high performance PCB electroplating apparatus is provided, which includes an electroplating bath 100, a copper basket 500, a guide rail 110, a cross beam 200, a turbulent air tube 310, an air pump 300, and an air tube support frame 320; a placing frame is arranged on the side wall of the electroplating bath 100; the copper basket 500 is arranged in the placement frame; the guide rail 110 is arranged at the opening edge of the electroplating bath 100; the beam 200 is used for suspending a workpiece to be plated and is slidably arranged on the guide rail 110, and specifically, a lead screw pair or an air cylinder can be arranged to drive the beam 200 to slide along the guide rail 110; one end of turbulent gas pipe 310 extends into plating bath 100 from the opening edge of plating bath 100; the air pump 300 is arranged on the cross beam 200, the other end of the turbulent air pipe 310 is connected with the air pump 300, and specifically, the number of the turbulent air pipes 310 is multiple; the gas pipe support frame 320 is arranged at the edge of the opening of the electroplating bath 100, an elastic clamping groove 400 made of rubber or silica gel is arranged on the gas pipe support frame 320, the turbulent gas pipe 310 is clamped in the elastic clamping groove 400, and two side walls of the elastic clamping groove 400 clamp the turbulent gas pipe 310 together; the placing frame and the copper basket 500 are made of metal and electrically connected with the anode of the power supply, and the beam 200 is made of metal and electrically connected with the cathode of the power supply. The elastic clamping groove 400 facilitates the fixation of the turbulent air tube 310 on the electroplating bath 100 and the adjustment of the depth of one end of the turbulent air tube 310 extending into the electroplating bath 100.
In order to prevent the plating solution from flowing back to the air-returning pump 300 through the turbulent air tube 310, in the embodiment provided below, a high-performance PCB plating apparatus is provided, which includes a plating bath 100, a copper basket 500, a guide rail 110, a cross beam 200, a turbulent air tube 310, and an air pump 300; a placing frame is arranged on the side wall of the electroplating bath 100; the copper basket 500 is arranged in the placement frame; the guide rail 110 is arranged at the opening edge of the electroplating bath 100; the beam 200 is used for suspending a workpiece to be plated and is slidably arranged on the guide rail 110, and specifically, a lead screw pair or an air cylinder can be arranged to drive the beam 200 to slide along the guide rail 110; one end of turbulent gas pipe 310 extends into plating bath 100 from the opening edge of plating bath 100; the air pump 300 is arranged on the cross beam 200, the other end of the turbulent air pipe 310 is connected with the air pump 300, and specifically, the number of the turbulent air pipes 310 is multiple; a gas check valve (not shown) is arranged at the position of the turbulent gas pipe 310 higher than the opening of the electroplating bath 100; the placing frame and the copper basket 500 are made of metal and electrically connected with the anode of the power supply, and the beam 200 is made of metal and electrically connected with the cathode of the power supply. The gas check valve is arranged to only allow gas to be delivered into the plating bath 100 from the gas pump 300, so that the gas carrying the plating solution is prevented from flowing back to the gas pump 300, the maintenance cost of the gas pump 300 is reduced, and the service life of the gas pump 300 is prolonged.
Referring to fig. 1, in order to further improve the uniformity of copper ions in the electroplating solution, the following embodiments provide a high performance PCB electroplating apparatus, including an electroplating bath 100, a copper basket 500, a guide rail 110, a cross beam 200, a turbulent air pipe 310, and an air pump 300; a placing frame is arranged on the side wall of the electroplating bath 100; the copper basket 500 is arranged in the placement frame; the guide rail 110 is arranged at the opening edge of the electroplating bath 100; the beam 200 is used for suspending a workpiece to be plated and is slidably arranged on the guide rail 110, and specifically, a lead screw pair or an air cylinder can be arranged to drive the beam 200 to slide along the guide rail 110; one end of turbulent gas pipe 310 extends into plating bath 100 from the opening edge of plating bath 100; the air pump 300 is arranged on the cross beam 200, the other end of the turbulent air pipe 310 is connected with the air pump 300, and specifically, the number of the turbulent air pipes 310 is multiple; the placing frame is a metal rod 600 with two ends respectively fixed on two opposite side walls of the electroplating bath 100, and a plurality of limiting grooves are formed in the surface of the metal rod 600 at equal intervals along the axial direction; the copper basket 500 comprises a hook 510 made of metal and a basket body 520 made of metal and electrically connected with the hook 510, the basket body 520 comprises an accommodating cavity for accommodating copper balls, and mesh holes 521 are formed in the side wall of the basket body 520 for enclosing the accommodating cavity; the copper basket 500 is hung at the position of the limiting groove of the metal rod 600 through the hook 510 to realize the electric connection of the two; the placing frame and the copper basket 500 are made of metal and electrically connected with the anode of the power supply, and the beam 200 is made of metal and electrically connected with the cathode of the power supply. Set up the fixed copper basket 500 of couple 510 modes and conveniently get and put, promote the efficiency that the copper ball was placed, set up along axial equidistance simultaneously on metal pole 600 and be used for the spacing groove of couple 510, further promoted the degree of consistency of copper ion in the plating solution to promote electroplating quality.
Referring to fig. 1, 3 and 4, in order to improve production efficiency, an embodiment is provided, which provides a high performance PCB electroplating apparatus, including an electroplating bath 100, a copper basket 500, a guide rail 110, a cross beam 200, a turbulent air pipe 310, and an air pump 300; a placing frame is arranged on the side wall of the electroplating bath 100; the copper basket 500 is arranged in the placement frame; the guide rail 110 is arranged at the opening edge of the electroplating bath 100; the beam 200 is used for suspending a workpiece to be plated and is slidably arranged on the guide rail 110, and specifically, a lead screw pair or an air cylinder can be arranged to drive the beam 200 to slide along the guide rail 110; one end of turbulent gas pipe 310 extends into plating bath 100 from the opening edge of plating bath 100; the air pump 300 is arranged on the cross beam 200, and the other end of the turbulent air pipe 310 is connected with the air pump 300; an insulating mounting seat 210 (made of plastic or insulating wood can be selected) is arranged at the top of the cross beam 200, a plurality of grooves 211 are arranged at the top of the mounting seat 210, a plurality of bumps 301, the positions of which are matched with the shapes of the grooves 211, are arranged at the bottom of the air pump 300, and the air pump 300 is embedded into the grooves 211 through the bumps 301 and is fixed on the cross beam 200; the placing frame and the copper basket 500 are made of metal and electrically connected with the anode of the power supply, and the beam 200 is made of metal and electrically connected with the cathode of the power supply. The air pump 300 can be conveniently disassembled and assembled by matching the groove 211 with the bump 301, and the production efficiency is improved.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention within the knowledge range of those skilled in the art.
Claims (5)
1. A high performance PCB board plating apparatus, comprising:
the side wall of the electroplating bath is provided with a placing frame;
the copper basket is arranged in the placement frame;
the guide rail is arranged on the edge of the opening of the electroplating bath;
the cross beam is used for suspending a workpiece to be electroplated and is slidably arranged on the guide rail;
one end of the turbulent air pipe extends into the electroplating bath from the opening edge of the electroplating bath;
the air pump is arranged on the cross beam, and the other end of the turbulent air pipe is connected with the air pump;
the placing frame and the copper basket are made of metal materials and are electrically connected with the anode of the power supply after being electrically connected, and the cross beam is made of metal materials and is electrically connected with the cathode of the power supply.
2. The high-performance PCB electroplating device according to claim 1, wherein: the gas pipe support frame is arranged at the edge of an opening of the electroplating bath, an elastic clamping groove made of rubber or silica gel is arranged on the gas pipe support frame, the turbulent gas pipe is clamped in the elastic clamping groove, and the two side walls of the elastic clamping groove clamp the turbulent gas pipe together.
3. The high-performance PCB electroplating device according to claim 1, wherein: and a gas one-way valve is arranged at the position of the turbulent gas pipe, which is higher than the opening of the electroplating bath.
4. The high-performance PCB electroplating device according to claim 1, wherein: the placing frame is a metal rod, two ends of the metal rod are respectively fixed on two opposite side walls of the electroplating bath, and a plurality of limiting grooves are axially and equidistantly formed in the surface of the metal rod;
the copper basket comprises a hook made of metal and a basket body made of metal and electrically connected with the hook, the basket body comprises an accommodating cavity for accommodating a copper ball, and mesh holes are formed in the side wall of the basket body for enclosing the accommodating cavity;
the copper basket is hung at the position of the limiting groove of the metal rod through the hook to realize the electric connection between the copper basket and the limiting groove.
5. The high-performance PCB electroplating device according to claim 1, wherein: the air pump is characterized in that an insulating mounting seat is arranged at the top of the cross beam, a plurality of grooves are formed in the top of the mounting seat, a plurality of protruding blocks matched with the grooves in shape and in position are arranged at the bottom of the air pump, and the air pump is embedded into the grooves through the protruding blocks and fixed on the cross beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921241548.XU CN210736927U (en) | 2019-08-01 | 2019-08-01 | High-performance PCB electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921241548.XU CN210736927U (en) | 2019-08-01 | 2019-08-01 | High-performance PCB electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210736927U true CN210736927U (en) | 2020-06-12 |
Family
ID=70987062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921241548.XU Active CN210736927U (en) | 2019-08-01 | 2019-08-01 | High-performance PCB electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210736927U (en) |
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2019
- 2019-08-01 CN CN201921241548.XU patent/CN210736927U/en active Active
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