CN210722516U - Ultrathin wire - Google Patents

Ultrathin wire Download PDF

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Publication number
CN210722516U
CN210722516U CN201921500008.9U CN201921500008U CN210722516U CN 210722516 U CN210722516 U CN 210722516U CN 201921500008 U CN201921500008 U CN 201921500008U CN 210722516 U CN210722516 U CN 210722516U
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CN
China
Prior art keywords
copper
clad
clad layer
glue
film
Prior art date
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Active
Application number
CN201921500008.9U
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Chinese (zh)
Inventor
王皓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong NOMI Home Intelligent Technology Co.,Ltd.
Original Assignee
Shenzhen Lixuan Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201921500008.9U priority Critical patent/CN210722516U/en
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Publication of CN210722516U publication Critical patent/CN210722516U/en
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Abstract

The utility model discloses an ultra-thin wire, which comprises a double copper-clad plate, AD glue and a PI film, wherein the double copper-clad plate comprises an upper copper-clad layer, a bottom copper-clad layer and a middle insulating layer, the upper copper-clad layer and the bottom copper-clad layer are scribed by laser, and the copper-clad layer on the same surface is divided into two sides; respectively arranging AD glue at the periphery of the double copper-clad plate, wherein the surface of the AD glue is plated with a PI film; and through points are also arranged at two ends of the lead and are used for communicating the upper copper-clad layer and the bottom copper-clad layer on the same side. The wire of the utility model adopts the double copper clad laminate as the conductive core material, then the double copper clad laminate is plated with the insulated AD glue, and the PI film is coated on the surface of the AD glue, so that the copper sheet can be ensured to be not leaked when being conductive; and because AD glue and PI film are used as insulating materials, the wire can resist high temperature, corrosion, water and moisture, and does not need to be coated with larger thickness, so that the whole thickness of the wire becomes extremely thin.

Description

Ultrathin wire
Technical Field
The utility model belongs to the technical field of the interior wire of cabinet and specifically relates to an ultra-thin wire.
Background
With the wide application of lamps, the lamp is used in many places, for example, lamps are not arranged in a cabinet in the past, and the lamps are also installed at present; however, since the lamps are installed in the cabinet, the wires are required to be connected with the lamps in the cabinet, but the conductive wires are directly laid on the cabinet plate, so that the interior of the cabinet is not attractive, and meanwhile, the exposed wires are mixed with articles to be placed, so that the wires are dragged. Therefore, the existing lamp in the cabinet is generally required to be provided with a groove on the side surface of the cabinet plate, so that the wire can be hidden in the wire groove, and the original appearance of the whole cabinet is kept; however, since the side surface of the cabinet plate is reserved with the connecting hole of the connecting piece, the side surface is grooved, so that the cabinet plate is easily damaged, and the whole plate is scrapped.
Therefore, improvements to the prior art are yet to be made.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an ultra-thin wire aims at solving current wire and arranges need the fluting on the side of cabinet board, leads to the cabinet board to damage easily and scrap to and can not realize hiding the technical problem of lamps and lanterns wire.
In order to achieve the above purpose, the technical scheme of the utility model is as follows: an ultrathin lead comprises a double copper-clad plate, AD glue and a PI film, wherein the double copper-clad plate comprises an upper copper-clad layer, a bottom copper-clad layer and a middle insulating layer, the upper copper-clad layer and the bottom copper-clad layer are scribed by laser, and the copper-clad layer on the same surface is divided into two sides; respectively arranging AD glue at the periphery of the double copper-clad plate, wherein the surface of the AD glue is plated with a PI film; and through points are also arranged at two ends of the lead and are used for communicating the upper copper-clad layer and the bottom copper-clad layer on the same side.
The ultra-thin wire, wherein, the thickness that the higher authority covers the copper layer and the bottom surface covers the copper layer is 35um respectively.
The ultrathin wire is characterized in that the thickness of the AD glue is 20-40 um.
The ultrathin wire is characterized in that the thickness of the PI film is 30-60 um.
The PI film is made of polyimide.
The ultrathin wire is characterized in that the thickness of the insulating layer is 70-80 um.
The ultrathin wire is 0.3-0.4mm in thickness and 2.5-5mm in width.
Has the advantages that: the utility model discloses a wire adopts two copper-clad plates as electrically conductive core, owing to will cover the copper layer groove with one side, so can cover the copper layer and cut apart into four copper layers with the copper layer on the top and bottom surface, and cover the copper layer and link up with the copper layer and bottom surface of covering the copper layer on the same side through the point of lining up, make the wire can switch on bigger electric current; then, plating insulated AD glue on the double copper clad laminate, and coating a PI film on the surface of the AD glue, so that the copper sheet can be ensured to be electricity-tight when conducting; and because the AD adhesive and the PI film are used as insulating materials, the copper sheet can resist high temperature, corrosion, water and moisture, and the copper sheet can be wrapped without coating with larger thickness, so that the whole thickness of the lead becomes extremely thin, and the thickness of the lead can reach 0.3-0.4 mm.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a cross-sectional view taken along a-a of fig. 1 according to the present invention.
Fig. 3 is a cross-sectional view taken along the direction B-B in fig. 1 according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention will be described in further detail below with reference to the accompanying drawings and examples.
As shown in fig. 1-3, the utility model discloses an ultra-thin wire, which comprises a double copper-clad plate 1, an AD adhesive 2 and a PI film 3, wherein the double copper-clad plate 1 comprises an upper copper-clad layer 4, a bottom copper-clad layer 5 and a middle insulating layer 6, the upper copper-clad layer 4 and the bottom copper-clad layer 5 are scribed by laser, and the copper-clad layer on the same surface is divided into two sides (the upper copper-clad layer 4 and the bottom copper-clad layer 5 respectively form a groove 9); the periphery of the double copper clad laminate 1 is respectively provided with AD adhesive 2, and the surface of the AD adhesive 2 is plated with a PI film 3; through points 7 are further arranged at two ends of the lead 8, and the upper copper-clad layer and the bottom copper-clad layer on the same side are communicated through the through points 7; the thickness of the upper copper-clad layer 4 and the bottom copper-clad layer 5 is 35 um.
The thickness of the AD glue is 20-40 um; the thickness of the AD gel is preferably 20 um.
The ultrathin wire is characterized in that the thickness of the PI film is 30-60um, and the thickness of the PI film is preferably 30 um.
In the ultrathin lead, the PI film 3 is made of polyimide.
The thickness of the ultrathin lead is 0.3-0.4mm, and the width of the ultrathin lead is 2.5-5 mm.
Preferably, the AD glue is an epoxy glue.
The utility model discloses a wire adopts two copper-clad plates as electrically conductive core, owing to will cover the copper layer groove with one side, so can cover the copper layer and cut apart into four copper layers with the copper layer on the top and bottom surface, and cover the copper layer and link up with the copper layer and bottom surface of covering the copper layer on the same side through the point of lining up, make the wire can switch on bigger electric current; then, plating insulated AD glue on the double copper clad laminate, and coating a PI film on the surface of the AD glue, so that the copper sheet can be ensured to be electricity-tight when conducting; and because the AD adhesive and the PI film are used as insulating materials, the copper sheet can resist high temperature, corrosion, water and moisture, and the copper sheet can be wrapped without coating with larger thickness, so that the whole thickness of the lead becomes extremely thin, and the thickness of the lead can reach 0.3-0.4 mm.
The above is a preferred embodiment of the present invention, and certainly not to limit the scope of the present invention, it should be noted that, for those skilled in the art, modifications or equivalent substitutions of the technical solutions of the present invention without creative efforts may not depart from the protection scope of the technical solutions of the present invention.

Claims (7)

1. An ultrathin lead is characterized by comprising a double copper-clad plate, AD glue and a PI film, wherein the double copper-clad plate comprises an upper copper-clad layer, a bottom copper-clad layer and a middle insulating layer, the upper copper-clad layer and the bottom copper-clad layer are scribed by laser, and the copper-clad layer on the same surface is divided into two sides; respectively arranging AD glue at the periphery of the double copper-clad plate, wherein the surface of the AD glue is plated with a PI film; and through points are also arranged at two ends of the lead and are used for communicating the upper copper-clad layer and the bottom copper-clad layer on the same side.
2. The ultra-thin wire of claim 1, wherein the upper copper-clad layer and the lower copper-clad layer each have a thickness of 35 um.
3. The ultra-thin wire as claimed in claim 1, wherein the thickness of the AD gel is 20-40 um.
4. The ultra-thin wire of claim 1, wherein the PI film has a thickness of 30-60 um.
5. The ultra-thin wire of claim 4, wherein the PI film is made of polyimide.
6. The ultra-thin wire of claim 1, wherein the insulating layer has a thickness of 70-80 um.
7. The ultra-thin wire as claimed in claim 1, wherein the ultra-thin wire has a thickness of 0.3-0.4mm and a width of 2.5-5 mm.
CN201921500008.9U 2019-09-10 2019-09-10 Ultrathin wire Active CN210722516U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921500008.9U CN210722516U (en) 2019-09-10 2019-09-10 Ultrathin wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921500008.9U CN210722516U (en) 2019-09-10 2019-09-10 Ultrathin wire

Publications (1)

Publication Number Publication Date
CN210722516U true CN210722516U (en) 2020-06-09

Family

ID=70931442

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921500008.9U Active CN210722516U (en) 2019-09-10 2019-09-10 Ultrathin wire

Country Status (1)

Country Link
CN (1) CN210722516U (en)

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Effective date of registration: 20211105

Address after: 528216 No. 1, Jintai Road, Danzao logistics center, Danzao Town, Nanhai District, Foshan City, Guangdong Province

Patentee after: Guangdong NOMI Home Intelligent Technology Co.,Ltd.

Address before: 518100 Room 102, No. 18, chishigang community, Longxin community, Baolong street, Longgang District, Shenzhen City, Guangdong Province

Patentee before: Shenzhen Lixuan Industry Co.,Ltd.