CN210721338U

CN210721338U - Heat dissipation mechanism for single chip microcomputer

Info

Publication number: CN210721338U
Application number: CN201922279853.4U
Authority: CN
Inventors: 秦鸿
Original assignee: Jiangsu Daxiang Intelligent Equipment Co ltd
Current assignee: Jiangsu Daxiang Intelligent Equipment Co ltd
Priority date: 2019-12-18
Filing date: 2019-12-18
Publication date: 2020-06-09
Anticipated expiration: 2029-12-18

Abstract

The utility model belongs to the technical field of the singlechip, especially be a heat dissipation mechanism for singlechip, including box seat, lid and heat abstractor, the outer wall of box seat is fixed with bellied A locating plate, and the inside edge of box seat is fixed with interior constant head tank, the inside of box seat still two bisymmetry have the spring, be fixed with splint on the spring, four groups of splint are held the PCB board; a raised B positioning plate is fixed on the outer wall of the box cover, and a heat dissipation plate is fixed in the middle of the box cover; the rotatory outside air that inhales of fan blade in the heat dissipation fan, in transmitting the air to storing up the wind box, the guide duct in storing up the wind box is used for the transmission of radiating wind, blow the singlechip on the PCB board through the guide duct with the radiating wind, the PCB board is installed in the confined space of box seat and lid junction, can evenly transmit the singlechip on the PCB board with the radiating wind, the accurate heat dissipation to the singlechip, whole radiating process does not have the loss of radiating wind, promote the radiating effect.

Description

Heat dissipation mechanism for single chip microcomputer

Technical Field

The utility model relates to a singlechip technical field especially relates to a heat dissipation mechanism for singlechip.

Background

The single chip computer is an integrated circuit chip, which is a small and perfect microcomputer system formed by integrating the functions of a central processing unit CPU with data processing capacity, a random access memory RAM, a read only memory ROM, various I/O ports, an interrupt system, a timer/counter and the like (possibly comprising a display driving circuit, a pulse width modulation circuit, an analog multiplexer, an A/D converter and other circuits) on a silicon chip by adopting a super-large scale integrated circuit technology, and is widely applied to the field of industrial control.

The technical problems in the prior art are as follows:

the singlechip is when continuously operating, can produce a large amount of heats, because the singlechip is installed on the PCB board, the radiating effect is relatively poor, easily leads to the singlechip overheated, and the hot melt takes place for the pin welding department, causes PCB board and the direct overheated damage of singlechip, influences the normal use of singlechip.

In order to solve the problem, the application provides a heat dissipation mechanism for a single chip microcomputer.

SUMMERY OF THE UTILITY MODEL

Objects of the invention

For solving the technical problem who exists among the background art, the utility model provides a heat dissipation mechanism for singlechip has quick heat dissipation and uses stable characteristics.

(II) technical scheme

In order to solve the problems, the utility model provides a heat dissipation mechanism for a single chip microcomputer, which comprises a box base, a box cover and a heat dissipation device, wherein a raised A positioning plate is fixed on the outer wall of the box base, an inner positioning groove is fixed on the inner edge of the box base, springs are symmetrically arranged in the box base in pairs, clamping plates are fixed on the springs, and a PCB is clamped between the four groups of clamping plates;

a raised B positioning plate is fixed on the outer wall of the box cover, a heat dissipation plate is fixed in the middle of the box cover, a hollow vent is formed in the heat dissipation plate, and the box base and the box cover are fixedly connected through the A positioning plate and the B positioning plate in an inserting mode to form a single chip microcomputer box;

the box comprises a box base and a box cover, wherein the box base is arranged on the box cover, the box cover is arranged on the box base, the box base is arranged on the box cover, the box base.

Preferably, the heat dissipation plate is arranged above the PCB, and the ventilation opening formed in the heat dissipation plate is parallel to the PCB.

Preferably, the outer wall of the box base is provided with raised heat dissipation fins.

Preferably, the other end of the box base is fixed with a wiring end base provided with a wiring port.

Preferably, the interior of the box base is divided into two parts of space, one part of space is provided with the air storage box, and the other part of space is provided with the PCB.

Preferably, the inside of the heat dissipation fan is provided with a fan blade connected with the micro motor, and the outer wall of the heat dissipation fan is fixed with a dustproof cover with a net structure.

The above technical scheme of the utility model has following profitable technological effect: the rotatory outside air that inhales of fan blade in the heat dissipation fan, in transmitting the air to storing up the wind box, the guide duct in storing up the wind box is used for the transmission of radiating wind, blow the singlechip on the PCB board through the guide duct with the radiating wind, the PCB board is installed in the confined space of box seat and lid junction, can evenly transmit the singlechip on the PCB board with the radiating wind, the accurate heat dissipation to the singlechip, whole radiating process does not have the loss of radiating wind, promote the radiating effect.

Drawings

FIG. 1 is a schematic view of the structure of the box base of the present invention;

FIG. 2 is a schematic view of the structure of the cover of the present invention;

fig. 3 is a rear view of the box base of the present invention;

fig. 4 is a schematic front view of the box base of the present invention;

fig. 5 is a schematic view of the structure of the heat dissipation fan of the present invention.

Reference numerals:

1. a box base; 11. an inner positioning groove; 12. a, positioning a plate; 13. a spring; 14. a splint; 15. a PCB board; 16. heat dissipation fins; 17. a terminal block; 2. a box cover; 21. b, positioning a plate; 22. a heat dissipation plate; 23. a vent; 3. a heat sink; 31. a heat dissipation fan; 311. a fan blade; 312. a dust cover; 32. an air supply pipe; 33. a wind storage box; 34. an air guide pipe.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

fig. 3 is a rear view of the box base of the present invention;

fig. 4 is a schematic front view of the box base of the present invention;

as shown in fig. 1-4, the utility model provides a heat dissipation mechanism for singlechip, including box base 1, lid 2 and heat abstractor 3, the inside of box base 1 is divided into two parts space, and partly space installation stores up wind box 33, and partly space installation PCB 15, and the outer wall of box base 1 is fixed with bellied a locating plate 12, and the inside edge of box base 1 is fixed with interior positioning groove 11, and the inside of box base 1 still two bisymmetry be provided with spring 13, is fixed with splint 14 on the spring 13, and the PCB 15 is held to the centre gripping between four group's splint 14;

a raised B positioning plate 21 is fixed on the outer wall of the box cover 2, a heat dissipation plate 22 is fixed in the middle of the box cover 2, a hollow vent 23 is formed in the heat dissipation plate 22, and the box base 1 and the box cover 2 are fixedly connected through an A positioning plate 12 and the B positioning plate 21 in an inserting mode to form a single chip microcomputer box;

the clamping of the junction of box seat 1 and lid 2 has heat abstractor 3, and heat abstractor 3 is connected with blast pipe 32 including heat dissipation fan 31, the one end that heat dissipation fan 31 runs through box seat 1 and lid 2 junction, and the other end of blast pipe 32 is connected with the storage box 33 that sets up in box seat 1 inside, is fixed with the guide duct 34 that a plurality of is close to PCB board 15 on the storage box 33.

It should be noted that: a heat dissipation plate 22 is arranged above the PCB 15, and an air vent 23 formed in the heat dissipation plate 22 is arranged in parallel with the PCB 15; the heat dissipation plate 22 is provided with a vent 23 for heat exchange between the single chip mounted on the PCB 15 and the outside air.

The utility model discloses in, heat abstractor 3 operation, the rotatory outside air of inhaling of fan leaf 311 in the heat dissipation fan 31, with air transmission to storing up in the wind box 33, the guide duct 34 that stores up in the wind box 33 is used for the transmission of heat dissipation wind, blow the singlechip to PCB board 15 through guide duct 34 with the heat dissipation wind, PCB board 15 is installed in the enclosure space of

box seat

1 and 2 junctions of lid, can evenly transmit the singlechip to PCB board 15 with the heat dissipation wind, accurate dispels the heat to the singlechip, whole radiating process does not have the loss of heat dissipation wind, promote the radiating effect.

Fig. 3 is a rear view of the box base of the present invention;

as shown in fig. 3, the outer wall of the box base 1 is provided with raised heat dissipation fins 16.

It should be noted that the heat dissipating fins 16 are of a convex structure and are used for conducting heat in the box base 1, and the contact surface between the heat dissipating fins 16 and the external space is large, so that the contact surface is improved to increase the heat dissipating effect.

Fig. 4 is a schematic front view of the box base of the present invention;

as shown in fig. 4, a terminal block 17 having a terminal port is fixed to the other end of the cassette block 1.

It should be noted that: the terminal block 17 is used for connecting the PCB 15 and performing information interaction with the external device, thereby controlling the external device through the singlechip installed on the PCB 15

As shown in fig. 5, a fan 311 connected to the micro motor is provided inside the heat dissipation fan 31, and a dust cover 312 having a mesh structure is fixed to an outer wall of the heat dissipation fan 31.

It should be noted that the micro motor drives the fan blades 311 to rotate, the air sucked into the outside blows into the air storage box 33 for collection, and the design of the dust cover 312 can isolate the impurities attached to the sucked outside air, so as to reduce the pollution of the external dust impurities to the space in the box as much as possible.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. A heat dissipation mechanism for a single chip microcomputer is characterized by comprising a box base (1), a box cover (2) and a heat dissipation device (3), wherein a raised A positioning plate (12) is fixed on the outer wall of the box base (1), an inner positioning groove (11) is fixed on the inner edge of the box base (1), springs (13) are symmetrically arranged in the box base (1) in pairs, clamping plates (14) are fixed on the springs (13), and a PCB (15) is clamped between the four groups of clamping plates (14);

a raised B positioning plate (21) is fixed on the outer wall of the box cover (2), a heat dissipation plate (22) is fixed in the middle of the box cover (2), a hollow vent (23) is formed in the heat dissipation plate (22), and the box base (1) and the box cover (2) are fixedly connected through the A positioning plate (12) and the B positioning plate (21) in an inserting mode to form a single chip box;

the box comprises a box base (1) and a box cover (2), wherein the heat dissipation device (3) is clamped at the joint of the box base (1) and the box cover (2), the heat dissipation device (3) comprises a heat dissipation fan (31), one end of the heat dissipation fan (31) penetrating through the joint of the box base (1) and the box cover (2) is connected with an air supply pipe (32), the other end of the air supply pipe (32) is connected with an air storage box (33) arranged inside the box base (1), and a plurality of air guide pipes (34) close to a PCB (15) are fixed on the air storage box (33).

2. The heat dissipation mechanism for the single chip microcomputer according to claim 1, wherein the heat dissipation plate (22) is disposed above the PCB (15), and the ventilation opening (23) formed in the heat dissipation plate (22) is disposed in parallel with the PCB (15).

3. The heat dissipation mechanism for the single chip microcomputer according to claim 1, wherein the outer wall of the box base (1) is provided with raised heat dissipation fin wings (16).

4. The heat dissipation mechanism for the single chip microcomputer according to claim 1, wherein a terminal base (17) provided with a terminal port is fixed to the other end of the box base (1).

5. The heat dissipation mechanism for the single chip microcomputer according to claim 1, wherein the inside of the box base (1) is divided into two parts, one part is provided with the air storage box (33), and the other part is provided with the PCB (15).

6. The heat dissipation mechanism for the single chip microcomputer according to claim 1, wherein a fan blade (311) connected with the micro motor is arranged inside the heat dissipation fan (31), and a dust cover (312) having a mesh structure is fixed on an outer wall of the heat dissipation fan (31).