CN214901804U - Heat dissipation heat sink that integrated circuit board was used - Google Patents

Heat dissipation heat sink that integrated circuit board was used Download PDF

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Publication number
CN214901804U
CN214901804U CN202120470739.4U CN202120470739U CN214901804U CN 214901804 U CN214901804 U CN 214901804U CN 202120470739 U CN202120470739 U CN 202120470739U CN 214901804 U CN214901804 U CN 214901804U
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CN
China
Prior art keywords
heat
conducting plate
circuit board
integrated circuit
shell
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Active
Application number
CN202120470739.4U
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Chinese (zh)
Inventor
陈伯员
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Hunan Miaoshun Industrial Co ltd
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Hunan Miaoshun Industrial Co ltd
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Priority to CN202120470739.4U priority Critical patent/CN214901804U/en
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Publication of CN214901804U publication Critical patent/CN214901804U/en
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Abstract

The utility model discloses a heat dissipation and cooling device for an integrated circuit board, which comprises a shell, wherein the bottom inside the shell is provided with a plurality of groups of bases, a plurality of groups of bases are arranged on the top of the bases, the top inside the shell is provided with a heat conducting plate A, the bottom of the heat conducting plate A is uniformly provided with a plurality of groups of heat conducting fins, the bottom of the heat conducting fins is provided with a heat conducting plate B, the top of the shell is provided with a bin body, and the top of the heat conducting plate A is provided with a plurality of groups of cooling fins; the utility model discloses a under fan, fin, heat-conducting plate A, air duct, conducting strip and heat-conducting plate B's cooperation, can be quick take away the heat on the integrated circuit board body, go in discharging the air with the heat, great improvement radiating speed, protect the integrated circuit board body, prevent that the high temperature on integrated circuit board body surface from leading to the fact the damage to the component on the integrated circuit board body.

Description

Heat dissipation heat sink that integrated circuit board was used
Technical Field
The utility model relates to an integrated circuit board technical field specifically is a heat dissipation heat sink that integrated circuit board used.
Background
The integrated circuit board is a carrier for loading the integrated circuit, and is generally applied to various electronic products, and because the electronic products can cause the integrated circuit board to generate heat after long-term operation, a cooling device is required to be used to ensure that the integrated circuit board can normally work and the electronic products can normally run;
the prior device has the following defects:
at present, the heat dissipation and cooling device for the integrated circuit board generally dissipates heat through a single fan, but can not achieve a good heat dissipation effect only by dissipating heat through the fan, and the cooling efficiency is insufficient.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation heat sink that integrated circuit board was used to propose the heat dissipation heat sink that present integrated circuit board was used in solving above-mentioned background art, dispel the heat to integrated circuit board through single fan usually, but only carry out radiating the words with the electric fan, can not play fine radiating effect, the problem that the efficiency of cooling is not enough.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation heat sink that integrated circuit board used, includes the casing, the inside bottom of casing is provided with multiunit base, multiunit the top of base is provided with the integrated circuit board body, the inside top of casing is provided with heat-conducting plate A, heat-conducting plate A's bottom evenly is provided with the multiunit conducting strip, the bottom of conducting strip is provided with heat-conducting plate B, the top of casing is provided with the storehouse body, heat-conducting plate A's top is provided with the multiunit fin, the top of fin extends to the outside of the storehouse body, one side of the internal portion in storehouse is provided with the fan, one side of the storehouse body is provided with the air duct, one side of casing is provided with ventilation net B.
Preferably, a through hole is formed in the middle of one side of the radiating fin.
Preferably, a plurality of groups of heat conducting rings are arranged on the outer side of the air guide pipe.
Preferably, the heat conducting plate B, the heat conducting fins, the heat conducting plate A and the radiating fins are all made of copper.
Preferably, one side of the bin body is provided with a ventilation net A.
Preferably, the air inlet of the air duct is connected with the top of one side of the shell.
Compared with the prior art, the beneficial effects of the utility model are that: the heat dissipation and cooling device for the finished circuit board;
under the cooperation through fan, fin, heat-conducting plate A, air duct, conducting strip and heat-conducting plate B, can be quick take away the heat on the integrated circuit board body, go in discharging the heat to the air, great improvement radiating speed, protect the integrated circuit board body, prevent that the temperature on integrated circuit board body surface is too high, cause the damage to the component on the integrated circuit board body.
Drawings
Fig. 1 is a front sectional view of the present invention;
FIG. 2 is a front view of the present invention;
fig. 3 is a side view of the present invention;
in the figure: 1. a housing; 2. an integrated circuit board body; 3. a base; 4. a ventilation net A; 5. an air duct; 6. a heat conducting plate A; 7. a heat sink; 8. a through hole; 9. a bin body; 10. a fan; 11. a heat conductive sheet; 12. a ventilation net B; 13. a heat conducting plate B.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a heat dissipation heat sink that integrated circuit board used, which comprises a housin 1, the inside bottom of casing 1 is provided with multiunit base 3, the top of multiunit base 3 is provided with integrated circuit board body 2, the inside top of casing 1 is provided with heat-conducting plate A6, heat-conducting plate A6's bottom evenly is provided with multiunit conducting strip 11, the bottom of conducting strip 11 is provided with heat-conducting plate B13, the top of casing 1 is provided with the storehouse body 9, heat-conducting plate A6's top is provided with multiunit fin 7, the top of fin 7 extends to the outside of the storehouse body 9, one side of the inside of the storehouse body 9 is provided with fan 10, one side of the storehouse body 9 is provided with air duct 5, one side of casing 1 is provided with ventilation net B12.
The fan 10 in the device is the prior art, and the composition structure and the connection mode are completely the same as those of the prior device.
Furthermore, the middle of one side of the radiating fin 7 is provided with a through hole 8, so that ventilation is facilitated.
Furthermore, a plurality of groups of heat conducting rings are arranged on the outer side of the air guide pipe 5, so that the heat radiating speed of air in the air guide pipe 5 is improved.
Furthermore, the heat conducting plate B13, the heat conducting fins 11, the heat conducting plate A6 and the radiating fins 7 are all made of copper, so that the heat conducting performance is good.
Furthermore, one side of the bin body 9 is provided with a ventilation net A4, which is convenient for discharging hot air.
Further, the air inlet of the air duct 5 is connected with the top of one side of the housing 1, so that the air duct is communicated with the housing 1.
The working principle is as follows: the device power consumption part is all supplied power by external power supply, when the circuit intercommunication, under heat-conducting plate B13 and heat-conducting strip 11's effect, can lead on heat-conducting plate A6 with the temperature on integrated circuit board body 2 surface, the temperature on heat-conducting plate A6 just can be absorbed to fin 7, heat-radiating area of heat-conducting plate A6 improves, then fin 7 can go in the quick air of taking to of these heats, when fan 10 starts, can accelerate the radiating rate of beating on the fin 7, the wind that fan 10 blew off can enter into the inside of air duct 5 through-hole 8 again, under the effect through air duct 5, can cool off wind, then blow inside casing 1, cool down integrated circuit board body 2.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Claims (6)

1. The utility model provides a heat dissipation heat sink that integrated circuit board used, includes casing (1), its characterized in that: the novel multifunctional nursing cabinet is characterized in that a plurality of groups of bases (3) are arranged at the bottom of the interior of the shell (1), a plurality of groups of bases are arranged at the top of the bases (3), a heat-conducting plate A (6) is arranged at the top of the interior of the shell (1), a plurality of groups of heat-conducting fins (11) are evenly arranged at the bottom of the heat-conducting plate A (6), a heat-conducting plate B (13) is arranged at the bottom of the heat-conducting plate B (11), a cabinet body (9) is arranged at the top of the shell (1), a plurality of groups of cooling fins (7) are arranged at the top of the heat-conducting plate A (6), the tops of the cooling fins (7) extend to the outside of the cabinet body (9), a fan (10) is arranged at one side of the interior of the cabinet body (9), an air guide pipe (5) is arranged at one side of the shell (1), and a ventilation net B (12) is arranged at one side of the shell (1).
2. The heat dissipating and cooling device of claim 1, wherein: the middle of one side of the radiating fin (7) is provided with a through hole (8).
3. The heat dissipating and cooling device of claim 1, wherein: and a plurality of groups of heat conducting rings are arranged on the outer side of the air duct (5).
4. The heat dissipating and cooling device of claim 1, wherein: the heat conducting plate B (13), the heat conducting fins (11), the heat conducting plate A (6) and the radiating fins (7) are all made of copper.
5. The heat dissipating and cooling device of claim 1, wherein: one side of the bin body (9) is provided with a ventilation net A (4).
6. The heat dissipating and cooling device of claim 1, wherein: and the air inlet of the air duct (5) is connected with the top of one side of the shell (1).
CN202120470739.4U 2021-03-04 2021-03-04 Heat dissipation heat sink that integrated circuit board was used Active CN214901804U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120470739.4U CN214901804U (en) 2021-03-04 2021-03-04 Heat dissipation heat sink that integrated circuit board was used

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120470739.4U CN214901804U (en) 2021-03-04 2021-03-04 Heat dissipation heat sink that integrated circuit board was used

Publications (1)

Publication Number Publication Date
CN214901804U true CN214901804U (en) 2021-11-26

Family

ID=78856465

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120470739.4U Active CN214901804U (en) 2021-03-04 2021-03-04 Heat dissipation heat sink that integrated circuit board was used

Country Status (1)

Country Link
CN (1) CN214901804U (en)

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