CN210694762U - SEM-D module cooling body - Google Patents

Abstract

The utility model relates to the technical field of SEM, and discloses a SEM-D module cooling mechanism, which comprises a heat dissipation plate, wherein a plurality of fins are integrally processed on the front surface of the heat dissipation plate, a liquid tank is bolted on the right side of the heat dissipation plate, a liquid pump is bolted on the top of the liquid tank, a liquid inlet of the liquid pump is communicated with the liquid tank, a liquid outlet of the liquid pump is communicated with a pipeline, two adjacent fins are both attached to the pipeline, and a heat dissipation mechanism is arranged on the right side of the liquid tank; according to the SEM-D module cooling mechanism, through the arrangement of the cooling plate, the fins, the liquid tank, the liquid pump, the pipeline and the cooling mechanism, the SEM-D module cooling mechanism can effectively achieve the effect that the SEM-D module cooling mechanism can achieve circulation flow of cooling liquid, the heat dissipation effect of the SEM-D module is improved, and the working temperature of the SEM-D module is reduced, so that the problem that the traditional SEM-D module is poor in heat dissipation efficiency and influences the use result of a user due to the fact that a cooling fan is often adopted for heat dissipation of the traditional SEM-D module can be effectively avoided.

Description

SEM-D module cooling body

Technical Field

The utility model relates to a SEM technical field specifically is a SEM-D module cooling body.

Background

The SEM is an abbreviation of Swich Enginr Module, which is a Module used in gateways such as RNC and GSN as internal exchange to complete the exchange of internal Ethernet packets, generally the Ethernet Swich scheme of L2/L3 of BroadCom is used to realize the main function, and also to realize the packet exchange of control stream and data stream, each SEM can provide 100BaseT exchange capability of 24 ports, two GE paths can be provided in the serial board of SEM, optical or electrical ports can be selected, the Module structure is SEM-D, LRM2-a120-B120-T1 socket is used to dissipate heat in cold conduction mode (normal operation can be performed when the temperature of the heat sink side is 70 ℃), the Module is powered by DC +28V (actual input 19V-32V), and the power consumption is not more than 40W; the weight of the module is not more than 1kg, the capability of loading PowerPC and FPGA programs on line through a network is supported, dynamic loading of the FPGA programs in other modules in a slave string mode is supported, the onboard FLASH supports 8 versions of PowerPC and FPGA program storage, the loaded program version CAN be selected through the LAN bus, the BIT capability is achieved, and self-checking information such as temperature, voltage and the like CAN be reported through the CAN bus and the LAN bus.

In the working process of the SEM-D module, certain heat can be generated, so that the ambient temperature of the module is higher, the working efficiency of the SEM-D module can be influenced, the service life of the SEM-D module can be shortened, even the module is burnt due to overhigh temperature, the conventional common heat dissipation mechanism usually adopts a heat dissipation fan for heat dissipation, but the heat dissipation efficiency of the heat dissipation fan is poor, the heat dissipation mechanism can be normally used only by auxiliary heat dissipation of external heat dissipation equipment in hot weather, and inconvenience is brought to the use of a user.

SUMMERY OF THE UTILITY MODEL

To the deficiency of the prior art, the utility model provides a SEM-D module cooling body possesses the circulation flow through the coolant liquid, has improved SEM-D module radiating effect, the effectual advantage that reduces SEM-D module operating temperature, has solved present SEM-D module heat dissipation and has often adopted radiator fan to dispel the heat, and radiating efficiency is poor, influences the problem that the user used.

For realize the aforesaid can increase filterable speed through applying the negative pressure, also can avoid blockking up the mesh of filtering the through-hole, the utility model provides a following technical scheme: the utility model provides a SEM-D module cooling body, includes the heating panel, the positive integrated into one piece of heating panel has a plurality of fin, the right side bolt of heating panel has the liquid case, the top bolt of liquid case has the liquid pump, the income liquid mouth and the liquid case intercommunication of liquid pump, the liquid outlet intercommunication of liquid pump has the pipeline, all laminates with the pipeline between two adjacent fins, the right side of liquid case is provided with heat dissipation mechanism, heat dissipation mechanism includes the refrigeration piece, the left side and the liquid case bonding of refrigeration piece, the top and the bottom on refrigeration piece right side all bolt and have the cooling fan.

Preferably, the fins are distributed in an equidistant arrangement mode, and the fins and the heat dissipation plate are made of copper materials.

Preferably, the cross section of the pipeline is rectangular, and the side surface and the back surface of the pipeline are respectively attached to the fins and the heat dissipation plate.

Preferably, the two sides of the top and the bottom of the heat dissipation plate are integrally provided with connecting seats, and the front of each connecting seat is provided with a strip-shaped mounting opening.

Preferably, the liquid injection port is formed in the front face of the liquid tank, the anti-overflow plug is clamped in the front face of the liquid tank through the liquid injection port, and the liquid in the liquid tank is cooling liquid.

Compared with the prior art, the utility model provides a SEM-D module cooling body possesses following beneficial effect:

1. according to the SEM-D module cooling mechanism, through the arrangement of the cooling plate, the fins, the liquid tank, the liquid pump, the pipeline and the cooling mechanism, the SEM-D module cooling mechanism effectively realizes the circulating flow of cooling liquid, the cooling effect of the SEM-D module is improved, and the working temperature of the SEM-D module is reduced, so that the problem that the traditional SEM-D module is poor in cooling efficiency and influences the use of a user due to the fact that a cooling fan is often adopted for cooling in the traditional SEM-D module can be effectively avoided;

2. this SEM-D module cooling body through the design of heat dissipation mechanism, can dispel the heat to the inside coolant liquid of liquid case, has increased the cooling effect of coolant liquid, through the design of fin, can increase heat radiating area, and the cooperation pipeline makes multiplicable radiating effect, through the design of connecting seat, can be convenient for this mechanism and the installation of SEM-D module, through the design of anti-overflow stopper, can be convenient for the user to pour into the coolant liquid into the liquid case and take out the coolant liquid, makes things convenient for the change of coolant liquid.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a left side view of the structure of the present invention;

FIG. 3 is a schematic view of the present invention from the bottom;

fig. 4 is a right-side view of the structure of the present invention.

In the figure: 1. a heat dissipation plate; 2. a fin; 3. a liquid tank; 4. a liquid pump; 5. a pipeline; 6. a heat dissipation mechanism; 61. a refrigeration plate; 62. a heat radiation fan; 7. a connecting seat; 8. and (4) preventing the overflow plug.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1, fig. 2, fig. 3 and fig. 4, a SEM-D module cooling mechanism, which includes a heat sink 1, a plurality of fins 2 are integrally formed on the front surface of the heat sink 1, a liquid tank 3 is bolted on the right side of the heat sink 1, a liquid pump 4 is bolted on the top of the liquid tank 3, a liquid inlet of the liquid pump 4 is communicated with the liquid tank 3, a liquid outlet of the liquid pump 4 is communicated with a pipeline 5, two adjacent fins 2 are both attached to the pipeline 5, a heat dissipation mechanism 6 is arranged on the right side of the liquid tank 3, the heat dissipation mechanism 6 includes a cooling fin 61, the left side of the cooling fin 61 is bonded to the liquid tank 3, and the top and the bottom of the right side of the cooling fin 61 are both bolted with a cooling fan 62.

Referring to fig. 1 and 2, the fins 2 are arranged at equal intervals, and the fins 2 and the heat dissipation plate 1 are made of copper material, so that the heat dissipation area can be increased, the heat dissipation effect can be increased by matching with the pipeline 5, and the fins 2 and the heat dissipation plate 1 are made of copper, so that the heat transfer of the SEM-D can be enhanced due to the good effect of the copper wires.

Referring to fig. 1 and 2, the cross section of the pipe 5 is rectangular, and the side and the back of the pipe 5 are respectively attached to the fin 2 and the heat dissipation plate 1, so that the pipe 5 can dissipate heat of the fin 2 and the heat dissipation plate 1 with maximum efficiency.

Referring to fig. 1, the heat sink 1 has connecting seats 7 integrally formed on both sides of the top and bottom thereof, and the connecting seats 7 have bar-shaped mounting holes formed on the front surface thereof, which facilitates the mounting of the mechanism and the SEM-D module.

Please refer to fig. 1, a liquid injection port is formed in the front surface of the liquid tank 3, the anti-overflow plug 8 is clamped on the front surface of the liquid tank 3 through the liquid injection port, and the liquid in the liquid tank 3 is the cooling liquid.

The working principle is as follows: before use, the mechanism and the SEM-D module are installed through the connecting seat 7 by using bolts, the bottom of the heat dissipation plate 1 is placed at the top of a heating position of the SEM-D module, the heat dissipation plate 1 is convenient to cool the SEM-D module in a heat dissipation manner, then the anti-overflow plug 8 is taken down, a user injects a proper amount of cooling liquid into the liquid tank 3 and then plugs the anti-overflow plug 8 back, when the SEM-D module works, the heat dissipation fan 62 and the liquid pump 4 are started to work simultaneously, when the liquid pump 4 works, the cooling liquid in the liquid tank 3 is pumped into the pipeline 5 and flows in the pipeline 5 through the cooling liquid, a part of heat of the heat dissipation plate 1 and the fins 2 is carried into the liquid tank 3 from the other end, the cooling liquid in the liquid tank 3 is cooled by the refrigerating sheet 61, the heat dissipation fan 62 discharges the heat, and the heat of the heat dissipation plate 1 and the fins 2 is taken away by the cooling liquid, therefore, the heat dissipation plate 1 and the fins 2 are used for cooling the SEM-D module, and the normal operation of the SEM-D module is guaranteed.

In conclusion, the SEM-D module cooling mechanism effectively realizes that the SEM-D module cooling mechanism can improve the heat dissipation effect of the SEM-D module and reduce the working temperature of the SEM-D module through the circulating flow of the cooling liquid by arranging the heat dissipation plate 1, the fins 2, the liquid tank 3, the liquid pump 4, the pipeline 5 and the heat dissipation mechanism 6, thereby effectively avoiding the problem that the heat dissipation of the traditional SEM-D module is often carried out by adopting a heat dissipation fan, the heat dissipation efficiency is poor, and the use of a user is influenced, the heat dissipation effect of the cooling liquid in the liquid tank 3 can be increased by designing the heat dissipation mechanism 6, the heat dissipation area can be increased by designing the fins 2, the heat dissipation effect can be increased by matching with the pipeline 5, and the installation of the mechanism and the SEM-D module can be facilitated by designing the connecting seat 7, through the design of anti-overflow stopper 8, can be convenient for the user to pour into the coolant liquid into in liquid case 3 and take the coolant liquid out, make things convenient for the change of coolant liquid.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. An SEM-D module cooling mechanism comprises a heat dissipation plate (1), and is characterized in that: the positive integrated into one piece of heating panel (1) has a plurality of fin (2), the right side bolt of heating panel (1) has liquid case (3), the top bolt of liquid case (3) has liquid pump (4), the income liquid mouth and liquid case (3) intercommunication of liquid pump (4), the liquid outlet intercommunication of liquid pump (4) has pipeline (5), all laminates with pipeline (5) between two adjacent fin (2), the right side of liquid case (3) is provided with heat dissipation mechanism (6), heat dissipation mechanism (6) are including refrigeration piece (61), the left side and the liquid case (3) of refrigeration piece (61) bond, the top and the bottom on refrigeration piece (61) right side all have bolted cooling fan (62).

2. The SEM-D module cooling mechanism of claim 1, wherein: the fins (2) are distributed in an equidistant arrangement mode, and the fins (2) and the heat dissipation plate (1) are made of copper materials.

3. The SEM-D module cooling mechanism of claim 1, wherein: the cross section of pipeline (5) is the rectangle, the side and the back of pipeline (5) respectively with fin (2) and heating panel (1) laminating.

4. The SEM-D module cooling mechanism of claim 1, wherein: the heat dissipation plate is characterized in that connecting seats (7) are integrally processed on the top and the bottom of the heat dissipation plate (1), and strip-shaped mounting openings are formed in the front faces of the connecting seats (7).

5. The SEM-D module cooling mechanism of claim 1, wherein: the front of liquid case (3) has been seted up and has been annotated the liquid mouth, the front of liquid case (3) is through annotating liquid mouth joint has anti-overflow stopper (8), the inside liquid of liquid case (3) is the coolant liquid.

Images