CN210670766U

CN210670766U - Multilayer laminated PCB board

Info

Publication number: CN210670766U
Application number: CN201921667754.7U
Authority: CN
Inventors: 曹华基; 陈晓芳
Original assignee: Wuxi Kailianwei Electronic Technology Co Ltd
Current assignee: Wuxi Kailianwei Electronic Technology Co Ltd
Priority date: 2019-10-08
Filing date: 2019-10-08
Publication date: 2020-06-02
Anticipated expiration: 2029-10-08

Abstract

The utility model discloses a multilayer coincide PCB board, including top layer base plate, bottom base plate and intermediate level base plate, bond through the PP layer between base plate and the base plate, every top layer base plate and intermediate level base plate's lower surface is provided with a plurality of reference columns, the intermediate level base plate is provided with the locating hole with reference column matched with the upper surface of bottom base plate, the outer peripheral face on the reference column is provided with the strengthening rib parallel with the axle center, thereby the strengthening rib realizes the tight fit of reference column and locating hole with locating hole lateral wall extrusion fit. Thereby strengthening rib and locating hole lateral wall extrusion fit realize the tight fit of reference column and locating hole to fix the reference column. The substrate is positioned along the positioning radial direction, and the horizontal deviation of the substrate and the separation between the plate layers are prevented.

Description

Multilayer laminated PCB board

Technical Field

The utility model relates to a printed circuit board makes technical field, concretely relates to multilayer coincide PCB board.

Background

With the increasingly complex electrical characteristics of modern electronic products and the resulting high requirements for power supply, signals, etc., the number of layers of PCB boards is increasing for beneficiaries in production technology.

However, most of the existing PCB multi-layer boards are manufactured by machine lamination, and lamination is required before lamination. The sheets can also shift during the lamination process if not positioned.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to solve multilayer printing board and appear squinting, layer and layer appearing the technical problem who breaks away from in range upon range of in-process.

In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a multilayer coincide PCB board, includes top layer base plate, bottom base plate and intermediate level base plate, bonds through the PP layer between base plate and the base plate, and every top layer base plate and intermediate level base plate's lower surface is provided with a plurality of reference columns, the upper surface of intermediate level base plate and bottom base plate is provided with the locating hole with reference column matched with, the outer peripheral face on the reference column is provided with the strengthening rib parallel with the axle center, thereby the strengthening rib realizes the tight fit of reference column and locating hole with locating hole lateral wall extrusion fit.

Furthermore, a gap of 0.5-1 mm is formed between the top of the reinforcing rib and the upper top and the end face of the positioning column.

Furthermore, the positioning hole is a counter bore, a sealing gasket is further arranged on the positioning column, the sealing gasket is located in a gap between the top of the reinforcing rib and the upper top and the end face of the positioning column, and the sealing gasket can sink into the positioning hole.

Furthermore, the lower end part of the positioning column is provided with an arc-shaped chamfer.

Furthermore, top layer base plate, bottom layer base plate and intermediate level base plate be the rectangle, the lower surface of every top layer base plate and intermediate level base plate is provided with four reference columns, is located the distance difference between two arbitrary adjacent reference columns of one deck and is greater than 5 mm.

According to the above technical scheme, the utility model has the advantages of it is following: thereby strengthening rib and locating hole lateral wall extrusion fit realize the tight fit of reference column and locating hole to fix the reference column. The substrate is positioned along the positioning radial direction, and the horizontal deviation of the substrate and the separation between the plate layers are prevented.

Drawings

Fig. 1 is an exploded view of the present invention;

fig. 2 is a cross-sectional view of two adjacent interlayer substrates in the present invention.

Detailed Description

The following description will specifically explain embodiments of the present invention with reference to the accompanying drawings.

As shown in fig. 1 and 2, the multi-layer laminated PCB of the present invention includes a top substrate 1, a bottom substrate 3 and a middle substrate 2. In this embodiment, a two-layer interlayer substrate is used. The substrate is bonded to the substrate through the PP layer, which is not described herein again.

The lower surfaces of each top layer substrate 1 and each middle layer substrate 2 are provided with a plurality of positioning columns 4, the upper surfaces of the middle layer substrates and the bottom layer substrates are provided with positioning holes 5 matched with the positioning columns, and the aligning holes correspond to the positioning columns one to one. The peripheral face on the positioning column is provided with a reinforcing rib 41 parallel to the axis, and the reinforcing rib 41 is in extrusion fit with the side wall of the positioning hole 5 so as to realize the close fit of the positioning column and the positioning hole and fix the positioning column. The substrate is positioned along the positioning radial direction, and the substrate is prevented from shifting in the horizontal direction. The reinforcing ribs are tightly matched with the side walls of the positioning holes, so that separation between the plate layers can be prevented.

And a gap of 0.5-1 mm is formed between the top of the reinforcing rib and the upper top and the end face of the positioning column. The locating hole is a counter bore, a sealing gasket 42 is further arranged on the locating column, the sealing gasket 42 is located in a gap between the top of the reinforcing rib and the upper top and the end face of the locating column, and the sealing gasket 42 can sink into the locating hole. Utilize sealed the pad to live with the counter bore seal, prevent that tiny metal powder granule from getting into the sheet layer inside through the locating hole, and utilize the counter bore can be with reference column and sealed pad all imbed the counter bore in, prevent to appear the clearance between base plate and the base plate.

The lower end part of the positioning column is provided with a circular arc chamfer so that the positioning column can enter the positioning hole conveniently. The top layer base plate, the bottom layer base plate and the middle layer base plate are all rectangular, four positioning columns are arranged on the lower surfaces of each top layer base plate and each middle layer base plate, and the distance difference between any two adjacent positioning columns on the same layer is larger than 5 mm. When the direction of the board layer is wrong, the positioning columns cannot be matched with the positioning holes of the adjacent base plates, so that the positioning columns can be quickly detected, and errors can be prevented during lamination.

Claims

1. The utility model provides a multilayer coincide PCB board, includes top layer base plate, bottom base plate and intermediate level base plate, bonds its characterized in that through the PP layer between base plate and the base plate: the lower surfaces of each top layer substrate and each middle layer substrate are provided with a plurality of positioning columns, the upper surfaces of the middle layer substrates and the bottom layer substrates are provided with positioning holes matched with the positioning columns, the outer peripheral surfaces of the positioning columns are provided with reinforcing ribs parallel to the axis, and the reinforcing ribs are in extrusion fit with the side walls of the positioning holes to realize the tight fit of the positioning columns and the positioning holes.

2. The multilayer laminated PCB panel of claim 1, wherein: and a gap of 0.5-1 mm is formed between the top of the reinforcing rib and the upper top and the end face of the positioning column.

3. The multilayer laminated PCB panel of claim 2, wherein: the locating hole is a counter bore, a sealing gasket is further arranged on the locating column, the sealing gasket is located in a gap between the top of the reinforcing rib and the upper top and the end face of the locating column, and the sealing gasket can sink into the locating hole.

4. The multilayer laminated PCB panel of claim 3, wherein: and the lower end part of the positioning column is provided with an arc-shaped chamfer.

5. The multilayer laminated PCB panel of claim 4, wherein: the top layer base plate, the bottom layer base plate and the middle layer base plate are all rectangular, four positioning columns are arranged on the lower surfaces of each top layer base plate and each middle layer base plate, and the distance difference between any two adjacent positioning columns on the same layer is larger than 5 mm.