CN114204361A - Laminated busbar - Google Patents

Laminated busbar Download PDF

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Publication number
CN114204361A
CN114204361A CN202111360303.0A CN202111360303A CN114204361A CN 114204361 A CN114204361 A CN 114204361A CN 202111360303 A CN202111360303 A CN 202111360303A CN 114204361 A CN114204361 A CN 114204361A
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CN
China
Prior art keywords
laminated busbar
substrate
conducting plate
current
groove
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111360303.0A
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Chinese (zh)
Inventor
袁平
朱城
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Individual
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Individual
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Publication date
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Priority to CN202111360303.0A priority Critical patent/CN114204361A/en
Publication of CN114204361A publication Critical patent/CN114204361A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R25/00Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H01R25/16Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members

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  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

The invention relates to the technical field of current transformation technology and alternating current drive control application, in particular to a laminated busbar. A laminated busbar comprises a substrate, a first current conducting plate and a second current conducting plate, wherein a wiring board is fixedly connected to the substrate, a first clamping block is fixedly connected to the first current conducting plate, a second clamping block is fixedly connected to the second current conducting plate, a first clamping groove is formed in the wiring board, the first clamping block and the second clamping block are arranged in the first clamping groove, through holes are formed in the substrate, the first current conducting plate and the second current conducting plate, and conducting rings are arranged in the through holes; the invention adopts machine pressing, the wedge-shaped first fixture block and the wedge-shaped second fixture block are combined into a rectangular block in the first fixture groove and fixed on the substrate, and stray inductance is reduced while stable connection is realized; according to the laminated busbar structure, the burrs on the through grooves are extruded through the convex eaves, so that the burrs enter the reserved gap between the clamping ring and the through grooves, the burrs are eliminated, and the effect of stable connection of the laminated busbar is further improved.

Description

Laminated busbar
Technical Field
The invention relates to the technical field of current transformation technology and alternating current drive control application, in particular to a laminated busbar.
Background
The laminated busbar is also called a composite busbar, is a multilayer composite structure connecting bar and can be used as an expressway of a power distribution system. The use of composite bus bars provides a modern, easily designed, quickly installed and structurally sound power distribution system, as compared to conventional, bulky, time consuming and cumbersome wiring methods.
In the prior art, 1, a plurality of layers of busbars are stacked and installed, and due to the fact that bolts needing to be fixed are too many or welding points are too many, time and labor are wasted in the assembling process, the busbars are easy to install wrongly, the processing cost is greatly improved, and the assembling quality is reduced; 2. through-hole on female arranging passes through stamping forming, can appear the burr phenomenon, clears up again the burr and increased workman's work load.
Disclosure of Invention
The invention aims to solve the problems of high cost, poor quality, and burr generation of the assembled busbar in the prior art, and provides a laminated busbar.
In order to achieve the purpose, the invention adopts the following technical scheme:
a laminated busbar comprises a substrate, a first current-conducting plate and a second current-conducting plate, wherein the substrate is arranged between the first current-conducting plate and the second current-conducting plate, the substrate, the first current-conducting plate and the second current-conducting plate are respectively composed of a mother board and insulating paper, a wiring board is fixedly connected to the substrate, a first clamping block is fixedly connected to the first current-conducting plate, a second clamping block is fixedly connected to the second current-conducting plate, and a first clamping groove is formed in the wiring board; the substrate, the first conducting plate and the second conducting plate are all provided with through holes, and conducting rings are arranged in the through holes.
Preferably, the first clamping block and the second clamping block are both arranged in the first clamping groove, and the first clamping block and the second clamping block are wedge blocks which are attached to each other.
Preferably, the substrate is provided with a through groove, the first conductive plate and the second conductive plate are fixedly connected with a clamping ring, and the clamping ring is arranged in the through groove.
Preferably, the diameter of the cross section of the snap ring is 0.1mm-0.2mm smaller than that of the through groove.
Preferably, one side of snap ring is provided with protruding eaves, the one end that protruding eaves is close to the snap ring opposite side is the inclined plane, the upper and lower both ends of snap ring are provided with No. two draw-in grooves.
Preferably, the cross-sectional structure of the conducting ring is the same as that of the clamping ring, and the diameter of the conducting ring is 0.1mm-0.2mm smaller than that of the through hole.
Preferably, the through holes are provided with a plurality of groups, and the through holes are matched with each other.
Preferably, the base plate is fixedly connected with a positioning column, the first current-conducting plate is provided with a positioning hole, the positioning column penetrates through the positioning hole, and the positioning column is provided with a threaded hole.
Compared with the prior art, the invention provides a laminated busbar which has the following beneficial effects:
1. this female arranging of stromatolite, through the current conducting plate stack of constituteing mother board and insulating paper, it fixes on the base plate to be wedge-shaped first fixture block and second fixture block at a card inslot composite rectangle piece, traditional screw and welded technology have been cancelled, when firm the connection, reduce stray inductance, and the compound mode of cooperation snap ring and logical groove, when further guaranteeing the joint firm, make the through-hole can the accurate correspondence one by one, be convenient for follow-up pressure equipment conducting ring, in this assembling process, only adopt the machine pressfitting, need not artifical too much operation, high efficiency is swift, when saving manufacturing cost, guarantee the female quality reliability who arranges of equipment.
2. The diameter of the cross section of the clamping ring is 0.1mm-0.2mm smaller than that of the cross section of the through groove, and a clearance is reserved for the burrs on the extrusion through groove; one end of the convex eaves, which is close to the other side of the clamping ring, is set to be an inclined surface, so that when burrs on the through groove are extruded, the burrs are prevented from being extruded in a direction far away from the through groove; the burr that leads to on the groove is extruded through protruding eaves, makes the burr get into the snap ring and leads to the clearance of reserving between the groove, when solving the burr, further promotes the female effect of arranging the firm connection of this stromatolite.
3. When the thickness of the laminated busbar changes, the connecting rings can be utilized to fixedly connect the plurality of clamping rings together through the second clamping grooves, and the purpose of fixing the laminated busbar with different thicknesses is further achieved.
Drawings
Fig. 1 is a schematic structural diagram of a first conductive plate of a laminated busbar according to the present invention;
fig. 2 is a schematic structural diagram of a laminated busbar substrate according to the present invention;
fig. 3 is an exploded view of a laminated busbar according to the present invention;
fig. 4 is a first combination view of a laminated busbar snap ring and a through groove according to the present invention;
fig. 5 is a second combination diagram of a laminated busbar snap ring and a through groove according to the present invention;
fig. 6 is a third combined view of the thickened laminated busbar and the snap ring and the through groove.
In the figure: 1. a first conductive plate; 11. a first clamping block; 12. positioning holes; 2. a substrate; 21. a wiring board; 211. a first card slot; 22. a positioning column; 23. a through groove; 3. a second conductive plate; 31. a second fixture block; 32. a through hole; 33. a snap ring; 331. a convex brim; 332. a second card slot; 34. a connecting ring; 4. and (6) conducting the ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1 to 6, a laminated busbar includes a substrate 2, a first conductive plate 1 and a second conductive plate 3, the substrate 2 is disposed between the first conductive plate 1 and the second conductive plate 3, the substrate 2, the first conductive plate 1 and the second conductive plate 3 are all composed of a mother board and insulating paper, and a wiring board 21 is fixedly connected to the substrate 2, wherein a first clamping block 11 is fixedly connected to the first conductive plate 1, a second clamping block 31 is fixedly connected to the second conductive plate 3, and a first clamping groove 211 is formed in the wiring board 21; the substrate 2, the first conductive plate 1 and the second conductive plate 3 are all provided with through holes 32, and the through holes 32 are internally provided with conductive rings 4.
As an embodiment of the present invention, the first fixture block 11 and the second fixture block 31 are both disposed in the first slot 211, and the first fixture block 11 and the second fixture block 31 are wedge blocks attached to each other, and the first fixture block 11 and the second fixture block 31 in the shape of a wedge are combined into a rectangular block in the first slot 211 and fixed on the substrate 2, so that a conventional screw and welding process is eliminated, and stray inductance is reduced while a primary stable connection is performed.
As a specific embodiment of the present invention, the substrate 2 is provided with the through groove 23, the first conductive plate 1 and the second conductive plate 3 are both fixedly connected with the snap ring 33, and the snap ring 33 is disposed in the through groove 23, so that the snap-fit connection is further ensured to be stable and the through holes 32 on the substrate 2, the first conductive plate 1 and the second conductive plate 3 can be accurately corresponded one to one by a combination manner of the snap ring 33 and the through groove 23, thereby facilitating the subsequent press-fitting of the conductive ring 4.
As a specific embodiment of the present invention, the diameter of the cross section of the snap ring 33 is 0.1mm to 0.2mm smaller than the diameter of the cross section of the through groove 23, so as to reserve a gap for extruding burrs on the through groove 23.
Referring to fig. 4-5, as a specific embodiment of the present invention, one side of the snap ring 33 is provided with a protruding eave 331, and one end of the protruding eave 331, which is close to the other side of the snap ring 33, is an inclined surface, so as to prevent burrs from being extruded in a direction away from the through groove 23 when burrs on the through groove 23 are extruded, so as to ensure that the burrs can enter a gap reserved between the snap ring 33 and the through groove 23, and the upper and lower ends of the snap ring 33 are provided with two clamping grooves 332, in the process of machine pressing, the protruding eave 331 on one side of the snap ring 33 is used to extrude the burrs on the through groove 23, so that the burrs enter the gap reserved between the snap ring 33 and the through groove 23, so that the burrs are clamped in the gap, and are prevented from falling off inside the host during the operation of the host, which affects the normal operation of the power system, when the burrs enter the gap reserved between the snap ring 33 and the through groove 23, the surface area of the through groove 23 is increased by the burrs, so that the contact area of the through groove 23 and the clamping ring 33 is increased, and the effect of stable connection of the laminated busbar is further improved;
referring to fig. 6, when the thickness of the laminated busbar is changed, the connecting ring 34 can be used to fixedly connect the plurality of snap rings 33 together through the second snap groove 332, so as to fix the laminated busbar with different thicknesses.
As a specific embodiment of the present invention, the cross-sectional structure of the conductive ring 4 is the same as the cross-sectional structure of the snap ring 33, so that in the press-fitting process of the machine, the burrs on the through holes 32 are squeezed, and the pressed burrs cannot fall off in the operation process of the host machine, thereby solving the problem of the burrs on the through holes 32, and further improving the effect of stable connection of the laminated busbar, and the diameter of the conductive ring 4 is 0.1mm to 0.2mm smaller than the diameter of the through holes 32.
In an embodiment of the present invention, there are multiple sets of the through holes 32, and two sets of the through holes 32 are matched with each other for connecting electronic components such as capacitors.
As an embodiment of the present invention, a positioning column 22 is fixedly connected to the substrate 2, a positioning hole 12 is formed on the first conductive plate 1, the positioning column 22 penetrates through the positioning hole 12, and a threaded hole is formed in the positioning column 22.
According to the invention, the current conducting plates consisting of a mother board and insulating paper are overlapped, the wedge-shaped first clamping block 11 and the wedge-shaped second clamping block 31 are combined into a rectangular block in the first clamping groove 211 and fixed on the substrate 2, the traditional screw and welding process is cancelled, the stray inductance is reduced while the clamping is stable, and the through holes 32 can accurately correspond one to one by matching with the combination mode of the clamping ring 33 and the through groove 23 while the clamping is further ensured to be stable, so that the subsequent press mounting of the conducting ring 4 is facilitated, only the machine press fitting is adopted in the assembling process, the manual excessive operation is not needed, the efficiency and the speed are high, and the quality reliability of the assembled busbar is ensured while the production cost is saved;
in the process of pressing the laminated busbar by a machine, the protruding eaves 331 on one side of the snap ring 33 are used for extruding the burrs on the through groove 23, so that the burrs enter a reserved gap between the snap ring 33 and the through groove 23, and when the burrs enter the reserved gap between the snap ring 33 and the through groove 23, the burrs increase the surface area of the through groove 23, so that the contact area between the through groove 23 and the snap ring 33 is increased, and the effect of stable connection of the laminated busbar is further improved while the burrs are solved;
when the thickness of the laminated busbar is changed, the connecting ring 34 can be utilized to fixedly connect the plurality of clamping rings 33 together through the second clamping groove 332, and the purpose of fixing the laminated busbar with different thicknesses is further achieved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (8)

1. A laminated busbar comprises a substrate (2), a first current-conducting plate (1) and a second current-conducting plate (3), wherein the substrate (2) is arranged between the first current-conducting plate (1) and the second current-conducting plate (3), the substrate (2), the first current-conducting plate (1) and the second current-conducting plate (3) are respectively composed of a mother board and insulating paper, and a wiring board (21) is fixedly connected onto the substrate (2), the laminated busbar is characterized in that a first clamping block (11) is fixedly connected onto the first current-conducting plate (1), a second clamping block (31) is fixedly connected onto the second current-conducting plate (3), and a first clamping groove (211) is formed in the wiring board (21); the substrate (2), the first conductive plate (1) and the second conductive plate (3) are all provided with through holes (32), and conductive rings (4) are arranged in the through holes (32).
2. The laminated busbar according to claim 1, wherein the first block (11) and the second block (31) are both disposed in the first block (211), and the first block (11) and the second block (31) are wedge-shaped blocks attached to each other.
3. The laminated busbar according to claim 1, wherein a through groove (23) is formed in the substrate (2), a clamping ring (33) is fixedly connected to each of the first conductive plate (1) and the second conductive plate (3), and the clamping ring (33) is arranged in the through groove (23).
4. A laminated busbar according to claim 3, wherein the cross-sectional diameter of the snap ring (33) is 0.1mm to 0.2mm smaller than the cross-sectional diameter of the through slot (23).
5. The laminated busbar according to claim 4, wherein a convex brim (331) is arranged on one side of the snap ring (33), one end of the convex brim (331) close to the other side of the snap ring (33) is an inclined surface, and a second clamping groove (332) is arranged at the upper end and the lower end of the snap ring (33).
6. The laminated busbar according to claim 1, wherein the conductive ring (4) has a cross-sectional structure identical to that of the snap ring (33), and the diameter of the conductive ring (4) is 0.1mm to 0.2mm smaller than that of the through hole (32).
7. A laminated busbar according to claim 6, wherein said through holes (32) are provided in a plurality of sets, and two sets of said through holes (32) are fitted to each other.
8. The laminated busbar according to claim 1, wherein a positioning column (22) is fixedly connected to the substrate (2), a positioning hole (12) is formed in the first conductive plate (1), the positioning column (22) penetrates through the positioning hole (12), and a threaded hole is formed in the positioning column (22).
CN202111360303.0A 2021-11-17 2021-11-17 Laminated busbar Pending CN114204361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111360303.0A CN114204361A (en) 2021-11-17 2021-11-17 Laminated busbar

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Application Number Priority Date Filing Date Title
CN202111360303.0A CN114204361A (en) 2021-11-17 2021-11-17 Laminated busbar

Publications (1)

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CN114204361A true CN114204361A (en) 2022-03-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024111400A1 (en) * 2022-11-21 2024-05-30 株式会社オートネットワーク技術研究所 Laminated busbar and terminal block

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB445863A (en) * 1934-10-15 1936-04-15 Cedric Addley Bourne Improvements in or relating to electrical connectors
JPH08261329A (en) * 1995-03-27 1996-10-11 Nippon Gasket Co Ltd Metal lamination gasket
JPH10252894A (en) * 1997-03-14 1998-09-22 Ishikawa Gasket Kk Metal laminated gasket
JPH11176497A (en) * 1997-12-11 1999-07-02 Sumitomo Wiring Syst Ltd Laminated circuit board
JP2000304133A (en) * 1999-04-20 2000-11-02 Ishikawa Gasket Co Ltd Metal layered gasket
CN102738378A (en) * 2011-03-29 2012-10-17 维尔尼科夫斯基·优里·菲利科瑟维奇 Thermoelectric cluster, method for operating same, device for connecting an active element in said cluster to a thermoelectric drive, generator (variants) and heat pump (variants) based thereon
US20120293967A1 (en) * 2011-05-16 2012-11-22 Infineon Technologies Ag Power Semiconductor Module and Power Semiconductor Module System
CN206422340U (en) * 2017-01-18 2017-08-18 凡己科技(苏州)有限公司 A kind of stack bus bar
CN207082639U (en) * 2017-08-30 2018-03-09 浙江赛英电力科技有限公司 The new copper post fastening structure of stack bus bar
CN109672324A (en) * 2019-01-22 2019-04-23 大禹电气科技股份有限公司 A kind of composite laminate busbar and its processing method
CN210670766U (en) * 2019-10-08 2020-06-02 无锡凯盟威电子科技有限公司 Multilayer laminated PCB board
CN212659773U (en) * 2020-06-03 2021-03-05 江苏经纬轨道交通设备有限公司 Laminated busbar and power electronic equipment
CN212751336U (en) * 2020-08-21 2021-03-19 浙江赛英电力科技有限公司 Novel female overlap joint structure of arranging of stromatolite
CN113658745A (en) * 2021-09-15 2021-11-16 张家港润盛科技材料有限公司 Conductive connection busbar structure for new energy automobile copper plate and manufacturing method

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB445863A (en) * 1934-10-15 1936-04-15 Cedric Addley Bourne Improvements in or relating to electrical connectors
JPH08261329A (en) * 1995-03-27 1996-10-11 Nippon Gasket Co Ltd Metal lamination gasket
JPH10252894A (en) * 1997-03-14 1998-09-22 Ishikawa Gasket Kk Metal laminated gasket
JPH11176497A (en) * 1997-12-11 1999-07-02 Sumitomo Wiring Syst Ltd Laminated circuit board
JP2000304133A (en) * 1999-04-20 2000-11-02 Ishikawa Gasket Co Ltd Metal layered gasket
CN102738378A (en) * 2011-03-29 2012-10-17 维尔尼科夫斯基·优里·菲利科瑟维奇 Thermoelectric cluster, method for operating same, device for connecting an active element in said cluster to a thermoelectric drive, generator (variants) and heat pump (variants) based thereon
US20120293967A1 (en) * 2011-05-16 2012-11-22 Infineon Technologies Ag Power Semiconductor Module and Power Semiconductor Module System
CN206422340U (en) * 2017-01-18 2017-08-18 凡己科技(苏州)有限公司 A kind of stack bus bar
CN207082639U (en) * 2017-08-30 2018-03-09 浙江赛英电力科技有限公司 The new copper post fastening structure of stack bus bar
CN109672324A (en) * 2019-01-22 2019-04-23 大禹电气科技股份有限公司 A kind of composite laminate busbar and its processing method
CN210670766U (en) * 2019-10-08 2020-06-02 无锡凯盟威电子科技有限公司 Multilayer laminated PCB board
CN212659773U (en) * 2020-06-03 2021-03-05 江苏经纬轨道交通设备有限公司 Laminated busbar and power electronic equipment
CN212751336U (en) * 2020-08-21 2021-03-19 浙江赛英电力科技有限公司 Novel female overlap joint structure of arranging of stromatolite
CN113658745A (en) * 2021-09-15 2021-11-16 张家港润盛科技材料有限公司 Conductive connection busbar structure for new energy automobile copper plate and manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024111400A1 (en) * 2022-11-21 2024-05-30 株式会社オートネットワーク技術研究所 Laminated busbar and terminal block

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