CN220915488U

CN220915488U - Multi-layer circuit board for power supply

Info

Publication number: CN220915488U
Application number: CN202322273336.2U
Authority: CN
Inventors: 李树平; 欧阳琴华; 吴会
Original assignee: Shenzhen China Electronics Co ltd
Current assignee: Shenzhen China Electronics Co ltd
Priority date: 2023-08-23
Filing date: 2023-08-23
Publication date: 2024-05-07
Anticipated expiration: 2033-08-23

Abstract

The utility model discloses a multi-layer circuit board for a power supply, which comprises a plurality of conductive circuit layers which are arranged up and down, wherein an insulating layer is arranged between the upper conductive circuit layer and the lower conductive circuit layer, electric connecting rings are fixed at corresponding positions of the conductive circuit layers, the upper conductive circuit layer and the lower conductive circuit layer are connected through threading through conductive columns, a threading hole is formed in the center of each electric connecting ring, a plurality of clamping plates which are circumferentially arranged are fixed at the inner side of each threading hole, when the circuit boards are assembled, the conductive circuit layers are connected through the conductive columns through the conductive connecting rings, the clamping plates arranged at the inner sides of the conductive connecting rings can be abutted against the conductive columns when the conductive columns are threaded, the conductive columns are fastened, and meanwhile, the problem that the conductive columns are loose or have poor contact is effectively solved.

Description

Multi-layer circuit board for power supply

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a multi-layer circuit board for a power supply.

Background

One type of multilayer circuit board is a multilayer wiring layer, and a dielectric layer is arranged between every two layers, so that the dielectric layer can be made thin. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface and the remaining one is incorporated into the insulating board. Electrical connections between them are typically made through plated through holes in the cross-section of the circuit board, and multilayer circuit boards meet the increased packaging density of integrated circuits and the highly focused use of interconnect lines, which are used on power supplies for their superior performance.

At present, the conductive lines of the existing multilayer circuit board are connected through the conductive columns which are inserted in the prior art, but the connection mode is easy to cause loosening or poor contact of the conductive columns, so that the normal use of the multilayer circuit board is affected.

Disclosure of utility model

In order to solve the problem that the loose or poor contact of the conductive posts easily occurs in the manner of connecting the conductive posts among the conductive circuits on the conventional multilayer circuit board, the application provides a multilayer circuit board for a power supply, which adopts the following technical scheme:

The utility model provides a multilayer circuit board for power, includes the multilayer conductive line layer of arranging from top to bottom, is provided with the insulating layer between two upper and lower adjacent conductive line layers, and the corresponding position of a plurality of conductive line layers all is fixed with and connects the electric ring, wears to draw through the conductive column between a plurality of electric rings that correspond from top to bottom and connects and connect the center of electric ring to set up and wear to draw the hole, and is located and wear to draw the inboard of hole to be fixed with a plurality of cardboard that are circumference form and all arrange.

Optionally, the positioning column vertically penetrates through the plurality of conductive circuit layers and the insulating layer to perform positioning fit, and the positioning column compresses and fixes the conductive circuit layers and the insulating layer.

Optionally, the reference column is hollow plastic tubing, and the last port edge of reference column is fixed with the retaining ring, and the lower extreme of reference column is installed and is fixed with the plug that compresses tightly fixed to conductive line layer and insulating layer.

Optionally, the lower extreme of plug is fixed with the baffle, and the outside of plug is fixed with a plurality of annular card muscle, and the draw-in groove with card muscle complex is seted up to the inboard of reference column.

Optionally, the conductive column is a copper column, a plurality of evenly arranged anti-slip grooves are formed in the outer side of the conductive column, and the anti-slip grooves are annular.

Optionally, the conductive circuit layer and the insulating layer are located at the positions where the positioning posts pass through and are provided with positioning holes, and the insulating layer is located at the positions where the conductive posts pass through and is provided with yielding holes.

Compared with the prior art, the utility model has the beneficial effects that:

When the circuit boards are assembled, the conductive circuit layers are electrically connected through the conductive posts penetrating through the plurality of electric connecting rings, and the clamping plates arranged on the inner sides of the electric connecting rings can be abutted against the conductive posts when the conductive posts are penetrated, so that the conductive posts are fastened, meanwhile, the electric connection stability is ensured, and the problem of loosening or poor contact of the conductive posts is effectively solved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a cross-sectional view of a multilayer circuit board for a power supply of the present utility model;

FIG. 2 is a schematic view of a power ring of a multi-layer circuit board for power supply according to the present utility model;

FIG. 3 is a schematic view of a positioning post of a multi-layer circuit board for power supply according to the present utility model;

Fig. 4 is a schematic diagram of a conductive pillar of a power supply multilayer circuit board according to the present utility model.

In the figure: 1. a conductive line layer; 2. an insulating layer; 3. an electric ring; 31. threading the hole; 32. a clamping plate; 4. positioning columns; 41. a retainer ring; 42. a clamping groove; 43. a plug; 44. a baffle; 45. clamping ribs; 5. a conductive post; 51. an anti-skid slot.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, based on the embodiments of the utility model, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the utility model. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model.

Referring to fig. 1 and 2, a power supply multi-layer circuit board includes a plurality of conductive circuit layers 1 arranged up and down, an insulating layer 2 is disposed between two adjacent conductive circuit layers 1, and a plurality of conductive circuit layers 1 are fixed with a plurality of conductive rings 3 at corresponding positions, the conductive rings 3 are connected through a conductive post 5 in a penetrating manner, a yielding hole is formed in the insulating layer 2 at the position where the conductive post 5 passes, a penetrating hole 31 is formed in the center of the conductive ring 3, a plurality of clamping plates 32 which are circumferentially arranged are fixed at the inner side of the penetrating hole 31, when the circuit boards are assembled, the conductive circuit layers 1 are connected through the conductive posts 5 in a penetrating manner, the clamping plates 32 which are disposed at the inner side of the conductive rings 3 can abut against the conductive post 5 when the conductive post 5 is penetrated, the conductive post 5 is fastened, and meanwhile, the problem of loose or poor contact of the conductive post 5 is effectively solved.

Referring to fig. 1 specifically, a plurality of conductive circuit layers 1 and insulating layers 2 are matched in positioning through a positioning column 4 penetrating vertically, and the positioning column 4 compresses and fixes the conductive circuit layers 1 and the insulating layers 2, so as to compress the multi-layer circuit board layer structure, the positioning column 4 penetrates the conductive circuit layers 1 and the insulating layers 2 to fix the conductive circuit layers 1 and the insulating layers 2 when assembling the conductive circuit layers 1 and the insulating layers 2, positioning holes are formed in positions where the positioning column 4 penetrates, and the conductive circuit layers 1 and the insulating layers 2 are matched in positioning through the positioning holes and the positioning column 4.

Referring to fig. 3 specifically, the positioning column 4 is a hollow plastic tube with a good insulation effect, the edge of the upper port of the positioning column 4 is fixed with a retainer ring 41, the retainer ring 41 is utilized to compress the conductive circuit layer 1 and the insulating layer 2, the lower end of the positioning column 4 is fixedly provided with a plug 43 which compresses the conductive circuit layer 1 and the insulating layer 2, the lower end of the plug 43 is fixedly provided with a baffle 44, the outer side of the plug 43 is fixedly provided with a plurality of annular clamping ribs 45, the inner side of the positioning column 4 is provided with clamping grooves 42 matched with the clamping ribs 45, the plug 43 is fixedly provided with the clamping grooves 42 in a plugging manner through the matching of the clamping ribs 45, the plug 43 compresses the conductive circuit layer 1 and the insulating layer 2 through the baffle 44, and the positioning column 4 passes through the conductive circuit layer 1 and the insulating layer 2 to be fixedly connected with the plug 43 so as to realize the compression fixing.

Referring to fig. 4 specifically, the conductive post 5 is a copper post with better conductivity, a plurality of anti-slip grooves 51 are formed on the outer side of the conductive post 5, and the anti-slip grooves 51 are annular, and the conductive post 5 is better anti-loosening after being mounted through the anti-slip grooves 51 formed on the outer surface.

Working principle: when assembling the multilayer circuit board, the positioning column 4 passes through the positioning holes on the conductive circuit layer 1 and the insulating layer 2 and is fixedly connected with the plug 43 so as to position and fix the multi-layer structure, then the conductive column 5 passes through the electric receiving ring 3 on the multi-layer structure, at the moment, the clamping plate 32 in the electric receiving ring 3 deforms under the extrusion of the conductive column 5, and after the conductive column 5 is installed, the clamping plate 32 compresses the conductive column 5 under the rebound capability of the clamping plate 32, so that the fixing is completed.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and various modifications and variations may be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A multilayer circuit board for a power supply, comprising a plurality of conductive circuit layers (1) arranged up and down, characterized in that: an insulating layer (2) is arranged between the upper adjacent conductive circuit layers (1) and the lower adjacent conductive circuit layers (1), electric connecting rings (3) are fixed at corresponding positions of the conductive circuit layers (1), the electric connecting rings (3) are connected in a penetrating way through conductive columns (5), penetrating holes (31) are formed in the centers of the electric connecting rings (3), and a plurality of clamping plates (32) which are in a circumferential shape and are arranged are fixed on the inner sides of the penetrating holes (31).

2. The multi-layer circuit board for power supply according to claim 1, wherein a plurality of the conductive circuit layers (1) and the insulating layers (2) are positioned and matched through vertically penetrating positioning columns (4), and the positioning columns (4) are used for compressing and fixing the conductive circuit layers (1) and the insulating layers (2).

3. The multi-layer circuit board for the power supply according to claim 2, wherein the positioning column (4) is a hollow plastic pipe, a retainer ring (41) is fixed at the edge of an upper port of the positioning column (4), and a plug (43) for compressing and fixing the conductive circuit layer (1) and the insulating layer (2) is inserted and fixed at the lower end of the positioning column (4).

4. A multi-layer circuit board for a power supply according to claim 3, wherein a baffle (44) is fixed at the lower end of the plug (43), a plurality of annular clamping ribs (45) are fixed at the outer side of the plug (43), and clamping grooves (42) matched with the clamping ribs (45) are formed at the inner side of the positioning column (4).

5. The multilayer circuit board for a power supply according to claim 1, wherein the conductive posts (5) are copper posts, a plurality of uniformly arranged anti-slip grooves (51) are formed on the outer sides of the conductive posts (5), and the anti-slip grooves (51) are annular.

6. The multilayer circuit board for power supply according to any one of claims 1 to 5, wherein the conductive circuit layer (1) and the insulating layer (2) are provided with positioning holes at positions where the positioning posts (4) pass through, and the insulating layer (2) is provided with yielding holes at positions where the conductive posts (5) pass through.