CN210110552U

CN210110552U - SMD super capacitor

Info

Publication number: CN210110552U
Application number: CN201921180873.XU
Authority: CN
Inventors: 王新
Original assignee: Shenzhen Huaxinke Technology Co Ltd
Current assignee: Shenzhen Huaxinke Technology Co Ltd
Priority date: 2019-07-25
Filing date: 2019-07-25
Publication date: 2020-02-21
Anticipated expiration: 2029-07-25

Abstract

The utility model relates to an electronic component field specifically is a SMD super capacitor, which comprises a mounting bas, it is provided with four group's connecting pins to encircle to place on the mount pad, and mount pad central authorities insert with one heart and be provided with two sets of connection reeds, and the mount pad upper surface veneer between two sets of connection reeds is provided with the insulating ring, it is provided with interior supporting ring to place between connection reed lower surface and the mount pad upper surface, the mount pad top has the connecting bottom plate through threaded mounting, and installs on the connecting bottom plate and be provided with outer aluminium cover, outer aluminium cover inside wall surface laminating is provided with the cushion collar, and the inside wall surface laminating of cushion collar is provided with the inner bag cover. The device passes through connecting pin high-speed joint to circuit board through the mount pad, and connecting plate passes through threaded connection to mount pad, and the device's installation does not rely on the use of external instrument, and the dismantlement process does not cause irreversible damage simultaneously, has improved erection joint's convenience.

Description

SMD super capacitor

Technical Field

The utility model relates to an electronic component technical field specifically is a SMD ultracapacitor system.

Background

The capacitor is formed by two conductors which are close to each other and a layer of non-conductive insulating medium is sandwiched between the two conductors. When a voltage is applied across the two plates of the capacitor, the capacitor stores charge. The capacitance of the capacitor is numerically equal to the ratio of the amount of charge on one conductive plate to the voltage between the two plates.

The existing capacitor is mainly characterized in that contact pins are inserted into a circuit board, the capacitor is connected with the circuit board through soldering, the connecting mode depends on soldering equipment, and meanwhile, the capacitor is detached, replaced and maintained more complexly.

Such problems could be solved if a capacitor could be invented that is easy to install, for which we provide an SMD supercapacitor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a SMD ultracapacitor system to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a SMD super capacitor, includes the mount pad, it is provided with four group's connecting pins to encircle to place on the mount pad, and the concentric arrangement of mount pad central authorities is provided with two sets of connection reeds, and the mount pad upper surface veneer between two sets of connection reeds is provided with the insulating ring, it is provided with interior supporting ring to place between connection reed lower surface and the mount pad upper surface, the mount pad top has connecting bottom plate through threaded mounting, and places on the connecting bottom plate and be provided with outer aluminium cover, outer aluminium cover inside wall surface laminating is provided with the cushion collar, and the inside wall surface laminating of cushion collar is provided with the inner bag cover, the packing is provided with insulating filling layer in the inner bag cover, and the equidistant capacitor of evenly placing in the insulating filling layer has a plurality of groups, connecting bottom plate lower surface is placed and is provided.

Preferably, the connecting rings are two groups of concentric copper rings, the positions of the connecting rings correspond to those of the inner support ring, and the capacitors are respectively connected to the two groups of connecting rings through wires.

Preferably, the connecting pin comprises a sliding column, a baffle, a compression spring and a pin head, the pin head is welded to the bottom of the sliding column, the baffle is welded to the top of the sliding column, the sliding column penetrates through the installation seat, and the compression spring is arranged between the lower surface of the baffle and the upper surface of the installation seat in a surrounding mode.

Preferably, the mounting seat upper surface is provided with a connecting sleeve, the inner diameter of the connecting sleeve is the same as the outer diameter of the connecting bottom plate, the connecting sleeve is connected with the connecting bottom plate through threads, and two groups of contacts are welded on the bottom surface of the mounting seat.

Preferably, a plurality of groups of rectangular openings are uniformly formed in the inner side of the buffer sleeve at equal intervals, and the buffer sleeve is a rubber sleeve which is installed between the outer aluminum sleeve and the inner container sleeve through gluing.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the device plays the jacking effect to insulating ring inside through interior vaulting ring, makes the connection reed can with go-between in close contact with, has improved the stability of electricity connection.

2. The device can insulate and separate two groups of connecting reeds through the insulating ring, and the short circuit problem caused by contact dislocation between the connecting ring and the connecting reeds during installation is avoided.

3. The device passes through connecting pin high-speed joint to circuit board through the mount pad, and connecting plate passes through threaded connection to mount pad, and the device's installation does not rely on the use of external instrument, and the dismantlement process does not cause irreversible damage simultaneously, has improved erection joint's convenience.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic cross-sectional view of the present invention.

In the figure: the structure comprises an installation seat 1, a connecting pin 2, a connecting reed 3, an insulating ring 4, an inner support ring 5, a connecting bottom plate 6, an outer aluminum sleeve 7, a buffer sleeve 8, an inner container sleeve 9, an insulating filling layer 10, a capacitor 11 and a connecting ring 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the technical scheme in the utility model, all other embodiments that ordinary skilled person in the art obtained under the prerequisite of not making the creative work all belong to the scope of the utility model protection.

Referring to fig. 1 to 2, the present invention provides a technical solution: the utility model provides a SMD super capacitor, includes mount pad 1, is provided with four group's connecting pin 2 around inserting on mount pad 1, and connecting pin 2 includes traveller, baffle, compression spring and round pin head, and the welding of round pin head sets up in the traveller bottom, and the baffle welding sets up at the traveller top, and the traveller runs through mount pad 1 setting, and encircles between baffle lower surface and the 1 upper surface of mount pad and be provided with compression spring.

1 central authorities of mount pad are inserted with one heart and are provided with two sets of connection reed 3, 1 upper surface veneer of mount pad between two sets of connection reed 3 is provided with insulating ring 4, it is provided with interior support ring 5 to insert between 3 lower surfaces of connection reed and the 1 upper surface of mount pad, 1 top of mount pad is installed connecting plate 6 through the screw thread, 1 upper surface of mount pad is provided with connecting sleeve, and connecting sleeve internal diameter is the same with 6 external diameters of connecting plate, through threaded connection between connecting sleeve and the connecting plate 6, 1 bottom surface welding of mount pad is provided with two sets of contacts.

The connection bottom plate 6 is provided with outer aluminum sleeve 7 in an inserting manner, the inner side wall surface of the outer aluminum sleeve 7 is provided with a buffer sleeve 8 in a fitting manner, the inner side wall surface of the buffer sleeve 8 is provided with an inner container sleeve 9 in a fitting manner, a plurality of groups of rectangular openings are uniformly formed in the inner side of the buffer sleeve 8 at equal intervals, and the buffer sleeve 8 is a rubber sleeve installed between the outer aluminum sleeve 7 and the inner container sleeve 9 through gluing.

The inner container sleeve 9 is filled with an insulating filling layer 10, a plurality of groups of capacitors 11 are uniformly inserted into the insulating filling layer 10 at equal intervals, and two groups of connecting rings 12 are inserted into the lower surface of the connecting bottom plate 6. The connecting rings 12 are two groups of concentric copper rings, the positions of the connecting rings 12 correspond to the positions of the inner support rings 5, and the capacitors 11 are respectively connected to the two groups of connecting rings 12 through wires.

The working principle is as follows: the installation seat 1 is inserted on the circuit board through the connecting pins 2, the elastic force applied to the upper surface of the installation seat 1 by the compression spring enables the contact on the lower surface of the installation seat 1 to be in close contact with the joint on the circuit board, the connecting bottom plate 6 is installed on the outer aluminum sleeve 7 through threads, the capacitor 11 is in electric connection with the circuit board through the matching contact of the connecting ring 12 and the connecting reeds 3, the inner supporting ring 5 plays a role in jacking the inner part of the insulating ring 4, the connecting reeds 3 can be in close contact with the connecting ring 12, the stability of electric connection is improved, the insulating isolation can be carried out between the two groups of connecting reeds 3 through the insulating ring 4, the short circuit problem caused by the contact dislocation between the connecting ring 12 and the connecting reeds 3 during installation is avoided, the installation seat 1 is quickly connected to the circuit board through the connecting pins 2, the connecting, the installation process of the device does not depend on the use of external tools, and the disassembly process does not cause irreversible damage, thereby improving the convenience degree of installation and connection.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An SMD supercapacitor, comprising a mounting base (1), characterized in that: four groups of connecting pins (2) are arranged on the mounting seat (1) in a surrounding and inserting manner, two groups of connecting reeds (3) are concentrically arranged in the center of the mounting seat (1) in an inserting manner, an insulating ring (4) is arranged on the upper surface of the mounting seat (1) between the two groups of connecting reeds (3) in a gluing manner, an inner supporting ring (5) is arranged between the lower surface of each connecting reed (3) and the upper surface of the mounting seat (1) in an inserting manner, a connecting bottom plate (6) is arranged at the top of the mounting seat (1) through threads, an outer aluminum sleeve (7) is arranged on the connecting bottom plate (6) in an inserting manner, a buffer sleeve (8) is arranged on the inner side wall surface of the outer aluminum sleeve (7) in an attaching manner, an inner container sleeve (9) is arranged on the inner side wall surface of the buffer sleeve (8) in an attaching manner, an insulating filling layer (10) is filled in the inner, the lower surface of the connecting bottom plate (6) is provided with two groups of connecting rings (12) in an inserting way.

2. The SMD supercapacitor according to claim 1, wherein: the connecting rings (12) are two groups of concentric copper rings, the positions of the connecting rings (12) correspond to the positions of the inner supporting rings (5), and the capacitors (11) are respectively connected to the two groups of connecting rings (12) through electric wires.

3. The SMD supercapacitor according to claim 1, wherein: the connecting pin (2) comprises a sliding column, a baffle, a compression spring and a pin head, the pin head is welded to the bottom of the sliding column, the baffle is welded to the top of the sliding column, the sliding column penetrates through the mounting seat (1) and is arranged, and the compression spring is arranged between the lower surface of the baffle and the upper surface of the mounting seat (1) in a surrounding mode.

4. The SMD supercapacitor according to claim 1, wherein: the upper surface of the mounting seat (1) is provided with a connecting sleeve, the inner diameter of the connecting sleeve is the same as the outer diameter of the connecting bottom plate (6), the connecting sleeve is connected with the connecting bottom plate (6) through threads, and two sets of contacts are welded on the bottom surface of the mounting seat (1).

5. The SMD supercapacitor according to claim 1, wherein: a plurality of groups of rectangular holes are uniformly formed in the inner side of the buffer sleeve (8) at equal intervals, and the buffer sleeve (8) is a rubber sleeve which is installed between the outer aluminum sleeve (7) and the inner container sleeve (9) through gluing.