JPH11176497A - Laminated circuit board - Google Patents

Laminated circuit board

Info

Publication number
JPH11176497A
JPH11176497A JP9341284A JP34128497A JPH11176497A JP H11176497 A JPH11176497 A JP H11176497A JP 9341284 A JP9341284 A JP 9341284A JP 34128497 A JP34128497 A JP 34128497A JP H11176497 A JPH11176497 A JP H11176497A
Authority
JP
Japan
Prior art keywords
circuit board
bus bar
bus bars
laminated circuit
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP9341284A
Other languages
Japanese (ja)
Inventor
Masayoshi Nakamura
昌芳 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP9341284A priority Critical patent/JPH11176497A/en
Publication of JPH11176497A publication Critical patent/JPH11176497A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Connection Or Junction Boxes (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a laminated circuit board for attaining compactness and high density. SOLUTION: Bus bars 14, 15 for constituting the same circuit are disposed and fixed on circuit boards 12, 13 in a laminated circuit board 11. In the bus bar 14, a connection part 18 extended through a through-hole 17 in the circuit board 12 to the bus bar 15 is folded and forded. In the bus bar 15, a connection part 19 extended to the bus bar 14 is folded and formed. By fitting in the connection part 19 to the connection part 18, the bus bars 14, 15 are pressure-welded and connected to each other.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、例えば自動車のエ
ンジンルーム等に設置される電気接続箱に使用される積
層回路基板に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated circuit board used for an electric junction box installed in, for example, an engine room of an automobile.

【0002】[0002]

【従来の技術】従来、電気接続箱における回路基板41
は、図8に示すように、絶縁板42と、該絶縁板42上
に配索されかつ異なる回路を構成する複数のバスバー4
3,44とからなる。複数のバスバー43,44は隣接
した異なる回路からのノイズの影響をなくすために、隣
接した異なる回路と一定の間隔を空けて配索されてい
る。
2. Description of the Related Art Conventionally, a circuit board 41 in an electric junction box is used.
As shown in FIG. 8, a plurality of bus bars 4 arranged on the insulating plate 42 and constituting different circuits are arranged on the insulating plate 42.
3,44. The plurality of busbars 43 and 44 are arranged at a fixed distance from adjacent different circuits in order to eliminate the influence of noise from adjacent different circuits.

【0003】[0003]

【発明が解決しようとする課題】ところが、上記従来の
回路基板においては、各バスバー43,44は1つの絶
縁板42上において複数に分離されることなく配索され
ており、しかも異なる回路のバスバー43,44との間
に一定の間隔をおいて配索しなければならない。そのた
め、配索すべき回路(バスバー)が複雑に分岐したり、
配索すべき回路(バスバー)が増加したりするほど、絶
縁板42が大面積化し、回路基板41が大型化してしま
う。
However, in the above-mentioned conventional circuit board, each bus bar 43, 44 is routed on a single insulating plate 42 without being separated into a plurality of bus bars. It must be routed with a certain distance between the wires 43 and 44. Therefore, the circuit (bus bar) to be routed is complicatedly branched,
As the number of circuits (bus bars) to be routed increases, the insulating plate 42 increases in area, and the circuit board 41 increases in size.

【0004】本発明は上記問題点を解決するためになさ
れたものであって、その目的は小型高密度化を図ること
ができる積層回路基板を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a laminated circuit board capable of achieving high density and high density.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するた
め、請求項1に記載の発明は、積層された複数の回路基
板上に、同一回路を構成する複数のバスバーを配置し、
該同一回路を構成する複数のバスバーを回路基板を貫通
して互いに接続した積層回路基板をその要旨とする。
In order to achieve the above object, according to the first aspect of the present invention, a plurality of bus bars constituting the same circuit are arranged on a plurality of stacked circuit boards.
The gist is a laminated circuit board in which a plurality of bus bars constituting the same circuit are connected to each other by penetrating the circuit board.

【0006】請求項2に記載の発明は、請求項1に記載
の積層回路基板において、接続される複数のバスバー
は、互いに他方のバスバー側に延び、かつ、互いに圧接
接続される接続部をそれぞれ備えることをその要旨とす
る。
According to a second aspect of the present invention, in the laminated circuit board according to the first aspect, the plurality of busbars connected to each other extend to the other busbar side, and each of the connection portions is press-connected to each other. The point is to prepare.

【0007】請求項3に記載の発明は、請求項2に記載
の積層回路基板において、接続される複数の接続部のう
ち、少なくともいずれか一方の接続部は他方の接続部を
挟着する一対の挟着片を備えることをその要旨とする。
According to a third aspect of the present invention, in the multilayer circuit board according to the second aspect, at least one of the plurality of connection portions to be connected is a pair of connectors sandwiching the other connection portion. The gist of the present invention is to provide a sandwiching piece.

【0008】請求項4に記載の発明は、請求項2に記載
の積層回路基板において、接続される複数の接続部のう
ち、いずれか一方の接続部は他方の接続部を挟着する一
対の挟着片であることをその要旨とする。
According to a fourth aspect of the present invention, in the laminated circuit board according to the second aspect, one of the plurality of connection portions to be connected is a pair of connection portions sandwiching the other connection portion. The gist is to be a sandwiching piece.

【0009】[0009]

【発明の実施の形態】(第1実施形態)以下、本発明
を、自動車のエンジンルーム等に設置される電気接続箱
内に収容される積層回路基板に具体化した第1実施形態
を図1〜図3に従って説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG. 1 shows a first embodiment in which the present invention is embodied in a laminated circuit board housed in an electric junction box installed in an engine room or the like of an automobile. 3 will be described with reference to FIG.

【0010】図1に示すように、積層回路基板11は、
絶縁板よりなる複数の回路基板12,13を備える。回
路基板12,13上には金属板を打ち抜き形成したバス
バー14,15,16が配置固定されている。本実施形
態において、バスバー14とバスバー15とは同一回路
を構成しているが、異なる回路基板12,13上に配置
されている。複数のバスバー15,16は異なる回路を
構成するため、バスバー15,16は一定の間隔をおい
て配索されている。
As shown in FIG. 1, the laminated circuit board 11 comprises
A plurality of circuit boards 12 and 13 made of an insulating plate are provided. On the circuit boards 12, 13, bus bars 14, 15, 16 formed by stamping a metal plate are arranged and fixed. In the present embodiment, the bus bar 14 and the bus bar 15 constitute the same circuit, but are arranged on different circuit boards 12 and 13. Since the plurality of busbars 15 and 16 constitute different circuits, the busbars 15 and 16 are arranged at regular intervals.

【0011】バスバー14の一端部にはタブ部14aが
折曲形成されている。バスバー15,16の一端部には
タブ部15a,16aが折曲形成され、その上端部は回
路基板12に形成された挿通孔を介して回路基板12上
に露出している。
A tab portion 14a is bent at one end of the bus bar 14. Tab portions 15a and 16a are bent at one ends of the bus bars 15 and 16, and upper ends thereof are exposed on the circuit board 12 through insertion holes formed in the circuit board 12.

【0012】バスバー14の一部には、回路基板12に
設けた貫通孔17を介してバスバー15側に延びる接続
部18が折曲形成されている。バスバー15の一部には
バスバー14側に延びる接続部19が折曲形成されてい
る。接続部18の先端部には他方の接続部19を圧入し
てその肉厚方向から挟着する一対の挟着片20が設けら
れている。一対の挟着片20の中間部には接続部19の
肉厚D1よりも若干幅狭の挟着部21が形成されてい
る。挟着片20の端部側には接続部19を挟着部21に
案内するためのテーパ状のガイド部22が設けられてい
る。
A connection portion 18 extending toward the bus bar 15 through a through hole 17 provided in the circuit board 12 is formed in a part of the bus bar 14 by bending. A connection portion 19 extending toward the bus bar 14 is bent at a part of the bus bar 15. A pair of sandwiching pieces 20 for press-fitting the other connecting section 19 and sandwiching the connecting section 19 from the thickness direction thereof is provided at the distal end of the connecting section 18. At a middle portion between the pair of sandwiching pieces 20, a sandwiching portion 21 slightly narrower than the thickness D1 of the connecting portion 19 is formed. A tapered guide portion 22 for guiding the connecting portion 19 to the holding portion 21 is provided on the end side of the holding piece 20.

【0013】そして、接続部18の両挟着片20間に接
続部19を圧入することにより、同一回路を構成するバ
スバー14,15は互いに圧接接続されている。次に、
本実施形態の作用および効果について説明する。
The bus bars 14 and 15 forming the same circuit are press-connected to each other by press-fitting the connection portion 19 between the two holding pieces 20 of the connection portion 18. next,
The operation and effect of the present embodiment will be described.

【0014】・本実施形態では、同一回路を構成するバ
スバーを複数のバスバー14,15に分離して複数の回
路基板12,13上にそれぞれ配置し、該複数のバスバ
ー14,15を回路基板12の貫通孔17を介して互い
に接続している。そのため、同一回路を構成するバスバ
ーが複雑化したとしても複数のバスバー14,15を小
型単純化することができ、よって回路基板12,13の
面積の増加を抑制して積層回路基板11の小型高密度化
を図ることができる。
In this embodiment, the bus bars constituting the same circuit are separated into a plurality of bus bars 14 and 15 and arranged on a plurality of circuit boards 12 and 13 respectively. Are connected to each other through a through hole 17. Therefore, even if the bus bars constituting the same circuit are complicated, the plurality of bus bars 14 and 15 can be reduced in size and simplified, thereby suppressing an increase in the area of the circuit boards 12 and 13 and reducing the size and height of the laminated circuit board 11. Density can be increased.

【0015】・本実施形態では、複数のバスバー14,
15を回路基板12,13上にそれぞれ配置し、両回路
基板12,13を積層する際に、両接続部18,19を
圧接接続することにより両バスバー14,15を接続す
ることができ、積層回路基板11を容易に構成すること
ができる。
In the present embodiment, a plurality of busbars 14,
15 are arranged on the circuit boards 12 and 13, respectively, and when the two circuit boards 12 and 13 are stacked, the connection portions 18 and 19 are press-connected to connect the bus bars 14 and 15 to each other. The circuit board 11 can be easily configured.

【0016】・本実施形態では、バスバー14の接続部
18にはバスバー15の接続部19を挟着する一対の挟
着片20を設け、挟着片20には接続部19を挟着部2
1に案内するためのテーパ状のガイド部22を設けたの
で、バスバー14,15の接続部18,19を容易に圧
接接続することができるとともに、幅狭の挟着部20に
よって両バスバー14,15を確実に接続することがで
きる。
In the present embodiment, the connecting portion 18 of the bus bar 14 is provided with a pair of holding pieces 20 for holding the connecting portion 19 of the bus bar 15, and the connecting portion 19 is provided with the connecting portion 19 on the holding portion 2.
1, the connecting portions 18 and 19 of the bus bars 14 and 15 can be easily press-contacted and connected to each other by the narrow clamping portion 20. 15 can be reliably connected.

【0017】(第2実施形態)次に、本発明を、自動車
のエンジンルーム等に設置される電気接続箱内に収容さ
れる積層回路基板に具体化した第2実施形態を図4,図
5に従って説明する。
Second Embodiment Next, a second embodiment in which the present invention is embodied in a laminated circuit board accommodated in an electric junction box installed in an engine room or the like of an automobile will be described with reference to FIGS. It will be described according to.

【0018】図4は、異なる回路基板上に配置固定さ
れ、かつ、同一回路を構成する複数のバスバー24,2
5を示す。バスバー24の一部には、バスバー25側に
延びる接続部26が折曲形成されている。
FIG. 4 shows a plurality of bus bars 24, 2 arranged and fixed on different circuit boards and constituting the same circuit.
5 is shown. A connection part 26 extending toward the bus bar 25 is formed in a part of the bus bar 24 by bending.

【0019】バスバー25の一部において、バスバー2
5の幅方向の両側には接続部としての一対の挟着片27
が折曲形成されている。両挟着片27は互いに対向する
ようにバスバー24側に延びており、両挟着片27は接
続部26を圧入して接続部26をその幅方向から挟着す
るようになっている。図5に示すように、各挟着片27
は他方の挟着片27側に凸となるように湾曲形成され、
その中間部には接続部26の幅方向の寸法D2よりも若
干幅狭の挟着部28が形成されている。両挟着片27の
端部側には接続部26を挟着部28に案内するためのテ
ーパ状のガイド部29が設けられている。
In part of the bus bar 25, the bus bar 2
5 are provided on both sides in the width direction as a pair of sandwiching pieces 27 as connecting portions.
Are bent. The two holding pieces 27 extend toward the bus bar 24 so as to face each other, and the two holding pieces 27 press-fit the connection portions 26 and hold the connection portions 26 from the width direction thereof. As shown in FIG.
Is formed to be convex toward the other holding piece 27 side,
A sandwiching portion 28 having a width slightly smaller than the width dimension D2 of the connecting portion 26 is formed at an intermediate portion thereof. A tapered guide portion 29 for guiding the connecting portion 26 to the holding portion 28 is provided on the end side of both holding pieces 27.

【0020】そして、両挟着片27間に接続部26を圧
入することにより、同一回路を構成するバスバー24,
25は互いに圧接接続され、積層回路基板が構成され
る。本実施形態は以上のように構成されているので、第
1実施形態の積層回路基板11と同様の作用および効果
を得ることができる。
Then, the connecting portion 26 is press-fitted between the sandwiching pieces 27 so that the bus bars 24,
Numerals 25 are press-connected to each other to form a laminated circuit board. Since the present embodiment is configured as described above, the same operations and effects as those of the multilayer circuit board 11 of the first embodiment can be obtained.

【0021】(第3実施形態)次に、本発明を、自動車
のエンジンルーム等に設置される電気接続箱内に収容さ
れる積層回路基板に具体化した第3実施形態を図6,図
7に従って説明する。
(Third Embodiment) Next, a third embodiment in which the present invention is embodied in a laminated circuit board accommodated in an electric junction box installed in an engine room or the like of an automobile will be described with reference to FIGS. It will be described according to.

【0022】図6は、異なる回路基板上に配置固定さ
れ、かつ、同一回路を構成する複数のバスバー31,3
2を示し、両バスバー31,32は積層回路基板を構成
する複数の回路基板(図示略)上に配置固定されてい
る。
FIG. 6 shows a plurality of bus bars 31 and 3 arranged and fixed on different circuit boards and constituting the same circuit.
2, both bus bars 31 and 32 are arranged and fixed on a plurality of circuit boards (not shown) constituting a laminated circuit board.

【0023】バスバー31の一部には、バスバー32側
に延びる接続部33が折曲形成されている。バスバー3
2の一部にはバスバー31側に延びる接続部としての一
対の挟着片34,35が折曲形成され、両挟着片34,
35は接続部33を圧入して接続部33をその肉厚方向
から挟着するようになっている。挟着片34は前記接続
部33とほぼ平行に設けられ、挟着片35は挟着片34
と交差するように設けられている。両挟着片27は接続
部26を圧入してその幅方向から挟着するようになって
いる。図7に示すように、挟着片34側において挟着片
35の中間部には接続部33の肉厚D1よりも若干幅狭
の挟着部36が形成され、挟着片35の端部側には接続
部33を挟着部36に案内するためのテーパ状のガイド
部37が設けられている。
A connection portion 33 extending toward the bus bar 32 is bent at a part of the bus bar 31. Bus bar 3
A pair of sandwiching pieces 34 and 35 as connecting portions extending toward the bus bar 31 are formed in a part of the second section 2 so as to be bent.
Reference numeral 35 is adapted to press-fit the connecting portion 33 to clamp the connecting portion 33 from its thickness direction. The holding piece 34 is provided substantially parallel to the connecting portion 33, and the holding piece 35 is
Are provided so as to intersect. The two holding pieces 27 press-fit the connection portion 26 and hold the connection portion 26 from the width direction thereof. As shown in FIG. 7, a clamping portion 36 having a width slightly smaller than the thickness D1 of the connecting portion 33 is formed at an intermediate portion of the clamping piece 35 on the clamping piece 34 side. On the side, a tapered guide portion 37 for guiding the connection portion 33 to the holding portion 36 is provided.

【0024】そして、両挟着片34,35間に接続部3
3を圧入することにより、同一回路を構成するバスバー
31,32は互いに圧接接続され、積層回路基板が構成
される。
The connecting portion 3 is provided between the sandwiching pieces 34 and 35.
By press-fitting the busbars 3, the bus bars 31 and 32 constituting the same circuit are pressed and connected to each other to form a laminated circuit board.

【0025】本実施形態は以上のように構成されている
ので、第1実施形態の積層回路基板11と同様の作用お
よび効果を得ることができる。ところで、上記実施形態
は以下のように変更してもよい。
Since the present embodiment is configured as described above, the same operations and effects as those of the laminated circuit board 11 of the first embodiment can be obtained. Incidentally, the above embodiment may be modified as follows.

【0026】・第1実施形態において、バスバー14の
接続部18の一対の挟着片20を省略し、バスバー15
の接続部19に一対の挟着片20を設けたり、バスバー
14,15の接続部18,19に各一対の挟着片20を
設けたりしてもよい。この場合にも、第1実施形態と同
様の作用および効果を得ることができる。
In the first embodiment, the pair of sandwiching pieces 20 of the connecting portion 18 of the bus bar 14 are omitted, and the bus bar 15
A pair of sandwiching pieces 20 may be provided at the connecting portion 19 of the pair, or a pair of sandwiching pieces 20 may be provided at the connecting portions 18 and 19 of the bus bars 14 and 15. Also in this case, the same operation and effect as in the first embodiment can be obtained.

【0027】・第2実施形態において、上層のバスバー
24に接続部としての一対の挟着片27を設け、下層の
バスバー25に接続部26を設けること。この場合に
も、第2実施形態と同様の作用および効果を得ることが
できる。
In the second embodiment, the upper bus bar 24 is provided with a pair of sandwiching pieces 27 as a connecting portion, and the lower bus bar 25 is provided with the connecting portion 26. In this case, the same operation and effect as in the second embodiment can be obtained.

【0028】・第3実施形態において、上層のバスバー
31に接続部としての一対の挟着片34,35を設け、
下層のバスバー32に接続部33を設けること。この場
合にも、第3実施形態と同様の作用および効果を得るこ
とができる。
In the third embodiment, the upper bus bar 31 is provided with a pair of sandwiching pieces 34 and 35 as connecting portions,
The connection portion 33 is provided on the lower bus bar 32. Also in this case, the same operation and effect as the third embodiment can be obtained.

【0029】以上、各実施形態について説明したが、各
実施形態から把握できる請求項以外の技術的思想につい
て記載する。 (イ)請求項4又は5に記載の積層回路基板において、
前記一対の挟着片は他方の接続部の寸法よりも幅狭の挟
着部と、他方の接続部を該挟着部に案内するためのガイ
ド部を備える積層回路基板。このようにすれば、複数の
バスバーの接続部同士を容易に圧接接続することができ
る。
While the embodiments have been described above, technical ideas other than the claims that can be grasped from the embodiments will be described. (A) The multilayer circuit board according to claim 4 or 5,
A laminated circuit board comprising: a pair of holding pieces each having a holding part narrower than a dimension of the other connecting part; and a guide part for guiding the other connecting part to the holding part. This makes it possible to easily press-connect the connection portions of the plurality of bus bars.

【0030】[0030]

【発明の効果】以上詳述したように、請求項1に記載の
発明によれば、積層回路基板の小型高密度化を図ること
ができる。
As described in detail above, according to the first aspect of the present invention, it is possible to reduce the size and density of the laminated circuit board.

【0031】請求項2に記載の発明によれば、複数の回
路基板を積層する際に、接続部を圧接接続することによ
り複数のバスバーを容易に接続でき、積層回路基板を容
易に構成することができる。
According to the second aspect of the present invention, when a plurality of circuit boards are stacked, a plurality of bus bars can be easily connected by press-connecting the connection portion, and the laminated circuit board can be easily formed. Can be.

【0032】請求項3又は4に記載の発明によれば、い
ずれかのバスバーに設けた挟着片によって複数のバスバ
ーを確実に接続することができる。
According to the third or fourth aspect of the present invention, a plurality of bus bars can be reliably connected by the holding pieces provided on any one of the bus bars.

【図面の簡単な説明】[Brief description of the drawings]

【図1】第1実施形態の積層回路基板を示す斜視図FIG. 1 is a perspective view showing a laminated circuit board according to a first embodiment.

【図2】同じくバスバーの接続状態を示す拡大断面図FIG. 2 is an enlarged sectional view showing a connection state of the bus bar.

【図3】同じくバスバーの接続部分を示す拡大断面図FIG. 3 is an enlarged sectional view showing a connection portion of the bus bar.

【図4】第2実施形態のバスバーを示す斜視図FIG. 4 is a perspective view showing a bus bar according to a second embodiment.

【図5】同じくバスバーの接続部分を示す拡大断面図FIG. 5 is an enlarged sectional view showing a connection portion of the bus bar.

【図6】第3実施形態のバスバーを示す斜視図FIG. 6 is a perspective view showing a bus bar according to a third embodiment.

【図7】同じくバスバーの接続部分を示す拡大断面図FIG. 7 is an enlarged sectional view showing a connection portion of the bus bar.

【図8】従来の回路基板を示す斜視図FIG. 8 is a perspective view showing a conventional circuit board.

【符号の説明】[Explanation of symbols]

12,13…回路基板、14,15,24,25,3
1,32…バスバー、18,19,26,33…接続
部、20…挟着片、27,34,35…接続部としての
挟着片。
12, 13 ... circuit board, 14, 15, 24, 25, 3
1, 32: bus bar, 18, 19, 26, 33: connecting portion, 20: holding piece, 27, 34, 35: holding piece as connection portion.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 積層された複数の回路基板上に、同一回
路を構成する複数のバスバーを配置し、該同一回路を構
成する複数のバスバーを回路基板を貫通して互いに接続
した積層回路基板。
1. A laminated circuit board in which a plurality of bus bars constituting the same circuit are arranged on a plurality of laminated circuit boards, and the plurality of bus bars constituting the same circuit are connected to each other through the circuit board.
【請求項2】 請求項1に記載の積層回路基板におい
て、 前記接続される複数のバスバーは、互いに他方のバスバ
ー側に延び、かつ、互いに圧接接続される接続部をそれ
ぞれ備える積層回路基板。
2. The multilayer circuit board according to claim 1, wherein the plurality of bus bars connected to each other extend to the other bus bar side, and each has a connection portion that is press-connected to each other.
【請求項3】 請求項2に記載の積層回路基板におい
て、 前記接続される複数の接続部のうち、少なくともいずれ
か一方の接続部は他方の接続部を挟着する一対の挟着片
を備える積層回路基板。
3. The laminated circuit board according to claim 2, wherein at least one of the plurality of connected portions has a pair of holding pieces for holding the other connecting portion. Laminated circuit board.
【請求項4】 請求項2に記載の積層回路基板におい
て、 前記接続される複数の接続部のうち、いずれか一方の接
続部は他方の接続部を挟着する一対の挟着片である積層
回路基板。
4. The laminated circuit board according to claim 2, wherein one of the plurality of connected portions is a pair of holding pieces for holding the other connecting portion. Circuit board.
JP9341284A 1997-12-11 1997-12-11 Laminated circuit board Abandoned JPH11176497A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9341284A JPH11176497A (en) 1997-12-11 1997-12-11 Laminated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9341284A JPH11176497A (en) 1997-12-11 1997-12-11 Laminated circuit board

Publications (1)

Publication Number Publication Date
JPH11176497A true JPH11176497A (en) 1999-07-02

Family

ID=18344870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9341284A Abandoned JPH11176497A (en) 1997-12-11 1997-12-11 Laminated circuit board

Country Status (1)

Country Link
JP (1) JPH11176497A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009181709A (en) * 2008-01-29 2009-08-13 Denso Corp Electric bus bar connection device
WO2013178212A3 (en) * 2012-05-30 2014-10-23 Kiekert Aktiengesellschaft Motor vehicle component support and method for the production thereof
JP2021040034A (en) * 2019-09-03 2021-03-11 ファナック株式会社 Motor drive device in which electric power flows in and out of power element via bus bar
CN114204361A (en) * 2021-11-17 2022-03-18 袁平 Laminated busbar
CN116347768A (en) * 2023-03-29 2023-06-27 浙江振有电子股份有限公司 PCB multilayer plate drilling communication method and equipment

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009181709A (en) * 2008-01-29 2009-08-13 Denso Corp Electric bus bar connection device
WO2013178212A3 (en) * 2012-05-30 2014-10-23 Kiekert Aktiengesellschaft Motor vehicle component support and method for the production thereof
US9849848B2 (en) 2012-05-30 2017-12-26 Kiekert Aktiengesellschaft Motor vehicle component support and method for the production thereof
JP2021040034A (en) * 2019-09-03 2021-03-11 ファナック株式会社 Motor drive device in which electric power flows in and out of power element via bus bar
CN114204361A (en) * 2021-11-17 2022-03-18 袁平 Laminated busbar
CN116347768A (en) * 2023-03-29 2023-06-27 浙江振有电子股份有限公司 PCB multilayer plate drilling communication method and equipment
CN116347768B (en) * 2023-03-29 2023-08-11 浙江振有电子股份有限公司 PCB multilayer plate drilling communication method and equipment

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Legal Events

Date Code Title Description
A762 Written abandonment of application

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Effective date: 20050415