CN212751336U

CN212751336U - Novel female overlap joint structure of arranging of stromatolite

Info

Publication number: CN212751336U
Application number: CN202021772503.8U
Authority: CN
Inventors: 胡顺鹏; 王亮军; 许丹; 袁志豪
Original assignee: Zhejiang Sine Power Technology Co ltd
Current assignee: Zhejiang Sine Power Technology Co ltd
Priority date: 2020-08-21
Filing date: 2020-08-21
Publication date: 2021-03-19
Anticipated expiration: 2030-08-21

Abstract

The utility model provides a novel female overlap joint structure of arranging of stromatolite, its includes the female structure of arranging that a range upon range of forms, at least three is followed female range upon range of direction of arranging structure in proper order and is run through female connecting hole of arranging the structure, a setting is in benchmark overlap joint structure in the connecting hole, and a setting is in outer overlap joint structure in the connecting hole. The bus bar structure comprises a reference conductive plate, at least two outer conductive plates and insulating films, wherein the reference conductive plate is stacked in the middle of the bus bar structure, the outer conductive plates are stacked on two sides of the reference conductive plate respectively, and the insulating films are arranged on two sides of the reference conductive plate and two sides of the outer conductive plates respectively. This female overlap joint structure of female arranging of stromatolite replaces original overlap joint steel column structure and has reduced the material specification through tensile arc convex part, and the female overlap joint installation of arranging of being convenient for further improves production efficiency, avoids the part to expose in female arranging the structure outside and has unified the specification of installation fastener through built-in overlap joint structure.

Description

Novel female overlap joint structure of arranging of stromatolite

Technical Field

The utility model belongs to the technical field of female the arranging, especially a novel female overlap joint structure of arranging of stromatolite.

Background

In the laminated busbar industry, the traditional lapping mode of the multilayer laminated busbar and the capacitor is copper column lapping, and the interference between the laminated busbar and the capacitor in lapping is generally avoided by riveting the copper column.

However, the copper column lapping capacitor adopted by the laminated busbar has the following problems: the copper column type is more, and a plurality of copper column types are easily used with fastening bolt length when the assembly, have increased the installation work load of production and have reduced production efficiency.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a female overlap joint structure of arranging of stromatolite to solve above-mentioned problem.

The utility model provides a novel female overlap joint structure of arranging of stromatolite, its includes the female structure of arranging that a range upon range of forms, at least three is followed female range upon range of direction of arranging structure in proper order and is run through female connecting hole of arranging the structure, a setting is in benchmark overlap joint structure in the connecting hole, and a setting is in outer overlap joint structure in the connecting hole. The bus bar structure comprises a reference conductive plate, at least two outer conductive plates and insulating films, wherein the reference conductive plate is stacked in the middle of the bus bar structure, the outer conductive plates are stacked on two sides of the reference conductive plate respectively, and the insulating films are arranged on two sides of the reference conductive plate and two sides of the outer conductive plates respectively. Benchmark overlap joint structure includes that one sets up on the benchmark current conducting plate and at the benchmark faying surface that corresponds the radial inward extension of connecting hole, outer overlap joint structure includes that at least two set up respectively in corresponding the connecting hole and along the annular inner wall of outer current conducting plate respectively towards the radial inward extension's of benchmark current conducting plate one side arc convex part, a groove of stepping down that forms between arc convex part and connecting hole inner wall, and one sets up the outer faying surface at arc convex part middle part.

Further, the reference faying surface is flush with the outer faying surface.

Furthermore, the middle part of the reference overlapping surface and the middle part of the outer layer overlapping surface are both provided with an overlapping hole.

Further, the laminated number of the busbar structures is an odd number, the reference conductive plate is arranged in the middle of the busbar structures, and the outer conductive plates are arranged on the outer layers of the two sides of the reference conductive plate.

Further, the laminated number of the busbar structure is an even number, the reference conductive plate is arranged on any one of the two layers of the middlemost of the busbar structure, and the outer conductive plates are arranged on the outer layers of the two sides of the reference conductive plate.

Further, the thickness of the busbar structure is in direct proportion to the inner diameter of the connecting hole.

Further, the peripheral edge of the insulating film protrudes from the peripheral edge of the busbar structure.

Compared with the prior art, the utility model provides a pair of female overlap joint structure of novel stromatolite arrange replaces original overlap joint steel column structure and has reduced the material specification through tensile arc convex part, and the female overlap joint installation of arranging of being convenient for further improves production efficiency, avoids the part to expose and has unified the specification of installation fastener in female arranging the structure outside through built-in overlap joint structure.

Drawings

Fig. 1 is a schematic structural view of a novel laminated busbar overlapping structure provided by the present invention.

Fig. 2 is a schematic top view of the novel laminated busbar overlapping structure shown in fig. 1.

Fig. 3 is a schematic cross-sectional view of the novel laminated busbar overlapping structure shown in fig. 1.

Detailed Description

Specific examples of the present invention will be described in further detail below. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.

Please refer to fig. 1 to fig. 3, which are schematic structural diagrams of a novel laminated busbar overlapping structure according to the present invention. The utility model provides a novel female overlap joint structure of arranging of stromatolite, its includes that a range upon range of female row structure 10 that forms stacks up, at least three is followed female row structure 10 range upon range of direction in proper order and is run through female connecting hole 20 of arranging structure 10, a setting is in benchmark overlap joint structure 30 in the connecting hole 20, and a setting is in outer overlap joint structure 40 in the connecting hole 20. It is understood that the laminated busbar overlapping structure of the present invention also includes other functional modules and specific structures, such as electrical connection components, mounting structures, etc., which are well known to those skilled in the art, and therefore, they will not be described in detail herein.

The busbar structure 10 includes a reference conductive plate 11 stacked in the middle of the busbar structure 10, at least two outer conductive plates 12 stacked on both sides of the reference conductive plate 11, and insulating films 13 respectively disposed on both sides of the reference conductive plate 11 and both sides of the outer conductive plates 12. Female structure 10 of arranging is formed by a plurality of current conducting plate range upon range of, and when female structure 10 current conducting plate range upon range of quantity lies in five layers and is the odd number layer, benchmark current conducting plate 11 sets up female structure 10's the midmost, outer current conducting plate 12 sets up the both sides of benchmark current conducting plate 11 are outer. When the laminated number of the busbar structure 10 conductive plates is within five layers and is an even number of layers, the reference conductive plate 11 is arranged on any one of the two layers at the middle of the busbar structure 10, and the outer conductive plates 12 are arranged on the outer layers on the two sides of the reference conductive plate 11. The structure enables the busbar structure 10 to keep bilateral symmetry, and can realize bidirectional lapping and diversified lapping modes of the busbar structure 10. When the laminated number of the conducting plates of the busbar structure 10 is greater than five layers, any one layer of conducting plate except the outermost conducting plate 12 on the two sides of the busbar can be selected as the reference conducting plate 11, the external lapping structure is prevented from being inserted into the connecting hole 20 too deeply, lapping is convenient, and the length of the lapping structure is saved.

Insulating films 13 are respectively covered on the two side surfaces of the reference conductive plate 11 and the surface of the outer layer conductive plate 12 through hot pressing, and the circumferential edge of the insulating films 13 protrudes out of the circumferential edge of the busbar structure 10, so that the insulativity between the conductive plates is further improved.

Benchmark overlap joint structure 30 is in including a setting benchmark overlap joint face 31 that just radially inwards extends at corresponding connecting hole 20 on the benchmark current conducting plate 11, benchmark overlap joint face 31 with 11 formula structures as an organic whole of benchmark current conducting plate the middle part of benchmark overlap joint face 31 is equipped with a overlap joint hole 50, realizes the location to the overlap joint structure, avoids female external part of 10 overlap joints of arranging the structure to form the short circuit.

Outer overlap joint structure 40 includes that at least two set up respectively in corresponding connecting hole 20 and along the annular inner wall of outer current conducting plate 12 respectively towards the radial inward arc convex part 41 that extends in benchmark current conducting plate 11 one side, a groove 42 of stepping down that forms between arc convex part 41 and connecting hole 20 inner wall, one sets up the outer faying face 43 at arc convex part 41 middle part, and one sets up the bridging hole 50 at outer faying face 43 middle part. The receding groove 42 is formed, namely, a gap exists between the arc-shaped convex part 41 and the inner wall of the connecting hole 20, the reference lapping surface 31 is flush with the outer layer lapping surface 43, the original lapping steel column structure is replaced by stretching the arc-shaped convex part 41, the material specification is reduced, the production efficiency is improved, and the built-in lapping structure prevents components from being exposed outside the busbar structure 10 and unifies the specification of mounting fasteners.

The thickness of the busbar structure 10 is proportional to the inner diameter of the connection hole 20, and it is conceivable that the thickness of the busbar structure 10 is related to the thickness and the number of stacked conductive plates, respectively, and when the thickness of the conductive plate is large or the number of stacked conductive plates is large, in order to secure the width of the outer layer overlapping surface 43 and prevent the arc-shaped protrusion 41 from contacting the inner wall of the connection hole 20,

the above description is only for the preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention, and any modification, equivalent replacement or improvement within the spirit of the present invention is encompassed by the claims of the present invention.

Claims

1. The utility model provides a female overlap joint structure that arranges of stromatolite which characterized in that: the novel laminated busbar lapping structure comprises a laminated busbar structure, at least three connecting holes which sequentially penetrate through the busbar structure along the laminating direction of the busbar structure, a reference lapping structure arranged in the connecting holes, and an outer lapping structure arranged in the connecting holes, wherein the busbar structure comprises a reference conductive plate laminated in the middle of the busbar structure, at least two outer conductive plates which are respectively laminated on two sides of the reference conductive plate, and insulating films which are respectively arranged on two sides of the reference conductive plate and two sides of the outer conductive plate, the reference lapping structure comprises a reference lapping surface which is arranged on the reference conductive plate and radially and inwardly extends in the corresponding connecting holes, the outer lapping structure comprises at least two arc-shaped convex parts which are respectively arranged in the corresponding connecting holes and radially and inwardly extend towards one side of the reference conductive plate along the annular inner wall of the outer conductive plate, a abdicating groove formed between the arc convex part and the inner wall of the connecting hole, and an outer layer lapping surface arranged at the middle part of the arc convex part.

2. The novel laminated busbar lapping structure of claim 1, wherein: the datum lapping surface is flush with the outer layer lapping surface.

3. The novel laminated busbar lapping structure of claim 1, wherein: the middle part of benchmark overlap joint face and the middle part of outer layer overlap joint face all are equipped with a bridging hole.

4. The novel laminated busbar lapping structure of claim 1, wherein: the laminated number of the busbar structures is an odd number, the reference conductive plate is arranged in the middle of the busbar structures, and the outer conductive plates are arranged on the outer layers of the two sides of the reference conductive plate.

5. The novel laminated busbar lapping structure of claim 1, wherein: the laminated number of the busbar structure is an even number, the reference conductive plate is arranged on any one of the two layers in the middle of the busbar structure, and the outer conductive plates are arranged on the outer layers of the two sides of the reference conductive plate.

6. The novel laminated busbar lapping structure of claim 1, wherein: the thickness of the busbar structure is in direct proportion to the inner diameter of the connecting hole.

7. The novel laminated busbar lapping structure of claim 1, wherein: the peripheral edge of the insulating film protrudes out of the peripheral edge of the busbar structure.