CN210666583U - Carry on AI intelligence mainboard of RK3399Pro treater - Google Patents
Carry on AI intelligence mainboard of RK3399Pro treater Download PDFInfo
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- CN210666583U CN210666583U CN201921922043.XU CN201921922043U CN210666583U CN 210666583 U CN210666583 U CN 210666583U CN 201921922043 U CN201921922043 U CN 201921922043U CN 210666583 U CN210666583 U CN 210666583U
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Abstract
The utility model discloses an carry on AI intelligence mainboard of RK3399Pro treater, include: RK3399Pro chip; DRAM pin 2/4G LPDDR3 high speed memory of RK3399Pro chip, EMMC pin 8-64G EMMC flash memory, SDEMMC pin TF card, HDMI pin Type-A, EDP pin LVDS interface, MIPI _ TX, MIPI _ RX pin FPC interface respectively, I2C0 pin, I2S1 pin and GPIO pin PMIC, I2S0 pin Header I2S interface, RGMII interface Ethernet transceiver RTL8221F, RTL8221F RJ45 network interface, UART0 pin COM interface, UART2 pin 232 debug interface, USB HOST0 pin, USB HOST1 pin USB interface GPIO4 pin, SPIO pin NPU, DDRBUS pin 1/2GB interface, PCIE pin X Type 4 Type, PCIE Type 4C pin 4.
Description
Technical Field
The utility model relates to an intelligence mainboard technical field, concretely relates to carry on AI intelligence mainboard of RK3399Pro treater.
Background
The existing mainboard carrying the ARM processor has the connection mode of each pin as follows:
various bus pins of the ARM chip are connected with the related bus function circuit and the function module.
The existing mainboard carrying the ARM processor has the following defects:
1. poor operation ability and low performance;
2. the system is not intelligent and has no integrated neural network processor;
3. the identification speed is low, the accuracy is low, the power consumption is high, and the expansion capability is weak;
4. the platform compatibility is poor, the software application development interface support is less, and the development time is long;
5. large-pixel high-definition cameras are not supported, and the display output resolution is low.
SUMMERY OF THE UTILITY MODEL
To the weak point that exists in the above-mentioned problem, the utility model provides an AI intelligence mainboard of carrying on RK3399Pro treater.
The utility model discloses an carry on AI intelligence mainboard of RK3399Pro treater, include: RK3399Pro chip;
the DRAM pin of the RK3399Pro chip is connected with 2/4G LPDDR3 high-speed memory;
the EMMC pin of the RK3399Pro chip is connected with an 8-64G EMMC flash memory;
the SDEMMC pin of the RK3399Pro chip is connected with the TF card;
the HDMI pin of the RK3399Pro chip is connected with Type-A;
the EDP pin of the RK3399Pro chip is connected with the LVDS interface;
the MIPI _ TX and MIPI _ RX pins of the RK3399Pro chip are respectively connected with an FPC interface;
the pin I2C0, the pin I2S1 and the pin GPIO of the RK3399Pro chip are connected with the PMIC;
the I2S0 pin of the RK3399Pro chip is connected with the I2S interface of the Header;
the RGMII interface of the RK3399Pro chip is connected with an Ethernet transceiver RTL8221F, and the RTL8221F is connected with an RJ45 network interface;
the UART0 pin of the RK3399Pro chip is connected with a COM 232 interface;
the UART2 pin of the RK3399Pro chip is connected with a 232 debugging interface;
the USB HOST0 pin and the USB HOST1 pin of the RK3399Pro chip are respectively connected with a USB interface, one USB interface is connected with Type-A and USB WIFI, and the other USB interface is connected with Type-A, Mini PCI-E and COM 232 interfaces;
the GPIO4 pin, the SPIO pin and the USB pin of the RK3399Pro chip are connected with the NPU;
the DDRBUS pin of the RK3399Pro chip is connected with an 1/2GB interface;
a PCIE pin of the RK3399Pro chip is connected with a PCIE X4 interface;
and the USB Type-C pin of the RK3399Pro chip is connected with Type-C.
As a further improvement of the utility model, the EMMC interface of RK3399Pro chip is used for mounting on-board memory, and the memory capacity can support 8 ~ 64G.
As a further improvement of the utility model, the EDP of the RK3399Pro chip is converted into an LVDS interface through a bridging chip CH 7511.
As the further improvement of the utility model, the HDMI interface signal of RK3399Pro chip is connected to on the HDMIType-A interface seat.
As a further improvement of the utility model, the GPIO of RK3399Pro chip is connected with the GPIO of NPU to realize real-time control and state feedback.
As a further improvement of the utility model, the USBType-C pin of RK3399Pro chip is connected to USBType-C seat.
As a further improvement of the utility model, the OTG pin of RK3399Pro chip is connected to the OTG power supply controller.
Compared with the prior art, the beneficial effects of the utility model are that:
the intelligent main board of the utility model has a neural network processing unit NPU by carrying a RK3399Pro processor, and the operation performance is as high as 2.4 TOPs;
the utility model discloses board carries 2/4GB LPDDR3 high-speed memory, board carries 16GB EMMC Flash, supports LVDS + HDMI interface, provides abundant IO interface; the plate type is compact, the product has high performance, high integration, rich interfaces, high expansion and other all-round application characteristics.
Drawings
Fig. 1 is a schematic circuit diagram of an AI intelligent motherboard with an RK3399Pro processor according to an embodiment of the present invention;
FIG. 2 is a schematic circuit diagram of the CPU, CPU-L, CPU _ B of FIG. 1;
FIG. 3 is a schematic circuit diagram of the EMMC pin of FIG. 1;
FIG. 4 is a schematic circuit diagram of the EDP pin of FIG. 1;
FIG. 5 is a schematic circuit diagram of the HDMI pin of FIG. 1;
FIG. 6 is a schematic circuit diagram of the GPIO4 pin of FIG. 1;
FIG. 7 is a schematic circuit diagram of the USB pin of FIG. 1;
fig. 8 is a schematic circuit diagram of the OTG pin of fig. 1.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The invention is described in further detail below with reference to the accompanying drawings:
as shown in fig. 1, the utility model provides an AI intelligence mainboard of carrying on RK3399Pro treater, include: RK3399Pro chip; wherein:
the DRAM pin of the RK3399Pro chip is connected with 2/4G LPDDR3 high-speed memory;
the EMMC pin of the RK3399Pro chip is connected with an 8-64G EMMC flash memory;
the SDEMMC pin of the RK3399Pro chip is connected with the TF card;
the HDMI pin of the RK3399Pro chip is connected with Type-A;
the EDP pin of the RK3399Pro chip is connected with the LVDS interface;
the MIPI _ TX and MIPI _ RX pins of the RK3399Pro chip are respectively connected with an FPC interface;
the pin I2C0, the pin I2S1 and the pin GPIO of the RK3399Pro chip are connected with the PMIC; the PMIC is connected with an I2S interface of the CPU.
The I2S0 pin of the RK3399Pro chip is connected with the I2S interface of the Header;
the RGMII interface of the RK3399Pro chip is connected with an Ethernet transceiver RTL8221F, and the RTL8221F is connected with an RJ45 network interface;
the UART0 pin of the RK3399Pro chip is connected with a COM 232 interface;
the UART2 pin of the RK3399Pro chip is connected with a 232 debugging interface;
the USB HOST0 pin and the USB HOST1 pin of the RK3399Pro chip are respectively connected with a USB interface, one USB interface is connected with Type-A and USB WIFI, and the other USB interface is connected with Type-A, Mini PCI-E and COM 232 interfaces;
the GPIO4 pin, the SPIO pin and the USB pin of the RK3399Pro chip are connected with the NPU;
the DDRBUS pin of the RK3399Pro chip is connected with an 1/2GB interface;
a PCIE pin of the RK3399Pro chip is connected with a PCIE X4 interface;
and the USB Type-C pin of the RK3399Pro chip is connected with Type-C.
As shown in FIG. 2, the CPU, CPU-L, CPU _ B, corresponds to the CPU power interface portion of RK3399 PRO.
As shown in FIG. 3, an EMMC interface of a RK3399Pro chip is used for mounting an on-board memory, and the capacity of the memory can support 8-64G; wherein, the EMMC BUS is connected with the EMMC memory BUS.
As shown in fig. 4, the EDP interface bus of the RK3399Pro chip is connected to the EDP interface bus of the bridging chip CH7511, and the EDP is converted into an LVDS interface through the bridging chip CH 7511; so as to connect the display device of the LVDS interface.
As shown in fig. 5, the HDMI signal of the RK3399Pro chip is connected to the HDMI Type-a interface socket to be suitable for connection of a display device of the HDMI interface.
As shown in FIG. 6, GPIO of RK3399Pro chip is connected with GPIO of NPU to realize real-time control and state feedback.
As shown in FIG. 7, the USB Type-C pin of the RK3399Pro chip is connected to the USB Type-C socket; so as to realize data transmission of USBType-C equipment.
As shown in FIG. 8, the OTG pin of the RK3399Pro chip is connected to the OTG power supply controller, and the OTG pin is used for Type-C power supply control of the peripheral.
In order to solve the problems 1-5 existing in the prior art, wherein:
to solve problem 1: the utility model discloses a high-speed CPU treater cooperation has independent AI to accelerate the treater, carries out intelligent data's processing.
To solve problem 2: the utility model discloses possess independent high-speed AI and accelerate the treater.
To solve problem 3: the utility model carries a plurality of interface conversion chips on board, so that the peripheral interfaces are abundant; the multi-camera interface, the CPU and the NPU independently process and exchange and compare data, and higher identification precision and higher identification speed are realized.
To solve problem 4: the utility model discloses a mainboard carries on tall and erect intelligent system of ann, and compatible peripheral hardware that can be better has also further shortened open time.
To solve problem 5: the utility model discloses the camera interface and the display interface of mainboard have all adopted the bus interface of present highest standard to high pixel acquisition and high pixel display have been realized.
The utility model discloses a mainboard passes through camera and sensor and sends CPU and NPU to, and CPU and NPU handle relevant information in order to realize intelligent recognition and control.
The utility model discloses be equipped with HDMI, LVDS, MIPI high definition display interface, multiunit MIPI camera interface, board-mounted WIFI module, acceleration sensor, electron compass, but the 4G communication module of carry, be equipped with giga network interface, CPU and NPU coordinate to divide the worker to handle different perception information and task process respectively to carry out information interconnection intercommunication through high-speed network and server end or node. Through the sensor, the information of camera realizes dynamic perception, object recognition, scene discernment, and the application that can be fine intelligent security protection, unmanned aerial vehicle, unmanned driving, industrial control, fields such as modern traffic.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. An AI intelligent motherboard with an RK3399Pro processor, comprising: RK3399Pro chip;
the DRAM pin of the RK3399Pro chip is connected with 2/4G LPDDR3 high-speed memory;
the EMMC pin of the RK3399Pro chip is connected with an 8-64G EMMC flash memory;
the SDEMMC pin of the RK3399Pro chip is connected with the TF card;
the HDMI pin of the RK3399Pro chip is connected with Type-A;
the EDP pin of the RK3399Pro chip is connected with the LVDS interface;
the MIPI _ TX and MIPI _ RX pins of the RK3399Pro chip are respectively connected with an FPC interface;
the pin I2C0, the pin I2S1 and the pin GPIO of the RK3399Pro chip are connected with the PMIC;
the I2S0 pin of the RK3399Pro chip is connected with the I2S interface of the Header;
the RGMII interface of the RK3399Pro chip is connected with an Ethernet transceiver RTL8221F, and the RTL8221F is connected with an RJ45 network interface;
the UART0 pin of the RK3399Pro chip is connected with a COM 232 interface;
the UART2 pin of the RK3399Pro chip is connected with a 232 debugging interface;
the USB HOST0 pin and the USB HOST1 pin of the RK3399Pro chip are respectively connected with a USB interface, one USB interface is connected with Type-A and USB WIFI, and the other USB interface is connected with Type-A, Mini PCI-E and COM 232 interfaces;
the GPIO4 pin, the SPIO pin and the USB pin of the RK3399Pro chip are connected with the NPU;
the DDRBUS pin of the RK3399Pro chip is connected with an 1/2GB interface;
a PCIE pin of the RK3399Pro chip is connected with a PCIE X4 interface;
and the USB Type-C pin of the RK3399Pro chip is connected with Type-C.
2. The AI smart motherboard of claim 1 wherein the EMMC interface of said RK3399Pro chip is configured to mount on-board memory having a memory capacity of 8-64G.
3. The AI intelligence motherboard of claim 1 wherein the EDP of the RK3399Pro chip is converted out of an LVDS interface via a bridging chip CH 7511.
4. The AI intelligence motherboard of claim 1 wherein the HDMI interface signal of the RK3399Pro chip is connected to an HDMI Type-a interface socket.
5. The AI smart motherboard of claim 1 wherein a GPIO of said RK3399Pro chip is connected to a GPIO of the NPU to enable real time control and status feedback.
6. The AI smart motherboard of claim 1, wherein the USB Type-C pin of the RK3399Pro chip is connected to a USB Type-C socket.
7. The AI smart motherboard of claim 1 wherein said OTG pin of said RK3399Pro chip is connected to an OTG power controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921922043.XU CN210666583U (en) | 2019-11-08 | 2019-11-08 | Carry on AI intelligence mainboard of RK3399Pro treater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921922043.XU CN210666583U (en) | 2019-11-08 | 2019-11-08 | Carry on AI intelligence mainboard of RK3399Pro treater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210666583U true CN210666583U (en) | 2020-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921922043.XU Active CN210666583U (en) | 2019-11-08 | 2019-11-08 | Carry on AI intelligence mainboard of RK3399Pro treater |
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| Country | Link |
|---|---|
| CN (1) | CN210666583U (en) |
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- 2019-11-08 CN CN201921922043.XU patent/CN210666583U/en active Active
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