CN210640210U - Silicon wafer jig - Google Patents
Silicon wafer jig Download PDFInfo
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- CN210640210U CN210640210U CN201921526266.4U CN201921526266U CN210640210U CN 210640210 U CN210640210 U CN 210640210U CN 201921526266 U CN201921526266 U CN 201921526266U CN 210640210 U CN210640210 U CN 210640210U
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Abstract
The utility model discloses a silicon wafer jig, which comprises a bottom plate, a silicon wafer bracket and a positioning vertical plate; the positioning vertical plate is provided with a first positioning vertical plate and a second positioning vertical plate which are arranged opposite to each other, and a third positioning vertical plate and a fourth positioning vertical plate which are arranged opposite to each other; at least two groups of first mounting holes are formed in the first positioning vertical plate and the second positioning vertical plate; at least two groups of first fixing holes are formed in the bottom plate corresponding to the first positioning vertical plate and the second positioning vertical plate; at least two groups of second mounting holes are formed in the third positioning vertical plate and the fourth positioning vertical plate; at least two groups of second fixing holes are formed in the bottom plate corresponding to the third positioning vertical plate and the fourth positioning vertical plate. The utility model discloses a silicon chip tool, one set of tool can cooperate the silicon chip of multiple specification to use, and the silicon chip that corresponds various specifications is installed and just can be used, does not need the debugging, can reduce the tool manufacturing cost of enterprise after the use, reduces tool debugging cost.
Description
Technical Field
The utility model relates to a photovoltaic technology field, concretely relates to silicon chip tool.
Background
In the streamlined production of silicon chip, be the silicon chip of pile up neatly stacking and place on the tool, in order to carry out position location to the silicon chip that stacks, avoid silicon chip jacking pay-off in-process skew, lie in the periphery of silicon chip on the tool and need dispose the locating plate, the silicon chip is injectd in the inner space that encloses by the locating plate after being placed on the silicon chip bracket. The setting position of the positioning plate is related to the sizes of the silicon wafers, namely, a silicon wafer jig needs to be correspondingly configured for each size of silicon wafer, and one type of jig cannot be suitable for silicon wafers of various sizes.
Disclosure of Invention
The embodiment of the utility model provides a silicon chip tool, one set of tool can cooperate the silicon chip of multiple specification to use, and the silicon chip that corresponds various specifications is installed and just can be used, need not debug, can reduce the tool manufacturing cost of enterprise after the use, reduces tool debugging cost.
In order to solve the technical problem, the utility model provides a silicon wafer jig, which comprises a bottom plate, a silicon wafer bracket arranged on the bottom plate and a positioning vertical plate arranged outside the silicon wafer bracket; the silicon wafer bracket is used for stacking a plurality of silicon wafers which are sequentially stacked, and the positioning vertical plate is positioned on the outer sides of the silicon wafers and used for limiting the stacked silicon wafers; the positioning vertical plate is provided with a first positioning vertical plate and a second positioning vertical plate which are arranged oppositely, and a third positioning vertical plate and a fourth positioning vertical plate which are arranged oppositely;
the first positioning vertical plate and the second positioning vertical plate are both provided with at least two groups of first mounting holes, and the two groups of first mounting holes are sequentially arranged along the connecting line direction of the first positioning vertical plate and the second positioning vertical plate or the extending line direction of the connecting line of the first positioning vertical plate and the second positioning vertical plate; at least two groups of first fixing holes are formed in the bottom plate corresponding to the first positioning vertical plate and the second positioning vertical plate; the first positioning vertical plate and the first positioning vertical plate are detachably arranged on the bottom plate through the first mounting hole, the first fixing hole and the fastener;
at least two groups of second mounting holes are formed in the third positioning vertical plate and the fourth positioning vertical plate, and the two groups of second mounting holes are sequentially arranged along the connecting line direction of the third positioning vertical plate and the fourth positioning vertical plate or the extending line direction of the connecting line of the third positioning vertical plate and the fourth positioning vertical plate; at least two groups of second fixing holes are formed in the bottom plate corresponding to the third positioning vertical plate and the fourth positioning vertical plate; the third positioning vertical plate and the fourth positioning vertical plate are detachably mounted on the bottom plate through the second mounting hole, the second fixing hole and the fastener.
In a preferred embodiment of the present invention, there are two first mounting holes and two second mounting holes in each group.
The utility model discloses a preferred embodiment, further include it still includes the equipment mounting panel, this silicon chip tool passes through the equipment mounting panel assembles to the silicon chip equipment on, the bottom plate sets up on the equipment mounting panel to fix a position through the spacing part of rotation on the equipment mounting panel.
The utility model discloses a preferred embodiment further includes the rotation limiting part includes that vertical scroll and cover establish the briquetting on the vertical scroll, the briquetting can rotate around the vertical scroll, the briquetting rotates the top crimping that lies in the bottom plate after the rotation the bottom plate, perhaps rotates the release the bottom plate.
The utility model discloses a preferred embodiment, further include the center of silicon chip bracket is equipped with the through-hole, all be equipped with the via hole that link up with this through-hole is coaxial on bottom plate and the equipment mounting panel.
The utility model discloses a preferred embodiment, further include be equipped with two sets of bottom plates on the equipment mounting panel, all be equipped with the silicon chip bracket on two sets of bottom plates, all be equipped with the location riser around the silicon chip bracket on two sets of bottom plates.
The utility model has the advantages that:
the embodiment of the utility model provides an in the embodiment of a silicon chip tool, the location riser that corresponds four components of a whole that can function independently setting on the bottom plate is equipped with at least two sets of mounting holes respectively, all be equipped with at least two sets of fixed orificess on the four components of a whole that can function independently location risers that set up simultaneously, fastener and mounting hole, the cooperation of fixed orifices is fixed the components of a whole that can function independently riser on the bottom plate, when launching different mounting holes and fixed orifices, the regional size that four components of a whole that can function independently riser enclose on the bottom plate is different for one set of tool can cooperate the silicon chip of multiple specification.
On the other hand, in order to solve the compatible use problem of the silicon wafer jig, the industry tries to open the waist-shaped slots on the bottom plate and the positioning vertical plates, and can also solve the problem that silicon wafers of various specifications share one set of jig, however, due to the design of the waist-shaped slots, the installation positions of the four split positioning vertical plates corresponding to the waist-shaped slots cannot be installed in place at one time, and debugging is needed. The silicon chip tool in this embodiment directly designs many sets of mounting holes and fixed orifices on the tool, and one set of mounting hole corresponds one set of fixed orifices, and one set of mounting hole and one set of fixed orifices correspond the silicon chip of a specification for the silicon chip that its tool corresponds various specifications is installed well and just can be used, need not debug, reduces tool debugging cost.
Drawings
FIG. 1 is a schematic structural view of a silicon wafer jig according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of the silicon wafer jig shown in FIG. 1 with the mounting plate of the apparatus hidden;
fig. 3 is a schematic structural view of a positioning vertical plate in the silicon wafer jig shown in fig. 1.
The reference numbers in the figures illustrate: 1-a silicon wafer, 2-a bottom plate, 4-a silicon wafer bracket, 6-a first positioning vertical plate, 8-a second positioning vertical plate, 10-a third positioning vertical plate, 12-a fourth positioning vertical plate, 14-a first mounting hole, 16-a first fixing hole, 18-a second mounting hole, 20-a second fixing hole, 22-an equipment mounting plate, 24-a vertical shaft, 26-a pressing block and 28-a through hole.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Examples
The embodiment discloses a silicon wafer jig, which is shown in fig. 1 to 3 and comprises an equipment mounting plate 22, a bottom plate 2, a silicon wafer holder 4 arranged on the bottom plate 2, and a positioning vertical plate arranged outside the silicon wafer holder 4. The silicon wafer jig is assembled on a silicon wafer device through a device mounting plate 22, and the bottom plate 2 is arranged on the device mounting plate 22 and is positioned and fixed through a rotation limiting part on the device mounting plate 22. On the silicon wafer production line, silicon wafers are stacked on a silicon wafer bracket 4 in a stack manner, and the positioning vertical plate is positioned on a plurality of stacked silicon wafers 1 (only one silicon wafer is shown in the figure) at the outer side of the silicon wafers in a limiting manner.
In the technical solution of this embodiment, the positioning vertical plate has a first positioning vertical plate 6 and a second positioning vertical plate 8 which are opposite to each other, and a third positioning vertical plate 10 and a fourth positioning vertical plate 12 which are opposite to each other;
at least two groups of first mounting holes 14 are formed in the first positioning vertical plate 6 and the second positioning vertical plate 8, and the two groups of first mounting holes 14 are sequentially arranged along the connecting line direction of the first positioning vertical plate 6 and the second positioning vertical plate 8 or the extending line direction of the connecting line of the first positioning vertical plate 6 and the second positioning vertical plate 8; at least two groups of first fixing holes 16 are formed in the bottom plate corresponding to the first positioning vertical plate 6 and the second positioning vertical plate 8; the first positioning vertical plate 6 and the second positioning vertical plate 8 are detachably mounted on the bottom plate 2 through a first mounting hole 14, a first fixing hole 16 and a fastener;
at least two groups of second mounting holes 18 are formed in the third positioning vertical plate 8 and the fourth positioning vertical plate 10, and the two groups of second mounting holes 18 are sequentially arranged along the connecting line of the third positioning vertical plate 8 and the fourth positioning vertical plate 10 or the extending line direction of the connecting line of the third positioning vertical plate and the fourth positioning vertical plate 10; at least two groups of second fixing holes 20 are formed in the bottom plate 2 corresponding to the third positioning vertical plate 8 and the fourth positioning vertical plate 10; the third positioning vertical plate 8 and the fourth positioning vertical plate 10 are detachably mounted on the bottom plate 2 through the second mounting hole 18, the second fixing hole 20 and the fastener.
The above fasteners preferably use a nut and screw fit, or a screw.
In one implementation scheme of this embodiment, two sets of first mounting holes 14 are respectively formed in the first positioning vertical plate 6 and the second positioning vertical plate 8, and each set of first mounting holes 14 has two hole sites; two groups of first fixing holes 16 are formed in the bottom plate corresponding to the first positioning vertical plate 6 and the second positioning vertical plate 8, and each group of first fixing holes is provided with two hole positions; two groups of second mounting holes 18 are formed in the third positioning vertical plate 8 and the fourth positioning vertical plate 10, and each group of second mounting holes 18 is provided with two hole sites; the three corresponding positioning vertical plates 8 and the four corresponding positioning vertical plates 10 on the bottom plate 2 are provided with two groups of second fixing holes 20, and each group of second fixing holes 20 is provided with two hole positions. Therefore, four groups of positioning vertical plates can enclose four silicon wafer placing areas with different sizes on the bottom plate, so that one set of jig can be matched with silicon wafers with four specifications for use.
In another embodiment of this embodiment, three sets of first mounting holes 14 are provided on the first positioning vertical plate 6 and the second positioning vertical plate 8, and each set of first mounting holes 14 has two hole locations; three groups of first fixing holes 16 are formed in the bottom plate corresponding to the first positioning vertical plate 6 and the second positioning vertical plate 8, and each group of first fixing holes is provided with two hole positions; three groups of second mounting holes 18 are formed in the third positioning vertical plate 8 and the fourth positioning vertical plate 10, and each group of second mounting holes 18 is provided with two hole sites; three groups of second fixing holes 20 are formed in the bottom plate 2 corresponding to the third positioning vertical plate 8 and the fourth positioning vertical plate 10, and each group of second fixing holes 20 is provided with two hole positions. Therefore, four groups of positioning vertical plates can enclose four silicon wafer placing areas with different sizes on the bottom plate, so that one set of jig can be matched with silicon wafers with eight specifications for use.
The rotation limiting part comprises a vertical shaft 24 and a pressing block 26 sleeved on the vertical shaft 24, the pressing block 26 can rotate around the vertical shaft 24, the pressing block 26 is positioned above the bottom plate 2 after rotating and is pressed on the bottom plate 2, or the bottom plate 2 is released after rotating. The bottom plate 2 is fixed on the equipment mounting plate 22 through the rotation limiting part with the structure, and the assembly and disassembly do not need auxiliary tools, so that the device is very convenient.
A through hole 28 is formed in the center of the silicon wafer holder 4, and through holes coaxially penetrating the through hole 28 are formed in the bottom plate 2 and the device mounting plate 22. The jacking mechanism can conveniently penetrate through the through hole 28 and the through hole to contact and push the silicon wafer bracket 4, so that the silicon wafer is taken.
Two groups of bottom plates 2 are arranged on the equipment mounting plate 22, silicon wafer brackets 4 are arranged on the two groups of bottom plates 2, and positioning vertical plates are arranged on the two groups of bottom plates 2 around the silicon wafer brackets 4. One set of tool can assist two silicon chip assembly lines to use.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (6)
1. The utility model provides a silicon chip tool which characterized in that: the silicon wafer fixing device comprises a bottom plate, a silicon wafer bracket arranged on the bottom plate and a positioning vertical plate arranged on the outer side of the silicon wafer bracket; the silicon wafer bracket is used for stacking a plurality of silicon wafers which are sequentially stacked, and the positioning vertical plate is positioned on the outer sides of the silicon wafers and used for limiting the stacked silicon wafers; the positioning vertical plate is provided with a first positioning vertical plate and a second positioning vertical plate which are arranged oppositely, and a third positioning vertical plate and a fourth positioning vertical plate which are arranged oppositely;
the first positioning vertical plate and the second positioning vertical plate are both provided with at least two groups of first mounting holes, and the two groups of first mounting holes are sequentially arranged along the connecting line direction of the first positioning vertical plate and the second positioning vertical plate or the extending line direction of the connecting line of the first positioning vertical plate and the second positioning vertical plate; at least two groups of first fixing holes are formed in the bottom plate corresponding to the first positioning vertical plate and the second positioning vertical plate; the first positioning vertical plate and the first positioning vertical plate are detachably arranged on the bottom plate through the first mounting hole, the first fixing hole and the fastener;
at least two groups of second mounting holes are formed in the third positioning vertical plate and the fourth positioning vertical plate, and the two groups of second mounting holes are sequentially arranged along the connecting line direction of the third positioning vertical plate and the fourth positioning vertical plate or the extending line direction of the connecting line of the third positioning vertical plate and the fourth positioning vertical plate; at least two groups of second fixing holes are formed in the bottom plate corresponding to the third positioning vertical plate and the fourth positioning vertical plate; the third positioning vertical plate and the fourth positioning vertical plate are detachably mounted on the bottom plate through the second mounting hole, the second fixing hole and the fastener.
2. The silicon wafer jig of claim 1, wherein: every first mounting hole of group all has two, and every second mounting hole all has two.
3. The silicon wafer jig according to claim 1 or 2, characterized in that: the silicon wafer jig is characterized by further comprising an equipment mounting plate, the silicon wafer jig is assembled on silicon wafer equipment through the equipment mounting plate, and the bottom plate is arranged on the equipment mounting plate and is positioned and fixed through a rotation limiting part on the equipment mounting plate.
4. The silicon wafer jig of claim 3, wherein: the rotation limiting part comprises a vertical shaft and a pressing block sleeved on the vertical shaft, the pressing block can rotate around the vertical shaft, the pressing block is located above the bottom plate after rotating and is in pressure connection with the bottom plate, or the pressing block releases the bottom plate after rotating.
5. The silicon wafer jig of claim 3, wherein: the center of the silicon wafer bracket is provided with a through hole, and the bottom plate and the equipment mounting plate are both provided with through holes which are coaxially communicated with the through hole.
6. The silicon wafer jig of claim 3, wherein: the equipment mounting plate is provided with two groups of bottom plates, the two groups of bottom plates are provided with silicon wafer brackets, and the two groups of bottom plates are provided with positioning vertical plates around the silicon wafer brackets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921526266.4U CN210640210U (en) | 2019-09-12 | 2019-09-12 | Silicon wafer jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921526266.4U CN210640210U (en) | 2019-09-12 | 2019-09-12 | Silicon wafer jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210640210U true CN210640210U (en) | 2020-05-29 |
Family
ID=70797138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921526266.4U Active CN210640210U (en) | 2019-09-12 | 2019-09-12 | Silicon wafer jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210640210U (en) |
-
2019
- 2019-09-12 CN CN201921526266.4U patent/CN210640210U/en active Active
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