CN218099325U - High-efficiency pre-assembling clamp for semiconductor test probe - Google Patents
High-efficiency pre-assembling clamp for semiconductor test probe Download PDFInfo
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- CN218099325U CN218099325U CN202222074143.XU CN202222074143U CN218099325U CN 218099325 U CN218099325 U CN 218099325U CN 202222074143 U CN202222074143 U CN 202222074143U CN 218099325 U CN218099325 U CN 218099325U
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Abstract
The utility model discloses a high-efficient preassembled anchor clamps of semiconductor test probe relates to probe equipment technical field. Wherein, this high-efficient anchor clamps of preassembleing of semiconductor test probe includes: sucking the frame; the pipe assembly is arranged at the bottom of the suction frame; a frame connected to the bottom of the pipe assembly; the pipe turning plate is arranged at the bottom of the frame; the small needle head component is connected with the bottom of the tube turning plate; the spring bottom plate is arranged at the bottom of the small needle head assembly; the large needle head bottom plate is connected with the bottom of the spring bottom plate; and the tube universal rotating plate is arranged at the bottom of the large needle head base plate. The utility model discloses, it is too simple to solve current probe equipment anchor clamps structure, only uses three blocks of panel to carry out the pre-assembly, requires high to operating personnel's vision requirement and hand when using, needs the very high stability of personnel to lead to the very low problem of pre-installation efficiency.
Description
Technical Field
The utility model relates to a probe equipment technical field particularly, relates to a high-efficient preassembled fixture of semiconductor test probe.
Background
The test probe is internally provided with a precise spring structure which comprises a needle head, a spring and a needle tube. Due to the special structure and size of the spring probe, the process of forming the finished probe by processing and assembling all the components in batches is complex, wherein pre-assembly is a very important link, how to quickly and efficiently complete the pre-assembly is achieved, and the capacity and the cost of a manufacturing plant are directly determined.
The existing probe assembling clamp is too simple in structure, only three plates are used for pre-assembling, the visual requirement and the hand requirement on an operator are extremely high when the probe assembling clamp is used, the stability of the operator is very high, and therefore the problem that the pre-assembling efficiency is very low is caused, and an effective solution is not provided at present.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: an efficient pre-assembling fixture for a semiconductor test probe is provided to solve the above problems in the prior art.
The technical scheme is as follows: a semiconductor test probe high efficiency pre-assembly fixture, comprising: sucking the frame; the pipe assembly is arranged at the bottom of the suction frame; a frame connected to the bottom of the pipe assembly; the pipe turning plate is arranged at the bottom of the frame; the small needle head assembly is connected with the bottom of the tube turning plate; the spring bottom plate is arranged at the bottom of the small needle head assembly; the large needle head bottom plate is connected with the bottom of the spring bottom plate; the tube universal rotating plate is arranged at the bottom of the large needle head bottom plate; a plurality of plates are sequentially stacked to pre-assemble the semiconductor test probe.
Preferably, the suction frame and the frame are universal and are provided with hollow accommodating cavities.
Preferably, a quick-connection threaded hole is formed in one side of the suction frame, and a quick connector is detachably arranged on the quick-connection threaded hole.
Preferably, the periphery of the bottom of the suction frame is provided with a first pin hole.
Preferably, the tube assembly, the frame, the tube turning plate, the small needle assembly, the spring bottom plate, the large needle bottom plate and the tube universal rotating plate are all provided with second pin holes in a penetrating mode.
Preferably, the tube assembly comprises: the pipe bottom plate is connected with the bottom of the suction frame, a pipe plate is arranged at the bottom of the first pipe bottom plate, and a second pipe bottom plate is arranged at the bottom of the pipe plate.
Preferably, the periphery of the pipe assembly is provided with third pin holes, and the pipe sub-plate and the second pipe bottom plate are respectively provided with a plurality of first pin holes in an array and opposite to each other.
Preferably, threaded holes are formed in the periphery of the pipe sub-plate in a penetrating mode, the threaded holes are respectively and adjacently located on the inner sides of the second pin holes, through holes are formed in the periphery of the first pipe bottom plate, and the through holes and the threaded holes are arranged oppositely.
Preferably, the small needle assembly comprises: and the small needle head bottom plate is connected with the bottom of the tube turning plate, and the bottom of the small needle head bottom plate is provided with a small needle head turning plate.
Preferably, a plurality of second pin needle holes are arranged on the tube turning plate, the small needle head assembly, the spring bottom plate, the large needle head bottom plate and the tube universal rotating plate in an array mode.
Has the advantages that: in this application embodiment, adopt the mode of piling up the polylith plate in proper order, through piling up in proper order and being provided with the polylith plate, with carry out the pre-assembling to semiconductor test probe, the purpose of high-efficient pre-assembling has been reached, thereby the technical effect of simplified operation mode and improvement packaging efficiency has been realized, and then solved current probe equipment anchor clamps structure oversimplified, only use three blocks of panel to carry out the pre-assembling, require that personnel's vision requirement and hand require extremely high when using, thereby need personnel's very high stability, thereby lead to the very low technical problem of pre-installation efficiency.
Drawings
FIG. 1 is a perspective view of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention 1;
FIG. 2 is a front view of the high efficiency pre-assembly fixture 2 for semiconductor test probes of the present invention;
FIG. 3 is a front view of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 4 is a right side view of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 5 is a front view of the suction frame of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 6 isbase:Sub>A cross-sectional view A-A of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 7 is a front view of the frame of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 8 is a front view of the small needle tip turning plate of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 9 is a front view of the small needle base plate of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 10 is a front view of the universal tube swivel plate of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 11 is a front view of a tube flap of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 12 is a front view of a second tube base plate of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 13 is a front view of the small needle tip turning plate of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 14 is a front elevation view of a tube sheet of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
FIG. 15 is a front view of the spring chassis of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention;
figure 16 is a front view of the large tip floor of the high efficiency pre-assembly fixture for semiconductor test probes of the present invention.
The reference signs are: 1. sucking the frame; 2. a tube assembly; 3. a frame; 4. turning over the plate of the pipe; 5. a small needle assembly; 6. a spring bottom plate; 7. a large needle head bottom plate; 8. the tube is used as a universal rotating plate; 9. quickly connecting a threaded hole; 10. a quick coupling; 11. a first pin hole; 12. a second pin hole; 13. a first tube bottom plate; 14. a pipe sub-plate; 15. a second tube bottom plate; 16. a first pin pinhole; 17. a threaded hole; 18. a through hole; 19. a small needle head base plate; 20. a small needle tip turning plate; 21. a second pin pinhole.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1-16, the present application relates to an efficient pre-assembly fixture for semiconductor test probes. The high-efficiency pre-assembly fixture for the semiconductor test probe comprises: a suction frame 1; the suction frame 1 is a frame having a suction function, and can achieve a good vacuum suction effect, thereby achieving a good fixing effect. The pipe assembly 2 is arranged at the bottom of the suction frame 1; can realize good pipe installation and fixed effect to the effect of the dismouting of being convenient for is realized, and then realizes the effect that improves work efficiency. A frame 3 connected to the bottom of the pipe assembly 2; can realize good fixed and support effect to realize improving stable in structure's effect. The pipe turning plate 4 is arranged at the bottom of the frame 3; and a good overturning effect can be realized, so that a good reversing effect is realized. The small needle head component 5 is connected with the bottom of the tube turning plate 4; can realize good fixing and mounting effects of the small needle head, thereby realizing the effect of convenient assembly. The spring bottom plate 6 is arranged at the bottom of the small needle assembly 5; a good assembly effect can be achieved. The large needle head bottom plate 7 is connected with the bottom of the spring bottom plate 6; the good fixing and mounting effect of the large needle can be realized, so that the effect of convenient pre-assembly is realized. The tube universal rotating plate 8 is arranged at the bottom of the large needle head bottom plate 7; can realize good fixed effect of pipe, can compatible good commonality simultaneously to the speed that realizes improving the dismouting, and then the effect of saving time is realized.
A plurality of plates are sequentially stacked to pre-assemble the semiconductor test probe. The multi-block plate is sequentially stacked from top to bottom, so that the effect of convenience in mounting and dismounting can be realized, and the effect of convenience in fixing and mounting the probe can also be realized, so that the effects of saving the assembly time and improving the mounting efficiency are realized, and the effect of greatly improving the productivity is realized.
From the above description, it can be seen that the following technical effects are achieved by the present application:
in this application embodiment, the mode of polylith plate is piled up in proper order in the adoption, be provided with polylith plate through piling up in proper order, in order to carry out the pre-assembling to semiconductor test probe, the purpose of high-efficient pre-assembling has been reached, thereby realized simplifying the operation mode and improve the technological effect of packaging efficiency, and then solved current probe equipment anchor clamps structure too simple, only use three panel to carry out the pre-assembling, require extremely high to operating personnel's vision requirement and hand when using, need the very high stability of personnel, thereby lead to the very low technical problem of pre-installation efficiency.
Further, inhale frame 1 with frame 3 adopts the general type, and all is provided with cavity holding chamber. Can realize good compatible effect, can also realize good holding effect simultaneously, prevent to take place the condition of interference, can also ensure good vacuum adsorption effect simultaneously.
Furthermore, a quick-connection threaded hole 9 is formed in one side of the suction frame 1, and a quick connector 10 is detachably arranged on the quick-connection threaded hole 9. The effect of high-speed joint can be realized to the effect of the dismouting of being convenient for is realized, and then ensures stable vacuum adsorption effect.
Furthermore, first pin holes 11 are formed in the periphery of the bottom of the suction frame 1. Can realize good fixed and equipment effect, can also realize quick assembly disassembly's effect simultaneously.
Furthermore, second pin holes 12 penetrate through the periphery of the pipe component 2, the frame 3, the pipe turning plate 4, the small needle component 5, the spring bottom plate 6, the large needle bottom plate 7 and the pipe universal rotating plate 8. Can realize good fixed and equipment effect, can also realize quick assembly disassembly's effect simultaneously. Further, the tube assembly 2 includes: and the bottom of the suction frame 1 is connected with a first pipe bottom plate 13, the bottom of the first pipe bottom plate 13 is provided with a pipe plate 14, and the bottom of the pipe plate 14 is provided with a second pipe bottom plate 15. Good fixing and connecting effects can be achieved, and therefore the effect of being convenient to assemble is achieved. Preferably, a plurality of first pin holes 16 are formed on the pipe sub-plate 14 and the second pipe bottom plate 15 in an array and opposite to each other. Can realize good pin needle installation effect to be convenient for fixed pin needle's effect.
Furthermore, threaded holes 17 penetrate through the periphery of the pipe sub-plate 14, the threaded holes 17 are respectively and adjacently located on the inner sides of the second pin holes 12, through holes 18 are formed in the periphery of the first pipe bottom plate 13, and the through holes 18 are opposite to the threaded holes 17. The effect of being convenient for install and fixed can be realized to ensure the effect of the firm installation of pin needle.
Further, the small needle assembly 5 includes: a small needle bottom plate 19 connected with the bottom of the tube turning plate 4, and a small needle turning plate 20 is arranged at the bottom of the small needle bottom plate 19. The effect of well fixing and installing the small needle can be realized, thereby realizing the effect of being convenient for assembling.
Furthermore, a plurality of second pin needle holes 21 are formed in the tube turning plate 4, the small needle assembly 5, the spring bottom plate 6, the large needle bottom plate 7 and the tube universal rotating plate 8 in an array mode. The effect of well fixing and installing the small needle can be realized, thereby realizing the effect of being convenient for assembling.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the details of the above embodiments, and the technical concept of the present invention can be modified to perform various equivalent transformations, which all belong to the protection scope of the present invention.
Claims (10)
1. High-efficient anchor clamps of preassembleing of semiconductor test probe, its characterized in that includes:
sucking the frame;
the pipe assembly is arranged at the bottom of the suction frame;
a frame connected to the bottom of the pipe assembly;
the pipe turning plate is arranged at the bottom of the frame;
the small needle head assembly is connected with the bottom of the tube turning plate;
the spring bottom plate is arranged at the bottom of the small needle head assembly;
the large needle head bottom plate is connected with the bottom of the spring bottom plate; and
the tube universal rotating plate is arranged at the bottom of the large needle head bottom plate;
a plurality of plates are sequentially stacked to pre-assemble the semiconductor test probe.
2. The efficient pre-assembly fixture for semiconductor test probes as claimed in claim 1, wherein the suction frame and the frame are of a universal type and are provided with hollow accommodating cavities.
3. The efficient pre-assembly fixture for semiconductor test probes as claimed in claim 1, wherein a quick-connection threaded hole is formed in one side of the suction frame, and a quick connector is detachably arranged on the quick-connection threaded hole.
4. The efficient pre-assembly fixture for semiconductor test probes as claimed in claim 1, wherein the periphery of the bottom of the suction frame is provided with a first pin hole.
5. The high-efficiency pre-assembly fixture for semiconductor test probes as claimed in claim 1, wherein the tube assembly, the frame, the tube turning plate, the small needle head assembly, the spring bottom plate, the large needle head bottom plate and the tube universal rotating plate are all provided with second pin holes all around in a penetrating manner.
6. The semiconductor test probe high efficiency pre-assembly fixture of claim 5, wherein the tube assembly comprises: the pipe bottom plate is connected with the bottom of the suction frame, a pipe plate is arranged at the bottom of the first pipe bottom plate, and a second pipe bottom plate is arranged at the bottom of the pipe plate.
7. The efficient pre-assembly fixture for semiconductor test probes as claimed in claim 6, wherein the first pin holes are formed in the tube sub-plate and the second tube base plate in an array opposite to each other.
8. The efficient pre-assembly fixture for semiconductor test probes as claimed in claim 6, wherein threaded holes are formed in the periphery of the pipe panel, the threaded holes are respectively adjacent to the inner sides of the second pin holes, through holes are formed in the periphery of the first pipe bottom plate, and the through holes are opposite to the threaded holes.
9. The semiconductor test probe high efficiency pre-assembly fixture of claim 4, wherein the small tip assembly comprises: and the small needle head bottom plate is connected with the bottom of the tube turning plate, and the bottom of the small needle head bottom plate is provided with a small needle head turning plate.
10. The efficient pre-assembly fixture for semiconductor test probes as claimed in claim 1, wherein a plurality of second pin holes are arranged on the tube turning plate, the small pin head assembly, the spring bottom plate, the large pin head bottom plate and the tube universal rotating plate in an array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222074143.XU CN218099325U (en) | 2022-08-08 | 2022-08-08 | High-efficiency pre-assembling clamp for semiconductor test probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222074143.XU CN218099325U (en) | 2022-08-08 | 2022-08-08 | High-efficiency pre-assembling clamp for semiconductor test probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218099325U true CN218099325U (en) | 2022-12-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222074143.XU Active CN218099325U (en) | 2022-08-08 | 2022-08-08 | High-efficiency pre-assembling clamp for semiconductor test probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218099325U (en) |
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2022
- 2022-08-08 CN CN202222074143.XU patent/CN218099325U/en active Active
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