CN210628272U

CN210628272U - Silicon wafer fixing tool

Info

Publication number: CN210628272U
Application number: CN201921949116.4U
Authority: CN
Inventors: 陈自力
Original assignee: Fujian Free Trade Zone Xiamen Area Silicon Technology Co Ltd
Current assignee: Xiamen Silicon Crystal Technology Co.,Ltd.
Priority date: 2019-11-12
Filing date: 2019-11-12
Publication date: 2020-05-26
Anticipated expiration: 2029-11-12

Abstract

The utility model relates to a silicon wafer fixing tool, which is used for fixing a silicon wafer and comprises a tool carrier arranged on a worktable of a silicon wafer cutting machine and an accommodating space used for placing the silicon wafer in the center area of the tool carrier; the accommodating space is of a circular hollow structure, and the size of the accommodating space is matched with that of the silicon wafer; the accommodating space is provided with a limiting interface which is matched with the direction limiting notch on the silicon wafer. The fixing tool can effectively improve the clamping effect of the silicon wafer and improve the cutting efficiency of the silicon wafer.

Description

Silicon wafer fixing tool

Technical Field

The present invention relates to a silicon wafer fixing tool, and more particularly to a tool for fixing a silicon wafer during cutting the silicon wafer.

Background

Silicon wafers (also called silicon wafers) are processed from silicon ingots, on which millions of transistors can be etched by a special process, and are widely used in the manufacture of integrated circuits. The silicon wafers were divided into 4 inches, 5 inches, 6 inches, 8 inches, and 12 inches in diameter. The larger the wafer is, the more chips can be produced on the same wafer, so that the cost can be reduced, and the required material technology and production technology are higher. The 12-inch wafer is mainly used for high-end products, such as logic chips and memory chips of CPU \ GPU and the like. The 8-inch wafer is mainly used for middle and low-end products, such as a power management IC, an LCD/LED drive IC, an MCU, a power semiconductor MOSFE, an automobile semiconductor and the like. 6-inch wafer power semiconductors, automotive electronics, and the like. Silicon wafers are always a short plate of the semiconductor industry chain in China, at present, domestic enterprises can only produce 6-inch and 8-inch silicon wafers, and the blank is basically the 12-inch silicon wafers. The silicon wafer is often damaged by abrasion, collision and the like at the edge of the wafer in the logistics transportation process, and the wafer is extremely wasted.

Therefore, in order to reduce the breakage rate of silicon wafers, users generally adopt to cut the scrapped large-size wafers into small-size wafers, thereby increasing the recycling rate. Therefore, the inventor designs a silicon wafer fixing tool which is used for cutting the silicon wafer so as to improve the clamping effect of the silicon wafer.

SUMMERY OF THE UTILITY MODEL

The invention provides a silicon wafer fixing tool, which aims to solve the technical problem of fixing a silicon wafer during cutting.

A silicon wafer fixing tool is used for fixing a silicon wafer and is characterized by comprising: a tool carrier arranged on the worktable of the silicon wafer cutting machine and a containing space for placing the silicon wafer in the center area of the tool carrier; the accommodating space is of a circular hollow structure, and the size of the accommodating space is matched with that of the silicon wafer; the accommodating space is provided with a limiting interface which is matched with the direction limiting notch on the silicon wafer.

Furthermore, the outer edge of the containing space is provided with a scrap discharging window for cleaning the scraps generated in the silicon wafer cutting process.

Furthermore, the scrap blanking window is in an I shape.

The utility model has the advantages that: the silicon wafer can be conveniently placed by arranging the accommodating space of the silicon wafer. A scrap blanking window is arranged on the outer edge of the accommodating space, and the scraps can be deposited in an ash collecting box below the worktable of the silicon wafer cutting machine under the action of gravity; meanwhile, when the silicon wafer after being cut is shifted to the lower part of the tool carrier, the silicon wafer can be taken out from the dust blanking window manually.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Detailed Description

Referring to FIG. 1, a silicon wafer fixing tool is used for fixing a silicon wafer. The silicon wafer fixing tool comprises a tool carrier 100 arranged on a worktable of a silicon wafer cutting machine and an accommodating space for accommodating a silicon wafer in the central area of the tool carrier 100; the accommodating space is of a circular hollow structure, and the size of the accommodating space is matched with that of the silicon wafer; the accommodating space is provided with a limiting interface 200 which is matched with the direction limiting notch 200 on the silicon wafer. The outer edge of the accommodating space is provided with a scrap discharge window 300 for cleaning scrap generated in the silicon wafer cutting process. The scrap blanking window 300 is I-shaped, so that the scrap blanking window is convenient to hold manually.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; for a person skilled in the art, modifications may be made to the technical solutions described in the foregoing embodiments, or some or all of the technical features may be replaced with equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims

1. A silicon wafer fixing tool is used for fixing a silicon wafer and is characterized by comprising a tool carrier arranged on a worktable of a silicon wafer cutting machine and an accommodating space used for placing the silicon wafer in the center area of the tool carrier; the accommodating space is of a circular hollow structure, and the size of the accommodating space is matched with that of the silicon wafer; the accommodating space is provided with a limiting interface which is matched with the direction limiting notch on the silicon wafer.

2. The silicon wafer fixing tool of claim 1, wherein the outer edge of the receiving space is opened with a scrap discharging window for cleaning the scraps generated in the silicon wafer cutting process.

3. The silicon wafer fixing tool as claimed in claim 1, wherein the window for blanking scraps is i-shaped.