CN215147646U

CN215147646U - Quick beveler of silicon dish

Info

Publication number: CN215147646U
Application number: CN202121788145.4U
Authority: CN
Inventors: 秦国梁
Original assignee: Jiangsu Hongxin Times Semiconductor Co ltd
Current assignee: Jiangsu Hongxin Times Semiconductor Co ltd
Priority date: 2021-08-02
Filing date: 2021-08-02
Publication date: 2021-12-14
Anticipated expiration: 2031-08-02

Abstract

The utility model discloses a silicon disc quick chamfering machine, which comprises a machine body, a workbench, a fixing device and a grinding wheel, wherein the workbench is fixed on the machine body, the fixing device is arranged on the workbench, the grinding wheel is arranged right above the fixing device, and an elliptic groove is formed on the grinding wheel close to the fixing device; the fixing device is a vacuum chuck; the utility model discloses simple structure, it is easy and simple to handle, through opening the emery wheel that has oval form recess, the vacuum chuck of the specific fixed silicon dish of cooperation can directly carry out the chamfer to the silicon dish surface, once accomplishes, and is high-efficient swift, has greatly improved the production efficiency of enterprise, can promote on a large scale.

Description

Quick beveler of silicon dish

Technical Field

The utility model relates to a silicon chip chamfering equipment technical field, more specifically say, it relates to a quick beveler of silicon dish.

Background

The chip made of silicon chip is a famous "Shen calculator", has amazing operational capability, the semiconductor silicon chip is the main substrate material of modern super large scale integrated circuit, generally produced by technological process such as slicing, lapping, etc.; however, the silicon wafer cut by the slicing machine has a surface roughness which does not meet the requirements of the product and needs to be obtained by grinding, and in order to reduce the damage caused by edge breakage in the lapping process in the processing of the silicon wafer, chamfering treatment needs to be performed before lapping. The present chamfering machine for processing silicon wafers is insufficient in chamfering accuracy, other edges can be processed only by changing the angle of the chamfering machine or changing the angle without stopping when the chamfering machine is used for chamfering the silicon wafers, waste scraps generated by chamfering are splashed all the time, manual processing is needed, time and labor are wasted, and the working efficiency is influenced.

Therefore, there is a need for a new silicon disk chamfering machine with high efficiency, without changing the angle of the chamfering machine for chamfering at a time, and capable of avoiding the splashing of the waste chips.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art exists, the utility model aims to provide a quick beveler of silicon dish has efficiently, need not to change the one-time chamfer shaping of beveler angle and can avoid the advantage that the sweeps spatters all around.

In order to achieve the above purpose, the utility model provides a following technical scheme: a silicon disc rapid chamfering machine comprises a machine body, a workbench, a fixing device and a grinding wheel, wherein the workbench is fixed on the machine body, the fixing device is arranged on the workbench, the grinding wheel is arranged right above the fixing device, and an elliptical groove is formed in one surface, close to the fixing device, of the grinding wheel; the fixing device is a vacuum chuck.

The utility model discloses simple structure, it is easy and simple to handle, through opening the emery wheel that has oval form recess, can directly carry out the chamfer to the silicon dish surface, once accomplish, high-efficient swift, greatly improved the production efficiency of enterprise, can promote on a large scale.

Further, the vacuum chuck comprises a chuck body, an auxiliary protrusion and a suction hole; the sucking disc body is cylindricly, supplementary arch is the ring form and is fixed in sucking disc body upper surface periphery, inhale the hole set up in sucking disc body upper surface center.

Because the emery wheel can be through oval form recess cover on the surface of silicon dish during the chamfer, consequently traditional beveler is not suitable to the centre gripping mode of silicon chip, the utility model discloses a vacuum chuck fixes the silicon chip, exposes the one side that needs the chamfer completely, convenient processing.

Further, the suction hole is communicated with a vacuum generator.

Furthermore, the grinding wheel is connected with a rotating motor, the rotating motor is fixed on a lifting screw rod, the lifting screw rod is vertically fixed on the machine body, and the rotating motor moves up and down through the lifting screw rod.

The setting of lift lead screw makes things convenient for the emery wheel to reciprocate, and the rotating electrical machines provides power for the emery wheel.

Further, the grinding wheel is connected with the rotating motor through a rotating shaft.

Furthermore, a scrap collecting groove is arranged on the workbench and surrounds the fixing device.

The setting of sweeps collecting vat can be in the same place the sweeps that produces, and the sweeps that produces when avoiding the chamfer splashes everywhere, makes things convenient for the clearance of beveler, reduces the cost of labor.

To sum up, the utility model discloses following beneficial effect has: the utility model discloses simple structure, it is easy and simple to handle, through opening the emery wheel that has oval form recess, adopt vacuum chuck to fix the silicon chip simultaneously, can directly carry out the chamfer to the silicon disc surface, once accomplish, high-efficient swift, greatly improved the production efficiency of enterprise, can promote on a large scale.

Drawings

Fig. 1 is a structural diagram of a silicon disc rapid chamfering machine according to embodiment 1;

FIG. 2 is a structural view of a fixing apparatus according to embodiment 1;

FIG. 3 is a working diagram of a silicon disk rapid chamfering machine according to embodiment 1;

fig. 4 is a cross-sectional view of the silicon disk rapid chamfering machine according to embodiment 1.

In the figure: 1. a work table; 2. a fixing device; 3. a grinding wheel; 4. a rotating electric machine; 5. a lifting screw rod; 6. a suction cup body; 7. an auxiliary projection; 8. sucking holes; 9. and a silicon disc.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings and embodiments.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.

Example 1

The embodiment provides a quick beveler of silicon dish, as shown in fig. 1, including the organism, workstation 1, fixing device 2 and emery wheel 3, workstation 1 is fixed on the organism, fixing device 2 sets up on workstation 1, emery wheel 3 sets up directly over fixing device 2, emery wheel 3 is close to 2 one sides of fixing device and opens there is an ellipse circular recess, it is the arcuation to add the contact department of ellipse circular recess and 9 corners of silicon dish during processing, and the arc angle of contact department can be adjusted according to the needs of actual processing, obtain the product that accords with the demand. The utility model discloses simple structure, it is easy and simple to handle, through opening emery wheel 3 that has oval form recess, can directly carry out the chamfer to silicon dish 9 surfaces, once accomplish, high-efficient swift, greatly improved the production efficiency of enterprise, can promote on a large scale.

As shown in fig. 2, in order to cooperate with the grinding wheel 3, the fixing device 2 in the present invention is a vacuum chuck, and the vacuum chuck includes a chuck body 6, an auxiliary protrusion 7 and a suction hole 8; the sucking disc body 6 is cylindricly, and supplementary arch 7 is the ring form and just is fixed in the periphery of the 6 upper surfaces of sucking disc body, and for making things convenient for the chamfer, supplementary arch 7 highly is less than the third of silicon dish 9 thickness, inhales hole 8 and sets up in sucking disc body 6 upper surface center, inhale hole 8 and a vacuum generator intercommunication. Because emery wheel 3 can be through oval form recess cover on the surface of silicon dish 9 during the chamfer, consequently traditional beveler is not suitable to the centre gripping mode of silicon chip, the utility model discloses a vacuum chuck fixes the silicon chip, exposes the one side that needs the chamfer completely, convenient processing.

The grinding wheel 3 is connected with a rotating motor 4, the rotating motor 4 provides power for the grinding wheel 3, the rotating motor 4 is fixed on a lifting screw rod 5, the lifting screw rod 5 is vertically fixed on the machine body, and the rotating motor 4 moves up and down through the lifting screw rod 5.

Wherein, the grinding wheel 3 is connected with the rotating motor 4 through a rotating shaft; a scrap collecting box (not shown) is provided on the table 1, surrounding the fixing device 2. The setting of sweeps collecting vat can be in the same place the sweeps that produces, and the sweeps that produces when avoiding the chamfer splashes everywhere, makes things convenient for the clearance of beveler, reduces the cost of labor.

The utility model provides a concrete implementation mode of 9 quick bevelers of silicon dish: as shown in fig. 3, the silicon disc 9 is placed on the vacuum chuck for fixing, the grinding wheel 3 is started, the lifting screw 5 controls the grinding wheel 3 to move downwards, the rotating motor 4 drives the grinding wheel 3 to rotate to chamfer the silicon disc 9, as shown in fig. 4, the edge of the chamfered silicon disc 9 is ground into an arc shape under the action of the elliptic inner groove of the grinding wheel 3, and chamfering is completed. The utility model discloses simple structure, it is easy and simple to handle, through opening emery wheel 3 that has oval form recess, be the cambered surface with silicon dish 9 contact department, adopt vacuum chuck to fix the silicon chip simultaneously, can directly carry out the chamfer to silicon dish 9 surface, once accomplish, high-efficient swift, greatly improved the production efficiency of enterprise, can promote on a large scale.

It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a silicon disc (9) quick beveler, includes organism, workstation (1), fixing device (2) and emery wheel (3), workstation (1) is fixed on the organism, fixing device (2) set up in on workstation (1), emery wheel (3) set up in directly over fixing device (2), its characterized in that: one surface of the grinding wheel (3) close to the fixing device (2) is provided with an elliptical groove; the fixing device (2) is a vacuum chuck.

2. The silicon disc (9) quick chamfering machine according to claim 1, wherein: the vacuum sucker comprises a sucker body (6), an auxiliary bulge (7) and a suction hole (8); the sucker body (6) is cylindrical, the auxiliary protrusions (7) are in a circular ring shape and fixed on the periphery of the upper surface of the sucker body (6), and the suction holes (8) are formed in the center of the upper surface of the sucker body (6).

3. The silicon disc (9) quick chamfering machine according to claim 2, wherein: the suction hole (8) is communicated with a vacuum generator.

4. The silicon disc (9) quick chamfering machine according to claim 1, wherein: the grinding wheel (3) is connected with a rotating motor (4), the rotating motor (4) is fixed on a lifting screw rod (5), the lifting screw rod (5) is vertically fixed on the machine body, and the rotating motor (4) moves up and down through the lifting screw rod (5).

5. The silicon disc (9) quick chamfering machine according to claim 4, wherein: the grinding wheel (3) is connected with the rotating motor (4) through a rotating shaft.

6. The silicon disc (9) quick chamfering machine according to claim 1, wherein: the workbench (1) is provided with a scrap collecting tank which surrounds the fixing device (2).