CN210577915U

CN210577915U - Power supply module

Info

Publication number: CN210577915U
Application number: CN201921465385.3U
Authority: CN
Inventors: 陆新城; 段花山; 贺先忠; 代勇敏; 朱文斌
Original assignee: Shandong Jingdao Microelectronics Co ltd
Current assignee: Shandong Jingdao Microelectronics Co ltd
Priority date: 2019-09-05
Filing date: 2019-09-05
Publication date: 2020-05-19
Anticipated expiration: 2029-09-05

Abstract

The utility model discloses a power module (100), include: -an IC power control chip (5), -a rectifying diode chip (1,2,3,4), -a transient voltage suppression diode chip (6) connected in parallel to an input or output loop of a diode chip (1,2,3,4), wherein when said transient voltage suppression diode chip (6) is connected in parallel to an output loop of said rectifying diode chip (1,2,3, 4): the IC power control chip (5) and the transient voltage suppression diode chip (6) are integrated in a package (8) with a plurality of pins, or the IC power control chip (5), the rectifier diode chips (1,2,3,4) and the transient voltage suppression diode chip (6) are integrated in the package (8). The utility model discloses a power module can control circuit such as drive LED banks illumination and charger with the mode of miniaturisation for power module after the miniaturization can more extensive application in various lighting apparatus or miniwatt circuit.

Description

Power supply module

Technical Field

The present invention relates generally to the field of semiconductor electronic devices. More particularly, the present invention relates to a power module that may be used, for example, to control circuits that drive LED light banks, lighting and chargers.

Background

Because of its high luminous efficiency, LED lighting has become the mainstream lighting mode in the world today, because it saves energy significantly compared to the traditional lighting mode, and has a longer life. Especially, light source products such as bulbs, down lamps and tubes generally need a built-in power supply driving board, the space in the lamp is very small, and the requirement on cost is extremely high due to the huge using amount; the requirement is also suitable for application requirements of mobile phone chargers and the like.

The LED lamp beads used in the lighting products and the mobile phone charging need to convert alternating current into direct current, and the alternating current is finally converted into a proper current source or voltage source through the control and driving of the IC power management chip, so that the requirements of light emitting, lighting and charging of the LED lamp are met. At present, the mainstream LED driving has the schemes of non-isolation, linearity and the like, and the mature general method is to adopt an independent pulse protection component, a rectifier bridge and an independent IC power management chip to convert alternating current in a power grid into a proper current source or voltage source so as to drive an LED lamp bead to emit light. The circuit connections of the exemplary LED power driver module are shown schematically in fig. 1-6.

With the development of the integrated circuit production process, the integration level and the reliability requirement of a power management chip are higher and higher, and devices such as a voltage dependent resistor, a transient suppression diode and the like must be added to a circuit under the condition of meeting the energy star requirements of safety regulations, combined waves and the like, so that the circuit can bear the influence of burst pulse voltage and large current impact. The conventional method in the prior art comprises the following steps: a rectifier bridge consisting of four diodes is used as an input loop of alternating current, the alternating current is converted into pulsating direct current, and the pulsating direct current is smoothly supplied to a post-stage IC control circuit to work by a filter capacitor; a voltage dependent resistor is connected in parallel at the input end, or a high-voltage protection device is added at the rear stage of the rectifier bridge; the rectifier bridge, the IC control chip and the protection device are separately welded on the circuit board, so that the size and the cost of the circuit board cannot be well controlled, the competitiveness and the wide application of the whole product are influenced, the integration degree is not high, and the miniaturization of the circuit is influenced.

Therefore, how to provide a power module with high integration degree, small circuit size, low manufacturing cost and easy control is a subject of research.

SUMMERY OF THE UTILITY MODEL

In order to solve at least the prior art drawbacks described in the background section above, the present invention provides a power module, which includes: an IC power control chip provided with a plurality of pads and configured to perform management and control on the power module; a rectifying diode chip having a plurality of pins connected to the IC power control chip and configured to convert an input alternating current into a direct current; and a transient voltage suppression diode chip connected in parallel to an input loop or an output loop of the rectifying diode chip and configured to protect the IC power control chip from interference.

In the above power module, when the transient voltage suppression diode chip is connected in parallel to the output loop of the rectifier diode chip:

said IC power control chip and transient voltage suppression diode chip being integrated within a package having a plurality of pins with said rectifier diode chip being connected to said package external to said package, and wherein said IC power control chip and transient voltage suppression diode chip are connected to associated pins of said package by associated pads and pins for effecting a power output in operation; or

The IC power control chip, the rectifier diode chip and the transient voltage suppression diode chip are integrated within a package having a plurality of pins, and wherein the IC power control chip, the rectifier diode chip and the transient voltage suppression diode chip are connected to associated pins of the package by associated pads and pins to achieve a power output in operation.

In one embodiment, the IC power control chip, the rectifying diode chip and the transient voltage suppression diode chip are integrated within the package when the transient voltage suppression diode chip is connected in parallel to the input loop of the rectifying diode chip, and wherein the IC power control chip, the rectifying diode chip and the transient voltage suppression diode chip are connected to associated pins of the package by associated pads and pins to achieve a power output in operation.

In another embodiment, when the transient voltage suppression diode chip is connected in parallel to the input loop of the rectifier diode chip, the transient voltage suppression diode chip is connected to two alternating current input terminals (AC1, AC2) of the rectifier diode chip.

In yet another embodiment, wherein the transient voltage suppression diode chip is connected to a high voltage output terminal and a common ground terminal among the plurality of pins of the package when the transient voltage suppression diode chip is connected in parallel to the output loop of the rectifier diode chip.

In one embodiment, the IC power control chip includes a mosfet to store energy in an energy storage component by controlling the mosfet switch.

In yet another embodiment, further comprising a freewheeling diode chip integrated within the package and connected to the high voltage control terminal and the high voltage output terminal in the plurality of pins of the package.

In another embodiment, the device further comprises a freewheeling diode chip integrated within the package, one end of which is connected to a high-voltage control terminal among the plurality of pins of the package, and the other end of which is connected to a second transient voltage suppression diode chip outside the package.

In one embodiment, the device further comprises a second transient voltage suppression diode chip integrated within the package, one end of the second transient voltage suppression diode chip being connected to a high voltage control terminal of the plurality of pins of the package, and the other end of the second transient voltage suppression diode chip being connected to a freewheeling diode chip outside of the package.

In yet another embodiment, further comprising a second transient voltage suppression diode chip and a freewheeling diode chip integrated within the package, the second transient voltage suppression diode chip and freewheeling diode chip connected in series and connected to the high voltage control terminal and the high voltage output terminal in the plurality of pins of the package.

In another embodiment, the IC further comprises a mosfet integrated in the package, wherein a pad of the IC power control chip is connected to a gate of the mosfet, and a drain of the mosfet is connected to a high voltage control terminal among the pins of the package.

In one embodiment, further comprising a freewheeling diode chip integrated within the package and connected to the high-voltage control terminal and the high-voltage output terminal of the plurality of pins of the package.

In yet another embodiment, further comprising: a second transient voltage suppression diode chip integrated within the package, one end of which is connected to a high voltage output terminal among the plurality of pins of the package, and the other end of which is connected to a freewheeling diode chip outside the package; or a second transient voltage suppression diode chip and a freewheeling diode chip integrated within the package, the second transient voltage suppression diode chip and the freewheeling diode chip being connected in series and connected to a high-voltage control terminal and a high-voltage output terminal of the plurality of pins of the package.

In one embodiment, wherein said transient voltage suppression diode chip is a unidirectional transient voltage suppression diode chip and is connected in parallel to the output loop of said rectifier diode chip, or said transient voltage suppression diode chip is a bidirectional transient voltage suppression diode chip and is connected in parallel to the input loop of said rectifier diode chip.

Through the foregoing, the technical personnel in the field can understand the utility model discloses a scheme and the description of a plurality of embodiments thereof the utility model discloses a power module can form an solitary integrated circuit through integrated rectifier diode chip and IC power control chip in a packaging body, has overcome among the prior art because difference and the degree of difficulty on the production technology and be difficult to integrate both in single chip simultaneously for power module after the miniaturization can be more extensive in the application to various lighting apparatus, has promoted the competitiveness of whole product. Additionally, utilize the utility model discloses a scheme can be with circuits such as the illumination of minimality mode control drive LED banks and charger, consequently the utility model discloses a scheme also is suitable for to circuit board volume and cost have multiple AC-DC power fields such as LED lighting drive, cell-phone charger of higher requirement, for example in the low-power circuit.

Drawings

The essential features of the invention are set forth in particular in the appended claims. A better understanding of the features and advantages of the present invention will be obtained by reference to the following detailed description that sets forth illustrative embodiments, in which the principles of the invention are utilized, and the accompanying drawings. In the drawings:

FIGS. 1-6 are conventional typical exemplary LED driver circuits;

fig. 7 is a schematic circuit block diagram generally illustrating a power module according to an embodiment of the present invention;

fig. 8 is a circuit configuration diagram illustrating a power module of a linear control LED driving scheme according to an embodiment of the present invention;

fig. 9 is another circuit block diagram illustrating a power module of a linear control LED driving scheme according to an embodiment of the present invention;

fig. 10 is a circuit block diagram illustrating a power module of a non-isolated LED driving scheme according to an embodiment of the present invention;

fig. 11 is a circuit block diagram illustrating another power module of a non-isolated LED driving scheme according to an embodiment of the present invention;

fig. 12 is a circuit block diagram illustrating a power module of an isolated power/LED drive scheme according to an embodiment of the invention;

fig. 13 is a circuit block diagram illustrating another power module of an isolated power/LED drive scheme according to an embodiment of the invention;

fig. 14 is a circuit block diagram illustrating yet another power module of an isolated power/LED drive scheme according to an embodiment of the invention; and

fig. 15 is a circuit block diagram illustrating yet another power module of an isolated power/LED driving scheme according to an embodiment of the present invention.

Detailed Description

The utility model discloses to prior art not enough, provide a brand-new realizable solution. In particular, different use requirements are met by flexible chip combination integration. Those skilled in the art will appreciate from the following description that the present invention relates to various embodiments of power modules (or power module groups). Modifications to the exemplary circuit structures, connections, or substitutions for certain components of the invention that are within the scope of the invention as defined by the claims, may be made by those skilled in the art in light of the teachings of this disclosure.

In an exemplary description, aspects of the present invention relate to a linear LED driver module, which may include a TVS transient voltage suppression diode (or "transient suppression diode"). In one embodiment, a bidirectional TVS tube may be added across the bridge input stage formed by the rectifier diode circuit. Similarly, a unidirectional or bidirectional TVS tube can be added to the output of the rectifier diode circuit in the same manner. Because the introduction of transient state suppression diode, the utility model discloses a scheme has still simplified the circuit and the cost of application end when guaranteeing that LED drive power supply satisfies reliability experiment requirements such as combination wave. In operation, the power module of the present invention can allow direct input of 220V or 110V ac (50Hz/60Hz) and convert it into dc through the full-bridge rectifier circuit, without adding additional voltage dependent resistor and TVS tube. Additionally, the utility model discloses a module can also be external filter capacitor in order to carry out level and smooth to high-voltage direct current, handles through the inside IC control chip of module (or call AC-DC chip) again to circuits such as the illumination of the drive LED banks of minimality mode control and charger are suitable for the LED drive illumination that has higher requirement to circuit board volume and cost.

Various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Fig. 1-6 are conventional typical exemplary LED driving circuits, which do not have the chip integration (or sealing) scheme of the present invention. Specifically, fig. 1 and 2 are example circuit diagrams for a linear control LED driving scheme, fig. 3 and 4 are example circuit diagrams for a non-isolated LED driving scheme, and fig. 5 and 6 are example circuit diagrams for an isolated power supply/LED driving scheme. In fig. 1, 3 and 5, a linear LED drive of a transient voltage suppressing diode (TVS) is added to the front end of the ac input of the rectifier bridge, and the TVS mainly plays a role in effectively suppressing lightning strike, electromagnetic pulse interference, and the like, and protects a rear-stage circuit from being damaged, so that the TVS can normally operate in a complex electromagnetic environment. In fig. 2, 4 and 6, a TVS tube linear LED drive is added at the output end of the ac rectifier, and the TVS tube mainly plays a role in effectively suppressing lightning strikes, electromagnetic pulse interference and the like, protects the rear-stage IC control circuit from being damaged, and can normally operate in a complex electromagnetic environment.

Fig. 7 is a schematic circuit block diagram generally illustrating a power module 100 according to an embodiment of the present invention. As shown in fig. 7, the power module 100 of the present invention includes an IC power control chip (also referred to as AC-DC chip) 5 and

rectifier diode chips

1,2,3, and 4. The IC power control chip 5 may be provided with a plurality of pads and configured to perform management and control of the power module 100. The rectifying

diode chips

1,2,3,4 have a plurality of pins connected to the IC power control chip 5, and are configured to convert an input alternating current into a direct current. Further, the power module 100 may further include a transient voltage suppression diode (TVS) chip 6, which may be connected in parallel to the input loop or the output loop of the rectifying

diode chips

1,2,3 and 4. As described above, when the TVS chips are connected in parallel to the ac input front ends or the ac output ends of the

rectifier diode chips

1,2,3, and 4, the TVS chips mainly perform effective suppression of lightning strikes, electromagnetic pulse interference, and the like, and protect the rear-stage circuit from being damaged, thereby operating normally in a complex electromagnetic environment.

According to the utility model discloses a scheme, when TVS chip parallel connection is in rectifying

diode chip

1,2,3 and 4 alternating current rectification output circuit, IC power control chip 5 and TVS chip 6 can be integrated in the packaging body 8 that has a plurality of pins, and rectifying

diode chip

1,2,3 and 4 are in packaging body 8 outside with packaging body 8 connects, and wherein IC power control chip and transient voltage suppression diode chip through relevant pad and pin with the relevant pin of packaging body is connected to realize power output in the operation, as shown in FIG. 7.

Alternatively or additionally, when the TVS chip 6 is connected in parallel to the output loop of the rectifying

diode chips

1,2,3 and 4, the IC power control chip 5, the rectifying

diode chips

1,2,3 and 4 and the TVS chip 6 may also be integrated in a package 8 having a plurality of pins, and wherein the IC power control chip 5, the rectifying

diode chips

1,2,3 and 4 and the TVS chip 6 may be connected to the associated pins of the package 8 through associated pads and pins so as to achieve a power output in operation.

In one embodiment, when the TVS chip 6 is connected in parallel to the input loop (i.e., ac input front end) of the rectifying

diode chips

1,2,3 and 4, the IC power control chip 5, the rectifying

diode chips

1,2,3 and 4 and the TVS chip 6 may be integrated within the package 8, and wherein the IC power control chip 5, the rectifying

diode chips

1,2,3 and 4 and the TVS chip 6 are connected to the associated pins of the package through the associated pads and pins to achieve a power output in operation.

In foretell the utility model discloses in the scheme,

rectifier diode chip

1,2,3 and 4 can realize the bridge type rectification through welding to copper frame on with processes such as wire bonding, and IC power control chip 5 can realize the functional connection of circuit through copper frame welding or silver thick liquid bonding and many bonding lead. In one embodiment, the IC power control chip 5 may be integrated with a metal oxide semiconductor type field effect transistor (MOSFET). Through various possible connection modes, the utility model discloses a power module 100 can drive the LED circuit or charge to outside portable equipment.

Fig. 8 is a structural diagram illustrating a power module according to an embodiment of the present invention. The power supply module shown in the block diagram improves the circuit structure of the linear control LED driving scheme shown in fig. 1. As shown in fig. 8, the rectifying

diode chips

1,2,3,4 (four chips in total), the IC power control chip 5 and the TVS chip 6 may be integrated in a package (e.g., a plastic package) 8 to form a single integrated circuit, wherein the TVS is a bidirectional transient suppressor connected in parallel to the ac input loop of the rectifying diode chips.

The package 8 has a plurality of pins and includes the aforementioned six chips, a copper frame (PAD) of four solderable chips (i.e., a lead frame), and a plurality of metal bonding wires 7. In the exemplary connection shown, four of the rectifying

diode chips

1,2,3 and 4 are bridge rectified by soldering to a copper frame and wire bonding, which includes two AC inputs (AC1/AC2), a common Ground (GND), and a high voltage output (HV). The IC power control chip 5 can achieve functional connection of the circuit through copper frame soldering or silver paste bonding and multiple bonding wires, and provides three outer leads. In an exemplary connection mode, one pad on the IC power control chip 5 may be connected to a high voltage control pin (DRAIN) of the package 8 through a bonding wire, and the ground pad thereof and the common ground of the diode rectifying chip are externally connected to a common Ground (GND) through a bonding wire. In addition, the sampling terminal of the IC power control chip 5 may be externally connected to a terminal (CS) through a bonding wire. The sixth chip shown is a TVS chip 6, and in one embodiment, this TVS chip 6 shares a PAD (PAD) with one of the rectifying

diode chips

1,2,3 and 4, and is electrically connected to the AC inputs AC1 and AC 2.

Fig. 9 is another circuit configuration diagram illustrating a power module of a linear control LED driving scheme according to an embodiment of the present invention. The power supply module shown in the block diagram improves the circuit structure of the linear control LED driving scheme shown in fig. 2. As shown in fig. 9, the rectifying

diode chips

1,2,3,4 (four chips in total), the IC power control chip 5 and the TVS chip 6 may be integrated in one package 8 to form a single integrated circuit, wherein the TVS is a unidirectional or bidirectional transient suppressor connected in parallel to the ac rectifying output loop of the rectifying diode chip.

The package 8 has a plurality of pins and contains therein the aforementioned six chips, a lead frame of five solderable chips and a plurality of metal bonding wires 7. Four rectifier diode chips are bridge rectified by welding on a copper frame and wire bonding, and two alternating current input ends (AC1/AC2), a common ground end (GND) and a high voltage output end (HV) are provided. In an exemplary connection, the IC power control chip 5 may be functionally connected to the circuit by copper frame soldering or silver paste bonding and a plurality of bonding wires, and provides three external pins, and one pad on the IC power control chip 5 may be connected to a high voltage control terminal pin (DRAIN) of the package 8 by a bonding wire. Further, the ground pad of the IC power control chip 5 is connected to the common ground of the rectifier diode chip by a bonding wire, and is externally connected to the common Ground (GND). In addition, the sampling terminal of the IC power control chip 5 is externally connected to a terminal (CS) via a bonding wire. As shown, one terminal of the TVS chip 6 shares a PAD (PAD) with two of the rectifier diode chips and is connected to the high voltage output terminal (HV), and the other terminal is Grounded (GND).

Fig. 10 is a circuit block diagram illustrating a power module of a non-isolated LED driving scheme according to an embodiment of the present invention. The power supply module shown in the block diagram improves the circuit structure of the non-isolated LED driving scheme shown in fig. 3. As shown in fig. 9, TVS chip 6, rectifying

diode chips

1,2,3, and 4 (four chips in total), and IC power control chip 5 may be integrated in one package 8 to form a single integrated circuit. The TVS tube is a bidirectional transient suppression tube and is connected in parallel with the alternating current input loop.

The package body 8 has a plurality of pins and is provided therein with a copper lead frame (PAD) containing the aforementioned six chips, four solderable chips and a plurality of metal leads 7. The four

rectifying diode chips

1,2,3 and 4 are used for realizing bridge rectification by welding to a copper frame and performing wire bonding and other processes, and comprise 2 alternating current input ends (AC1/AC2), a common ground end (GND) and a high voltage output end (HV). In an exemplary connection, the IC power control chip 5 may be functionally connected to the circuit by means of copper frame soldering or silver paste bonding and a plurality of bonding wires, and provides three external pins. One pad on the IC power control chip 5 may be connected to a high voltage control terminal pin (DRAIN) of the package 8 by a bonding wire. Further, the common ground terminal of the IC power control chip 5 and the rectifying diode chip is connected to an external common ground terminal (GND) through a bonding wire. In addition, the sampling terminal of the IC power control chip 5 is externally connected to a terminal (CS) via a bonding wire. As shown, the TVS chip 6 shares a PAD (PAD) with one of the

rectifier diodes

1,2,3, and 4 and is electrically connected to the AC input terminals AC1 and AC 2.

Fig. 11 is a circuit block diagram illustrating another power module of a non-isolated LED driving scheme according to an embodiment of the present invention. The power supply module shown in the block diagram improves the circuit structure of the non-isolated LED driving scheme shown in fig. 4. As shown in fig. 11, the rectifying

diode chips

1,2,3,4 (four chips in total), the IC power control chip 5 and the TVS chip 6 may be integrated in one package 8 to form a single integrated circuit, wherein the TVS is a unidirectional or bidirectional transient suppressor connected in parallel to the ac rectifying output loop of the rectifying diode chips.

The package 8 has a plurality of pins and contains therein the aforementioned six chips, a copper lead frame (PAD) of four solderable chips and a plurality of metal bonding wires 7. Four rectifier diode chips are bridge rectified by welding on a copper frame and wire bonding, and two alternating current input ends (AC1/AC2), a common ground end (GND) and a high voltage output end (HV) are provided. In an exemplary connection, the IC power control chip 5 may be functionally connected to the circuit by copper frame soldering or silver paste bonding and a plurality of bonding wires, and provides three external pins, and one pad on the IC power control chip 5 may be connected to a high voltage control terminal pin (DRAIN) of the package 8 by a bonding wire. Further, the ground pad of the IC power control chip 5 is connected to the common ground of the rectifier diode chip by a bonding wire, and is externally connected to the common Ground (GND). In addition, the sampling terminal of the IC power control chip 5 is externally connected to a terminal (CS) via a bonding wire. As shown, one terminal of the TVS chip 6 shares a PAD (PAD) with two of the rectifier diode chips and is connected to the high voltage output terminal (HV), and the other terminal is Grounded (GND).

Fig. 12 is a circuit block diagram illustrating a power module of an isolated power/LED driving scheme according to an embodiment of the present invention. The power module shown in this block diagram improves the circuit structure of the isolated power/LED driving scheme shown in fig. 5. As shown in fig. 12, TVS chip 6, rectifying

diode chips

rectifying diode chips

rectifier diodes

Fig. 13 is a circuit block diagram illustrating another power module of an isolated power/LED driving scheme according to an embodiment of the invention. The power module shown in this block diagram improves the circuit structure of the isolated power/LED driving scheme shown in fig. 6. As shown in fig. 13, the rectifying

diode chips

Fig. 14 is a circuit block diagram illustrating yet another power module of an isolated power/LED driving scheme according to an embodiment of the invention. The power module shown in this block diagram improves the circuit configuration of an isolated power/LED driving scheme similar to that shown in fig. 5. As shown in fig. 14, the

rectifier diode chips

1,2,3, and 4 (four chips in total), the IC power control chip 5, the TVS chip 6 (i.e., D-TVS shown in the figure), the metal oxide semiconductor type field effect transistor (MOSFET)9, the freewheeling diode chip 10, and the second transient voltage suppression diode chip (i.e., "second TVS chip") 11 may be integrated in one package 8 to form a single integrated circuit. Similar to the above discussion, the TVS chip 6 (also referred to as "the first transient voltage suppression diode chip" or "the first TVS chip") is a bidirectional transient suppression transistor (D-TVS) connected in parallel to the ac input circuit, and mainly plays a role in effectively suppressing lightning strike, electromagnetic pulse interference, etc., protecting the rear stage circuit from damage, and operating normally in a complex electromagnetic environment. In contrast, the second TVS chip 11 and the freewheeling diode chip 10 together serve as a bypass circuit of the isolation transformer, performing freewheeling, reverse switching pulse clamping, and magnetic recovery functions.

The package body 8 has a plurality of pins and is provided therein with a copper lead frame (PAD) containing the aforementioned nine chips, six solderable chips and a plurality of metal leads 7. The four

rectifying diode chips

1,2,3 and 4 are used for realizing bridge rectification by welding to a copper frame and performing wire bonding and other processes, and comprise 2 alternating current input ends (AC1/AC2), a common ground end (GND) and a high voltage output end (HV). In an exemplary connection, the IC power control chip 5 may be functionally connected to the circuit by means of copper frame soldering or silver paste bonding and a plurality of bonding wires, and provides four external pins. One pad on the IC power control chip 5 may be connected to the MOSFET 9 by a bonding wire. Further, the ground pad of the IC power control chip 5 is connected to the common ground of the rectifier diode chip by a bonding wire, and is externally connected to the common Ground (GND). In addition, the sampling terminal of the IC power control chip 5 is externally connected to a terminal (CS) via a bonding wire. As shown, the D-TVS chip 6 is connected in parallel with the AC inputs AC1 and AC2 of the

rectifier diodes

1,2,3, and 4. One end of the second TVS chip is connected to the freewheeling diode chip 10, and the other end is connected to the high voltage output terminal (HV).

Fig. 15 is a circuit block diagram illustrating yet another power module of an isolated power/LED driving scheme according to an embodiment of the present invention. The block diagram shows a power module that improves on the circuit structure of an isolated power/LED driving scheme similar to that shown in fig. 6. As shown in fig. 15, the rectifying

diode chips

1,2,3,4 (four chips in total), the IC power control chip 5, the D-TVS 6, the MOSFET 9, the freewheel diode 10, and the second TVS chip 11 may be integrated in one package 8 to form a single integrated circuit, wherein the D-TVS is a bidirectional transient suppressor connected in parallel to an ac rectified output loop of the rectifying diode chips.

The package 8 has a plurality of pins and contains therein the aforementioned nine chips, a lead copper frame (PAD) of six solderable chips and a plurality of metal bonding wires 7. Four rectifier diode chips are bridge rectified by welding on a copper frame and wire bonding, and two alternating current input ends (AC1/AC2), a common ground end (GND) and a high voltage output end (HV) are provided. In an exemplary connection, the IC power control chip 5 may be functionally connected to the circuit by copper frame soldering or silver paste bonding and a plurality of bonding wires, and provides four external pins, and one pad on the IC power control chip 5 may be connected to the MOSFET 9 by a bonding wire. Further, the ground pad of the IC power control chip 5 is connected to the common ground of the rectifier diode chip by a bonding wire, and is externally connected to the common Ground (GND). In addition, the sampling terminal of the IC power control chip 5 is externally connected to a terminal (CS) via a bonding wire. As shown, one terminal of the D-TVS chip 6 is connected to the high voltage output terminal (HV), and the other terminal is Grounded (GND), thereby being connected in parallel to the ac rectified output loop of the rectifying

diode chips

1,2,3, and 4. The second TVS chip 11 is connected at one end to the freewheeling diode chip 10 and at the other end to the high voltage output (HV), and the illustrated freewheeling diode chip 10 is connected at one end to the second TVS chip 11 and at the other end to the MOSFET 9.

From the above description of fig. 14 and 15, those skilled in the art can understand that the package of the present invention can be flexibly applied by packaging or integrating different chips. Although fig. 14 and 15 show the rectifier diode chip, TVS (D-TVS) chip, IC power control chip, MOSFET, freewheeling diode, and second TVS chip enclosed in a package, it is also contemplated by those skilled in the art in light of the teachings of the present invention to integrate some of the above chips in a package and place others outside of the package.

Based on the above considerations, the present invention also provides the following embodiments of multiple chip arrangements to at least implement isolation, non-isolation and linear schemes of the LED driving circuit.

In one embodiment, the IC power control chip of the present invention includes a MOSFET to store energy in an energy storage component by controlling the switching of the MOSFET.

In the above case where the IC power control chip includes or has integrated therein a MOSFET, the present invention may further include a plurality of the following parallel selection schemes:

a freewheeling diode chip integrated within the package and connected to a high-voltage control terminal and a high-voltage output terminal of the plurality of pins of the package; or preferably

A freewheeling diode chip integrated within the package, one end of which is connected to a high-voltage control terminal among the plurality of pins of the package, and the other end of which is connected to a second transient voltage suppression diode chip outside the package; or preferably

A second transient voltage suppression diode chip integrated within the package, one end of which is connected to a high voltage control terminal among the plurality of pins of the package, and the other end of which is connected to a freewheeling diode chip outside the package; or preferably

And a second transient voltage suppression diode chip and a freewheeling diode chip integrated within the package, the second transient voltage suppression diode chip and the freewheeling diode chip connected in series and connected to a high-voltage control terminal and a high-voltage output terminal in the plurality of pins of the package.

In another embodiment, the power module of the present invention may further include a mosfet integrated in the package, wherein one pad of the IC power control chip is connected to a gate of the mosfet, and a drain of the mosfet is connected to a high voltage control terminal among the plurality of pins of the package.

In the case of the above IC power control chip and the mosfet being separated, the present invention may further include a plurality of following schemes selected in parallel:

a freewheeling diode chip integrated within the package and connected to a high voltage control terminal and a high voltage output terminal of the plurality of pins of the package; or preferably

A second transient voltage suppression diode chip integrated within the package, one end of which is connected to a high voltage output terminal among the plurality of pins of the package, and the other end of which is connected to a freewheeling diode chip outside the package; or preferably

From the above description, those skilled in the art can understand that in the above embodiments of the present invention and the different embodiments thereof, what performs the conversion from the alternating current to the direct current may be a rectifier diode chip, which may constitute a rectifier bridge circuit to realize the rectification function of converting the high-voltage alternating current into the high-voltage direct current, and the rectifier bridge circuit may include a copper lead frame with at least three bonding pads and four bonding leads. The IC power control chip can be integrated with a control logic circuit and adopts an independent copper lead frame, so that the high-voltage isolation circuit has good heat dissipation and safe high-voltage isolation efficiency.

In addition, as mentioned above, in the solution of the present invention, it is also allowed that the IC power control chip (which may also be referred to as a driving control IC chip) adopts an integrated field effect transistor (MOSFET) and a design in which the IC power control chip is separated from the MOSFET. The TVS chip may share a frame with a rectifying diode or have a separate frame according to different embodiments. When the TVS chip has an independent frame, it also uses a copper lead frame as a carrier, and the two have a plurality of leads for functional connection, so as to have a good heat dissipation efficiency. When the TVS transient suppression diode, the rectifier diode chip and the IC power control chip are integrated to meet different use requirements, the utility model discloses as before, still allow to integrate freewheel diode and clamp TVS pipe (for example, the second TVS chip as before) in non-isolation and isolation circuit. Thus, the second TVS, together with the freewheeling diode, acts as a bypass circuit for the isolation transformer, acting as a freewheel, reverse switching pulse clamp, and magnetic recovery.

The utility model discloses a copper lead frame can regard as integrated chip welding carrier and play the electric connection effect. Further, the utility model discloses a bonding lead can be ultrasonic bonding, gold wire ball bonding and laser welding on the lead wire technology, can compatible silicon aluminium silk, thick aluminum wire, gold thread and copper line in the material. In addition, the number of pins of the package of the present invention may be plural (for example, not limited to eight pins), and other numbers of pins may be allowed as necessary. In addition, according to the application of difference, the utility model discloses a can be provided with up to four or five independent copper frame base PAD (PAD) and six independent chips in the encapsulation.

The technical solution of the present invention is described in detail above with reference to the accompanying drawings of the present invention. Through the above description, those skilled in the art can understand that the integrated chip structure of the present invention can integrate the TVS tube together with the rectifier diode chip and the IC power control chip in a package, so as to have better use experience and performance/cost ratio, and expand the application range and application flexibility of the power module, and is particularly suitable for the LED lighting with higher requirements on the volume and cost of the power board.

While various embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous modifications, changes, and substitutions will occur to those skilled in the art without departing from the spirit and scope of the present invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. The following claims are intended to define the scope of the invention and, therefore, to cover module compositions, equivalents, or alternatives falling within the scope of these claims.

Claims

1. A power supply module (100), comprising:

an IC power control chip (5) provided with a plurality of pads and configured to perform management and control of the power module (100);

a rectifying diode chip (1,2,3,4) having a plurality of pins connected to the IC power control chip (5) and configured to convert an input alternating current into a direct current; and

a transient voltage suppression diode chip (6) connected in parallel to an input loop or an output loop of the rectifying diode chip (1,2,3,4) and configured to protect the IC power control chip (5) from interference,

wherein when said transient voltage suppression diode chip (6) is connected in parallel to the output loop of said rectifying diode chip (1,2,3, 4):

-said IC power control chip (5) and transient voltage suppression diode chip (6) are integrated in a package (8) having a plurality of pins, while said rectifying diode chips (1,2,3,4) are connected with said package (8) outside said package (8), and wherein said IC power control chip (5) and transient voltage suppression diode chip (6) are connected with the associated pins of said package (8) by means of associated pads and pins, so as to realize a power output in operation; or

The IC power control chip (5), the rectifying diode chips (1,2,3,4) and the transient voltage suppression diode chip (6) are integrated in a package (8) having a plurality of pins, and wherein the IC power control chip (5), the rectifying diode chips (1,2,3,4) and the transient voltage suppression diode chip (6) are connected to associated pins of the package (8) by associated pads and pins for enabling a power output in operation.

2. The power supply module according to claim 1, wherein the IC power control chip (5), the rectifying diode chips (1,2,3,4) and the transient voltage suppression diode chip (6) are integrated within the package (8) when the transient voltage suppression diode chip (6) is connected in parallel to the input loop of the rectifying diode chips (1,2,3,4), and wherein the IC power control chip (5), the rectifying diode chips (1,2,3,4) and the transient voltage suppression diode chip (6) are connected with the associated pins of the package (8) by associated pads and pins so as to realize a power output in operation.

3. Power supply module according to claim 1 or 2, characterized in that the transient voltage suppression diode chip (6) is connected to both alternating current inputs (AC1, AC2) of the rectifying diode chip (1,2,3,4) when the transient voltage suppression diode chip (6) is connected in parallel to the input loop of the rectifying diode chip (1,2,3, 4).

4. The power supply module according to claim 1 or 2, characterized in that when the transient voltage suppression diode chip (6) is connected in parallel to the output loop of the rectifying diode chip (1,2,3,4), the transient voltage suppression diode chip (6) is connected to a high voltage output and a common ground among the pins of the package (8).

5. The power supply module according to claim 1 or 2, wherein the IC power control chip (5) comprises a mosfet (9) to store energy in an energy storage component by controlling the switching of the mosfet.

6. The power module of claim 5, further comprising:

a freewheeling diode chip (10) integrated within the package (8) connected to a high-voltage control terminal and a high-voltage output terminal of the plurality of pins of the package; or

A freewheeling diode chip (10) integrated within said package (8), one end of which is connected to a high-voltage control terminal among the pins of said package (8), and the other end of which is connected to a second transient voltage suppression diode chip outside said package (8); or

-a second transient voltage suppression diode chip (11) integrated within said package (8), one end of which is connected to a high voltage control terminal of a plurality of pins of said package (8), and the other end of which is connected to a freewheeling diode chip (10) external to said package (8); or

A second transient voltage suppression diode chip (11) and a freewheeling diode chip (10) integrated within the package (8), the second transient voltage suppression diode chip (11) and freewheeling diode chip (10) connected in series and connected to high voltage control and high voltage output terminals in a plurality of pins of the package.

7. The power supply module according to claim 1 or 2, further comprising a mosfet (9) integrated in the package (8), wherein one pad of the IC power control chip (5) is connected to a gate of the mosfet (9), and a drain of the mosfet is connected to a high voltage control terminal among the pins of the package.

8. The power module of claim 7, further comprising:

a freewheeling diode chip (10) integrated within the package (8) connected to a high-voltage control terminal and a high-voltage output terminal of the plurality of pins of the package (8); or

A freewheeling diode chip (10) integrated within said package (8), one end of which is connected to a high-voltage control terminal among the pins of said package (8), and the other end of which is connected to a second transient voltage suppression diode chip (11) outside said package (8); or

-a second transient voltage suppression diode chip (11) integrated within said package (8), one end of which is connected to a high voltage output of said plurality of pins of said package (8) and the other end of which is connected to a freewheeling diode chip (10) external to said package (8); or

A second transient voltage suppression diode chip (11) and a freewheeling diode chip (10) integrated within the package (8), the second transient voltage suppression diode chip (11) and freewheeling diode chip (10) connected in series and connected to high voltage control and high voltage output terminals in a plurality of pins of the package (8).

9. Power supply module according to claim 1 or 2, characterized in that the transient voltage suppression diode chip (6) is a unidirectional transient voltage suppression diode chip and it is connected in parallel to the output loop of the rectifying diode chip (1,2,3,4), or that the transient voltage suppression diode chip (6) is a bidirectional transient voltage suppression diode chip and it is connected in parallel to the input loop of the rectifying diode chip (1,2,3, 4).