CN110391689A - Power module - Google Patents
Power module Download PDFInfo
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- CN110391689A CN110391689A CN201910834593.4A CN201910834593A CN110391689A CN 110391689 A CN110391689 A CN 110391689A CN 201910834593 A CN201910834593 A CN 201910834593A CN 110391689 A CN110391689 A CN 110391689A
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- Prior art keywords
- chip
- packaging body
- power supply
- transient voltage
- voltage suppressor
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 97
- 230000001052 transient effect Effects 0.000 claims abstract description 76
- 238000005538 encapsulation Methods 0.000 claims description 22
- 230000005669 field effect Effects 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000004146 energy storage Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 230000002452 interceptive effect Effects 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 238000005286 illumination Methods 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 31
- 229910052802 copper Inorganic materials 0.000 description 30
- 239000010949 copper Substances 0.000 description 30
- 238000003466 welding Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 238000005070 sampling Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 208000025274 Lightning injury Diseases 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
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- 238000004134 energy conservation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
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Classifications
-
- H02J7/045—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
Abstract
The invention discloses a kind of power module (100), it include: IC power supply control chip (5), rectifier diode chip (1, 2, 3, 4), transient voltage suppressor chip (6), it is connected in parallel in diode chip for backlight unit (1, 2, 3, 4) input or output loop, wherein when the transient voltage suppressor chip (6) is connected in parallel in the rectifier diode chip (1, 2, 3, 4) when output loop: IC power supply control chip (5) and transient voltage suppressor chip (6) are integrated in the packaging body (8) with multiple pins Nei, or the IC power supply control chip (5), the rectifier diode chip (1, 2, 3, 4) it is integrated in packaging body (8) with transient voltage suppressor chip (6).Power module of the invention can control the circuits such as the illumination of driving LED light group and charger in a manner of extremely letter, so that the power module after miniaturization can be more broadly applicable in various lighting apparatus or low-power circuit.
Description
Technical field
Present invention relates in general to semi-conductor electronic device fields.More particularly it relates to a kind of power module,
It can the circuit such as being used to control the illumination of driving LED light group and charger.
Background technique
LED illumination has compared the energy conservation of traditional lighting mode obviously because its luminous efficiency is high, and longer life expectancy, therefore
Have become the mainstream lighting method of the world today.Especially light source class product, such as ball bubble, downlight and fluorescent tube, these productions
Product usually require built-in power driving plate, and the space in lamps and lanterns is very small, and because the huge requirement to cost of dosage is high；
This requires the application requirements such as similarly suitable phone charger.
It LED lamp bead used in illuminating product and charges the phone and alternating current must be all converted into direct current, then lead to
Alternating current, is finally converted into suitable current source or voltage source, to realize LED light by the control driving for crossing IC power management chip
Luminous lighting and charging need.The LED driving of mainstream has non-isolated, isolation, the schemes such as linear, mature general method at present
It is to be converted the alternating current in power grid using independent pulse protection component, rectifier bridge and independent IC power management chip
At suitable current source or voltage source, and then LED lamp bead is driven to shine.The circuit connection of illustrative LED power drive module
As attached drawing 1- Fig. 6 is exemplarily illustrated.
With the development of integrated circuit production technology, the integrated level of power management chip is higher and higher, reliability requirement
It is higher and higher, in the case where meeting the Energy Star such as safety, composite wave and requiring, it must be added to varistor, transient state suppression in usual circuit
The devices such as diode processed, so that circuit is able to bear the influence of burst voltage and heavy current impact.It is conventional in the prior art
Way be: input circuit of the rectifier bridge being made of four diodes as alternating current provides and is converted to pulsation by alternating current
Direct current, then by filter capacitor smoothly for rear class IC control circuit work；In this input terminal varistor in parallel, or
High voltage protective device is added in the rear class of rectifier bridge；Here rectifier bridge and IC controls chip, and protection device is all to separate
On circuit boards, the volume and cost for being thus bound to cause circuit board cannot be controlled well, be affected whole for welding
The competitiveness and extensive use of a product, integration degree is not high, affects the miniaturization of circuit.
Therefore, how providing one kind, integration degree is high, circuit is small in size, manufacturing cost is low and easily controllable power supply mould
Block becomes the project for needing to study at present.
Summary of the invention
In order at least solve the prior art defect described in above-mentioned background technology part, the present invention provides a kind of electricity
Source module comprising: IC power supply control chip, be equipped with multiple pads and be configured to the power module execute management and
Control；Rectifier diode chip has the multiple pins connecting with the IC power supply control chip, and being configured to will be defeated
The alternating current entered is converted into direct current；And transient voltage suppressor chip, it is connected in parallel in the rectifier diode
The input circuit or output loop of chip, and be configured to protect the IC power supply control chip from interference.
In above-mentioned power module, when the transient voltage suppressor chip is connected in parallel in two poles of the rectification
When the output loop of tube chip:
The IC power supply control chip and transient voltage suppressor integrated chip are in the packaging body with multiple pins
It is interior, and the rectifier diode chip is connect outside the packaging body with the packaging body, and the wherein IC power supply control
Coremaking piece and transient voltage suppressor chip are connected by related pad and pin with the relevant pins of the packaging body,
To realize that power supply exports in operation；Or
The IC power supply control chip, the rectifier diode chip and transient voltage suppressor integrated chip are in tool
In the packaging body for having multiple pins, and the wherein IC power supply control chip, the rectifier diode chip and transient voltage
Diode chip for backlight unit is inhibited to be connected by related pad and pin with the relevant pins of the packaging body, to realize in operation
Power supply output.
In one embodiment, when the transient voltage suppressor chip is connected in parallel in the rectifier diode core
When the input circuit of piece, the IC power supply control chip, the rectifier diode chip and transient voltage suppressor chip
It is integrated in the packaging body, and wherein the IC power supply control chip, the rectifier diode chip and transient electrical are constrained
Diode chip for backlight unit processed is connected by related pad and pin with the relevant pins of the packaging body, to realize electricity in operation
Source output.
In another embodiment, when the transient voltage suppressor chip is connected in parallel in the rectifier diode
When the input circuit of chip, two ac input ends of the transient voltage suppressor chip and the rectifier diode chip
(AC1, AC2) is connected.
In yet another embodiment, wherein when the transient voltage suppressor chip is connected in parallel in the rectification two
When the output loop of pole pipe chip, which is connected to the height in multiple pins of the packaging body
Press output end and common ground.
In one embodiment, the IC power supply control chip includes MOS type field-effect tube, so as to
Energy is stored in energy storage component by the switch by controlling the MOS type field-effect tube.
It In yet another embodiment, further comprise being integrated in the intracorporal freewheeling diode chip of encapsulation, connection
High voltage control end and high-voltage output end into multiple pins of the packaging body.
It in another embodiment, further comprise being integrated in the intracorporal freewheeling diode chip of encapsulation, one end
It is connected to the high voltage control end in multiple pins of the packaging body, and its other end is connected to the second wink outside the packaging body
Time variant voltage inhibits diode chip for backlight unit.
It in one embodiment, further comprise being integrated in the intracorporal second transient voltage suppressor core of encapsulation
Piece, one end is connected to the high voltage control end in multiple pins of the packaging body, and its other end is connected to the packaging body
Outer freewheeling diode chip.
It In yet another embodiment, further comprise being integrated in intracorporal second transient voltage suppressor of encapsulation
Chip and freewheeling diode chip, the second transient voltage suppressor chip are connected with freewheeling diode chip-in series,
And it is connected to high voltage control end and high-voltage output end in multiple pins of the packaging body.
It in another embodiment, further comprise being integrated in the intracorporal MOS type field effect of the encapsulation
Tube chip is answered, wherein a pad of the IC power supply control chip is connected to the MOS type field-effect tube
The grid of chip, and the drain electrode of the MOS type field effect tube chip is connected to the described more of the packaging body
High voltage control end in a pin.
In one embodiment, further comprise being integrated in the intracorporal freewheeling diode chip of encapsulation, be connected to
High voltage control end and high-voltage output end in the multiple pin of the packaging body.
It in another embodiment, further comprise being integrated in the intracorporal freewheeling diode chip of encapsulation, one end
It is connected to the high voltage control end in multiple pins of the packaging body, and its other end is connected to the second wink outside the packaging body
Time variant voltage inhibits diode chip for backlight unit.
In yet another embodiment, further comprise: being integrated in intracorporal second transient voltage of encapsulation and inhibit two poles
Tube chip, one end is connected to the high-voltage output end in the multiple pin of the packaging body, and its other end is connected to institute
State the freewheeling diode chip outside packaging body；Or it is integrated in the intracorporal second transient voltage suppressor chip of encapsulation
With freewheeling diode chip, the second transient voltage suppressor chip is connected with freewheeling diode chip-in series, and even
High voltage control end and the high-voltage output end being connected in multiple pins of the packaging body.
In one embodiment, wherein the transient voltage suppressor chip is unidirectional transient voltage suppressor
Chip, and its output loop for being connected in parallel in the rectifier diode chip or the transient voltage suppressor
Chip is two-way transient voltage suppressor chip, and its input for being connected in parallel in the rectifier diode chip is returned
Road.
By the above-mentioned description to the solution of the present invention and its multiple embodiments, it will be appreciated by those skilled in the art that this hair
Bright power module can be formed individually by integrating rectifier diode chip and IC power supply control chip in a package
An integrated circuit, overcome and be difficult to simultaneously integrate the two due to the difference and difficulty in production technology in the prior art
Entire production is improved so that the power module after miniaturization can be more broadly applicable in various lighting apparatus in one chip
The competitiveness of product.In addition, the illumination of driving LED light group and charger can be controlled in a manner of extremely letter using the solution of the present invention
Equal circuits, therefore the solution of the present invention is also suitable for the LED illumination having higher requirements to route plate bulk and cost driving, mobile phone
A variety of AC-DC field of power supplies such as charger, such as in low-power circuit.
Detailed description of the invention
Main feature of the invention is specifically described in the appended claims.By reference to using original of the invention
The features as discussed above that the illustrative embodiments of reason is illustrated, it will the features and advantages of the present invention are obtained more preferable
Understanding.In the accompanying drawings:
Fig. 1-Fig. 6 is conventional exemplary LED drive circuit；
Fig. 7 is the schematic block circuit diagram for generally illustrating power module according to an embodiment of the present invention；
Fig. 8 is the circuit structure diagram for showing the power module of Linear Control LED drive scheme according to an embodiment of the present invention；
Fig. 9 is another circuit knot for showing the power module of Linear Control LED drive scheme according to an embodiment of the present invention
Composition；
Figure 10 is the circuit structure diagram for showing the power module of non-isolated LED drive scheme according to an embodiment of the present invention；
Figure 11 is the circuit structure for showing another power module of non-isolated LED drive scheme according to an embodiment of the present invention
Figure；
Figure 12 is the circuit structure for showing isolated power supply according to an embodiment of the present invention/LED drive scheme power module
Figure；
Figure 13 is the circuit for showing another power module of isolated power supply according to an embodiment of the present invention/LED drive scheme
Structure chart；
Figure 14 is the circuit for showing the another power module of isolated power supply according to an embodiment of the present invention/LED drive scheme
Structure chart；And
Figure 15 is the circuit for showing the another power module of isolated power supply according to an embodiment of the present invention/LED drive scheme
Structure chart.
Specific embodiment
In view of the deficiencies of the prior art, the present invention provides a kind of completely new achievable solutions.Particularly, pass through
Flexible chip portfolio integrates to meet different requirements.By following description, it will be appreciated by those skilled in the art that
The present invention relates to a variety of different power module (or power module group) embodiments.Under the introduction of the disclosure, this field
Technical staff can modify to exemplary circuit configuration of the invention, connection relationship or be replaced to certain components, and
These modifications or substitutions are still fallen in the protection scope that the present invention is defined by the claims.
In illustrative description, the solution of the present invention is related to linear LED driver module, can wrap containing TVS wink
Time variant voltage inhibits diode (or " Transient Suppression Diode ").It in one embodiment, can be in rectifier diode circuit group
At bridge-type input stage both ends two-way TVS pipe is added.It similarly, can also be in the same way in rectifier diode circuit
One-way or bi-directional TVS pipe is added in output end.Due to the introducing of Transient Suppression Diode, the solution of the present invention is ensuring LED drive
While dynamic power supply meets the failtests requirement such as composite wave, the circuit and cost of application end are also simplified.In operation, originally
The power module of invention, which can permit, directly inputs 220V or 110V alternating current (50Hz/60Hz), passes through the full-bridge rectification included
Circuit transformations are at direct current, without additionally incorporating varistor and TVS pipe.In addition, module of the invention can be with external filter
Wave capacitor is smooth to carry out to high voltage direct current, then is handled by IC control chip (or AC-DC chip) of inside modules, with
Extremely simple mode controls the circuits such as the illumination of driving LED light group and charger, and be suitable for having route plate bulk and cost compared with
The LED of high request drives illumination.
Various embodiments of the present invention are specifically described below in conjunction with attached drawing.
Fig. 1-Fig. 6 is conventional exemplary LED drive circuit, in these circuits and does not have the core of the present invention program
Integrated (or closing envelope) scheme of piece.Specifically, Fig. 1 and Fig. 2 is the exemplary circuit figure of linear control LED drive scheme, Fig. 3
It is the exemplary circuit figure for being directed to non-isolated LED drive scheme with Fig. 4, and Fig. 5 and Fig. 6 are isolated power supply/LED drive schemes
Exemplary circuit figure.In Fig. 1, Fig. 3 and Fig. 5, transient voltage suppressor diode is increased in the exchange input front end of rectifier bridge
(TVS) linear LED driving, which, which primarily serves, effectively inhibits lightning stroke, electromagnetic pulse interference etc., after protection
Grade circuit is not damaged, to can work normally under complex electromagnetic environment.In Fig. 2, Fig. 4 and Fig. 6, in the defeated of AC rectification
Outlet increases the linear LED driving of TVS pipe, which, which primarily serves, effectively presses down lightning stroke, electromagnetic pulse interference etc.
System, protection rear class IC control circuit is not damaged, can work normally under complex electromagnetic environment.
Fig. 7 is the schematic block circuit diagram for generally illustrating power module 100 according to an embodiment of the present invention.As shown in fig. 7,
Power module 100 of the invention includes IC power supply control chip (also referred to as AC-DC chip) 5 and rectifier diode chip 1,2,3,4.
The IC power supply control chip 5 can be equipped with multiple pads and be configured to execute the power module 100 and manage and control.It is whole
Stream diode chip for backlight unit 1,2,3,4 has the multiple pins connecting with the IC power supply control chip 5, and is configured to input
Alternating current be converted into direct current.Further, power module 100 can also include transient voltage suppressor (or TVS
Pipe) chip 6, it can be connected in parallel in the input circuit or output loop of the rectifier diode chip 1,2,3 and 4.As before
Described, when be connected in rectifier diode chip 1,2,3 and 4 in parallel exchanges input front end or output end, the TVS pipe chip is main
It plays and lightning stroke, electromagnetic pulse interference etc. is effectively inhibited, protection late-class circuit is not damaged, thus in complicated electromagnetism ring
It can be worked normally under border.
According to the solution of the present invention, when the TVS pipe chip is connected in parallel in the friendship of rectifier diode chip 1,2,3 and 4
When stream rectification output loop, the IC power supply control chip 5 and TVS pipe chip 6 be can integrate in the encapsulation with multiple pins
In body 8, and rectifier diode chip 1,2,3 and 4 is connect in 8 outside of packaging body with the packaging body 8, and wherein described
IC power supply control chip and transient voltage suppressor chip pass through the relevant tube of related pad and pin and the packaging body
Foot is connected, to realize that power supply exports in operation, as shown in Figure 7.
As substitution or alternative scheme, when the TVS pipe chip 6 be connected in parallel in the rectifier diode chip 1,2,
When 3 and 4 output loop, the IC power supply control chip 5, the rectifier diode chip 1,2,3 and 4 and TVS pipe chip 6 are also
It can integrate in the packaging body 8 with multiple pins, and the wherein IC power supply control chip 5, the rectifier diode
Chip 1,2,3 and 4 and TVS pipe chip 6 can be connected by related pad and pin with the relevant pins of the packaging body 8
It connects, to realize that power supply exports in operation.
In one embodiment, when the TVS pipe chip 6 is connected in parallel in the rectifier diode chip 1,2,3 and 4
When input circuit (i.e. exchange input front end), the IC power supply control chip 5, the rectifier diode chip 1,2,3 and 4 and
TVS pipe chip 6 can integrate in the packaging body 8, and the wherein IC power supply control chip 5, the rectifier diode
Chip 1,2,3 and 4 and TVS pipe chip 6 are connected by related pad and pin with the relevant pins of the packaging body, so as to
Power supply output is realized in operation.
In above-mentioned the present invention program, rectifier diode chip 1,2,3 and 4 can be by being welded on copper frame and drawing
The techniques such as line bonding realize bridge rectifier, and IC power supply control chip 5 can by copper frame welding or silver paste bonding and
A plurality of bonding wire realizes the function connects of circuit.In one embodiment, IC power supply control chip 5 can integrate metal oxygen
Compound semiconductor field effect tube chip (MOSFET).By various possible connection types, power module 100 of the invention can
Drive or charge to external portable equipment to LED circuit.
Fig. 8 is the structure chart for showing power module according to an embodiment of the invention.Power supply shown by the structure chart
Module improves the circuit structure of the drive scheme of Linear Control LED shown in Fig. 1.As shown in Figure 8, rectifier diode chip
2,3,41, (amounting to four chips), IC power supply control chip 5 and TVS pipe chip 6 can integrate (such as moulds in a packaging body
Seal body) in 8 to form an individual integrated circuit, wherein TVS pipe is that two-way transient state inhibits pipe, is connected in parallel in rectification two
The ac input circuit of pole pipe chip.
The packaging body 8 has multiple pins and the copper frame including six chips above-mentioned, four solderable chips
(PAD) (i.e. lead frame) and a plurality of metal bonding lead 7.In the exemplary connection shown in, rectifier diode chip 1,
2,3 and 4 four chips by be welded on copper frame and the techniques such as wire bonding realize bridge rectifier comprising two exchange
Input terminal (AC1/AC2), a common ground (GND) and a high-voltage output end (HV).IC power supply control chip 5 can pass through
Copper frame welding or silver paste bonding and a plurality of bonding wire realize the function connects of circuit, and provide three outer pins.One
In a illustrative connection type, wherein a pad on IC power supply control chip 5 can be connected to envelope by bonding wire
The common ground of the high voltage control end pipe foot (DRAIN) that fills body 8 and its ground pad and diode rectification chip passes through bonding wire
It is connected and is external in common ground (GND).In addition, the sampling end of IC power supply control chip 5 can pass through the external end of bonding wire
Sub (CS).The 6th shown chip is TVS pipe chip 6, and in one embodiment, the TVS pipe chip 6 and rectification two
A diode chip for backlight unit in pole pipe chip 1,2,3 and 4 shares a pad (PAD), and with ac input end AC1 and AC2
Electrical connection.
Fig. 9 is another circuit knot for showing the power module of Linear Control LED drive scheme according to an embodiment of the present invention
Composition.The circuit structure of the Linear Control LED drive scheme shown in Fig. 2 of electric power source pair of module shown by the structure chart is changed
Into.As shown in Figure 9, rectifier diode chip 1,2,3,4 (amounting to four chips), IC power supply control chip 5 and TVS pipe chip
6 can integrate to form an individual integrated circuit in a packaging body 8, and wherein TVS pipe is one-way or bi-directional transient state
Inhibit pipe, is connected in the AC rectification output loop of rectifier diode chip in parallel.
Packaging body 8 have multiple pins and its in altogether include six chips above-mentioned, the lead of five solderable chips
Frame and a plurality of metal bonding lead 7.Four rectifier diode chips are by being welded on copper frame and the works such as wire bonding
Skill realizes bridge rectifier, and provides two ac input ends (AC1/AC2), a common ground (GND) and a high-voltage output end
(HV).In illustrative connection, the IC power supply control chip 5 can be by copper frame welding or silver paste bonding and a plurality of
Bonding wire realizes the function connects of circuit, and provides three external pins, and a pad on IC power supply control chip 5 can be with
The high voltage control end pipe foot (DRAIN) of packaging body 8 is connected to by bonding wire.Further, the ground connection of IC power supply control chip 5 weldering
Disk is connected external common ground (GND) by bonding wire with the common ground of rectifier diode chip.In addition, IC power supply control chip
5 sampling end passes through the external terminal (CS) of bonding wire.As shown, two poles of a terminal of TVS pipe chip 6 and rectification
Two diode chip for backlight unit in tube chip share a pad (PAD), and connect high-voltage output end (HV), another terminal ground
(GND)。
Figure 10 is the circuit structure diagram for showing the power module of non-isolated LED drive scheme according to an embodiment of the present invention.
The circuit structure of the non-isolated LED drive scheme shown in Fig. 3 of electric power source pair of module shown by the structure chart improves.Such as Fig. 9
Shown in, TVS pipe chip 6, rectifier diode chip 1,2,3 and 4 (amounting to four chips) and IC power supply control chip 5 can collect
In Cheng Yi encapsulation 8, to form an individual integrated circuit.Wherein TVS pipe is that two-way transient state inhibits pipe, is connected in parallel on friendship
Flow input circuit.
Packaging body 8 has multiple pins and is arranged inside comprising six chips above-mentioned, the copper of four solderable chips
Lead frame (PAD) and a plurality of metal lead wire 7.Four rectifier diode chips 1,2,3 and 4 by being welded on copper frame and
The techniques such as wire bonding realize bridge rectifier, and 2 ac input ends (AC1/AC2), a common ground (GND) and a high pressure are defeated
Outlet (HV).In illustrative connection, the IC power supply control chip 5 can by copper frame welding or silver paste bonding and
A plurality of bonding wire realizes the function connects of circuit, and provides three external pins.A pad on IC power supply control chip 5
The high voltage control end pipe foot (DRAIN) of packaging body 8 can be connected to by bonding wire.Further, IC power supply control chip 5 connects
Ground pad is connected external common ground (GND) by bonding wire with rectifier diode chip common ground.In addition, IC power supply controls core
The sampling end of piece 5 passes through the external terminal (CS) of bonding wire.As shown, TVS pipe chip 6 and rectifier diode 1,2,3
A pad (PAD) is shared with a diode chip for backlight unit in 4, and is electrically connected with ac input end AC1 and AC2.
Figure 11 is the circuit structure for showing another power module of non-isolated LED drive scheme according to an embodiment of the present invention
Figure.The circuit structure of the non-isolated LED drive scheme shown in Fig. 4 of electric power source pair of module shown by the structure chart improves.Such as
Shown in Figure 11, rectifier diode chip 1,2,3,4 (amounting to four chips), IC power supply control chip 5 and TVS pipe chip 6 can
An individual integrated circuit is formed to be integrated in a packaging body 8, wherein TVS pipe is that one-way or bi-directional transient state inhibits
Pipe, is connected in the AC rectification output loop of rectifier diode chip in parallel.
Packaging body 8 have multiple pins and its in altogether include six chips above-mentioned, the lead of four solderable chips
Copper frame (PAD) and a plurality of metal bonding lead 7.Four rectifier diode chips are by being welded on copper frame and lead key
The techniques such as conjunction realize bridge rectifier, and provide two ac input ends (AC1/AC2), a common ground (GND) and a high pressure
Output end (HV).In illustrative connection, the IC power supply control chip 5 can by copper frame welding or silver paste bonding with
And a plurality of bonding wire realizes the function connects of circuit, and provides three external pins, a weldering on IC power supply control chip 5
Disk can be connected to the high voltage control end pipe foot (DRAIN) of packaging body 8 by bonding wire.Further, IC power supply control chip 5
Ground pad is connected external common ground (GND) by bonding wire with the common ground of rectifier diode chip.In addition, IC power supply control
The sampling end of coremaking piece 5 passes through the external terminal (CS) of bonding wire.As shown, a terminal of TVS pipe chip 6 with it is whole
Two diode chip for backlight unit flowed in diode chip for backlight unit share a pad (PAD), and connect high-voltage output end (HV), another end
Son ground connection (GND).
Figure 12 is the circuit structure for showing isolated power supply according to an embodiment of the present invention/LED drive scheme power module
Figure.The isolated power supply shown in fig. 5 of electric power source pair of module shown by the structure chart/LED drive scheme circuit structure improves.
As shown in Figure 12, TVS pipe chip 6, rectifier diode chip 1,2,3 and 4 (amounting to four chips) and IC power supply control chip 5
It can integrate in an encapsulation 8, to form an individual integrated circuit.Wherein TVS pipe is two-way transient state inhibition pipe, and
It is associated in ac input circuit.
Packaging body 8 has multiple pins and is arranged inside comprising six chips above-mentioned, the copper of four solderable chips
Lead frame (PAD) and a plurality of metal lead wire 7.Four rectifier diode chips 1,2,3 and 4 by being welded on copper frame and
The techniques such as wire bonding realize bridge rectifier, and 2 ac input ends (AC1/AC2), a common ground (GND) and a high pressure are defeated
Outlet (HV).In illustrative connection, the IC power supply control chip 5 can by copper frame welding or silver paste bonding and
A plurality of bonding wire realizes the function connects of circuit, and provides three external pins.A pad on IC power supply control chip 5
The high voltage control end pipe foot (DRAIN) of packaging body 8 can be connected to by bonding wire.Further, IC power supply control chip 5 connects
Ground pad is connected external common ground (GND) by bonding wire with rectifier diode chip common ground.In addition, IC power supply controls core
The sampling end of piece 5 passes through the external terminal (CS) of bonding wire.As shown, TVS pipe chip 6 and rectifier diode 1,2,3
A pad (PAD) is shared with a diode chip for backlight unit in 4, and is electrically connected with ac input end AC1 and AC2.
Figure 13 is the circuit for showing another power module of isolated power supply according to an embodiment of the present invention/LED drive scheme
Structure chart.The isolated power supply shown in fig. 6 of electric power source pair of module shown by the structure chart/LED drive scheme circuit structure carries out
It improves.As shown in Figure 13, rectifier diode chip 1,2,3,4 (amounting to four chips), IC power supply control chip 5 and TVS pipe
Chip 6 can integrate to form an individual integrated circuit in a packaging body 8, and wherein TVS pipe is one-way or bi-directional
Transient state inhibits pipe, is connected in the AC rectification output loop of rectifier diode chip in parallel.
Packaging body 8 have multiple pins and its in altogether include six chips above-mentioned, the lead of four solderable chips
Copper frame (PAD) and a plurality of metal bonding lead 7.Four rectifier diode chips are by being welded on copper frame and lead key
The techniques such as conjunction realize bridge rectifier, and provide two ac input ends (AC1/AC2), a common ground (GND) and a high pressure
Output end (HV).In illustrative connection, the IC power supply control chip 5 can by copper frame welding or silver paste bonding with
And a plurality of bonding wire realizes the function connects of circuit, and provides three external pins, a weldering on IC power supply control chip 5
Disk can be connected to the high voltage control end pipe foot (DRAIN) of packaging body 8 by bonding wire.Further, IC power supply control chip 5
Ground pad is connected external common ground (GND) by bonding wire with the common ground of rectifier diode chip.In addition, IC power supply control
The sampling end of coremaking piece 5 passes through the external terminal (CS) of bonding wire.As shown, a terminal of TVS pipe chip 6 with it is whole
Two diode chip for backlight unit flowed in diode chip for backlight unit share a pad (PAD), and connect high-voltage output end (HV), another end
Son ground connection (GND).
Figure 14 is the circuit for showing the another power module of isolated power supply according to an embodiment of the present invention/LED drive scheme
Structure chart.Electric power source pair of module shown by the structure chart is similar to isolated power supply shown in fig. 5/LED drive scheme circuit knot
Structure improves.As shown in Figure 14, rectifier diode chip 1,2,3 and 4 (amount to four chips), IC power supply control chip 5,
TVS pipe chip 6 (D-TVS i.e. shown in the drawings), MOS type field-effect tube (MOSFET) 9, two pole of afterflow
Tube chip 10, the second transient voltage suppressor chip (i.e. " the second TVS pipe chip ") 11, which can integrate, encapsulates 8 at one
It is interior, to form an individual integrated circuit.Similar with what is discussed before, TVS pipe chip 6 (is referred to as " the first transient electrical
Constrain diode chip for backlight unit processed " or " the first TVS pipe chip ") it is that two-way transient state inhibits pipe (D-TVS), it is connected in parallel on exchange and inputs back
Road primarily serves and is effectively inhibited to lightning stroke, electromagnetic pulse interference etc., and protection late-class circuit is not damaged, in complexity
It can be worked normally under electromagnetic environment.In contrast, the second TVS pipe chip 11 and freewheeling diode chip 10 become together as being isolated
The bypass circuit of depressor does afterflow, reverser Pulse clamp and magnetic restitution.
Packaging body 8 has multiple pins and is arranged inside comprising nine chips above-mentioned, the copper of six solderable chips
Lead frame (PAD) and a plurality of metal lead wire 7.Four rectifier diode chips 1,2,3 and 4 by being welded on copper frame and
The techniques such as wire bonding realize bridge rectifier, and 2 ac input ends (AC1/AC2), a common ground (GND) and a high pressure are defeated
Outlet (HV).In illustrative connection, the IC power supply control chip 5 can by copper frame welding or silver paste bonding and
A plurality of bonding wire realizes the function connects of circuit, and provides four external pins.A pad on IC power supply control chip 5
MOSFET 9 can be connected to by bonding wire.Further, 5 ground pad of IC power supply control chip and rectifier diode chip
Common ground external common ground (GND) is connected by bonding wire.In addition, the sampling end of IC power supply control chip 5 passes through bonding
One terminal (CS) of lead external.As shown, the ac input end AC1 of D-TVS tube chip 6 and rectifier diode 1,2,3 and 4
It is connected in parallel with AC2.Second TVS pipe chip one end is connected with freewheeling diode chip 10, and the other end is connected to High voltage output
It holds (HV).
Figure 15 is the circuit for showing the another power module of isolated power supply according to an embodiment of the present invention/LED drive scheme
Structure chart.Electric power source pair of module shown by the structure chart is similar to isolated power supply shown in fig. 6/LED drive scheme circuit knot
Structure improves.As shown in Figure 15, rectifier diode chip 1,2,3,4 (amount to four chips), IC power supply control chip 5,
D-TVS 6, MOSFET 9, freewheeling diode 10 and the second TVS pipe chip 11 can integrate single to be formed in a packaging body 8
An only integrated circuit, wherein D-TVS pipe is that two-way transient state inhibits pipe, is connected in the exchange of rectifier diode chip in parallel
Rectify output loop.
Packaging body 8 have multiple pins and its in altogether include aforementioned nine chips, the lead copper of six solderable chips
Frame (PAD) and a plurality of metal bonding lead 7.Four rectifier diode chips are by being welded on copper frame and wire bonding
Etc. techniques realize bridge rectifier, and provide two ac input ends (AC1/AC2), a common ground (GND) and a high pressure it is defeated
Outlet (HV).In illustrative connection, the IC power supply control chip 5 can by copper frame welding or silver paste bonding and
A plurality of bonding wire realizes the function connects of circuit, and provides four external pins, a pad on IC power supply control chip 5
MOSFET 9 can be connected to by bonding wire.Further, 5 ground pad of IC power supply control chip and rectifier diode chip
Common ground external common ground (GND) is connected by bonding wire.In addition, the sampling end of IC power supply control chip 5 passes through bonding
One terminal (CS) of lead external.As shown, a terminal of D-TVS tube chip 6 connects high-voltage output end (HV), another
Terminal ground (GND), to be connected in parallel in the AC rectification output loop of rectifier diode chip 1,2,3 and 4.2nd TVS
11 one end of tube chip is connected with freewheeling diode chip 10, and the other end is connected to high-voltage output end (HV), and shown continuous
Stream 10 one end of diode chip for backlight unit is connected with the second TVS pipe chip 11, and the other end is connected with MOSFET 9.
By the description of above-mentioned Figure 14 and Figure 15, it will be appreciated by those skilled in the art that packaging body of the invention can pass through
It encapsulates or integrates different chips and realize flexible application.Although Figure 14 and Figure 15 show rectifier diode chip, TVS
(D-TVS) tube chip, IC power supply control chip, MOSFET, freewheeling diode, the conjunction of the second TVS pipe chip are encapsulated in a packaging body
It is interior, but those skilled in the art's introduction according to the present invention, it is also contemplated that by some integrated chips in said chip one
In a packaging body, and other chip is placed in outside the packaging body.
Based on above-mentioned consideration, the present invention also proposes the embodiment of following various chips arrangement, at least to realize that LED drives
The isolation of circuit, non-isolated and linear arrangement.
In one embodiment, the IC power supply control chip of the invention includes MOSFET, will pass through described in control
Energy is stored in energy storage component by the switch of MOSFET.
In the case where the IC power supply control chip includes or has been internally integrated the above situation of MOSFET, the solution of the present invention can
To further comprise following multiple and column selection schemes:
It is integrated in the intracorporal freewheeling diode chip of encapsulation, the height being connected in multiple pins of the packaging body
Press control terminal and high-voltage output end；Or preferably
It is integrated in the intracorporal freewheeling diode chip of encapsulation, one end is connected in multiple pins of the packaging body
High voltage control end, and its other end is connected to the second transient voltage suppressor chip outside the packaging body；Or it is excellent
Selection of land
It is integrated in the intracorporal second transient voltage suppressor chip of encapsulation, one end is connected to the packaging body
Multiple pins in high voltage control end, and its other end is connected to the freewheeling diode chip outside the packaging body；Or it is excellent
Selection of land
It is integrated in the intracorporal second transient voltage suppressor chip of the encapsulation and freewheeling diode chip, described the
Two transient voltage suppressor chips are connected with freewheeling diode chip-in series, and are connected to multiple pins of the packaging body
In high voltage control end and high-voltage output end.
In another embodiment, power module of the invention, which may further include, is integrated in the intracorporal gold of encapsulation
Belong to oxide semiconductor-type field effect tube chip, wherein a pad of the IC power supply control chip is connected to the metal oxygen
The grid of compound semiconductor field effect tube chip, and the drain electrode of the MOS type field effect tube chip connects
High voltage control end into the multiple pin of the packaging body.
In the situation that above-mentioned IC power supply control chip and MOS type field effect tube chip separate, this hair
Bright scheme may further include following multiple and column selection schemes:
It is integrated in the intracorporal freewheeling diode chip of encapsulation, is connected in the multiple pin of the packaging body
High voltage control end and high-voltage output end；Or preferably
It is integrated in the intracorporal freewheeling diode chip of encapsulation, one end is connected in multiple pins of the packaging body
High voltage control end, and its other end is connected to the second transient voltage suppressor chip outside the packaging body；Or it is excellent
Selection of land
It is integrated in the intracorporal second transient voltage suppressor chip of encapsulation, one end is connected to the packaging body
The multiple pin in high-voltage output end, and its other end is connected to the freewheeling diode chip outside the packaging body；Or
Person is preferably
It is integrated in the intracorporal second transient voltage suppressor chip of the encapsulation and freewheeling diode chip, described the
Two transient voltage suppressor chips are connected with freewheeling diode chip-in series, and are connected to multiple pins of the packaging body
In high voltage control end and high-voltage output end.
Through the above description, it will be appreciated by those skilled in the art that in above scheme and its different embodiments of the invention
In, executing alternating current to what direct circulation was changed can be rectifier diode chip, can form rectifier circuit to realize height
Pressing AC conversion is the rectified action of high voltage direct current, which may include the copper lead frame of at least three pads
Frame and four bonding wires.IC power supply control chip can integrate control logic circuit, using independent copper lead frame, from
And the high_voltage isolation efficiency with good heat dissipation and safety.
In addition, as previously mentioned, also permission IC power supply control chip (is referred to as driving control in the solution of the present invention
IC chip processed) design that is separated using integrated field effect transistor (MOSFET) and IC power supply control chip with MOSFET.
TVS pipe chip can share a frame with a rectifier diode according to different embodiments or have independent frame.Work as TVS
When tube chip has independent frame, copper lead frame is equally used as carrier, the two has a plurality of leads to carry out function
Link, with good heat dissipation.When by TVS Transient Suppression Diode, rectifier diode chip, IC power supply control chip
Combination is integrated to meet different requirements, and the present invention is as previously mentioned, also allow to allow in non-isolated and isolation circuit integrated continuous
Flow diode and clamper TVS pipe (such as foregoing second TVS pipe chip).Second TVS and freewheeling diode as a result,
Together as the bypass circuit of isolating transformer, afterflow, reverser Pulse clamp and magnetic restitution are played.
Copper lead frame of the invention can be used as integrated chip welding carrier and play the role of electric connection.Further,
Bonding wire of the invention can be ultrasonic bond, gold ball bonding and laser welding in lead technique, can be in material
Compatible Si-Al wire, crude aluminum line, gold thread and copper wire.In addition, the number of pins of packaging body of the invention can be multiple (such as not offices
It is limited to eight pins), and can according to need the pin allowed using other quantity.In addition, according to different applications, this hair
Up to four or five independent copper frame base island pads (PAD) and six independent cores can be set in bright packaging body
Piece.
Technical solution of the present invention is described in detail above in conjunction with attached drawing of the invention.Pass through foregoing description, this field
Technical staff is understood that integrated chip structure of the invention can control TVS pipe together with rectifier diode chip and IC power supply
Integrated chip has better usage experience and cost performance, the scope of application for expanding power supply mould group in a packaging body
And the flexibility of application, particularly suitable in the LED illumination that has higher requirements to power supply plate bulk and cost.
It is aobvious for those skilled in the art although multiple embodiments of the invention have been shown and described in this specification
And be clear to, such embodiment only provides in an illustrative manner.Those skilled in the art can be without departing from the present invention
The mode for expecting many changes in the case where thought and spirit, changing and substituting.It should be understood that practicing mistake of the invention
Cheng Zhong, can be using the various alternative solutions to invention as described herein embodiment.The appended claims are intended to limit
Protection scope of the present invention, and therefore cover the composition of the module in these scopes of the claims, equivalent or alternative solution.
Claims (9)
1. a kind of power module (100), comprising:
IC power supply control chip (5) is equipped with multiple pads and is configured to execute management and control to the power module (100)
System；
Rectifier diode chip (1,2,3,4) has the multiple pins connecting with the IC power supply control chip (5), and
It is configured to the alternating current of input being converted into direct current；And
Transient voltage suppressor chip (6), the input for being connected in parallel in the rectifier diode chip (1,2,3,4) are returned
Road or output loop, and be configured to protect the IC power supply control chip (5) from interfering,
Wherein when the transient voltage suppressor chip (6) is connected in parallel in the rectifier diode chip (1,2,3,4)
Output loop when:
The IC power supply control chip (5) and transient voltage suppressor chip (6) are integrated in the encapsulation with multiple pins
In body (8), and the rectifier diode chip (1,2,3,4) connects in the packaging body (8) outside with the packaging body (8)
It connects, and wherein the IC power supply control chip (5) and transient voltage suppressor chip (6) pass through related pad and pin
It is connected with the relevant pins of the packaging body (8), to realize that power supply exports in operation；Or
The IC power supply control chip (5), the rectifier diode chip (1,2,3,4) and transient voltage suppressor chip
(6) it is integrated in the packaging body (8) with multiple pins Nei, and the wherein IC power supply control chip (5), two poles of the rectification
Tube chip (1,2,3,4) and transient voltage suppressor chip (6) pass through related pad and pin and the packaging body (8)
Relevant pins are connected, to realize that power supply exports in operation.
2. power module according to claim 1, wherein when the transient voltage suppressor chip (6) is connected in parallel
When the input circuit of the rectifier diode chip (1,2,3,4), the IC power supply control chip (5), two poles of the rectification
Tube chip (1,2,3,4) and transient voltage suppressor chip (6) are integrated in the packaging body (8), and wherein described
IC power supply control chip (5), the rectifier diode chip (1,2,3,4) and transient voltage suppressor chip (6) pass through
Related pad and pin are connected with the relevant pins of the packaging body (8), to realize that power supply exports in operation.
3. power module according to claim 1 or 2, wherein when the transient voltage suppressor chip (6) is in parallel
When being connected to the input circuit of the rectifier diode chip (1,2,3,4), the transient voltage suppressor chip (6) and institute
Two ac input ends (AC1, AC2) for stating rectifier diode chip (1,2,3,4) are connected.
4. power module according to claim 1 or 2, wherein when the transient voltage suppressor chip (6) is in parallel
When being connected to the output loop of the rectifier diode chip (1,2,3,4), the transient voltage suppressor chip (6) connection
High-voltage output end and common ground into multiple pins of the packaging body (8).
5. power module according to claim 1 or 2, wherein the IC power supply control chip (5) includes metal oxide
Semiconductor field effect pipe (9) controls the switch of the MOS type field-effect tube for energy will pass through
It is stored in energy storage component.
6. power module according to claim 5, further comprises:
The freewheeling diode chip (10) being integrated in the packaging body (8), is connected in multiple pins of the packaging body
High voltage control end and high-voltage output end；Or preferably
The freewheeling diode chip (10) being integrated in the packaging body (8), one end are connected to the multiple of the packaging body (8)
High voltage control end in pin, and its other end is connected to the second transient voltage suppressor core of the packaging body (8) outside
Piece；Or preferably
The second transient voltage suppressor chip (11) being integrated in the packaging body (8), one end are connected to the envelope
The high voltage control end in multiple pins of body (8) is filled, and its other end is connected to the freewheeling diode core of the packaging body (8) outside
Piece (10)；Or preferably
The second transient voltage suppressor chip (11) and the freewheeling diode chip being integrated in the packaging body (8)
(10), the second transient voltage suppressor chip (11) and freewheeling diode chip (10) are connected in series, and are connected to
High voltage control end and high-voltage output end in multiple pins of the packaging body.
7. power module according to claim 1 or 2 further comprises the metal oxygen being integrated in the packaging body (8)
Compound semiconductor field effect tube chip (9) a, wherein pad of the IC power supply control chip (5) is connected to the metal
The grid of oxide semiconductor-type field effect tube chip (9), and the leakage of the MOS type field effect tube chip
Pole is connected to the high voltage control end in the multiple pin of the packaging body.
8. power module according to claim 7, further comprises:
The freewheeling diode chip (10) being integrated in the packaging body (8), is connected to the multiple of the packaging body (8)
High voltage control end and high-voltage output end in pin；Or preferably
The freewheeling diode chip (10) being integrated in the packaging body (8), one end are connected to the multiple of the packaging body (8)
High voltage control end in pin, and its other end is connected to the second transient voltage suppressor core of the packaging body (8) outside
Piece (11)；Or preferably
The second transient voltage suppressor chip (11) being integrated in the packaging body (8), one end are connected to the envelope
The high-voltage output end in the multiple pin of body (8) is filled, and its other end is connected to two pole of afterflow of the packaging body (8) outside
Tube chip (10)；Or preferably
The second transient voltage suppressor chip (11) and the freewheeling diode chip being integrated in the packaging body (8)
(10), the second transient voltage suppressor chip (11) and freewheeling diode chip (10) are connected in series, and are connected to
High voltage control end and high-voltage output end in multiple pins of the packaging body (8).
9. power module according to claim 1 or 2, wherein the transient voltage suppressor chip (6) is unidirectional
Transient voltage suppressor chip, and its output loop for being connected in parallel in the rectifier diode chip (1,2,3,4),
Or the transient voltage suppressor chip (6) is two-way transient voltage suppressor chip, and it is connected in parallel
Input circuit in the rectifier diode chip (1,2,3,4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910834593.4A CN110391689A (en) | 2019-09-05 | 2019-09-05 | Power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910834593.4A CN110391689A (en) | 2019-09-05 | 2019-09-05 | Power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110391689A true CN110391689A (en) | 2019-10-29 |
Family
ID=68289674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910834593.4A Pending CN110391689A (en) | 2019-09-05 | 2019-09-05 | Power module |
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|---|---|
| CN (1) | CN110391689A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021147101A1 (en) * | 2020-01-23 | 2021-07-29 | 华为技术有限公司 | Chip device and wireless communication device |
| CN113300589A (en) * | 2021-05-28 | 2021-08-24 | 太原航空仪表有限公司 | Filtering, surge and power supply integrated module |
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