CN111343756A - Constant current controller packaging device and driving device - Google Patents

Abstract

The invention discloses a constant current controller package device, comprising a SOP7 lead frame unit, a constant current control chip, a freewheeling rectifier diode and a power tube. On the basis of using the existing SOP7 double-base island frame, the present invention seals the constant current control chip and some or all of the semiconductor elements together at the lowest cost, realizes the extremely simplified application circuit, has a large cost advantage, and significantly improves the Productivity.

Description

Constant current controller package device and drive device

technical field

The present invention relates to a package of a constant current controller, in particular, to a constant current controller with a packaged rectifier diode, and a driving device including the constant current controller.

Background technique

At present, light-emitting diode (LED) lighting sources have been widely used. As the main driving power supply of LED light source, in the early stage of the market, a variety of professional LED constant current switching power supply controllers have appeared; then, gradually mature professional driving integrated circuits have greatly promoted the start and growth of the LED lighting market.

The circuit structure of a typical LED step-down constant current controller has become popular on the market, as shown in Figure 1. The circuit structure of the new generation LED constant current controller that appears at present is shown in Figure 2. They are two different constant current controllers, each with advantages and disadvantages. The circuit of FIG. 1 has some advantages when the number of strings of the LED load 111 is relatively large, that is, when the load voltage is relatively high (eg, greater than 100V). However, when the number of strings of output LED loads 111 is relatively small (for example, the load voltage is lower than 100V), the circuit of FIG. 2 has obvious cost and performance advantages. The above two circuit structures have good complementarity, compete with each other, and continue to evolve along similar but not identical evolutionary routes, pursuing better performance and lower cost. Of course, lower cost is the first priority evolution direction.

In the pursuit of lower cost, the circuits in Figure 1 and Figure 2 are similar in that they encapsulate as many peripheral semiconductor components as possible. It can be seen that, in addition to the load 111, the circuits in Fig. 1 and Fig. 2 have the same number and type of semiconductor components as follows: constant current control chip (200 in Fig. 1, 300 in Fig. 2), high voltage power tube (107 in Fig. 1) , 307 in FIG. 2 ), a freewheeling rectifier diode (108 in FIG. 1 , 308 in FIG. 2 ), and an AC rectifier bridge 101 . At present, as far as the circuits shown in Figure 1 and Figure 2 are concerned, the co-sealing of the constant current control chip and the high-voltage power tube has been achieved, and this co-sealing method and technology have been commercialized for more than five years. Here, co-encapsulation refers to a technology in which the control chip die and the power die are mounted on the same chip frame, and then wire-bonded and plastic-encapsulated into an integrated circuit.

The current evolution direction is how to package the freewheeling rectifier diode and the AC rectifier bridge. Due to the large proportion of the circuit structure in Figure 1 in the market, many semiconductor companies are working in this direction. In order to encapsulate the diode 108, some companies also specially develop a new encapsulation frame and apply for a patent. Some companies go further and develop larger and more complex encapsulation frames in order to encapsulate the diode 108 and the rectifier bridge at the same time. For the circuit structure shown in FIG. 2 , there is no solution for encapsulating the freewheeling rectifier diode 308 or even the AC rectifier bridge 101 , which is an urgent problem to be solved in the fierce market competition.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a new constant current controller for rectifier diodes in combination with the above problems of the prior art, which realizes a higher integration constant current combination technology while having the advantage of low cost.

According to a first aspect of the present invention, a constant current controller package device is provided, including a SOP7 lead frame unit, a constant current control chip, a freewheeling rectifier diode and a power tube; the lead frame unit includes a first base island, a second A base island and seven pins, the first base island is connected to the seventh pin, and the second base island is connected to the fifth and sixth pins, wherein the constant current control chip is bonded on the first base by insulating glue. A base island, its power supply (VCC) welding area is welded to the first base island by welding wires; the freewheeling rectifier diode is bonded to the first base island by conductive glue; the power tube is bonded to the first base island by conductive glue On the second base island, its gate is connected to the driving (DRV) welding area of the constant current control chip through bonding wires; when any one of the first to fourth pins is free, the freewheeling rectifier diode The anode, the output current detection (CS) welding area of the constant current control chip and the reference ground (ICGND) welding area are connected to the other three pins from the first to the fourth pins in order according to the pin number from small to large. ; And the source of the power tube is connected to the same pin connected to the reference ground (ICGND) welding area of the constant current control chip through a welding wire.

Preferably, the anode of the freewheeling rectifier diode is connected to the first pin, the output current detection (CS) welding area of the constant current control chip is connected to the second pin, and the constant current control chip is referenced to ground (ICGND) The welding area and the source of the power transistor are connected to the third pin.

Preferably, the constant current controller package device further includes an AC rectifier diode; the AC rectifier diode is bonded to the second base island by conductive glue, and its anode is connected to the fourth pin by a welding wire.

According to a second aspect, a constant current controller package device is provided, including a SOP7 lead frame unit, a constant current control chip, a freewheeling rectifier diode and a power tube; the lead frame unit includes a first base island, a second base island and Seven pins, the first base island is connected to the seventh pin, the second base island is connected to the fifth and sixth pins, wherein the constant current control chip is bonded to the first base island by insulating glue The power supply (VCC) welding area is welded to the first base island by wire bonding; the freewheeling rectifier diode is bonded to the first base island by conductive glue; the power tube is bonded to the second base island by conductive glue On the upper side, its gate is connected to the driving (DRV) welding area of the constant current control chip through a welding wire; in the case that any one of the first to fourth pins is free, the anode of the freewheeling rectifier diode, The reference ground (ICGND) welding area of the constant current control chip and the inductive charge/discharge current detection (CS) welding area are connected to the other three pins of the first to fourth pins in order by the pin number from small to large. ; And the source of the power tube is connected with the same pin connected to the constant current control chip inductance charge/discharge current detection (CS) welding area through the welding wire.

Preferably, the anode of the freewheeling rectifier diode is connected to the first pin, the reference ground (ICGND) welding area of the constant current control chip is connected to the second pin, and the inductance charge/discharge current detection of the constant current control chip (CS) the welding area and the power transistor source are connected to the third pin.

Preferably, the constant current controller package device further includes an AC rectifier diode; the AC rectifier diode is bonded to the second base island by conductive glue, and its anode is connected to the fourth pin by a welding wire.

According to a third aspect, a constant current source load driving device is provided, comprising the constant current controller package device as described in the first aspect and a peripheral circuit, the peripheral circuit including an inductor, a capacitor, a detection resistor and a power supply resistor, Wherein, the fifth and sixth pins of the constant current controller package device are connected to the positive pole (VIN) of the input voltage source, and the first pin is connected to the negative pole (GND) of the input voltage source; the inductor is connected to the constant current between the first and third pins of the controller package device; the seventh pin of the constant current controller package device is connected to the VCC node between the power supply resistor and one end of the capacitor; the other end of the capacitor is connected to the The node between one end of the constant current source load and the detection resistor and the second pin of the constant current controller package device is used as the filter capacitor of the constant current source load; the other end of the detection resistor is connected to the constant current The third pin of the controller packaged device is used to generate an output current detection signal (CS); and the constant current control chip in the constant current controller packaged device determines, based on the output current detection signal (CS), The average current of the constant current source load, and control the closing and opening of the power tube.

According to a fourth aspect, a constant current source load driving device is provided, comprising the constant current controller packaged device as described in the second aspect above and a peripheral circuit, the peripheral circuit comprising an inductor, an inductor charge/discharge current detection resistor, A capacitor and a power supply resistor, wherein the fifth and sixth pins of the constant current controller package device are connected to the positive electrode (VIN) of the input voltage source, and the first pin is connected to the negative electrode (GND) of the input voltage source; the inductor, connected to between the first and second pins of the constant current controller packaged device; an inductive charge/discharge current detection resistor, connected between the second and third pins of the constant current controller packaged device; The seventh pin of the constant current controller package device is connected to the VCC node between the power supply resistor and one end of the capacitor; the other end of the capacitor is connected to the third pin of the constant current controller package device, and is used as a constant current The filter capacitor of the source load; the constant current control chip in the constant current controller package device provides overcurrent protection to the power tube based on the inductor charge/discharge current detection signal; and, when charging/discharging the inductor current The average output current of the constant current source load is determined based on the detection signal shielding the inductor charging current detection signal.

Preferably, the constant current source load is an LED load.

According to the present invention, on the basis of using the existing SOP7 double-base island frame, the constant current control chip and some or all of the semiconductor elements are sealed together at the lowest cost, so that the application circuit is extremely simplified, and the cost advantage is relatively large. Significantly improve production efficiency. Therefore, the present invention has practical significance for the LED lighting industry to develop towards a lower carbon.

Description of drawings

For a better understanding of the present invention, the present invention will be further described below with examples in conjunction with the accompanying drawings. In the attached picture:

1 is a circuit diagram of a representative LED step-down constant current controller in the prior art;

Fig. 2 is the circuit structure diagram of the new generation LED constant current controller in the prior art;

FIG. 3 is an example of encapsulating the constant current control chip 300 and the power transistor 307 in FIG. 2;

Fig. 4 shows the diode structure of N-type substrate;

FIG. 5 is an example of a packaged device that encapsulates the constant current control chip 300, the power transistor 307 and the diode 308 in FIG. 2;

Figure 6 is a circuit structure diagram of a new generation of LED constant current controller with half-wave rectification;

FIG. 7 is an example of a packaged device that encapsulates the constant current control chip 300 , the power transistor 307 , the diode 308 and the diode 100 in FIG. 6 ;

Fig. 8 is the circuit structure diagram of the improved new generation LED constant current controller;

FIG. 9 is an example of a packaged device that encapsulates the constant current control chip 600, the power transistor 307 and the diode 308 in FIG. 8;

Figure 10 is the circuit structure diagram of the improved new generation LED constant current controller with half-wave rectification;

FIG. 11 is an example of a packaged device incorporating the constant current control chip 600 , the power transistor 307 , the diode 308 and the diode 100 in FIG. 10 .

Detailed ways

The inventor considers that, for the circuit shown in FIG. 2, to realize the sealing of the external semiconductor diode, it must be established on the basis of the sealing of the constant current control chip and the high-voltage power tube. Referring to FIG. 3 , FIG. 3 is an example of encapsulating the constant current control chip 300 and the power transistor 307 in FIG. 2 .

Co-package usually adopts SOP7 SMD double base island lead frame. The first base island on the left side of the frame unit is connected to the seventh pin, and the base island is generally installed with the constant current control chip 300; The top of the power tube 307 is provided with a wire bonding window for the gate G and the source S; the bottom is a back silver alloy drain, which is connected to the bottom metal substrate through conductive glue or soft solder, so the 5th and 6th pins are The high voltage drain of the power transistor 307 is the node VIN in FIG. 2 . In this example, the constant current control chip 300 is generally adhered to the first base island through an insulating adhesive sheet, and the ICGND soldering area of the die is directly welded to the first base island through bonding wires, that is, the seventh pin of the frame unit is The reference ground ICGND of the constant current control chip 300; the VCC welding area of the constant current control chip 300 is welded to the first pin of the frame unit by the wire bonding; the CS welding area of the constant current control chip 300 is welded to the third pin of the frame unit by the welding wire pin; the source S end of the power tube 307 is directly welded to the first base island by a wire;

In the circuit of Fig. 2, although the electrical properties of the four diode dies used in the AC rectifier bridge 101 are not exactly the same as those of the freewheeling rectifier diode 308, they are both called rectifier diodes, and they basically have the same die structure, as shown in the figure 4 shown. FIG. 4 shows a diode structure of an N-type substrate. In this structure, the top is a P-type anode with a bonding wire window; the bottom is an N-type cathode with a back silver alloy, which is connected to the bottom metal substrate through conductive glue or soft solder. In addition, there are also diodes in the supply chain market where the back silver alloy is a P-type anode, but the market share is less than 1%. The freewheeling rectifier diode 108 in the circuit of FIG. 1 is suitable for adopting such a P-type substrate structure.

Next, the inventor considers how to encapsulate the freewheeling rectifier diode 308 in FIG. 2 . As mentioned above, the N-type cathode of the diode 308 needs to be bonded to the metal substrate by conductive glue; and the second base island and the drain of the power tube 307 have been directly and electrically connected together, but in FIG. 2 , the cathode of the diode 308 is There is no direct electrical connection with the drain of the power tube 307. Therefore, the diode 308 can only be bonded to the first base island through conductive glue, and shares the same base island with the constant current control chip 300, and there is no second choose.

In the circuit of FIG. 2, the N-type cathode of the diode 308 is connected to the VCC pin of the constant current control chip 300, so that the seventh pin connected to the first base island should be the VCC pin of the constant current control chip. Since the constant current control chip 300 is a P-type substrate, which is generally the reference ground of the control chip, for electrical insulation, it is necessary to use insulating glue to bond the constant current control chip 300 to the first base island (the base island voltage is the VCC voltage ); and then directly weld the VCC welding area of the constant current control chip 300 on the first base island through the bonding wire, thereby connecting the seventh pin. Because the VCC voltage of the constant current control chip 300 is generally below 100V, the corresponding requirement of the insulating adhesive used must be above 100V. This insulation requirement is easy to achieve in modern packaging technology. Referring to FIG. 5 , FIG. 5 is an example of a packaged device that encapsulates the constant current control chip 300 , the power transistor 307 and the diode 308 in FIG. 2 .

Now it is determined that the 7th pin is VCC, and the 5th and 6th pins are VIN; the connection relationship has not yet been determined: the GND pin connected to the P-type anode of the diode 308, the reference ground ICGND pin of the constant current control chip 300, and the output Current detection pin CS. As shown in FIG. 5 , preferably, the anode of the diode 308 can be connected to the first pin of the frame unit through bonding wires; the output current detection CS welding area of the constant current control chip 300 is connected to the second pin, and the The reference ground ICGND soldering area is connected to the third pin; at the same time, the source of the power transistor 307 is also connected to the third pin. In addition, the gate of the power transistor 307 is connected to the driving DRV welding area of the constant current control chip 300 through a bonding wire.

In the above example, the 4th pin of the frame unit is free. Alternatively, any one of the 1st to 3rd pins of the frame unit can be spared, and the anode of the diode 308, the output current detection CS welding area of the constant current control chip and the reference ground ICGND welding area can be passed through the welding wire, press The pin numbers are connected to the other three pins from the 1st to the 4th pins in order from small to large; and the source of the power tube 307 is connected to the same pin connected to the ICGND welding area of the constant current control chip through the welding wire. . For example, when the first pin is free, the anode of the diode 308 is connected to the second pin, the constant current control chip output current detection CS welding area is connected to the third pin, and the constant current control chip refers to the ICGND welding area and the power tube. 307 sources are connected to the 4th pin.

In this way, the encapsulation of the freewheeling rectifier diode 308 in FIG. 2 is realized, so that three semiconductor dies of different types, sizes and functions are encapsulated inside one packaged device.

According to the present invention, on the basis of realizing the encapsulation of the device shown in FIG. 5 , the LED load driving device in FIG. 2 may correspondingly include: the constant current controller packaged device shown in FIG. 5 and a peripheral circuit. The peripheral circuit includes an inductor 309 , a capacitor 604 , a detection resistor 306 and a power supply resistor 103 . Among them, the fifth and sixth pins of the constant current controller package device are connected to the positive VIN of the input voltage source, and the first pin is connected to the negative GND of the input voltage source; the inductor 309 is connected to the first and third pins of the packaged device. The 7th pin of the packaged device is connected to the VCC node between the power supply resistor 103 and one end of the capacitor 604; the other end of the capacitor 604 is connected to the node between the LED load 111, one end of the detection resistor 306 and the second pin of the packaged device, And it is used as a filter capacitor for the LED load 111; the other end of the detection resistor 306 is connected to the third pin of the packaged device to generate the output current detection signal CS; and the constant current control chip 300 in the packaged device determines the output current detection signal CS based on the output current detection signal CS The average current of the LED load 111 and control the closing and opening of the power tube 307 .

Further, the inventor considers how to encapsulate the diodes of the rectifier bridge 101 in FIG. 2 . Generally speaking, there are four identical independent diode dies inside the full-wave rectifier bridge, but it is impossible to encapsulate these four diode dies on the double-base island SOP7 frame unit. However, in LED lamps with low power such as 1W to 5W, half-wave rectification technology can be used, and only one AC rectifier diode 100 is used, as shown in FIG. 6 . Due to the huge number of 1W to 5W low-power LED lamps, which can account for about half of the total number of lamps, and the circuit structure shown in Figure 6 has obvious advantages in low-power applications, the co-packaged AC rectifier diode 100 die is also quite practical. .

Since the N-type cathode of the AC rectifier diode 100 and the drain of the power tube 307 are both connected to the VIN node, the diode 100 and the power tube 307 can be bonded together with conductive glue on the second base island. Referring to FIG. 7 , FIG. 7 is an example of a packaged device that encapsulates the constant current control chip 300 , the power transistor 307 , the diode 308 and the diode 100 in FIG. 6 . In this example, based on the packaged device shown in FIG. 5 , the AC rectifier diode 100 is bonded to the second base island through conductive glue, and its P-type anode is connected to the spare fourth pin of the frame unit through bonding wires. In this way, four different types, sizes and functions of semiconductor die are packaged in one integrated circuit. In this way, all the semiconductor components shown in FIG. 6 are packaged in one integrated circuit, which makes the whole constant current circuit extremely simple, reduces the number of components, reduces the cost, reduces the circuit space, and improves the production efficiency and reduces the failure. Rate.

Referring to FIG. 8, FIG. 8 is a circuit structure diagram of an improved new generation LED constant current controller. On the basis of the circuit of FIG. 2 , the improved circuit increases the maximum current limiting function of the power tube 307, thereby improving the safety of the system. FIG. 9 is an example of a packaged device that encapsulates the constant current control chip 600 , the power transistor 307 and the diode 308 in FIG. 8 . In this packaged device, the setting of the constant current control chip 600, the power tube 307 and the diode 308 on the base island and their connection with the 1st, 5th, 6th and 7th pins of the frame unit are the same as in FIG. 5; The driving DRV bonding area of the flow control chip 600 is also connected to the gate of the power transistor 307 through bonding wires. Different from the packaged device shown in FIG. 5 , in FIG. 9 , the reference ground ICGND welding area of the constant current control chip 600 is connected to the second pin of the frame unit, and the inductive charge/discharge current detection CS welding area of the constant current control chip 600 and The source of the power tube 307 is connected to the third pin.

In the example of Figure 9, the fourth pin of the frame unit is free. Alternatively, any one of the first to third pins of the frame unit can be spared, and the anode of the diode 308, the reference ground ICGND welding area of the constant current control chip 600, and the inductor charge/discharge current detection CS welding area Connect the other three pins from the 1st to the 4th pins in sequence according to the pin number from small to large through the bonding wires; The same pins that the pads are connected to are connected.

On the basis of realizing the encapsulation of the device shown in FIG. 9 , the LED load driving device in FIG. 8 may correspondingly include: the constant current controller packaged device shown in FIG. 9 and a peripheral circuit. The peripheral circuit includes an inductor 309 , an inductor charge/discharge current detection resistor 606 , a capacitor 604 and a power supply resistor 103 . Among them, the fifth and sixth pins of the constant current controller package device are connected to the positive VIN of the input voltage source, and the first pin is connected to the negative GND of the input voltage source; the inductor 309 is connected to the first and second pins of the package device. between; the inductor charge/discharge current detection resistor 606 is connected between the second and third pins of the packaged device; the seventh pin of the packaged device is connected to the VCC node between the power supply resistor 103 and one end of the capacitor 604; the capacitor 604 is another One end is connected to the third pin of the packaged device and used as a filter capacitor for the LED load 111; the constant current control chip 600 in the packaged device provides overcurrent protection to the power tube 307 based on the inductor charge/discharge current detection signal CS, and provides overcurrent protection to the inductor when charging. The average output current of the LED load 111 is determined on the basis of the discharge current detection signal CS shielding the inductor charging current detection signal.

Corresponding to the improved circuit structure of Figure 8 using the half-wave rectification technology, as shown in Figure 10. In this circuit, only one AC rectifier diode 100 is used to replace the full-wave rectifier bridge. Referring to FIG. 11 , FIG. 11 is an example of a packaged device that encapsulates the constant current control chip 600 , the power transistor 307 , the diode 308 and the diode 100 in FIG. 10 . Similarly, on the basis of the packaged device shown in FIG. 9 , the AC rectifier diode 100 is bonded to the second base island through conductive glue, and its P-type anode is connected to the spare fourth pin of the frame unit through bonding wires.

In the foregoing description, although the present invention is taken as an example of driving an LED load, those skilled in the art can easily understand that the present invention can be used to drive any kind of constant current source load.

Obviously, many variations of the invention described herein are possible without such variations being considered a departure from the spirit and scope of the invention. Accordingly, all modifications obvious to those skilled in the art are intended to be included within the scope of the appended claims.

Claims (9)

1. A constant current controller packaging device comprises an SOP7 lead frame unit, a constant current control chip, a freewheeling rectifying diode and a power tube; the lead frame unit comprises a first base island, a second base island and seven pins, wherein the first base island is connected with a seventh pin, the second base island is connected with a fifth pin and a sixth pin, wherein,

the constant current control chip is bonded on the first base island through insulating glue, and a power supply (VCC) welding area of the constant current control chip is welded on the first base island through a welding wire;

the follow current rectifier diode is connected to the first base island through conductive glue;

the power tube is bonded on the second base island through conductive glue, and the grid electrode of the power tube is connected with a Driving (DPV) welding area of the constant current control chip through a welding wire;

under the condition that any one of the first pin, the second pin and the fourth pin is vacant, the anode of the freewheeling rectifying diode, the output current detection (CS) welding area and the reference ground (ICGND) welding area of the constant current control chip are sequentially connected with the other three pins of the first pin, the second pin and the fourth pin from small to large through bonding wires according to the pin serial numbers; and the source electrode of the power tube is connected with the same pin connected with a reference ground (ICGND) welding area of the constant current control chip through a welding wire.

2. The constant current controller package device of claim 1, wherein an anode of the freewheeling rectifier diode is connected to the first pin, an output Current Sense (CS) pad of the constant current control chip is connected to the second pin, and a ground reference (ICGND) pad and a power transistor source of the constant current control chip are connected to the third pin.

3. The constant current controller package of claim 2, wherein the constant current controller package further comprises an ac rectifier diode; the alternating current rectifier diode is connected to the second base island through conductive glue, and the anode of the alternating current rectifier diode is connected with the fourth pin through a welding wire.

4. A constant current controller packaging device comprises an SOP7 lead frame unit, a constant current control chip, a freewheeling rectifying diode and a power tube; the lead frame unit comprises a first base island, a second base island and seven pins, wherein the first base island is connected with a seventh pin, the second base island is connected with a fifth pin and a sixth pin, wherein,

the constant current control chip is bonded on the first base island through insulating glue, and a power supply (VCC) welding area of the constant current control chip is welded on the first base island through a welding wire;

the follow current rectifier diode is connected to the first base island through conductive glue;

the power tube is adhered to the second base island through conductive glue, and the grid electrode of the power tube is connected with a Drive (DRV) welding area of the constant current control chip through a welding wire;

under the condition that any one of the first pin to the fourth pin is vacant, the anode of the freewheeling rectifying diode, a reference ground (ICGND) welding area and an inductance charging/discharging current detection (CS) welding area of the constant current control chip are sequentially connected with the other three pins of the first pin to the fourth pin from small to large according to the pin serial numbers through bonding wires; and the source electrode of the power tube is connected with the same pin connected with a constant current control chip inductance charging/discharging current detection (CS) welding area through a welding wire.

5. The constant current controller package device of claim 4, wherein an anode of the freewheeling rectifier diode is connected to the first pin, a ground reference (ICGND) pad of the constant current control chip is connected to the second pin, and an inductive charge/discharge Current Sense (CS) pad of the constant current control chip and a power transistor source are connected to the third pin.

6. The constant current controller package of claim 5, wherein the constant current controller package further comprises an AC rectifier diode; the alternating current rectifier diode is connected to the second base island through conductive glue, and the anode of the alternating current rectifier diode is connected with the fourth pin through a welding wire.

7. A constant current source load driving apparatus comprising the constant current controller package device according to claim 2 and a peripheral circuit including an inductance, a capacitance, a detection resistance, and a supply resistance, wherein,

a fifth pin and a sixth pin of the constant current controller packaging device are connected with the anode (VIN) of an input voltage source, and a first pin is connected with the cathode (GND) of the input voltage source;

the inductor is connected between the first pin and the third pin of the constant current controller packaging device;

a seventh pin of the constant current controller packaging device is connected with a VCC node between the power supply resistor and one end of the capacitor;

the other end of the capacitor is connected to a node between the constant current source load, one end of the detection resistor and a second pin of the constant current controller packaging device, and the capacitor is used as a filter capacitor of the constant current source load;

the other end of the detection resistor is connected with a third pin of the constant current controller packaging device and used for generating an output current detection signal (CS); and the number of the first and second electrodes,

and the constant current control chip in the constant current controller packaging device determines the average current of the constant current source load based on the output current detection signal (CS) and controls the on and off of the power tube.

8. A constant current source load driving apparatus comprising the constant current controller package device according to claim 5 and a peripheral circuit including an inductor, an inductor charge/discharge current detection resistor, a capacitor, and a supply resistor, wherein,

a fifth pin and a sixth pin of the constant current controller packaging device are connected with the anode (VIN) of an input voltage source, and a first pin is connected with the cathode (GND) of the input voltage source;

the inductor is connected between the first pin and the second pin of the constant current controller packaging device;

the inductor charging/discharging current detection resistor is connected between the second pin and the third pin of the constant current controller packaging device;

a seventh pin of the constant current controller packaging device is connected with an VcC node between the power supply resistor and one end of the capacitor;

the other end of the capacitor is connected with a third pin of the constant current controller packaging device and is used as a filter capacitor of a constant current source load;

the constant current control chip in the constant current controller packaging device provides overcurrent protection for the power tube based on an inductor charging/discharging current detection signal; and, on the basis of shielding the inductance charging current detection signal from the inductance charging/discharging current detection signal, determining the average output current of the constant current source load.

9. The constant-current-source-load driving device according to claim 7 or 8, wherein the constant-current source load is an LED load.

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