CN111343756A - Constant current controller packaging device and driving device - Google Patents
Constant current controller packaging device and driving device Download PDFInfo
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- CN111343756A CN111343756A CN202010336361.9A CN202010336361A CN111343756A CN 111343756 A CN111343756 A CN 111343756A CN 202010336361 A CN202010336361 A CN 202010336361A CN 111343756 A CN111343756 A CN 111343756A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 238000003466 welding Methods 0.000 claims description 48
- 238000001514 detection method Methods 0.000 claims description 43
- 239000003990 capacitor Substances 0.000 claims description 25
- 239000003292 glue Substances 0.000 claims description 18
- 238000007599 discharging Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 230000001939 inductive effect Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910001316 Ag alloy Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
The invention discloses a constant current controller packaging device which comprises an SOP7 lead frame unit, a constant current control chip, a freewheeling rectifier diode and a power tube. The invention seals the constant current control chip and part or all semiconductor elements together with the lowest cost on the basis of adopting the prior SOP7 double-base island frame, realizes the great simplification of an application circuit, has the advantage of higher cost, and simultaneously obviously improves the production efficiency.
Description
Technical Field
The invention relates to packaging of a constant current controller, in particular to a constant current controller of a closed rectifying diode and a driving device comprising the constant current controller.
Background
Currently, Light Emitting Diode (LED) illumination sources have been widely used. As a main driving power supply of an LED light source, a plurality of professional LED constant current switch power supply controllers appear at the initial stage of the market; subsequently, the drive integrated circuits that became more sophisticated and specialized have greatly facilitated the start-up and growth of the LED lighting market.
The circuit structure of the LED step-down constant current controller which has started to be popular in the market and is representative is shown in fig. 1. The circuit structure of a new generation of LED constant current controller is shown in fig. 2. They are two different constant current controllers, each having advantages and disadvantages. The circuit of fig. 1 has some advantages when the string ratio of the LED load 111 is large, that is, the load voltage is high (for example, greater than 100V). The circuit of fig. 2 has significant cost and performance advantages when the output LED load 111 has a small number of strings (e.g., the load voltage is lower than 100V). The two circuit structures have better complementarity and compete with each other, and continuously evolve along similar but not completely identical evolution routes, pursuing better performance and lower cost. Of course, lower cost is the first direction of preferential evolution.
In the direction of lower cost, the circuits of fig. 1 and 2 are similar in that as many peripheral semiconductor elements as possible are encapsulated. It can be seen that the circuits of fig. 1 and 2 have the following same number and kind of semiconductor elements, except for the load 111: the constant current control circuit comprises a constant current control chip (200 in figure 1 and 300 in figure 2), a high-voltage power tube (107 in figure 1 and 307 in figure 2), a freewheeling rectifying diode (108 in figure 1 and 308 in figure 2) and an alternating current rectifying bridge 101. At present, as for the circuits in fig. 1 and fig. 2, the sealing of the constant current control chip and the high voltage power tube has been realized, and the sealing manner and technology have been commercially used for more than five years. Here, sealing refers to a technique of mounting a control chip die and a power tube die on the same chip frame, and then bonding wires and plastically molding into an integrated circuit.
The current evolution is how to encapsulate freewheeling rectifier diodes and ac rectifier bridges. Due to the large percentage of the circuit structure of fig. 1 on the market, many semiconductor companies have made efforts in this direction. To close the diode 108, some companies have also developed and patented new close-in frames. Some companies go further and develop larger and more complex sealing frames specifically for sealing both the diode 108 and the rectifier bridge. For the circuit structure shown in fig. 2, there is no scheme for sealing the freewheeling rectifier diode 308 or the ac rectifier bridge 101 at present, which is a problem to be solved urgently in a severe market competition.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides a novel constant current controller of a closed rectifying diode, which has the advantages of low cost and realizes a constant current closed sealing technology with higher integration level.
According to a first aspect of the present invention, there is provided a constant current controller package device, comprising an SOP7 lead frame unit, a constant current control chip, a freewheeling rectifier diode, and a power transistor; the lead frame unit comprises a first base island, a second base island and seven pins, wherein the first base island is connected with the seventh pin, the second base island is connected with the fifth pin and the sixth pin, the constant current control chip is bonded on the first base island through insulating glue, and a power supply (VCC) welding area of the constant current control chip is welded on the first base island through a bonding wire; the follow current rectifier diode is connected to the first base island through conductive glue; the power tube is adhered to the second base island through conductive glue, and the grid electrode of the power tube is connected with a Drive (DRV) welding area of the constant current control chip through a welding wire; under the condition that any one of the first pin, the second pin and the fourth pin is vacant, the anode of the freewheeling rectifying diode, the output current detection (CS) welding area and the reference ground (ICGND) welding area of the constant current control chip are sequentially connected with the other three pins of the first pin, the second pin and the fourth pin from small to large through bonding wires according to the pin serial numbers; and the source electrode of the power tube is connected with the same pin connected with a reference ground (ICGND) welding area of the constant current control chip through a welding wire.
Preferably, the anode of the freewheeling rectifying diode is connected with the first pin, the output current detection (CS) welding area of the constant current control chip is connected with the second pin, and the reference ground (ICGND) welding area and the power tube source electrode of the constant current control chip are connected with the third pin.
Preferably, the constant current controller packaging device further comprises an alternating current rectifier diode; the alternating current rectifier diode is connected to the second base island through conductive glue, and the anode of the alternating current rectifier diode is connected with the fourth pin through a welding wire.
According to a second aspect, a constant current controller package device is provided, which comprises an SOP7 lead frame unit, a constant current control chip, a freewheeling rectifier diode and a power tube; the lead frame unit comprises a first base island, a second base island and seven pins, wherein the first base island is connected with the seventh pin, the second base island is connected with the fifth pin and the sixth pin, the constant current control chip is bonded on the first base island through insulating glue, and a power supply (VCC) welding area of the constant current control chip is welded on the first base island through a bonding wire; the follow current rectifier diode is connected to the first base island through conductive glue; the power tube is adhered to the second base island through conductive glue, and the grid electrode of the power tube is connected with a Drive (DRV) welding area of the constant current control chip through a welding wire; under the condition that any one of the first pin to the fourth pin is vacant, the anode of the freewheeling rectifying diode, a reference ground (ICGND) welding area and an inductance charging/discharging current detection (CS) welding area of the constant current control chip are sequentially connected with the other three pins of the first pin to the fourth pin from small to large according to the pin serial numbers through bonding wires; and the source electrode of the power tube is connected with the same pin connected with a constant current control chip inductance charging/discharging current detection (CS) welding area through a welding wire.
Preferably, the anode of the freewheeling rectifying diode is connected to the first pin, the reference ground (ICGND) pad of the constant current control chip is connected to the second pin, and the inductor charge/discharge current detection (CS) pad of the constant current control chip and the source of the power tube are connected to the third pin.
Preferably, the constant current controller packaging device further comprises an alternating current rectifier diode; the alternating current rectifier diode is connected to the second base island through conductive glue, and the anode of the alternating current rectifier diode is connected with the fourth pin through a welding wire.
According to a third aspect, there is provided a constant current source load driving apparatus comprising a constant current controller package device as described in the first aspect above, and a peripheral circuit comprising an inductor, a capacitor, a detection resistor, and a supply resistor, wherein fifth and sixth pins of the constant current controller package device are connected to a positive electrode (VIN) of an input voltage source, and a first pin is connected to a negative electrode (GND) of the input voltage source; the inductor is connected between the first pin and the third pin of the constant current controller packaging device; a seventh pin of the constant current controller packaging device is connected with a VCC node between the power supply resistor and one end of the capacitor; the other end of the capacitor is connected to a node between the constant current source load, one end of the detection resistor and a second pin of the constant current controller packaging device, and the capacitor is used as a filter capacitor of the constant current source load; the other end of the detection resistor is connected with a third pin of the constant current controller packaging device and used for generating an output current detection signal (CS); and the constant current control chip in the constant current controller packaging device determines the average current of the constant current source load based on the output current detection signal (CS) and controls the on and off of the power tube.
According to a fourth aspect, there is provided a constant current source load driving apparatus comprising the constant current controller package device as described in the second aspect above, and a peripheral circuit including an inductor, an inductor charge/discharge current detection resistor, a capacitor, and a power supply resistor, wherein fifth and sixth pins of the constant current controller package device are connected to a positive electrode (VIN) of an input voltage source, and a first pin is connected to a negative electrode (GND) of the input voltage source; the inductor is connected between the first pin and the second pin of the constant current controller packaging device; the inductor charging/discharging current detection resistor is connected between the second pin and the third pin of the constant current controller packaging device; a seventh pin of the constant current controller packaging device is connected with a VCC node between the power supply resistor and one end of the capacitor; the other end of the capacitor is connected with a third pin of the constant current controller packaging device and is used as a filter capacitor of a constant current source load; the constant current control chip in the constant current controller packaging device provides overcurrent protection for the power tube based on an inductor charging/discharging current detection signal; and, on the basis of shielding the inductance charging current detection signal from the inductance charging/discharging current detection signal, determining the average output current of the constant current source load.
Preferably, the constant current source load is an LED load.
According to the invention, on the basis of adopting the existing SOP7 double-base island frame, the constant current control chip and part or all of the semiconductor elements are sealed together at the lowest cost, thereby realizing the extremely simplified application circuit, having the advantage of higher cost and simultaneously obviously improving the production efficiency. Therefore, the method has practical significance for the development of lower carbon in the LED lighting industry.
Drawings
For a better understanding of the present invention, the following examples are provided to further illustrate the present invention in conjunction with the accompanying drawings. In the drawings:
fig. 1 is a circuit structure diagram of a representative LED step-down constant current controller in the prior art;
FIG. 2 is a circuit diagram of a new generation of LED constant current controller in the prior art;
fig. 3 is an example of sealing the constant current control chip 300 and the power tube 307 in fig. 2;
FIG. 4 shows a diode structure of an N-type substrate;
fig. 5 is an example of a package device for sealing the constant current control chip 300, the power transistor 307 and the diode 308 in fig. 2;
FIG. 6 is a circuit structure diagram of a half-wave rectified new generation LED constant current controller;
fig. 7 is an example of a package device for sealing the constant current control chip 300, the power transistor 307, the diode 308 and the diode 100 in fig. 6;
FIG. 8 is a circuit structure diagram of a new generation of LED constant current controller;
fig. 9 is an example of a package device for sealing the constant current control chip 600, the power transistor 307 and the diode 308 in fig. 8;
fig. 10 is a circuit structure diagram of a half-wave rectified improved new generation LED constant current controller;
fig. 11 is an example of a package device for sealing the constant current control chip 600, the power transistor 307, the diode 308, and the diode 100 in fig. 10.
Detailed Description
The inventor considers that for the circuit shown in fig. 2, to realize the sealing of the external semiconductor diode, the sealing is necessarily based on the sealing of the constant current control chip and the high voltage power tube. Referring to fig. 3, fig. 3 is an example of sealing the constant current control chip 300 and the power tube 307 in fig. 2.
The seal is usually made by SOP7 patch dual-base lead frame. The first base island, located on the left of the frame unit, which typically mounts the constant current control chip 300, connects pin 7; the second base island on the right connects the 5 th and 6 th pins, which typically mount a power tube 307. The top of the power tube 307 is provided with a bonding wire window of the grid G and the source S; the bottom of the power transistor is a back silver alloy drain, and the back silver alloy drain is connected to the bottom metal substrate through a conductive adhesive or soft solder, so that the 5 th and 6 th pins are the high-voltage drains of the power transistor 307, i.e., the node VIN in fig. 2. In this example, the constant current control chip 300 is generally adhered to the first base island by an insulating adhesive sheet, and the die ICGND pad thereof is directly welded to the first base island by a bonding wire, that is, the 7 th pin of the frame unit is the reference ground ICGND of the constant current control chip 300; a VCC welding area of a tube core of the constant current control chip 300 is welded with a No. 1 pin of the frame unit through a welding wire; a CS welding area of a tube core of the constant current control chip 300 is welded with a No. 3 pin of the frame unit through a welding wire; the source S end of the power tube 307 is directly welded to the first base island by a bonding wire; the DRV pad of the constant current control chip 300 is bonded to the gate G of the power transistor 307 by a wire bond.
In the circuit of fig. 2, although the four diode dies used in the ac rectifier bridge 101 and the freewheeling rectifier diode 308 are not identical in electrical performance, they are all referred to as rectifier diodes and have substantially the same die structure, as shown in fig. 4. Figure 4 shows a diode structure of an N-type substrate. In the structure, the top is a P-type anode provided with a welding wire window; and the bottom is an N-type cathode of the back silver alloy and is connected to the bottom metal substrate through conductive adhesive or soft solder. In addition, although there are diodes with P-type anodes made of back silver alloy on the market, the market percentage is less than 1%, and the freewheeling rectifier diode 108 in the circuit of fig. 1 is suitable for the P-type substrate structure.
Next, the inventors consider how to encapsulate the freewheeling rectifier diode 308 in fig. 2. As described above, the N-type cathode of the diode 308 needs to be bonded to the metal substrate by conductive glue; and the second base island and the drain of the power tube 307 are directly and electrically connected together, but in fig. 2, there is no direct electrical connection relationship between the cathode of the diode 308 and the drain of the power tube 307, so the diode 308 can only be bonded on the first base island by conductive glue, and shares the same base island with the constant current control chip 300, and there is no second option.
In the circuit of fig. 2, the N-type cathode of the diode 308 is connected to the VCC pin of the constant current control chip 300, so that the 7 th pin connected to the first base island should be the VCC pin of the constant current control chip. Since the constant current control chip 300 is a P-type substrate, which is generally the reference ground of the control chip, in order to electrically insulate, the constant current control chip 300 needs to be adhered to the first base island by using an insulating adhesive (the base island voltage is VCC voltage); then, the VCC bonding area of the constant current control chip 300 is directly bonded to the first base island by a bonding wire, thereby connecting the 7 th pin. Because the VCC voltage of the constant current control chip 300 is generally below 100V, the insulation requirement, which is easily achieved in modern packaging technology, must be above 100V for the insulation paste withstand voltage used. Referring to fig. 5, fig. 5 is an example of a package device for sealing the constant current control chip 300, the power transistor 307, and the diode 308 in fig. 2.
Now, pin 7 is determined to be VCC and pins 5 and 6 are determined to be VIN; the connection relationship has not been determined: a GND terminal connected to the P-type anode of the diode 308, a ground reference ICGND terminal of the constant current control chip 300, and an output current detection terminal CS. As shown in fig. 5, the anode of the diode 308 can be connected to the 1 st pin of the frame unit, preferably by bonding wires; connecting the CS welding area of the output current detection of the constant current control chip 300 with the 2 nd pin, and connecting the CS welding area with the 3 rd pin by referring to the ICGND welding area; meanwhile, the source of the power transistor 307 is also connected to pin 3. The gate of the power transistor 307 is connected to the driving DRV pad of the constant current control chip 300 by a bonding wire.
In the above example, the frame element pin 4 is left free. Alternatively, any pin of the 1 st to 3 rd pins of the frame unit may be left, and the anode of the diode 308, the constant current control chip output current detection CS welding region and the reference ground ICGND welding region are connected to the other three pins of the 1 st to 4 th pins in sequence from small to large according to the pin numbers through bonding wires; and the source of the power tube 307 is connected to the same pin connected to the gnd reference pad of the constant current control chip through a bonding wire. For example, when pin 1 is left, the anode of the diode 308 is connected to pin 2, the output current detection CS pad of the constant current control chip is connected to pin 3, and the reference ground ICGND pad of the constant current control chip and the source of the power tube 307 are both connected to pin 4.
Thus, the encapsulation of the freewheeling rectifier diode 308 in fig. 2 is achieved, such that three different types, sizes and functions of semiconductor die are encapsulated within one packaged device.
According to the present invention, upon realizing the device sealing as shown in fig. 5, the LED load driving apparatus of fig. 2 may include: the constant current controller package device and peripheral circuits shown in fig. 5. The peripheral circuit includes an inductor 309, a capacitor 604, a detection resistor 306, and a supply resistor 103. Pins 5 and 6 of the constant current controller packaging device are connected with an anode VIN of an input voltage source, and a pin 1 is connected with a cathode GND of the input voltage source; the inductor 309 is connected between the 1 st and 3 rd pins of the packaged device; the 7 th pin of the packaging device is connected with a VCC node between the supply resistor 103 and one end of the capacitor 604; the other end of the capacitor 604 is connected to a node between the LED load 111 and the 2 nd pin of the package device, and is used as a filter capacitor of the LED load 111; the other end of the detection resistor 306 is connected with a 3 rd pin of the packaging device and used for generating an output current detection signal CS; further, the constant current control chip 300 in the packaged device determines the average current of the LED load 111 based on the output current detection signal CS, and controls the power tube 307 to be turned on and off.
Further, the inventors consider how to encapsulate the diodes of the rectifier bridge 101 in fig. 2. Generally, four identical independent diode dies are arranged inside the full-wave rectifier bridge, but the four diode dies cannot be sealed on the double-base island SOP7 frame unit. However, in a low power LED lamp such as 1W to 5W, half-wave rectification technology can be used, and only one ac rectifier diode 100 is used, as shown in fig. 6. Since the number of 1W to 5W low-power LED lamps is large, which can account for about half of the total number of lamps, and the circuit structure shown in fig. 6 has a significant advantage in low-power applications, the closed ac rectifier diode 100 has a practical value.
Since the N-type cathode of the ac rectifying diode 100 and the drain of the power tube 307 are both connected to the VIN node, the diode 100 and the power tube 307 may be bonded together on the second base island by using a conductive adhesive. Referring to fig. 7, fig. 7 is an example of a package device for sealing the constant current control chip 300, the power transistor 307, the diode 308, and the diode 100 in fig. 6. In this example, on the basis of the packaged device of fig. 5, the ac rectifying diode 100 is bonded to the second base island by a conductive adhesive, and its P-type anode is connected to the vacant 4 th pin of the frame unit by a bonding wire. Thus, four semiconductor chip chips with different types, sizes and functions are encapsulated in one integrated circuit. Therefore, the sealing of all semiconductor elements in the integrated circuit in fig. 6 is realized, the whole constant current circuit is extremely simple, the number of elements is reduced, the cost is reduced, the circuit space is reduced, the production efficiency is improved, and the failure rate is reduced.
Referring to fig. 8, fig. 8 is a circuit structure diagram of a new generation of improved LED constant current controller. On the basis of the circuit of fig. 2, the improved circuit increases the maximum current limiting function of the power tube 307, and improves the safety of the system. Fig. 9 is an example of a package device for sealing the constant current control chip 600, the power transistor 307, and the diode 308 in fig. 8. In the packaged device, the arrangement of the constant current control chip 600, the power tube 307 and the diode 308 on the base island and the connection of the constant current control chip, the power tube and the diode with the 1 st, 5 th, 6 th and 7 th pins of the frame unit are the same as those in fig. 5; the drive DRV pad of the constant current control chip 600 is also connected to the gate of the power transistor 307 by a bonding wire. Unlike the packaged device shown in fig. 5, in fig. 9, the reference ground ICGND pad of the constant current control chip 600 is connected to the 2 nd pin of the frame unit, and the inductive charge/discharge current detection CS pad and the source of the power tube 307 of the constant current control chip 600 are connected to the 3 rd pin.
In the example of fig. 9, the frame element pin 4 is free. Alternatively, any one of the 1 st to 3 rd pins of the frame unit may be left, and the anode of the diode 308, the reference ground ICGND welding region of the constant current control chip 600, and the inductance charging/discharging current detection CS welding region are connected to the other three pins of the 1 st to 4 th pins in sequence from small to large according to the pin numbers through bonding wires; and the source of the power tube 307 is connected to the same pin connected to the constant current control chip inductor charge/discharge current detection CS pad through a bonding wire.
On the basis of realizing the device sealing shown in fig. 9, the LED load driving apparatus of fig. 8 may include: fig. 9 shows a constant current controller package device and peripheral circuits. The peripheral circuit includes an inductor 309, an inductor charge/discharge current detection resistor 606, a capacitor 604, and a supply resistor 103. Pins 5 and 6 of the constant current controller packaging device are connected with an anode VIN of an input voltage source, and a pin 1 is connected with a cathode GND of the input voltage source; the inductor 309 is connected between the 1 st and 2 nd pins of the packaged device; an inductor charge/discharge current sense resistor 606 is connected between pins 2 and 3 of the packaged device; the 7 th pin of the packaging device is connected with a VCC node between the supply resistor 103 and one end of the capacitor 604; the other end of the capacitor 604 is connected to the 3 rd pin of the package device and is used as a filter capacitor of the LED load 111; the constant current control chip 600 in the package device provides overcurrent protection for the power tube 307 based on the inductive charging/discharging current detection signal CS, and determines the average output current of the LED load 111 on the basis of shielding the inductive charging current detection signal from the inductive charging/discharging current detection signal CS.
The circuit structure is modified corresponding to fig. 8 using the half-wave rectification technique, as shown in fig. 10. In this circuit, only one ac rectifier diode 100 is used instead of a full-wave rectifier bridge. Referring to fig. 11, fig. 11 is an example of a package device for sealing the constant current control chip 600, the power transistor 307, the diode 308, and the diode 100 in fig. 10. Similarly, on the basis of the packaged device in fig. 9, the ac rectifying diode 100 is bonded to the second base island by a conductive adhesive, and its P-type anode is connected to the vacant 4 th pin of the frame unit by a bonding wire.
In the foregoing description, although the present invention is exemplified to drive an LED load, it is easily understood by those skilled in the art that the present invention can be used to drive any kind of constant current source load.
It will be apparent that there are many variations of the invention described herein which are not to be regarded as a departure from the spirit and scope of the invention. Accordingly, all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of this invention as set forth in the following claims.
Claims (9)
1. A constant current controller packaging device comprises an SOP7 lead frame unit, a constant current control chip, a freewheeling rectifying diode and a power tube; the lead frame unit comprises a first base island, a second base island and seven pins, wherein the first base island is connected with a seventh pin, the second base island is connected with a fifth pin and a sixth pin, wherein,
the constant current control chip is bonded on the first base island through insulating glue, and a power supply (VCC) welding area of the constant current control chip is welded on the first base island through a welding wire;
the follow current rectifier diode is connected to the first base island through conductive glue;
the power tube is bonded on the second base island through conductive glue, and the grid electrode of the power tube is connected with a Driving (DPV) welding area of the constant current control chip through a welding wire;
under the condition that any one of the first pin, the second pin and the fourth pin is vacant, the anode of the freewheeling rectifying diode, the output current detection (CS) welding area and the reference ground (ICGND) welding area of the constant current control chip are sequentially connected with the other three pins of the first pin, the second pin and the fourth pin from small to large through bonding wires according to the pin serial numbers; and the source electrode of the power tube is connected with the same pin connected with a reference ground (ICGND) welding area of the constant current control chip through a welding wire.
2. The constant current controller package device of claim 1, wherein an anode of the freewheeling rectifier diode is connected to the first pin, an output Current Sense (CS) pad of the constant current control chip is connected to the second pin, and a ground reference (ICGND) pad and a power transistor source of the constant current control chip are connected to the third pin.
3. The constant current controller package of claim 2, wherein the constant current controller package further comprises an ac rectifier diode; the alternating current rectifier diode is connected to the second base island through conductive glue, and the anode of the alternating current rectifier diode is connected with the fourth pin through a welding wire.
4. A constant current controller packaging device comprises an SOP7 lead frame unit, a constant current control chip, a freewheeling rectifying diode and a power tube; the lead frame unit comprises a first base island, a second base island and seven pins, wherein the first base island is connected with a seventh pin, the second base island is connected with a fifth pin and a sixth pin, wherein,
the constant current control chip is bonded on the first base island through insulating glue, and a power supply (VCC) welding area of the constant current control chip is welded on the first base island through a welding wire;
the follow current rectifier diode is connected to the first base island through conductive glue;
the power tube is adhered to the second base island through conductive glue, and the grid electrode of the power tube is connected with a Drive (DRV) welding area of the constant current control chip through a welding wire;
under the condition that any one of the first pin to the fourth pin is vacant, the anode of the freewheeling rectifying diode, a reference ground (ICGND) welding area and an inductance charging/discharging current detection (CS) welding area of the constant current control chip are sequentially connected with the other three pins of the first pin to the fourth pin from small to large according to the pin serial numbers through bonding wires; and the source electrode of the power tube is connected with the same pin connected with a constant current control chip inductance charging/discharging current detection (CS) welding area through a welding wire.
5. The constant current controller package device of claim 4, wherein an anode of the freewheeling rectifier diode is connected to the first pin, a ground reference (ICGND) pad of the constant current control chip is connected to the second pin, and an inductive charge/discharge Current Sense (CS) pad of the constant current control chip and a power transistor source are connected to the third pin.
6. The constant current controller package of claim 5, wherein the constant current controller package further comprises an AC rectifier diode; the alternating current rectifier diode is connected to the second base island through conductive glue, and the anode of the alternating current rectifier diode is connected with the fourth pin through a welding wire.
7. A constant current source load driving apparatus comprising the constant current controller package device according to claim 2 and a peripheral circuit including an inductance, a capacitance, a detection resistance, and a supply resistance, wherein,
a fifth pin and a sixth pin of the constant current controller packaging device are connected with the anode (VIN) of an input voltage source, and a first pin is connected with the cathode (GND) of the input voltage source;
the inductor is connected between the first pin and the third pin of the constant current controller packaging device;
a seventh pin of the constant current controller packaging device is connected with a VCC node between the power supply resistor and one end of the capacitor;
the other end of the capacitor is connected to a node between the constant current source load, one end of the detection resistor and a second pin of the constant current controller packaging device, and the capacitor is used as a filter capacitor of the constant current source load;
the other end of the detection resistor is connected with a third pin of the constant current controller packaging device and used for generating an output current detection signal (CS); and the number of the first and second electrodes,
and the constant current control chip in the constant current controller packaging device determines the average current of the constant current source load based on the output current detection signal (CS) and controls the on and off of the power tube.
8. A constant current source load driving apparatus comprising the constant current controller package device according to claim 5 and a peripheral circuit including an inductor, an inductor charge/discharge current detection resistor, a capacitor, and a supply resistor, wherein,
a fifth pin and a sixth pin of the constant current controller packaging device are connected with the anode (VIN) of an input voltage source, and a first pin is connected with the cathode (GND) of the input voltage source;
the inductor is connected between the first pin and the second pin of the constant current controller packaging device;
the inductor charging/discharging current detection resistor is connected between the second pin and the third pin of the constant current controller packaging device;
a seventh pin of the constant current controller packaging device is connected with an VcC node between the power supply resistor and one end of the capacitor;
the other end of the capacitor is connected with a third pin of the constant current controller packaging device and is used as a filter capacitor of a constant current source load;
the constant current control chip in the constant current controller packaging device provides overcurrent protection for the power tube based on an inductor charging/discharging current detection signal; and, on the basis of shielding the inductance charging current detection signal from the inductance charging/discharging current detection signal, determining the average output current of the constant current source load.
9. The constant-current-source-load driving device according to claim 7 or 8, wherein the constant-current source load is an LED load.
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| CN202010336361.9A CN111343756A (en) | 2020-04-23 | 2020-04-23 | Constant current controller packaging device and driving device |
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