CN210575986U

CN210575986U - Semiconductor X-ray detector packaging structure

Info

Publication number: CN210575986U
Application number: CN201922054089.0U
Authority: CN
Inventors: 王环
Original assignee: Suzhou Wuxiang Scientific Instrument Co Ltd
Current assignee: Suzhou Wuxiang Scientific Instrument Co Ltd
Priority date: 2019-11-25
Filing date: 2019-11-25
Publication date: 2020-05-19
Anticipated expiration: 2029-11-25

Abstract

The utility model discloses a semiconductor X ray detector packaging structure, including detector installation shell, cantilever and the detector main casing body, compare current detector structure, have following advantage: 1. the X-ray detector is compatible with various X-ray sensors, and different X-ray sensors can be arranged on the structure; 2, secondary milling processing of the PCB clamping groove and the circular sinking groove enables the product to have excellent heat conduction and electromagnetic compatibility; 3. the installation and the disassembly are more convenient; 4, the processing cost is lower; 5. the product structure is smaller and more beautiful.

Description

Semiconductor X-ray detector packaging structure

Technical Field

The utility model relates to a detector technical field, in particular to semiconductor X ray detector packaging structure.

Background

An X-ray detector is a device that converts X-ray energy into electrical signals that can be recorded. It receives the radiation and then generates an electrical signal proportional to the intensity of the radiation. The current existing detector structural design exists: difficult to install and dismantle, the sensor installation sequence of feet is easy to make mistakes, the processing cost is high, big and heavy, the inconvenient scheduling problem of installation.

Disclosure of Invention

In order to overcome the defects, the utility model provides a semiconductor X-ray detector packaging structure can effectively solve above-mentioned problem rationally.

The utility model discloses a solve the technical scheme that its technical problem adopted and be: a semiconductor X-ray detector packaging structure comprises a detector mounting shell, a cantilever and a detector main shell, the detector mounting shell is fixedly provided with a detector, a PCB is fixed in the cantilever, the front end of the cantilever is connected with the detector mounting shell, the tail end of the cantilever is inserted into one side of the detector main shell and is detachably mounted and fixed, the detector mounting shell is assembled by an upper mounting shell and a lower mounting shell, the cantilever is assembled by an upper cantilever shell and a lower cantilever shell, the upper mounting shell and the upper cantilever shell are integrally formed, the lower mounting shell and the lower cantilever shell are integrally formed, the lower mounting shell is internally provided with a mounting groove for embedding the detector, the mounting groove is internally provided with a positioning clamping groove opposite to the detector pin, the mounting surfaces of the upper mounting shell and the lower mounting shell are provided with circular sinking grooves, the X-ray sensor can be effectively prevented from being damaged due to the fact that the X-ray sensor pins correspond to errors when the X-ray sensor is reversely mounted. And meanwhile, the cantilever is of a hollow structure, a PCB clamping groove which is occluded is arranged between an upper cantilever shell and a lower cantilever shell, the edge of a PCB circuit board is fixed in the PCB clamping groove, the upper part and the lower part of the PCB circuit board are of hollow structures, the circuit board is fixed, the shell and the circuit board are effectively prevented from being in contact conduction with electronic components, and the shell and the circuit board are not required to be fixed by an additional insulating material.

As the utility model discloses a further improvement, circular heavy groove and PCB draw-in groove surface carry out the secondary milling process and handle, effectively guarantee the contact electric conductive property of occlusal surface, realize improving electromagnetic shielding performance and whole EMC performance with the effective contact in circuit board shielding area.

As a further improvement of the utility model, the surface of the circular sinking groove is covered with an insulating thin gasket. On the premise of ensuring that the circuit board 1 is not short-circuited (not contacted) with the lower cantilever shell and the insertion is good, the maximum thickness of the contact surface of the lower cantilever shell and the X-ray sensor is ensured, and the thermal resistance is effectively reduced.

As the utility model discloses a further improvement, the connector of PCB circuit board is scalable to be set up outside the cantilever, a side of the main casing body of detector is equipped with and supplies to connect plug-in components male fixed slot to insert the screw fixation through the fixed orifices on the main casing body surface of detector.

As a further improvement of the utility model, a protective cap is established to X ray sensor's surface cover.

The utility model has the advantages that: the utility model discloses a semiconductor X-ray detector packaging structure compares current detector structure, has following advantage: 1. the X-ray detector is compatible with various X-ray sensors, and different X-ray sensors can be arranged on the structure; 2, secondary milling processing of the PCB clamping groove and the circular sinking groove enables the product to have excellent heat conduction and electromagnetic compatibility; 3. the installation and the disassembly are more convenient; 4, the processing cost is lower; 5. the product structure is smaller and more beautiful.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of a structural part of the present invention;

FIG. 3 is a second schematic view of the structural part of the present invention;

FIG. 4 is a third schematic view of the structural part of the present invention;

FIG. 5 is a rear view of FIG. 3;

the following are marked in the figure: 1-a detector mounting housing; 2-a cantilever; 3-a main detector housing; 4-a detector; 5-a PCB circuit board; 6-mounting grooves; 7-positioning the clamping groove; 8-circular sink tank; 9-PCB card slot; 10-insulating shims; 11-mounting a shell; 12-a lower mounting shell; 21-upper cantilever shell; 22-lower cantilever shell.

Detailed Description

In order to deepen the understanding of the present invention, the present invention will be further described in detail with reference to the following embodiments and the attached drawings, and the embodiments are only used for explaining the present invention, and do not constitute the limitation to the protection scope of the present invention.

Fig. 1 shows an embodiment of the utility model relates to a semiconductor X-ray detector packaging structure, including detector installation shell 1, cantilever 2 and detector main casing 3, detector installation shell 1 fixed mounting has detector 4, is fixed with PCB circuit board 5 in the cantilever 2, and the front end of cantilever 2 is connected with detector installation shell 1, and the tail end of cantilever 2 inserts one side of detector main casing 3 and can dismantle the installation and fix, as shown in fig. 2, detector installation shell 1 is assembled by upper mounting shell 11 and lower mounting shell 12, cantilever 2 is assembled by upper cantilever shell 21 and lower cantilever shell 22, upper mounting shell 11 and upper cantilever shell 21 integrated into one piece, lower mounting shell 12 and lower cantilever shell 22 integrated into one piece; as shown in fig. 3, a mounting groove 6 for embedding the detector 4 is formed in the lower mounting shell 12, a positioning clamping groove 7 corresponding to the detector pin position is formed in the mounting groove 6, and circular sinking grooves 8 are formed in the mounting surfaces of the upper mounting shell 11 and the lower mounting shell 12, so that the X-ray sensor can be effectively prevented from being damaged due to the fact that the X-ray sensor pin is mistakenly mounted in a reverse manner. Meanwhile, the X-ray sensor is compatible with various X-ray sensors of different manufacturers, as shown in fig. 5, the cantilever 2 is of a hollow structure, a PCB clamping groove 9 which is occluded is formed between the upper cantilever shell 21 and the lower cantilever shell 22, the edge of the PCB 5 is fixed in the PCB clamping groove 9, the upper portion and the lower portion of the PCB 5 are both of hollow structures, the circuit board is fixed, the shell and electronic components on the circuit board are effectively prevented from being in contact conduction, and the shell and the electronic components on the circuit board are not required to be fixed by additional insulating materials.

And performing secondary milling processing on the surfaces of the circular sinking groove 8 and the PCB clamping groove 9. The contact conductivity of the occlusion surface is effectively ensured, the effective contact with the circuit board shielding belt is realized, and the electromagnetic shielding performance and the integral EMC performance are improved.

As shown in fig. 4, the surface of the circular sinking groove 8 is coated with an insulating thin gasket 10. On the premise of ensuring that the circuit board 1 is not short-circuited (not contacted) with the lower cantilever shell and the insertion is good, the maximum thickness of the contact surface of the lower cantilever shell and the X-ray sensor is ensured, and the thermal resistance is effectively reduced

The connector of PCB circuit board 5 is scalable to be set up outside cantilever 2, a side of the main casing body 3 of the detector is equipped with and supplies to connect the male fixed slot of plug-in components to it is fixed to insert the screw through the fixed orifices on the main casing body surface of detector.

A protective cap is sleeved on the surface of the detector 4.

Claims

1. A semiconductor X-ray detector packaging structure is characterized in that: the detector comprises a detector installation shell (1), a cantilever (2) and a detector main shell (3), wherein the detector installation shell (1) is fixedly provided with a detector (4), a PCB (printed circuit board) (5) is fixed in the cantilever (2), the front end of the cantilever (2) is connected with the detector installation shell (1), the tail end of the cantilever (2) is inserted into one side of the detector main shell (3) and is detachably installed and fixed, the detector installation shell (1) is formed by assembling an upper installation shell (11) and a lower installation shell (12), the cantilever (2) is formed by assembling an upper cantilever shell (21) and a lower cantilever shell (22), the upper installation shell (11) and the upper cantilever shell (21) are integrally formed, the lower installation shell (12) and the lower cantilever shell (22) are integrally formed, a mounting groove (6) for embedding the detector (4) is formed in the lower installation shell (12), and a positioning clamping groove (7) corresponding to a detector pin is formed in the mounting groove (6), the installation surface of the upper installation shell (11) and the lower installation shell (12) is provided with a circular sinking groove (8), the cantilever (2) is of a hollow structure, a PCB clamping groove (9) which is occluded is arranged between the upper cantilever shell (21) and the lower cantilever shell (22), the edge of the PCB circuit board (5) is fixed in the PCB clamping groove (9), and the upper part and the lower part of the PCB circuit board (5) are both of a hollow structure.

2. The semiconductor X-ray detector package structure of claim 1, wherein: and the surfaces of the circular sinking groove (8) and the PCB clamping groove (9) are subjected to secondary milling processing.

3. The semiconductor X-ray detector package structure of claim 1, wherein: and an insulating thin gasket (10) is adhered to the surface of the circular sinking groove (8).

4. The semiconductor X-ray detector package structure of claim 1, wherein: the connector of PCB circuit board (5) is scalable to be set up outside cantilever (2), the side of the main casing body of the detector (3) is equipped with and supplies to connect plug-in components male fixed slot to it is fixed to insert the screw through the fixed orifices on the main casing body surface of the detector.

5. The semiconductor X-ray detector package structure of claim 1, wherein: a protective cap is sleeved on the surface of the detector (4).