CN210575923U - Conductive adhesive film - Google Patents
Conductive adhesive film Download PDFInfo
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- CN210575923U CN210575923U CN201922059110.6U CN201922059110U CN210575923U CN 210575923 U CN210575923 U CN 210575923U CN 201922059110 U CN201922059110 U CN 201922059110U CN 210575923 U CN210575923 U CN 210575923U
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- conductive adhesive
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Abstract
The utility model provides a conductive adhesive film contains conductive substrate, the first conductive adhesive layer of joint on conductive substrate, the porous film of joint on the first conductive adhesive layer and the second conductive adhesive layer of joint on the porous film. The porous film is composed of a plurality of fibers and has a plurality of through holes. The second conductive adhesive layer is connected with the first conductive adhesive layer through a plurality of through holes of the porous film. The first adhesive force of the first conductive adhesive layer is larger than the second adhesive force of the second conductive adhesive layer. The second adhesive force of the second conductive adhesive layer is equal to or less than 400 gf. The thickness of the porous film is equal to or less than 50 μm. The utility model discloses a conductive adhesive film can supply the perpendicular configuration semiconductor bare crystal of small-size to carry out the electrical characteristic test.
Description
Technical Field
The present invention relates to a conductive adhesive film, and more particularly to a conductive adhesive film for testing electrical characteristics of a small-sized vertical semiconductor die (also called a semiconductor die).
Background
Semiconductor devices (including optoelectronic devices) are fabricated on a wafer and then diced to obtain semiconductor dies (or semiconductor dies). The semiconductor bare crystal whisker is detected to be defective or not by detecting the electrical characteristics of the semiconductor bare crystal whisker through a probe instrument. The semiconductor die detected as defective is marked. The semiconductor dies that are detected to be qualified are classified according to their electrical characteristics, and then the next packaging process is performed.
The semiconductor die having the upper electrode and the lower electrode is referred to as a vertical semiconductor die. Many semiconductor light emitting devices are vertical. The electrical characteristics of the conventional vertical semiconductor bare chip are tested by the conductive adhesive film, so as to shorten the testing time and improve the overall manufacturing efficiency.
Referring to fig. 1, fig. 1 is a partial cross-sectional view of a conductive adhesive film 1 of the prior art.
As shown in fig. 1, a conductive adhesive film 1 of the prior art includes a conductive cloth 10, a conductive mesh 12 and a conductive adhesive layer 14. The conductive mesh 12 is formed by screen-printing a conductive paste (e.g., silver paste) on the conductive cloth 10. The conductive adhesive layer 14 is bonded to the conductive mesh 12 and is bonded to the conductive cloth 10 through the plurality of meshes 122 of the conductive mesh 12.
The prior art conductive film 1 can be used with a test system (not shown in fig. 1) for testing vertical semiconductor dies (not shown in fig. 1). The prior art conductive adhesive film 1 is placed on a platform of a testing system. The bottom electrode of the vertical semiconductor die is adhered to the conductive adhesive layer 14. A first probe of the test system abuts an upper electrode of the vertical semiconductor die. The second probe of the test system is electrically connected to the bottom electrode of the vertical semiconductor die via the conductive film 1 of the prior art. The test system further applies a test current to the vertical semiconductor die to perform an electrical characteristic test.
However, due to the resolution of screen printing, the conductive mesh 12 is limited in mesh 122 size, and the mesh 122 size is at least 0.1mm × 0.2 mm. However, as some types of vertical semiconductor dies are developed toward small size and even very small size, such as mini-LED and micro-LED. The mini-LED has a size of 100-200 μm (long side or wide side), and the micro-LED has a size of 100 μm or less (long side or wide side). The vertical semiconductor die with small size and extremely small size is adhered to the conductive adhesive film 1 of the prior art, and the first probe of the test system is abutted to the upper electrode of the vertical semiconductor die, so that the vertical semiconductor die is likely to be skewed, which results in the failure of the electrical characteristic test.
In addition, the use of silver paste to manufacture the prior art conductive adhesive film 1 results in an excessive manufacturing cost of the prior art conductive adhesive film 1.
In addition, the conductive adhesive layer 14 of the conductive adhesive film 1 of the prior art needs to be matched with the conductive grid 12 formed by silver paste, so that after the electrical characteristic test of the vertical semiconductor die is performed by using the conductive adhesive film 1 of the prior art and a large current test is applied, the temperature of the vertical semiconductor die is increased during the test process, and the lower electrode surface of the tested vertical semiconductor die often has adhesive residue.
In addition, the conductive adhesive film 1 of the prior art is used to perform the electrical characteristic test of the vertical semiconductor bare chip, and the test accuracy still has room for improvement.
SUMMERY OF THE UTILITY MODEL
Therefore, the present invention is directed to a conductive adhesive film for testing electrical characteristics of a small-sized vertical semiconductor die. And, the application is according to the utility model discloses a conductive adhesive film carries out the electrical characteristic test of the naked brilliant of vertical pattern semiconductor, especially to the electrical characteristic test of the naked brilliant of the perpendicular pattern semiconductor of minimum size, and its test accuracy obviously promotes.
According to the present invention, the conductive adhesive film of the preferred embodiment comprises a conductive substrate, a first conductive adhesive layer, a porous film and a second conductive adhesive layer. The first conductive adhesive layer is bonded on the conductive substrate. The porous film is jointed on the first conductive adhesive layer. The porous membrane is composed of a plurality of fibers and has a plurality of through holes. The second conductive adhesive layer is jointed on the porous film. The second conductive adhesive layer is connected with the first conductive adhesive layer through a plurality of through holes of the porous film. The first adhesive force of the first conductive adhesive layer is larger than the second adhesive force of the second conductive adhesive layer. The second adhesive force of the second conductive adhesive layer is equal to or less than 400 gf. The first thickness of the porous film is equal to or less than 50 μm.
In one embodiment, the first adhesion of the first conductive adhesive layer is greater than 400 gf.
In one embodiment, the first conductive adhesive layer includes a first adhesive body layer and a plurality of first conductive particles. The first conductive particles are uniformly distributed in the first glue body layer and the through holes of the porous film.
In one embodiment, the second conductive adhesive layer includes a second adhesive body layer and a plurality of second conductive particles. The second conductive particles are uniformly distributed in the second glue body layer and the through holes of the porous film.
In one embodiment, the second thickness of the second conductive adhesive layer is equal to or less than 15 μm.
In one embodiment, the third thickness of the first conductive adhesive layer is equal to or less than 15 μm.
In one embodiment, the fourth thickness of the conductive substrate is equal to or less than 200 μm.
In one embodiment, the conductive substrate may be a copper foil, an aluminum foil, or a conductive cloth.
In one embodiment, the first surface resistance of the conductive substrate is equal to or less than 0.1 Ω.
In one embodiment, the second surface resistance of the second conductive adhesive layer is equal to 0.1 Ω.
In one embodiment, the pores of the plurality of through holes of the porous membrane have a diameter equal to or less than 30 μm.
In practical application, according to the utility model discloses a conductive adhesive film can supply the naked brilliant electric characteristic test of carrying out of semiconductor. The semiconductor die includes an upper electrode and a lower electrode. The lower electrode of the semiconductor bare chip is adhered to the second conductive adhesive layer. The long side of the semiconductor bare chip is equal to or less than 6mil (thousandth of an inch), and the wide side of the semiconductor bare chip is equal to or less than 6 mil.
In one embodiment, the long side of the semiconductor die is equal to 6mil, the wide side of the semiconductor die is equal to 6mil, the electrical characteristic test applied current is 0.01mA, and the electrical characteristic test has a jitter error range of ± 0.02V under forward bias.
Different from the prior art, according to the utility model discloses a conductive adhesive film does not have prior art to form the restriction of electrically conductive net at the processing procedure resolution with electrically conductive thick liquid, so according to the utility model discloses a conductive adhesive film can supply the perpendicular type semiconductor bare crystal of small-size to carry out the electrical characteristic test. And, the application is according to the utility model discloses a conductive adhesive film carries out the electrical characteristic test of the naked brilliant of vertical pattern semiconductor, especially to the electrical characteristic test of the naked brilliant of the perpendicular pattern semiconductor of minimum size, and its test accuracy obviously promotes. After applying large current to perform electrical characteristic test, the lower electrode surface of the vertical semiconductor bare chip has no residual glue.
The advantages and spirit of the present invention can be further understood by the following embodiments and the accompanying drawings.
Drawings
FIG. 1 is a partial cross-sectional view of a prior art conductive adhesive film;
fig. 2 is a partial cross-sectional view of a conductive adhesive film according to a preferred embodiment of the present invention.
Description of reference numerals:
1: a conductive adhesive film; 10: a conductive cloth;
12: a conductive mesh; 122: screening;
14: a conductive adhesive layer; 2: a conductive adhesive film;
20: conductive substrate 22: a first conductive adhesive layer;
222: a first glue body layer; 224: first conductive particles;
24: a porous film; 242: fibers;
244: a through hole; 26: a second conductive adhesive layer;
262: a second glue body layer; 264: second conductive particles.
Detailed Description
Referring to fig. 2, fig. 2 is a partial cross-sectional view of a conductive adhesive film 2 according to a preferred embodiment of the present invention.
As shown in fig. 2, the conductive adhesive film 2 according to the preferred embodiment of the present invention comprises a conductive substrate 20, a first conductive adhesive layer 22, a porous film 24 and a second conductive adhesive layer 26.
The first conductive adhesive layer 22 is bonded to the conductive substrate 20.
In one embodiment, the conductive substrate 20 may be a copper foil, an aluminum foil, or a conductive cloth.
The porous film 24 is bonded to the first conductive adhesive layer 22. The porous membrane 24 is formed of a plurality of fibers 242 and has a plurality of through-holes 244.
In one embodiment, the fibers 242 forming the porous membrane 24 may be polymeric fibers or conductive fibers. The conductive fibers may be carbon fibers, metal fibers (e.g., stainless steel fibers), or metalized fibers (e.g., polymer fibers with a silver film coated on the surface). The fibers 242 forming the porous membrane 24 may be in the form of long or short fibers.
In one embodiment, the pores 244 of the porous membrane 24 have a diameter equal to or less than 30 μm.
A second layer of conductive adhesive 26 is bonded to the porous membrane 24. The second layer of conductive adhesive 26 is joined to the first layer of conductive adhesive 22 by a plurality of through holes 244 of the porous membrane 24.
In one embodiment, the first conductive adhesive layer 22 includes a first adhesive body layer 222 and a plurality of first conductive particles 224. The plurality of first conductive particles 224 are uniformly distributed in the first glue body layer 222 and the plurality of through holes 244 of the porous film 24. In practical applications, the first conductive particles 224 may include various conductive particles, such as metal particles, e.g., silver particles, copper particles, nickel particles, aluminum particles, etc., and non-metal conductive particles, e.g., graphite particles, graphene particles, etc.
In one embodiment, the second conductive adhesive layer 26 includes a second adhesive body layer 262 and a plurality of second conductive particles 264. The plurality of second conductive particles 264 are uniformly distributed in the second glue body layer 262 and the plurality of through holes 244 of the porous film 24. In practical applications, the second conductive particles 264 may also include various conductive particles, such as metal particles, e.g., silver particles, copper particles, nickel particles, aluminum particles, etc., and non-metal conductive particles, e.g., graphite particles, graphene particles, etc.
In particular, the first adhesion of the first layer of conductive adhesive 22 is greater than the second adhesion of the second layer of conductive adhesive 26. The second adhesive force of the second conductive adhesive layer 26 is equal to or less than 400 gf. The first thickness of the porous film 24 is equal to or less than 50 μm.
In one embodiment, the first adhesion of the first conductive adhesive layer 22 is greater than 400 gf.
Obviously, the conductive adhesive film 2 according to the present invention does not have the limitation of the conductive paste used in the prior art to form the conductive mesh in the process resolution, so that it can be used for the electrical characteristic test of the small-sized vertical semiconductor die, and even for the electrical characteristic test of the very small-sized vertical semiconductor die. After applying large current to perform electrical characteristic test, the lower electrode surface of the vertical semiconductor bare chip has no residual glue.
Further, the conductive adhesive film 2 according to the preferred embodiment of the present invention further includes a release layer (not shown in fig. 2). The release layer is bonded on the second conductive adhesive layer 26. According to the utility model discloses a conductive adhesive film 2 of preferred embodiment is earlier torn from the type layer before using.
According to for promoting the application the utility model discloses a conductive adhesive film 2 carries out the test precision of the electrical characteristic test of perpendicular style semiconductor bare grain, according to the utility model discloses a parameter of 2 each layer structures of conductive adhesive film is further research, restriction also. The parameter limitation of each layer structure of the conductive adhesive film 2 according to the present invention is described in detail below.
In one embodiment, the second thickness of the second conductive adhesive layer 26 is equal to or less than 15 μm.
In one embodiment, the third thickness of the first conductive adhesive layer 22 is equal to or less than 15 μm.
In one embodiment, the fourth thickness of the conductive substrate 20 is equal to or less than 200 μm.
Through measuring by 9 point ohm meter, according to the utility model discloses a conductive adhesive film 2's conductive substrate 20's first surface resistance equals or is less than 0.1 omega.
Through measuring by 9 point ohm meter, according to the utility model discloses a second surface resistance of conductive adhesive layer 26 of conductive adhesive film 2 equals 0.1 omega.
In practical application, according to the utility model discloses a conductive adhesive film 2 can supply the naked brilliant electric characteristic test of carrying out of semiconductor. The semiconductor die includes an upper electrode and a lower electrode, i.e., a vertical semiconductor die. The semiconductor die is adhered to the second conductive adhesive layer 26 by the lower electrode. The semiconductor die has a long side of 6 mils (about 140 μm) or less and a wide side of 6 mils or less.
In one exemplary test, the long side of the semiconductor die is equal to 6mil, the wide side of the semiconductor die is equal to 6mil, the electrical characteristic test applied current is 0.01mA, and the electrical characteristic test error jitter under forward bias is + -0.02V. Obviously, the conductive adhesive film according to the present invention is used to test the electrical characteristics of the vertical semiconductor bare die, and the test accuracy is very high.
Through above being right the utility model discloses a detailed description, can clearly understand according to the utility model discloses a conducting film does not have prior art to form the restriction of electrically conductive net at the processing procedure resolution with electrically conductive thick liquid, so according to the utility model discloses a conducting film can supply the perpendicular type semiconductor bare crystal of small-size to carry out the electrical characteristic test, can supply the perpendicular type semiconductor bare crystal of minimum size to carry out the electrical characteristic test even. According to the utility model discloses a conductive adhesive film does not have prior art and uses conductive paste, and its manufacturing cost is obviously lower. And, the application is according to the utility model discloses a conductive adhesive film carries out the electrical characteristic test of the naked brilliant of vertical pattern semiconductor, especially to the electrical characteristic test of the naked brilliant of the perpendicular pattern semiconductor of minimum size, and its test accuracy obviously promotes. After applying large current to perform electrical characteristic test, the lower electrode surface of the vertical semiconductor bare chip has no residual glue.
The foregoing detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the invention to the particular embodiments disclosed. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims. The scope of the appended claims should therefore be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.
Claims (10)
1. An electroconductive adhesive film, comprising:
a conductive substrate;
the first conductive adhesive layer is jointed on the conductive substrate;
a porous film bonded to the first conductive adhesive layer, the porous film being composed of a plurality of fibers and having a plurality of through holes; and
and the second conductive adhesive layer is jointed on the porous film and is jointed with the first conductive adhesive layer through the through holes, wherein the first adhesive force of the first conductive adhesive layer is greater than the second adhesive force of the second conductive adhesive layer, the second adhesive force of the second conductive adhesive layer is equal to or less than 400gf, and the first thickness of the porous film is equal to or less than 50 μm.
2. The conductive adhesive film as claimed in claim 1, wherein the first conductive adhesive layer comprises a first adhesive body layer and a plurality of first conductive particles, and the plurality of first conductive particles are uniformly distributed in the first adhesive body layer and the plurality of through holes.
3. The conductive adhesive film as claimed in claim 2, wherein the second conductive adhesive layer comprises a second adhesive body layer and a plurality of second conductive particles, and the plurality of second conductive particles are uniformly distributed in the second adhesive body layer and the plurality of through holes.
4. The conductive adhesive film according to claim 2, wherein the second thickness of the second conductive adhesive layer is equal to or less than 15 μm.
5. The conductive adhesive film according to claim 4, wherein the third thickness of the first conductive adhesive layer is equal to or less than 15 μm.
6. The conductive adhesive film of claim 5, wherein the fourth thickness of the conductive substrate is equal to or less than 200 μm, and the conductive substrate is one selected from the group consisting of a copper foil, an aluminum foil, and a conductive cloth.
7. The conductive adhesive film according to claim 6, wherein a first surface resistance of the conductive substrate is equal to or less than 0.1 Ω, and a second surface resistance of the second conductive adhesive layer is equal to 0.1 Ω.
8. The electroconductive adhesive film according to claim 7, wherein the pore diameter of the plurality of through holes of the porous film is equal to or smaller than 30 μm.
9. The conductive adhesive film of claim 8, wherein the conductive adhesive film is used for testing electrical characteristics of a semiconductor die, wherein the semiconductor die comprises an upper electrode and a lower electrode, the semiconductor die is adhered to the second conductive adhesive layer by the lower electrode, the long side of the semiconductor die is equal to or less than 6 mils, and the wide side of the semiconductor die is equal to or less than 6 mils.
10. The conductive adhesive film according to claim 9, wherein the long side of the semiconductor die is equal to 6mil, the wide side of the semiconductor die is equal to 6mil, the electrical characteristic test applied test current is 0.01mA, and the error jitter range of the electrical characteristic test under forward bias is ± 0.02V.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922059110.6U CN210575923U (en) | 2019-11-26 | 2019-11-26 | Conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922059110.6U CN210575923U (en) | 2019-11-26 | 2019-11-26 | Conductive adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210575923U true CN210575923U (en) | 2020-05-19 |
Family
ID=70660991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922059110.6U Active CN210575923U (en) | 2019-11-26 | 2019-11-26 | Conductive adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210575923U (en) |
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2019
- 2019-11-26 CN CN201922059110.6U patent/CN210575923U/en active Active
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