CN210489637U

CN210489637U - Slicing device

Info

Publication number: CN210489637U
Application number: CN201922014168.9U
Authority: CN
Inventors: 王豪兵; 周彬; 谢金晶; 张飞; 费志良; 杨雪梅; 衡阳; 潘励刚
Original assignee: CSI Cells Co Ltd; CSI Solar Power Group Co Ltd
Current assignee: Canadian Solar Inc; CSI Cells Co Ltd
Priority date: 2019-11-20
Filing date: 2019-11-20
Publication date: 2020-05-08
Anticipated expiration: 2029-11-20

Abstract

The utility model relates to a solar cell technical field especially relates to a slicing device. The slicing device comprises a bearing table and a slicing device, wherein the bearing table comprises a loading area and an unloading area which are arranged adjacently, the loading area is used for placing a first container of sheets to be loaded, the unloading area is used for placing a second container of stacked sheets to be unloaded, and the height of the top surface of the unloading area is higher than that of the top surface of the loading area; the sheet pusher comprises a support and a plurality of push plates, the support is arranged on one side, far away from the first container, of the unloading area, the push plates are arranged on one side, facing the second container, of the support, and the push plates can extend into the second container and push even-numbered or odd-numbered sheets in the second container into the first container. The height difference between the loading area and the unloading area facilitates the sheet to be guided into the first container from the second container; the sheets corresponding to the odd layers or the even layers in the second container are pushed by the push plate, so that the sheets are quickly separated in batches under the condition of avoiding hand contact, time and labor are saved, and the pollution risk is reduced.

Description

Slicing device

Technical Field

The utility model relates to a solar cell technical field especially relates to a slicing device.

Background

In the solar cell industry, the cell needs to be extracted for experiment to ensure the quality of the cell. In the experimental process, accurate slicing is often needed, i.e. the experimental slices are equally divided into two groups, and the characteristics of the two groups of experimental slices are required to be as close as possible, so that the performance difference between the two groups of experimental slices can be observed after a certain variable of one group is changed in the experimental process. According to the manufacturing process of the solar cell and a large amount of experimental data, the characteristics of two adjacent silicon wafers are close to each other in the manufacturing process, so that the two adjacent silicon wafers are separated to be used as an experimental group A and an experimental group B in the accurate slicing process of the experimental wafers.

In the solar cell processing process, the silicon wafer is processed and transported by taking the flower basket as a carrier, and a plurality of wafer grooves are arranged in the flower basket. At present, during accurate fragmentation, a silicon wafer needs to be separated into a flower basket B and a flower basket C one by one from the flower basket A by hands or tweezers, the process is more complicated, the time consumption is long, fragments are more, and the risk of pollution is caused when the hands contact the silicon wafer.

Therefore, a slicing device is needed to rapidly slice in batches under the condition of avoiding hand contact, so that time and labor are saved, and the pollution risk is reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a burst device, the burst of quick batch under the condition of avoiding the hand contact, labour saving and time saving reduces the pollution risk.

To achieve the purpose, the utility model adopts the following technical proposal:

a singulation engine, comprising:

the bearing table comprises a loading area and an unloading area which are arranged adjacently, the loading area is used for placing a first container of sheets to be loaded, the unloading area is used for placing a second container of stacked sheets to be unloaded, and the height of the top surface of the unloading area is higher than that of the top surface of the loading area; and

a blade pusher, the blade pusher comprising:

the bracket is arranged on one side of the unloading area far away from the first container; and

the push plates are arranged on one side, facing the second container, of the support, can extend into the second container and can push the even-numbered layers or the odd-numbered layers of the sheets in the second container into the first container.

Wherein the distance between two adjacent push plates is twice as long as the distance between two adjacent sheets in the second container.

The height of the push plate positioned at the lowest part of the sheet pusher is H when one end of the sheet pusher in the arrangement direction of the plurality of push plates is supported in the unloading area, the height of the push plate positioned at the lowest part of the sheet pusher in the arrangement direction of the plurality of push plates is H when the other end of the sheet pusher in the arrangement direction of the plurality of push plates is supported in the unloading area, and the difference between H and H is equal to the distance between two adjacent sheets in the second container.

Wherein, the support includes:

a top plate;

a bottom plate disposed opposite to the top plate; and

the side plate is connected with the top plate and the bottom plate, and the push plates are arranged on the side plate and located between the top plate and the side plates.

The top plate and the bottom plate are equal in thickness, the distance between the top plate and the closest pushing plate is a, the distance between the bottom plate and the closest pushing plate is b, and the difference value between a and b is equal to the distance between two adjacent sheets in the second container.

Wherein the distance between the top plate and the closest push plate is equal to the distance between the bottom plate and the closest push plate, and the thickness difference between the top plate and the bottom plate is equal to the distance between two adjacent sheets in the second container.

Wherein, a handle is arranged on the bracket.

Wherein the height difference between the unloading area and the loading area is 0.5-1.5 mm.

Wherein, the slicing device further comprises:

the output end of the rotating mechanism is connected with the sheet pusher so as to drive the sheet pusher to rotate around the pushing direction;

the output end of the push-pull mechanism is connected with the rotating mechanism so as to drive the push plate to extend into the second container or be drawn out of the second container;

and the output end of the lifting mechanism is connected with the push-pull mechanism and is used for driving the sheet pusher to lift.

And a guide assembly is arranged in the unloading area and guides the sheet pusher to move along the direction close to or far away from the second container.

Has the advantages that:

in the utility model, the height difference between the loading area and the unloading area ensures that the first container for loading the sheets is lower than the second container for unloading the sheets, thereby facilitating the introduction of the sheets into the first container from the second container; in stretching into the second container through a plurality of push pedals in the blade pusher, can promote in the second container odd number layer or the sheet that the even number layer corresponds get into first container, compare artifical burst, quick batch burst under the condition of avoiding the hand contact, labour saving and time saving reduces the pollution risk.

Drawings

Fig. 1 is a schematic structural diagram of a slicing device according to a first embodiment of the present invention.

Wherein:

1. a bearing table; 11. a loading zone; 12. an unloading area; 21. a top plate; 22. a side plate; 23. a base plate; 24. a handle; 25. pushing the plate; 3. a first container; 4. a second container; 5. and (3) a silicon wafer.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "secured" are to be construed broadly and encompass, for example, both fixed and removable connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may include the first feature being in direct contact with the second feature, or may include the first feature being in direct contact with the second feature but being in contact with the second feature by another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

Example one

The embodiment provides a slicing device which can realize batch separation of laminated sheets. In this embodiment, two groups of test pieces for accurate slicing in the process of manufacturing the solar cell by applying the slicing device are taken as an example, and a specific structure and a using method of the slicing device are described.

As shown in fig. 1, the sheet separating device includes a carrying platform 1 and a sheet pusher. The carrier table 1 includes a loading area 11 and an unloading area 12 which are adjacently disposed, the loading area 11 being used for placing a first container 3 of sheets to be loaded, and the unloading area 12 being used for placing a second container 4 of stacked sheets to be unloaded. Wherein the sheet corresponds to a silicon wafer 5.

The sheet pusher is arranged in the unloading area 12 and located on one side of the second container 4, which is far away from the first container 3, and is used for pushing the silicon wafers 5 in the second container 4 into the first container 3. In order to make the silicon wafer 5 pushed out by the second container 4 by the wafer pusher smoothly enter the first container 3, the first container 3 and the second container 4 may be adjacently arranged so that the silicon wafer 5 is pushed out and then directly enters the first container 3.

Specifically, both ends of the first container 3 and the second container 4 in the arrangement direction thereof are provided with openings for the pushing in and pushing out of the silicon wafer 5. The structures of the first container 3 and the second container 4 can be the same, and both comprise a top limiting plate and a bottom limiting plate which are arranged oppositely, and two opposite sides of the top limiting plate and the bottom limiting plate are connected through side limiting plates, so that the top limiting plate, the bottom limiting plate and the side limiting plates are surrounded to form an opening for pushing or withdrawing the silicon wafer 5. A plurality of clamping teeth are arranged on the lateral limiting plate, and a wafer groove for accommodating the silicon wafer 5 is formed between every two adjacent clamping teeth. Fig. 1 is a schematic structural view of the container and the slicing device, and the latch on the side limiting plate is not shown.

In order to enable the silicon wafer 5 in the second container 4 to be smoothly pushed into the first container 3, a height difference exists between the loading area 11 and the unloading area 12, the loading area 11 is lower than the unloading area 12, so that the first container 3 is lower than the second container 4, the silicon wafer 5 can have a certain height difference when the silicon wafer 5 is pushed into the first container 3 from the second container 4, contact and friction between the silicon wafer 5 and the corresponding latch of the first container 3 can be reduced, resistance of the silicon wafer 5 is reduced, and the silicon wafer 5 can smoothly enter the first container 3.

Alternatively, the height difference between the loading area 11 and the unloading area 12 may be selected according to the thickness of the actual silicon wafer 5 and the height of the wafer slot. Taking the conventional silicon wafer 5 as an example, the height difference between the loading area 11 and the unloading area 12 may be 0.5-1.5mm, and in this embodiment, the height difference between the loading area 11 and the unloading area 12 is 1 mm.

Alternatively, the size and shape of the loading area 11 and the unloading area 12 can be set according to the actual situation. In this embodiment, the bottom limiting plate of the container is generally square, and the side length is 186mm, in order to ensure the stability of placing the first container 3, the loading area 11 may also be square, and the side length may be 300mm, so as to carry the first container 3. Correspondingly, the unloading area 12 is to place the second container 4 and the blade pusher, and the unloading area 12 may be rectangular, 300mm wide to connect with the loading area 11, and 600mm long to meet the operation requirement when the blade pusher is close to or far from the second container 4.

In this embodiment, the wafer pusher includes a support placed in the unloading area 12 and capable of moving in a direction close to or away from the loading area 11, and a plurality of push plates 25 disposed on a side of the support facing the second container 4, so that the push plates 25 can extend into the second container 4 along with the movement of the wafer pusher, corresponding to the silicon wafers 5 in odd or even layers in the second container 4 one by one, so as to push the silicon wafers 5 into the first container 3.

In order to realize that the push plates 25 correspond to the silicon wafers 5 of the odd or even layers in the second container 4, the positions of the plurality of push plates 25 may be set according to the positions of the silicon wafers 5 of the odd or even layers in the second container 4.

Because the height of the wafer grooves in the first container 3 is consistent with that of the wafer grooves in the second container 4, namely the clamping teeth are arranged at equal intervals, in the embodiment, the distance between two adjacent pushing plates 25 in the wafer pusher can be twice as long as the distance between two adjacent silicon wafers 5 in the second container 4. When the push plates 25 in the wafer pusher extend into the second container 4, on the basis of ensuring that any push plate 25 can have the same height as one silicon wafer 5, a plurality of push plates 25 can correspond to the even-numbered or odd-numbered silicon wafers 5 in the second container 4 one by one, so that the slicing of the silicon wafers 5 is realized.

In this embodiment, the bottom of the ejector is in contact with the unloading area 12, and the ejector can slide on the surface of the unloading area 12 to ensure that the heights of the plurality of push plates 25 in the ejector are kept constant.

In order to enable the wafer pusher to push out the silicon wafers 5 of the odd number layers and the silicon wafers 5 of the even number layers in the second container 4 by twice pushing, when one end of the wafer pusher in the arrangement direction of the plurality of pushing plates 25 is supported by the unloading area 12, the height of the pushing plate 25 positioned at the farthest side is H, and when the other end of the wafer pusher in the arrangement direction of the plurality of pushing plates 25 is supported by the unloading area 12, the height of the pushing plate 25 positioned at the lowest side is H, and the difference between H and H is equal to the distance between two adjacent wafers in the second container 4.

Specifically, the rack includes a top plate 21, a bottom plate 23, and a side plate 22 connecting the top plate 21 and the bottom plate 23, and a plurality of push plates 25 are provided on the side plate 22 between the top plate 21 and the side plate 22. For convenience of description, as shown in fig. 1, the thickness of the top plate 21 is c, and the distance between the top plate 21 and the closest push plate 25 is a; the thickness of the bottom plate 23 is d and the distance between the bottom plate 23 and the closest push plate 25 is b.

When the unloading area 12 supports the bottom plate 23, the height h of the push plate 25 positioned at the lowest position is the sum of d and b, at this time, the plurality of push plates 25 correspond to the silicon wafers 5 at odd layers in the second container 4 one by one, and when the wafer pusher is pushed, the silicon wafers 5 at odd layers in the second container 4 can be pushed into the first container 3.

When the unloading area 12 supports the top plate 21, that is, the wafer pusher is inverted, the height H of the push plate 25 positioned at the lowermost position is the sum of a and c, and because the difference between H and H is the distance L between two adjacent silicon wafers 5 in the second container 4, the position of the push plate 25 has a height difference of L from the position shown in fig. 1, so that the plurality of push plates 25 correspond to the silicon wafers 5 of the even number layers in the second container 4 one by one, and when the wafer pusher is pushed, the silicon wafers 5 of the even number layers in the second container 4 can be pushed into the first container 3.

Through the arrangement, the silicon wafers 5 on odd layers and even layers in the second container 4 can be respectively pushed into two different first containers 3 through the wafer pushing device in the embodiment through twice wafer pushing in the upright and inverted states, and accurate wafer separation in an experiment is achieved.

Alternatively, in order to realize the positive and negative positions of the wafer pusher, the height difference of the lowest pushing plate 25 is the distance between two adjacent silicon wafers 5 in the second container 4, the thicknesses of the top plate 21 and the bottom plate 23 may be equal, and the difference between the distance a between the top plate 21 and the closest pushing plate 25 and the distance b between the bottom plate 23 and the opposite-close pushing plate 25 is set as the distance L between two adjacent silicon wafers 5 in the second container 4.

Alternatively, in order to realize the positive and negative arrangement of the wafer pusher, the height difference of the lowest pushing plate 25 is the distance between two adjacent silicon wafers 5 in the second container 4, the distance a between the top plate 21 and the closest pushing plate 25 may be set to be equal to the distance b between the bottom plate 23 and the opposite-to-close pushing plate 25, and the thickness difference between the top plate 21 and the bottom plate 23 may be set to be the distance L between two adjacent silicon wafers 5.

In this embodiment, the height of the sheet pusher is 296.5mm, and the top plate 21 and the bottom plate 23 are both square, and have a side length of 80 mm. The thickness of the top plate 21 is 24mm, and the distance between the top plate 21 and the closest push plate 25 is 25.25 mm. The thickness of the bottom plate 23 is 20mm, the distance between the bottom plate 23 and the closest push plate 25 is 25.25mm, the thickness of the push plate 25 is 2mm, the distance between two adjacent silicon wafers 5 in the second container 4 is 4mm, and the distance between two adjacent push plates 25 is 8 mm.

Optionally, the height of the bottom surface of the push plate 25 is smaller than the height of the top surface of the corresponding latch in the first container 3, and the difference between the two is equal to the height difference between the loading area 11 and the unloading area 12, so that the silicon wafer 5 pushed by the push plate 25 can be matched with the height of the corresponding latch in the first container 3, thereby ensuring that the silicon wafer smoothly enters the first container 3.

In this embodiment, the bottom surface of the push plate 25 is 1mm lower than the top surface of the corresponding latch in the first container 3.

The height in this embodiment is based on the stage, the height of the structure in the loading area 11 is based on the loading area 11 as a horizontal plane, and the height of the structure in the unloading area 12 is based on the unloading area 12 as a horizontal plane.

Optionally, a handle 24 may be further disposed on a side of the bracket facing away from the pushing plate 25, and the worker may grip the handle 24 to move the pushing plate in a direction approaching or departing from the second container 4.

Optionally, a guiding assembly may be further disposed in the unloading area 12, and the guiding assembly can guide the blade pusher to approach or depart from the second container 4, so as to ensure that the pushing direction of the blade pusher is stable and does not deviate.

Optionally, the guiding assembly includes a guide rail disposed on the unloading area 12, the guide rail is disposed along the pushing direction of the pushing plate 25, and a top plate 21 and a bottom plate 23 of the bracket are both provided with a sliding block or a pulley in sliding fit with the guide rail, so that the movement direction of the blade pusher is limited by the sliding fit of the sliding block and the pulley.

In other embodiments, the guiding component may also be a guide rod and a slider slidably disposed on the guide rod, the guide rod may be disposed in the unloading area 12, and the slider may be disposed on the top plate 21 and the bottom plate 23, and the direction limitation is realized by the cooperation of the slider and the guide rod.

Example two

The embodiment provides a slicing device which can realize batch separation of laminated sheets. The difference between the first embodiment and the second embodiment is that the sheet pusher can automatically realize sliding and switching between right position and upside down position.

Specifically, the slicing device further comprises a rotating mechanism, a push-pull mechanism and a lifting mechanism, wherein the lifting mechanism is arranged in the unloading area 12, and the output end of the lifting mechanism is connected with the push-pull mechanism so as to realize the lifting of the push-pull mechanism; the output end of the push-pull mechanism is connected with the rotating mechanism so as to realize the movement of the rotating mechanism along the direction close to or far away from the second container 4, and the output end of the rotating mechanism is connected with the bracket of the sheet pusher so as to realize the rotation of the sheet pusher, thereby carrying out the switching between the upright position and the inverted position.

The lifting, pushing and pulling and rotation of the sheet pusher can be realized through the matching of the lifting mechanism, the pushing and pulling mechanism and the rotating mechanism.

In use, the first container 3 is placed in the loading area and the second container 4 is placed in the unloading area 12. The height of the blade pusher is then adjusted by the lifting mechanism so that the top plate 21 or bottom plate 23 of the blade pusher is supported within the unloading zone 12. And then, the push-pull mechanism is started to push the wafer pusher to be close to the second container 4, so that the push plate 25 extends into the second container 4 to be abutted against the corresponding silicon wafer 5, and further the silicon wafer 5 is pushed into the first container 3 to finish the movement of the silicon wafers 5 at odd layers or even layers in the second container 4.

The push-pull mechanism works in reverse to drive the blade pusher to move away from the second container 4, so that the push plate 25 is pulled out of the second container 4. The lifting mechanism is started to drive the sheet pusher to rise so as to lift off the unloading area 12, so that preparation is made for turning over of the subsequent sheet pusher, and the interference of the sheet pusher and the unloading area 12 is avoided. After the blade pusher is lifted to a specified height, the rotating mechanism is started and drives the blade pusher to rotate 180 degrees around the pushing and pulling direction of the push plate 25, so that the blade pusher is inverted. And then, the inverted wafer pusher pushes the wafers for the next time through the adjustment of the lifting mechanism and the push-pull mechanism, so that the even-numbered or odd-numbered silicon wafers 5 in the second container 4 are moved.

Optionally, the push-pull mechanism and the lifting mechanism may be a linear motor, an air cylinder, a hydraulic cylinder, or the like, which can output linear motion. The rotation mechanism may be a rotary motor.

The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims

1. A singulation apparatus, comprising:

the carrying platform (1) comprises a loading area (11) and an unloading area (12) which are arranged adjacently, the loading area (11) is used for placing a first container (3) of sheets to be loaded, the unloading area (12) is used for placing a second container (4) of stacked sheets to be unloaded, and the height of the top surface of the unloading area (12) is higher than that of the top surface of the loading area (11); and

a blade pusher, the blade pusher comprising:

-a support arranged in the unloading zone (12) on the side remote from the first container (3); and

a plurality of push plates (25) are arranged on one side of the bracket facing the second container (4), and the push plates (25) can extend into the second container (4) and can push the even layers or the odd layers of the sheets in the second container (4) into the first container (3).

2. The device according to claim 1, characterized in that the distance between two adjacent pushing plates (25) is twice the distance between two adjacent sheets in the second container (4).

3. The sheet separating device according to claim 1, wherein the height of the lowermost push plate (25) is H when one end of the sheet pusher in the arrangement direction of the plurality of push plates (25) is supported by the unloading section (12), and the height of the lowermost push plate (25) is H when the other end of the sheet pusher in the arrangement direction of the plurality of push plates (25) is supported by the unloading section (12), and the difference between H and H is equal to the distance between two adjacent sheets in the second container (4).

4. The slicing apparatus of claim 3, wherein the support comprises:

a top plate (21);

a bottom plate (23) disposed opposite to the top plate (21); and

the side plates (22), the side plates (22) are connected with the top plate (21) and the bottom plate (23), and the push plates (25) are arranged on the side plates (22) and located between the top plate (21) and the side plates (22).

5. The device according to claim 4, characterized in that the top plate (21) and the bottom plate (23) have the same thickness, the distance between the top plate (21) and the closest pushing plate (25) is a, the distance between the bottom plate (23) and the closest pushing plate (25) is b, and the difference between a and b is equal to the distance between two adjacent sheets in the second container (4).

6. The device according to claim 4, characterized in that the distance between the top plate (21) and the closest pushing plate (25) is equal to the distance between the bottom plate (23) and the closest pushing plate (25), and the difference in thickness between the top plate (21) and the bottom plate (23) is equal to the distance between two adjacent sheets in the second container (4).

7. The slicing device according to any one of claims 1 to 6, wherein the holder is provided with a handle (24).

8. The slicing device according to any of the claims 1 to 6, wherein the height difference between the unloading zone (12) and the loading zone (11) is 0.5-1.5 mm.

9. The slicing apparatus according to any one of claims 1 to 6, wherein the slicing apparatus further comprises:

the output end of the push-pull mechanism is connected with the rotating mechanism so as to drive the push plate (25) to extend into the second container (4) or be drawn out of the second container (4);

10. The sheet separation device according to any one of claims 1 to 6, wherein a guide assembly is arranged in the unloading zone (12), the guide assembly guiding the sheet pusher to move in a direction towards or away from the second container (4).