CN210452283U

CN210452283U - Polishing pad and polishing apparatus

Info

Publication number: CN210452283U
Application number: CN201921134857.7U
Authority: CN
Inventors: 姜宏
Original assignee: Dongtai Hi Tech Equipment Technology Co Ltd
Current assignee: Zishi Energy Co.,Ltd.
Priority date: 2019-07-18
Filing date: 2019-07-18
Publication date: 2020-05-05
Anticipated expiration: 2029-07-18

Abstract

The utility model relates to the technical field of chemical mechanical polishing, and provides a polishing pad and polishing equipment, the polishing pad comprises a surface functional layer and a basal layer, a separation layer is arranged between the surface functional layer and the basal layer, and the surface functional layer and the basal layer are both detachably connected with the separation layer; the polishing equipment comprises the polishing pad and the polishing machine, wherein the polishing pad is detachably arranged on the disc surface of the polishing machine. Through set up the separating layer between surface functional layer and stratum basale, guarantee that surface functional layer and stratum basale are connected with the equal detachable of separating layer, realize the reuse on stratum basale, only need dismantle the surface functional layer change can, reduced polishing manufacturing cost, simple structure, convenient operation.

Description

Polishing pad and polishing apparatus

Technical Field

The utility model relates to a chemical mechanical polishing technical field especially relates to a polishing pad and polishing equipment.

Background

The polishing pad is an important auxiliary material for determining the surface quality in chemical mechanical polishing, and can be divided into a polyurethane polishing pad, a non-woven fabric polishing pad and a composite polishing pad according to different materials; the surface structure can be roughly divided into a plane type, a grid type, a spiral line type and the like, and the main functions of the surface structure are as follows:

① to deliver the slurry efficiently and uniformly to different areas of the polishing pad;

② the reactant and the debris which are fully reacted after polishing are smoothly discharged, so as to achieve the removal effect;

③ maintaining the thin film of slurry on the surface of the pad so that the chemical reaction is fully carried out;

④ keep the polishing process smooth and the surface free from distortion so as to obtain better wafer surface topography.

The overall structure of the polishing pad can be a surface functional layer, a substrate layer and an adhesive layer, and the surface functional layer and the substrate layer of all the polishing pads are integrated at present; in the chemical mechanical polishing, the surface layer of the polishing pad is mainly in contact with the wafer and the polishing solution, and the surface structure layer of the polishing pad is worn and consumed, so that the whole polishing pad is often replaced after the surface structure of the polishing pad loses efficacy (such as groove abrasion, surface glazing and the like), thereby causing waste of the base layer of the polishing pad and increasing the production cost.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model aims at providing a polishing pad and polishing equipment to solve the extravagant problem that the change of current polishing pad caused.

(II) technical scheme

In order to solve the technical problem, the utility model provides a polishing pad, including surface functional layer and stratum basale, the surface functional layer with be equipped with the separating layer between the stratum basale, the surface functional layer with the equal detachable of stratum basale with the separating layer is connected.

The separation layer comprises at least two layers of separation pieces, the adjacent two layers of separation pieces are bonded, the separation piece close to the first layer of the surface functional layer is bonded with the surface functional layer, and the separation piece close to the last layer of the substrate layer is bonded with the substrate layer.

The surface functional layer comprises a surface layer and an impermeable layer, the surface layer is bonded with the impermeable layer, and the impermeable layer is bonded with the separation layer.

Wherein, the superficial layer is equipped with the slot for place wait to polish the piece.

The impermeable layer is made of polyethylene high polymer materials.

And the first side of the substrate layer is bonded with the separation layer, and the second side of the substrate layer, which is opposite to the first side, is bonded with the isolation layer.

The utility model also provides a polishing equipment, include as above polishing pad and burnishing machine, polishing pad detachable installs in the quotation of burnishing machine.

(III) advantageous effects

The utility model provides a pair of polishing pad and polishing equipment through set up the separation layer between surface functional layer and stratum basale, guarantees that surface functional layer and stratum basale are connected with the equal detachable of separation layer, realizes the reuse of stratum basale, only need dismantle the surface functional layer change can, reduced polishing manufacturing cost, simple structure, convenient operation.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of a polishing pad according to an embodiment of the present invention.

In the figure, 10: a surface layer; 20: double-sided adhesive tape; 30: an impermeable layer; 40: a separating member; 50: a base layer; 60: an isolation layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description of the present invention, unless otherwise specified, "plurality", and "plural" mean two or more, and "several", and "several groups" mean one or more.

As shown in FIG. 1, the embodiment of the present invention provides a polishing pad, including surface functional layer and stratum basale 50, be equipped with the separating layer between surface functional layer and the stratum basale 50, surface functional layer and the equal detachable of stratum basale 50 are connected with the separating layer, realize that the dismantlement alone of surface functional layer is changed, need not to change whole polishing pad, practice thrift the cost.

Wherein the separating layer comprises at least two layers of separating elements 40, enabling at least one recycling of the substrate layer 50. Two adjacent layers of separating members 40 are bonded, and two adjacent layers of separating members 40 can be detached. The first layer of separator elements 40 adjacent to the surface functional layer is bonded to the surface functional layer and the last layer of separator elements 40 adjacent to the substrate layer 50 is bonded to the substrate layer 50. In this embodiment, the separating member 40 may be provided with 10, 15 or 20 layers, and in order to secure the stability of the polishing pad during polishing, the separating member 40 is preferably provided with 10 layers. It will be appreciated that the number of layers of separating members 40 may be specifically set according to the actual polishing process requirements.

Further, in this embodiment, the separating member 40 is specifically a release paper, the surface functional layer is detachably disposed on the upper side of the separating layer, and the substrate layer 50 is detachably disposed on the lower side of the separating layer. The separating member 40 of the uppermost layer is bonded to the surface functional layer by the double-sided tape 20, the separating members 40 of the adjacent two layers are bonded by the double-sided tape 20, and the separating member 40 of the lowermost layer is bonded to the base layer 50 by the double-sided tape. It can be understood that when the surface functional layer loses efficacy and needs to be replaced, the polishing process can be continued only by tearing the separating member 40 of the first layer to detach the failed surface functional layer and the first separating member 40, and then bonding a new surface functional layer to the upper side of the double-sided adhesive tape 20 on the upper side of the second separating member 40.

The surface functional layer comprises a surface layer 10 and an impermeable layer 30, the surface layer 10 is bonded with the impermeable layer 30, and the impermeable layer 30 is bonded with the separation layer. The surface layer 10 is provided with grooves for placing the piece to be polished. In this embodiment, the upper side of surface layer 10 evenly sets up a plurality of slots for the solid spacing piece of treating polishing of card, makes things convenient for the even transport of polishing solution simultaneously, improves polishing effect. The lower side of the surface layer 10 is bonded with the upper side of the impermeable layer 30 through the double-sided adhesive tape 20, and the impermeable layer 30 is made of polyethylene high polymer material, and is resistant to corrosion of acid, alkali, organic solvent and the like, so as to protect the double-sided adhesive tape 20 from being corroded and failed by the polishing solution. The underside of the barrier layer 30 is bonded to a first layer separator member 40 of the separator layer by means of a double-sided adhesive tape 20.

Further, a first side of the substrate layer 50 is bonded to the release layer, and a second side of the substrate layer 50 opposite to the first side is bonded to the release layer 60. It will be appreciated that the upper side of the base layer 50 is bonded to the lowermost separator member 40 of the separator layer by means of the double-sided adhesive tape 20, and the lower side of the base layer 50 is bonded to the separator layer 60 by means of the double-sided adhesive tape 20. In this embodiment, the isolation layer 60 is specifically release paper, which is used to facilitate the assembly and disassembly of the whole polishing pad.

The embodiment of the utility model provides a still provide a polishing equipment, including above polishing pad and burnishing machine, polishing pad detachable installs in the quotation of burnishing machine. As can be appreciated, the isolation layer 60 of the polishing pad is bonded on the disk surface of the polishing machine through the double-sided adhesive tape, so that the polishing pad is convenient to disassemble and maintain, and meanwhile, the installation strength is guaranteed.

Example (b):

the embodiment of the utility model provides a polishing pad, the groove size is 10mm long, 10mm wide, 15mm deep; the thickness of each layer of double faced adhesive tape is 0.2 mm; the thickness of the impermeable layer is 0.5 mm; the thickness of the release paper is 0.2 mm; the thickness of the basal layer is 30 mm; the separating piece of the separating layer is provided with 10 layers, so that the substrate layer can be recycled for 10 times.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The polishing pad is characterized by comprising a surface functional layer and a substrate layer, wherein a separation layer is arranged between the surface functional layer and the substrate layer, and the surface functional layer and the substrate layer are detachably connected with the separation layer.

2. The polishing pad of claim 1, wherein the release layer comprises at least two layers of release members, two adjacent layers of the release members being bonded, a first layer of the release members adjacent to the surface functional layer being bonded to the surface functional layer, and a last layer of the release members adjacent to the substrate layer being bonded to the substrate layer.

3. The polishing pad of claim 1, wherein the surface functional layer comprises a surface layer and a barrier layer, the surface layer being bonded to the barrier layer, the barrier layer being bonded to the release layer.

4. The polishing pad of claim 3, wherein the surface layer is provided with grooves for receiving an item to be polished.

5. The polishing pad of claim 3, wherein the barrier layer is made of a polyethylene polymer material.

6. The polishing pad of claim 1, wherein a first side of the substrate layer is bonded to the release layer and a second side of the substrate layer opposite the first side is bonded to the release layer.

7. A polishing apparatus comprising the polishing pad as set forth in any one of claims 1 to 6 and a polishing machine, the polishing pad being detachably mounted on a disk surface of the polishing machine.