CN210444719U - 一种cog液晶模组底框一体成型的散热结构 - Google Patents
一种cog液晶模组底框一体成型的散热结构 Download PDFInfo
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- CN210444719U CN210444719U CN201921368973.5U CN201921368973U CN210444719U CN 210444719 U CN210444719 U CN 210444719U CN 201921368973 U CN201921368973 U CN 201921368973U CN 210444719 U CN210444719 U CN 210444719U
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- die
- aluminum alloy
- liquid crystal
- heat radiation
- casting aluminum
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 19
- 230000005855 radiation Effects 0.000 title claims abstract description 19
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 27
- 238000004512 die casting Methods 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 description 6
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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Abstract
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CN201921368973.5U CN210444719U (zh) | 2019-08-22 | 2019-08-22 | 一种cog液晶模组底框一体成型的散热结构 |
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CN201921368973.5U CN210444719U (zh) | 2019-08-22 | 2019-08-22 | 一种cog液晶模组底框一体成型的散热结构 |
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CN210444719U true CN210444719U (zh) | 2020-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A heat dissipation structure for the integrated formation of the bottom frame of a COG liquid crystal module Effective date of registration: 20230620 Granted publication date: 20200501 Pledgee: Bank of Communications Limited Shenzhen Branch Pledgor: SHENZHEN MIND ELECTRONICS CO.,LTD. Registration number: Y2023980044981 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20200501 Pledgee: Bank of Communications Limited Shenzhen Branch Pledgor: SHENZHEN MIND ELECTRONICS CO.,LTD. Registration number: Y2023980044981 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A heat dissipation structure with integrated bottom frame of COG LCD module Granted publication date: 20200501 Pledgee: Bank of Communications Limited Shenzhen Branch Pledgor: SHENZHEN MIND ELECTRONICS CO.,LTD. Registration number: Y2024980032435 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |