CN210442473U - Transient thermal resistance test circuit - Google Patents

Transient thermal resistance test circuit Download PDF

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Publication number
CN210442473U
CN210442473U CN201921093506.6U CN201921093506U CN210442473U CN 210442473 U CN210442473 U CN 210442473U CN 201921093506 U CN201921093506 U CN 201921093506U CN 210442473 U CN210442473 U CN 210442473U
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power supply
tested
constant current
current load
voltage
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周鹏
孙衍翀
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Beijing Huafeng Test&control Co ltd
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Beijing Huafeng Test&control Co ltd
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Abstract

The utility model provides a transient state thermal resistance test circuit, include: the device to be tested is divided into a driving port and two working ports according to working characteristics, and the two working ports are conducted when driving voltage is applied to the driving port; the test circuit includes: the constant current load is used for setting a constant current value, and the input end of the constant current load is connected with the first working port of the device to be tested; the anode of the power supply is connected with the second working port of the tested device, and the cathode of the power supply is connected with the output end of the constant current load; the positive pole of the control power supply is connected with the non-inverting input end of the operational amplifier, and the negative pole of the control power supply is connected with the output end of the constant current load; the output end of the operational amplifier is connected with the driving end of the device to be tested, and the inverting input end of the operational amplifier is connected with the first working port of the device to be tested. The utility model discloses can solve voltage current power amplifier design degree of difficulty among the current transient state thermal resistance test circuit big, generate heat seriously, efficiency is lower, the complicated scheduling problem of circuit.

Description

Transient thermal resistance test circuit
Technical Field
The invention relates to the technical field of integrated circuit testing, in particular to a transient thermal resistance testing circuit.
Background
At present, when a power semiconductor device works under a power pulse condition, the temperature rise of the device is related to the width and the duty ratio of the power pulse. Under the test conditions of setting applied power, power pulse time and pulse duty ratio, the temperature change of the device is represented by certain temperature-sensitive characteristics in the semiconductor device, and the transient thermal resistance is calculated. The transient thermal resistance of the semiconductor device is related to the geometric dimensions, specific heat capacity, thermal diffusivity and the like of a chip and a package, so that the transient thermal resistance of the semiconductor device can reflect many characteristics of the device.
The test flow of the transient thermal resistance test comprises the following steps: testing the normal junction temperature of the device under test T1 → applying power → testing the junction temperature of the device under test after power application T2 → calculating the transient thermal resistance from the temperature changes of T1 and T2 and the applied power. Applying power to the device under test requires setting the power voltage and power current of the device under test, and generally, the power applied to the device under test can reach several hundreds to one kilowatt.
In the prior art, a test circuit as shown in fig. 1 to 3 is often used to apply a power voltage and a power current to a power semiconductor device to perform a transient thermal resistance test. The test circuit shown in fig. 1 is used for testing field effect transistors such as MOSFETs and IGBTs, and the test circuit shown in fig. 2 and 3 is used for testing triodes.
The test circuits shown in fig. 1 and fig. 2 adopt the same principle, and make the gate (base) of the device under test (MOSFET or triode) be zero by using the feedback of the operational amplifier, and at this time, the voltage output by the voltage power amplifier and the current output by the current power amplifier connected to the remaining two ends of the device under test are the power voltage and the power current of the device under test; the test circuit shown in fig. 3 does not use the operational amplifier feedback, but directly connects the base of the device under test (triode) to ground to make it zero, at this time, the sum of the voltage output by the power amplifier connected to the remaining end of the device under test and the Vbe voltage (voltage between the base and the emitter) of the device under test (triode) is the power voltage of the device under test, and the current output by the power amplifier connected to the remaining end of the device under test is the power current of the device under test.
However, the problems of the prior art are that, as shown above, the required power for testing the device under test usually reaches several hundreds to one thousand watts, the difficulty of designing the voltage and current power amplifier is great, the efficiency of the voltage and current power amplifier bears great power, the heat generation is serious, the efficiency is low, the size of the test circuit is large, and the circuit is complex.
Disclosure of Invention
In view of the above, the main objective of the present invention is to provide a transient thermal resistance test circuit, which has the advantages of wider applicability of a power source, smaller power loss of the test circuit, easy control, simple design, and small volume by simplifying the design of the power source, and can effectively solve the problems of difficult design, serious heat generation, low efficiency, large volume, complex circuit, and the like of a voltage-current power amplifier of a power output circuit in the existing transient thermal resistance test circuit.
The invention adopts the technical scheme that a transient thermal resistance test circuit comprises:
the device to be tested is divided into a driving port and two working ports according to working characteristics, and the two working ports are conducted when driving voltage is applied to the driving port; the test circuit includes:
the constant current load is used for setting a constant current value, and the input end of the constant current load is connected with the first working port of the device to be tested;
the anode of the power supply is connected with the second working port of the tested device, and the cathode of the power supply is connected with the output end of the constant current load;
the positive pole of the control power supply is connected with the non-inverting input end of the operational amplifier, and the negative pole of the control power supply is connected with the output end of the constant current load; the output end of the operational amplifier is connected with the driving end of the device to be tested, and the inverting input end of the operational amplifier is connected with the first working port of the device to be tested; the operational amplifier enables the voltage at the first working port of the tested device to be the voltage output by the control power supply;
and the voltage output by the control power supply is greater than or equal to the minimum working voltage for driving the constant-current load.
Therefore, in the technical scheme, the control power supply plays a role in driving the tested device to be switched on or switched off and setting the working voltage value of the constant-current load, the voltage value only needs to meet the minimum working voltage (about 1V) of the constant-current load, and compared with the working voltage required by a voltage power amplifier and a current power amplifier in the prior art, the power loss is greatly reduced. After the control power supply drives the tested device to be closed, setting the voltage of a first working port of the tested device as the voltage output by the control power supply through the feedback of the inverting input end of the operational amplifier, wherein the voltage of the first working port is the minimum working voltage required by the constant-current load; the power supply plays a role of providing power voltage for the tested device, the voltage of the power supply is larger, the voltage of the first working port of the tested device is the voltage output by the control power supply, the voltage output by the control power supply is subtracted from the voltage output by the power supply at the moment, the power voltage of the tested device can be obtained, and the transient thermal resistance power of the tested device can be obtained according to the power current. The scheme simplifies the design of the power source, simplifies the voltage power amplifier and the current power amplifier in the background technology into a single power supply, and simultaneously the power supply can select a finished commercial power supply, thereby simplifying the design of a power part of a test circuit, leading the applicability of the power source to be wider, leading the power output of the power source to be applied to a tested device for the most part, having high power efficiency, heating of the test circuit and small volume; the test circuit only needs to design a low-power control circuit, is simple in circuit design, and can effectively meet the power requirement of the transient thermal resistance test circuit.
The invention also provides another transient thermal resistance test circuit, which comprises:
the device to be tested is divided into a driving port and two working ports according to working characteristics, and the two working ports are conducted when driving voltage is applied to the driving port; the test circuit comprises;
the constant current load is used for setting a constant current value, and the input end of the constant current load is connected with the first working port of the device to be tested;
the anode of the power supply is connected with the second working port of the tested device, and the cathode of the power supply is connected with the output end of the constant current load;
the anode of the control power supply is connected with the second working port of the tested device, and the cathode of the control power supply is connected with the non-inverting input end of the operational amplifier; the output end of the operational amplifier is connected with the driving end of the device to be tested, and the inverting input end of the operational amplifier is connected with the first working port of the device to be tested; the operational amplifier enables the voltage at the first working port of the tested device to be the voltage output by the control power supply;
and the difference value between the voltage output by the power supply and the voltage output by the control power supply is greater than or equal to the minimum working voltage for driving the constant-current load.
In the technical scheme, the control power supply plays a role in driving the tested device to be switched on or off and setting a power voltage value for the tested device; the power supply plays a role in providing power for the device to be tested and driving the constant-current load to work, the voltage of the power supply needs to be slightly larger than the voltage of the control power supply, the voltage difference value of the power supply only needs to meet the minimum working voltage of the constant-current load, the constant-current load sets power current for the device to be tested, and the thermal resistance power of the device to be tested can be calculated through the power voltage and the power current.
The invention also provides another transient thermal resistance test circuit, which comprises:
the device to be tested is divided into a driving port and two working ports according to working characteristics, and the two working ports are conducted when driving voltage is applied to the driving port; the test circuit comprises;
the constant current load is used for setting a constant current value, and the input end of the constant current load is connected with the first working port of the device to be tested;
the anode of the power supply is connected with the second working port of the tested device, and the cathode of the power supply is connected with the output end of the constant current load;
the anode of the control power supply is connected with the driving port of the tested device, and the cathode of the control power supply is connected with the output end of the constant current load;
the voltage output by the control power supply is greater than or equal to the sum of the minimum working voltage for driving the constant-current load and the voltage drop of the control power supply on the tested device.
According to the technical scheme, the control power supply plays a role in driving the tested device to be switched on or switched off and driving the constant-current load to work, the voltage of the control power supply is the sum of the voltage between the driving end of the tested device and the first working port and the minimum working voltage of the constant-current load, the power supply plays a role in providing power voltage for the tested device, and according to the connection mode of the circuit, the power voltage of the tested device is obtained by subtracting the working voltages at two ends of the constant-current load from the voltage output by the power supply and combining the power current set by the constant-current load, so that the thermal resistance power of the tested device can be calculated.
Preferably, the positive pole of the power supply is connected with the second working port of the device to be tested, and the negative pole of the power supply is connected with the output end of the constant current load by adopting a kelvin circuit;
the kelvin circuit includes a drive sub-circuit and a sense sub-circuit.
Therefore, as the circuit connected with the power supply and the tested device has larger power current, the Kelvin circuit connection is adopted, the loss of voltage drop on the line caused by large current can be effectively reduced, and the thermal resistance test is more accurate.
Preferably, the constant current load comprises a constant current load circuit connected with an MOS (metal oxide semiconductor) tube, a resistor, a second operational amplifier and a differential amplifier;
the source electrode of the MOS tube is connected with one end of the resistor, and the drain electrode of the MOS tube and the other end of the resistor respectively correspond to the input end and the output end of the constant current load;
the non-inverting input end of the second operational amplifier is connected with an external power supply, the output end of the second operational amplifier is connected with the grid electrode of the MOS tube, and the inverting input end of the second operational amplifier is connected with the output end of the differential amplifier;
the non-inverting input end and the inverting input end of the differential amplifier are respectively connected to two ends of the resistor, and the voltage output by the external power supply is subjected to gain amplification to provide constant-current voltage for the resistor.
Therefore, the constant current load achieves the purpose of setting power current for the tested device by applying an external power supply and controlling the gain multiple of the differential amplifier and combining the resistance.
Optionally, the device under test includes an N-type field effect transistor, and the driving port, the first working port, and the second working port of the device under test are a gate, a drain, and a source, respectively.
Optionally, the device under test includes a triode, and the driving port, the first working port and the second working port of the device under test are respectively a base, an emitter and a collector.
Optionally, a resistor is further connected in series to the circuit at the base end of the triode.
Drawings
FIG. 1 is a schematic diagram of a prior art transient thermal resistance test for a field effect transistor;
FIG. 2 is a schematic diagram of a prior art transient thermal resistance test for a transistor;
FIG. 3 is a schematic diagram of another prior art transient thermal resistance test for a transistor;
FIG. 4 is a schematic circuit diagram of a transient thermal resistance test circuit according to a first embodiment of the present invention;
FIG. 5 is a schematic circuit diagram of a constant current load according to the present invention;
FIG. 6 is a schematic circuit diagram of a transient thermal resistance test circuit according to a second embodiment of the present invention;
FIG. 7 is a schematic circuit diagram of a transient thermal resistance test circuit according to a third embodiment of the present invention;
FIG. 8 is a schematic circuit diagram of a transient thermal resistance test circuit according to a fourth embodiment of the present invention;
FIG. 9 is a schematic circuit diagram of a transient thermal resistance test circuit according to a fifth embodiment of the present invention.
Detailed Description
The following describes a specific embodiment of the transient thermal resistance test circuit according to the present invention in detail with reference to fig. 4 to 8.
Example one
In the first embodiment shown in fig. 4, the device to be tested is an N-type MOS transistor, and the testing principle of the transient thermal resistance testing circuit is as follows, corresponding to the prior art shown in fig. 1:
a control power supply V1 is used as a driving power supply of the MOS tube to be detected, the MOS tube to be detected is driven to be closed or opened, and meanwhile, a working voltage value required by a constant current load is set; a power supply V2 is used as a power supply of the MOS tube to be tested, and provides power voltage for the MOS tube to be tested and working voltage for a constant current load; a constant current load is used as a constant current source of the MOS tube to be tested, and power current is set for the MOS tube to be tested;
the positive pole of the control power supply V1 is connected with the non-inverting input end of an operational amplifier, the output end of the operational amplifier is connected with the grid electrode of the MOS tube to be tested and provides threshold voltage for the grid electrode of the operational amplifier, and the inverting input end of the operational amplifier is connected with the source electrode of the MOS tube to be tested, so that the source electrode voltage is V1; the negative electrode of the control power supply V1 is connected in series with the constant current load and then is connected to the source electrode of the MOS tube to be tested;
the positive electrode of the power supply V2 is connected to the drain electrode of the MOS tube to be tested by a Kelvin circuit, and the negative electrode of the power supply V2 is connected to the source electrode of the MOS tube to be tested after being connected with a constant current load in series by the Kelvin circuit. The Kelvin circuits connected with the anode and the cathode of the power supply V2 respectively comprise two sub-circuits, the two sub-circuits connected with the anode are Force + (driving sub-circuit) and sequence + (sensing sub-circuit), the two sub-circuits connected with the cathode are Force- (driving sub-circuit) and sequence- (sensing sub-circuit), in the Kelvin connection circuit, a Force port is also called as a driving port, and a sequence is also called as a sensing port, and the Kelvin circuit connection mode is adopted to avoid voltage drop of power voltage on a conducting wire, so that the power voltage on a tested device is relatively accurate;
in the embodiment, the voltage of the control power supply V1 can be designed to be 1V or even smaller, and the specific voltage depends on the minimum working voltage of the constant-current load, and can be realized by a simple low-power integrated amplifier; the power supply V2 can adopt commercial linear power supply, because it adopts Kelvin circuit to connect to the two ends of the MOS tube to be tested, so its voltage drop is low, according to the voltage of the source electrode of the MOS tube to be tested is V1, the power voltage VDS applied on the MOS tube to be tested can be calculated as V2-V1;
fig. 5 is a schematic circuit diagram of the constant current load in this embodiment, which is formed by connecting an operational amplifier, a differential amplifier, a MOS transistor and a resistor R, wherein a non-inverting input terminal of the operational amplifier is connected to an external voltage Vset, an output terminal of the operational amplifier is connected to a gate of the MOS transistor for controlling the MOS transistor to be turned on or off, an inverting input terminal of the operational amplifier is connected to an output terminal of the differential amplifier, two input terminals of the differential amplifier are respectively connected to two ends of the resistor R, the resistor R is connected in series between a source and an output terminal of the MOS transistor, a drain of the MOS transistor is connected to the source of the MOS transistor to be tested through the input terminal, and the output terminal is respectively connected to a control. The constant current load circuit can control the voltage applied to two ends of the resistor R by setting the Vset and controlling the gain multiple of the differential amplifier, thereby obtaining the output power current. For example, when the gain multiple of the differential amplifier is 1, the output power current I is Vset/R;
therefore, the transient thermal resistance power of the tested MOS tube is calculated to be I (V2-V1).
In the embodiment corresponding to fig. 4, the setting of the required working voltage value for the constant current load by using the control power supply V1, and the providing of the working voltage by the power supply V2 to drive the constant current load to work means: the voltage difference between the gate and the source of the MOS transistor shown in fig. 5 is positive, and the voltage difference between the drain and the source of the MOS transistor is also positive through the circuit of V1, so that the drain and the source of the MOS transistor are conducted, and the power current I output by the constant current load is provided to the device under test.
Example two
In the second embodiment shown in fig. 6, still taking the device under test as an N-type MOS transistor as an example, the transient thermal resistance test circuit provides another design concept:
setting a required power voltage value for the MOS tube to be tested by adopting a control power supply V1; a constant current load is used as a constant current source of the MOS tube to be detected, and power current is set for the MOS tube to be detected; a power supply V2 is adopted to provide power for the MOS tube to be tested and drive voltage for the constant current load to drive the constant current load to work;
the positive electrode of the control power supply V1 is connected with the drain electrode of the MOS tube to be tested, the negative electrode of the control power supply V1 is connected with the non-inverting input end of the operational amplifier, the output end of the remote operational amplifier is connected with the grid electrode of the MOS tube to be tested, and the inverting input end of the remote operational amplifier is connected with the source electrode of the MOS tube to be tested;
the positive electrode of the power supply V2 is connected with the drain electrode of the MOS tube to be tested, and the negative electrode of the power supply V2 is connected with the source electrode of the MOS tube to be tested after being connected with a constant current load in series;
in this embodiment, the control power supply V1 sets the power voltage value required by the MOS transistor to be tested through the feedback of the operational amplifier, even if the power voltage VDS is equal to V1, and since there is no large current on the circuit, there is no need to use a kelvin circuit connection; the voltage of the power supply V2 needs to be slightly larger than the power voltage VDS (V1), so that the power is provided for the MOS tube to be tested, the constant-current load can work, and the working voltage is provided for the MOS tube to be tested, wherein the difference value of V2-V1 only needs to meet the minimum working voltage of the constant-current load;
the constant current load sets a power current for the test circuit, and the circuit connection of the constant current load is the same as that of the constant current load in the first embodiment, which is not described herein again;
according to the power voltage VDS (V1) and the power current set by the constant current load, the transient thermal resistance power of the MOS transistor to be tested in this embodiment can be calculated.
EXAMPLE III
In the third embodiment shown in fig. 7, the device to be tested is an N-type triode, and the testing principle of the transient thermal resistance testing circuit is as follows, corresponding to the prior art shown in fig. 2:
a control power supply V1 is used as a driving power supply of the tested triode and the constant current load to drive the tested triode to be closed or disconnected and drive the constant current load to work; a power supply V2 is used as a power supply of the triode to be tested to provide power voltage for the triode to be tested; a constant current load is used as a constant current source of the triode to be tested, and power current is set for the triode to be tested;
the positive pole of the control power supply V1 is connected with the non-inverting input end of the operational amplifier, the output end of the operational amplifier is connected with the base electrode of the tested triode in series through a resistor to provide threshold voltage for the base electrode, and the inverting input end of the operational amplifier is connected with the emitting electrode of the tested triode to enable the voltage of the emitting electrode to be V1; the negative electrode of the control power supply V1 is connected with the constant current load in series and then is connected to the emitter of the triode to be tested;
the positive electrode of the power supply V2 is connected to the collector of the tested triode by a Kelvin circuit, and the negative electrode of the power supply V2 is connected to the emitter of the tested triode after being connected with a constant current load in series by the Kelvin circuit;
the working principle of the test circuit in this embodiment is basically the same as that of the test circuit in the first embodiment, and it is sufficient that the voltage of the control power supply V1 meets the minimum working voltage of the constant-current load; the power supply V2 is connected to the collector and emitter of the tested triode by a Kelvin circuit, so that the voltage drop on the line is low, and the power voltage VCE applied to the tested triode can be calculated to be V2-V1 according to the voltage of the emitter of the tested triode as V1;
the constant current load sets a power current for the test circuit, and the circuit connection of the constant current load is the same as that of the constant current load in the first embodiment, which is not described herein again;
according to the power voltage VCE and the power current set by the constant current load, the transient thermal resistance power of the tested triode in the embodiment can be calculated.
Example four
In the fourth embodiment shown in fig. 8, the device under test is still an N-type transistor, and the design concept of the transient thermal resistance test circuit is consistent with the test circuit principle described in the second embodiment, except that the device under test is different;
setting a required power voltage value for the tested triode by using a control power supply V1; a constant current load is used as a constant current source of the triode to be tested, and power current is set for the triode to be tested; a power supply V2 is adopted to provide power for the triode to be tested and drive voltage for the constant current load to drive the constant current load to work;
the positive pole of the control power supply V1 is connected with the collector of the tested triode, the negative pole is connected with the non-inverting input end of the operational amplifier, the output end of the remote operational amplifier is connected with the base electrode of the tested triode, and the inverting input end is connected with the emitter electrode of the tested triode;
the positive electrode of the power supply V2 is connected with the collector electrode of the triode to be tested, and the negative electrode of the power supply V2 is connected with the emitter electrode of the triode to be tested after being connected with a constant current load in series;
in this embodiment, the control power supply V1 sets the power voltage value required by the tested triode through the feedback of the operational amplifier, that is, the power voltage VCE is V1; the voltage of the power supply V2 needs to be slightly larger than the power voltage VCE (V1), so that the constant-current load can work and the working voltage can be provided for the triode to be tested while the power is provided for the triode to be tested, wherein the difference value of V2-V1 only needs to meet the minimum working voltage of the constant-current load;
the constant current load sets a power current for the test circuit, and the circuit connection of the constant current load is the same as that of the constant current load in the first embodiment, which is not described herein again;
according to the power voltage VCE (V1) and the power current set by the constant current load, the transient thermal resistance power of the tested triode in the embodiment can be calculated.
EXAMPLE five
In the fifth embodiment shown in fig. 9, still taking the device under test as an N-type triode as an example, another transient thermal resistance test circuit is provided corresponding to the prior art shown in fig. 3, and the difference between the test circuit and the above embodiments is that an operational amplifier is not used for feedback, and the specific circuit includes:
the positive pole of the control power supply V1 is connected with the base electrode of the triode to be tested to drive the triode to be tested to be closed or opened, the negative pole of the control power supply V1 is connected with the emitter electrode of the triode to be tested after being connected with the constant current load in series, and according to the connection characteristic, the voltage of the control power supply V1 is the sum of the minimum working voltage of the constant current load and the voltage between the base electrode and the emitter electrode of the triode to be tested;
the positive electrode of the power supply V2 is connected to the collector of the tested triode by a Kelvin circuit, and the negative electrode of the power supply V2 is connected to the emitter of the tested triode after being connected with a constant current load in series by the Kelvin circuit;
the power voltage VCE of the tested triode is V2-V1+ the voltage between the base electrode and the emitting electrode of the tested triode, namely VCE is V2-the working voltage at two ends of the constant current load, the power current is set by the constant current load, and the transient thermal resistance power of the tested triode can be calculated according to the power voltage VCE and the power current.
The above embodiments are described by taking an N-type field effect transistor or a triode as an example, and when testing a P-type field effect transistor or a triode, the principle of the transient thermal resistance testing circuit of the present invention is not changed, and only the positive and negative polarities of the control power supply V1, the power supply V2 and the constant current load need to be adjusted correspondingly.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (8)

1. A transient thermal resistance test circuit, characterized by: the method comprises the following steps:
the device to be tested is divided into a driving port and two working ports according to working characteristics, and the two working ports are conducted when driving voltage is applied to the driving port; the test circuit includes:
the constant current load is used for setting a constant current value, and the input end of the constant current load is connected with the first working port of the device to be tested;
the anode of the power supply is connected with the second working port of the tested device, and the cathode of the power supply is connected with the output end of the constant current load;
the positive pole of the control power supply is connected with the non-inverting input end of the operational amplifier, and the negative pole of the control power supply is connected with the output end of the constant current load; the output end of the operational amplifier is connected with the driving end of the device to be tested, and the inverting input end of the operational amplifier is connected with the first working port of the device to be tested; the operational amplifier enables the voltage at the first working port of the tested device to be the voltage output by the control power supply;
and the voltage output by the control power supply is greater than or equal to the minimum working voltage for driving the constant-current load.
2. A transient thermal resistance test circuit, comprising:
the device to be tested is divided into a driving port and two working ports according to working characteristics, and the two working ports are conducted when driving voltage is applied to the driving port; the test circuit comprises;
the constant current load is used for setting a constant current value, and the input end of the constant current load is connected with the first working port of the device to be tested;
the anode of the power supply is connected with the second working port of the tested device, and the cathode of the power supply is connected with the output end of the constant current load;
the anode of the control power supply is connected with the second working port of the tested device, and the cathode of the control power supply is connected with the non-inverting input end of the operational amplifier; the output end of the operational amplifier is connected with the driving end of the device to be tested, and the inverting input end of the operational amplifier is connected with the first working port of the device to be tested; the operational amplifier enables the voltage at the first working port of the tested device to be the voltage output by the control power supply;
and the difference value between the voltage output by the power supply and the voltage output by the control power supply is greater than or equal to the minimum working voltage for driving the constant-current load.
3. A transient thermal resistance test circuit, comprising:
the device to be tested is divided into a driving port and two working ports according to working characteristics, and the two working ports are conducted when driving voltage is applied to the driving port; the test circuit comprises;
the constant current load is used for setting a constant current value, and the input end of the constant current load is connected with the first working port of the device to be tested;
the anode of the power supply is connected with the second working port of the tested device, and the cathode of the power supply is connected with the output end of the constant current load;
the anode of the control power supply is connected with the driving port of the tested device, and the cathode of the control power supply is connected with the output end of the constant current load;
the voltage output by the control power supply is greater than or equal to the sum of the minimum working voltage for driving the constant-current load and the voltage drop of the control power supply on the tested device.
4. The circuit according to claim 1 or 3, wherein the connection of the positive pole of the power supply and the second working port of the device under test, and the connection of the negative pole of the power supply and the output end of the constant current load adopt a Kelvin circuit connection;
the kelvin circuit includes a drive sub-circuit and a sense sub-circuit.
5. The circuit according to any one of claims 1, 2 or 3, wherein the constant current load comprises a constant current load circuit connected by a MOS transistor, a resistor, a second operational amplifier and a differential amplifier;
the source electrode of the MOS tube is connected with one end of the resistor, and the drain electrode of the MOS tube and the other end of the resistor respectively correspond to the input end and the output end of the constant current load;
the non-inverting input end of the second operational amplifier is connected with an external power supply, the output end of the second operational amplifier is connected with the grid electrode of the MOS tube, and the inverting input end of the second operational amplifier is connected with the output end of the differential amplifier;
the non-inverting input end and the inverting input end of the differential amplifier are respectively connected to two ends of the resistor, and the voltage output by the external power supply is subjected to gain amplification to provide constant-current voltage for the resistor.
6. The circuit of any of claims 1, 2, or 3, wherein the device under test comprises an N-type fet, and the driving port, the first working port, and the second working port of the device under test are a gate, a drain, and a source, respectively.
7. A circuit according to any of claims 1, 2 or 3, wherein the device under test comprises a transistor, and the driving port, the first working port and the second working port of the device under test are a base, an emitter and a collector, respectively.
8. The circuit of claim 7, wherein a resistor is further connected in series with the base terminal circuit of the transistor.
CN201921093506.6U 2019-07-12 2019-07-12 Transient thermal resistance test circuit Withdrawn - After Issue CN210442473U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110244211A (en) * 2019-07-12 2019-09-17 北京华峰测控技术股份有限公司 A kind of transient thermal resistance test circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110244211A (en) * 2019-07-12 2019-09-17 北京华峰测控技术股份有限公司 A kind of transient thermal resistance test circuit
CN110244211B (en) * 2019-07-12 2024-04-30 北京华峰测控技术股份有限公司 Transient thermal resistance test circuit

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