CN210432043U - Substrate unit and display device - Google Patents

Abstract

An object of the present invention is to provide a substrate unit and a display device capable of inspecting a connection state between substrates with high accuracy. The substrate unit has a first resin substrate, a second resin substrate connected to the first resin substrate, a conductive portion provided on the first resin substrate, a first electrode provided on the second resin substrate, and a second electrode provided on the second resin substrate and arranged apart from the first electrode in the first direction. The conductive portion has a first portion for facing and connecting to the first electrode, a second portion arranged apart from the first portion in the first direction and for facing and connecting to the second electrode, and a connecting portion connecting the first portion and the second portion. In the first direction, an inter-center distance between a first site and the second site, and an inter-center distance between the first electrode and the second electrode are different from each other.

Description

Substrate unit and display device

Technical Field

The utility model relates to a base plate unit and display device.

Background

An electronic device such as a display device or a portable electronic device includes a substrate unit including a substrate (wiring substrate, circuit substrate) in which an electronic circuit and a wiring are formed, and a flexible substrate connected to the substrate. As a method of connecting a substrate and a flexible substrate, as described in patent document 1, there is a method of connecting a substrate and a flexible substrate by disposing an ACF (Anisotropic Conductive Film) between the substrate and the flexible substrate and pressure-bonding them with a pressure-bonding head.

Patent document 1: japanese patent laid-open publication No. 2004-95872

SUMMERY OF THE UTILITY MODEL

The utility model discloses a seek to inspect the connection state between the base plate with high accuracy.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate unit and a display device capable of accurately inspecting a connection state between substrates.

The substrate unit of the first mode includes: a first resin substrate; a second resin substrate connected to the first resin substrate; a conductive portion provided on the first resin substrate; a first electrode provided on the second resin substrate; and a second electrode provided on the second resin substrate and disposed apart from the first electrode in a first direction, the conductive portion including: a first portion for opposing and connecting to the first electrode; a second portion which is disposed apart from the first portion in the first direction and is opposed to and connected to the second electrode; and a connecting portion that connects the first portion and the second portion, wherein a center-to-center distance between the first portion and the second portion and a center-to-center distance between the first electrode and the second electrode are different from each other in the first direction.

In the substrate unit according to the first aspect, it is preferable that the substrate unit has an inspection pattern for inspecting a positional displacement amount of the second resin substrate with respect to the first resin substrate, and the conductive portion, the first electrode, and the second electrode function as the inspection pattern.

In the substrate unit according to the first aspect, the first portion and the first electrode may be provided to extend in a second direction intersecting the first direction in a plan view, and a width of the first portion in the first direction may be smaller than a width of the first electrode.

In the substrate unit according to the first aspect, the second portion and the second electrode may be provided to extend in a second direction, and the width of the second portion may be smaller than the width of the second electrode in the first direction.

In the substrate unit according to the first aspect, it is preferable that the substrate unit further includes: a first pad connected to the first electrode; and a second pad connected to the second electrode.

In the substrate unit according to the first aspect, it is preferable that the substrate unit further includes an adhesive layer disposed between the first resin substrate and the second resin substrate; the adhesive layer has: a binder; and conductive particles dispersed in the binder.

The substrate unit of the second aspect includes: a first resin substrate; a second resin substrate connected to the first resin substrate; a conductive portion provided on the first resin substrate; a first electrode provided on the second resin substrate; a second electrode provided on the second resin substrate and spaced apart from the first electrode in a first direction; a first pad connected to the first electrode; a second pad connected to the second electrode; and a third pad connected to the conductive portion, wherein a distance between the first electrode and the second electrode in the first direction is larger than a width of the conductive portion.

In the substrate unit according to the first aspect, it is preferable that the substrate unit includes an inspection pattern for inspecting a positional displacement amount of the second resin substrate with respect to the first resin substrate, and the conductive portion, the first electrode, the second electrode, the first pad, the second pad, and the third pad function as the inspection pattern.

The substrate unit of the third aspect includes: a first resin substrate; a second resin substrate connected to the first resin substrate; a conductive portion provided on the first resin substrate; a first electrode provided on the second resin substrate; and a second electrode provided on the second resin substrate and disposed apart from the first electrode in a first direction, the conductive portion including: a first portion opposed to and connected to the first electrode; a second portion disposed apart from the first portion in the first direction; and a connecting portion that connects the first portion and the second portion, wherein a distance between the first electrode and the second electrode in the first direction is larger than a width of the second portion.

In the substrate unit according to the third aspect, it is preferable that the substrate unit has an inspection pattern for inspecting a positional displacement amount of the second resin substrate with respect to the first resin substrate, and the conductive portion, the first electrode, and the second electrode function as the inspection pattern.

In the substrate unit according to the second or third aspect, the inspection pattern preferably includes a dummy electrode disposed between the first electrode and the second electrode, and a distance between the first electrode and the dummy electrode in the first direction is equal to a distance between the second electrode and the dummy electrode.

Preferably, a display device has: one substrate unit of a first form substrate unit, a second form substrate unit and a third form substrate unit; and a display panel mounted with the substrate unit.

Drawings

Fig. 1 is a plan view showing an example of the configuration of a display device according to the embodiment.

Fig. 2 is a cross-sectional view showing a state before the first wiring substrate and the second wiring substrate are joined.

Fig. 3 is a cross-sectional view showing a state after the first wiring substrate and the second wiring substrate are joined.

FIG. 4 is a plan view showing an enlarged FOF region shown in FIG. 1.

Fig. 5 is a plan view showing an example of the structure of the test pattern TP in embodiment 1.

Fig. 6 is a sectional view taken along line VI-VI' and taken from the top view shown in fig. 5.

Fig. 7 is a flowchart showing a manufacturing process and an inspection process of the substrate unit according to embodiment 1.

Fig. 8 is a plan view showing a case where the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 in the inspection pattern of embodiment 1.

Fig. 9 is a plan view showing a case where the conductive portion T1 is displaced leftward from the inspection electrode T2 in the inspection pattern of embodiment 1.

Fig. 10 is a plan view showing an inspection pattern in modification 1 of embodiment 1.

Fig. 11 is a cross-sectional view taken along line XI-XI' and taken from the top view shown in fig. 10.

Fig. 12 is a plan view showing a case where the conductive portion T1 is shifted in position to the right with respect to the inspection electrode T2 in the inspection pattern of modification 1 of embodiment 1.

Fig. 13 is a plan view showing a case where the conductive portion T1 is displaced leftward from the inspection electrode T2 in the inspection pattern according to modification 1 of embodiment 1.

Fig. 14 is a plan view showing an inspection pattern according to modification 2 of embodiment 1.

Fig. 15 is a sectional view taken along the line XV-XV' and taken from the top view shown in fig. 14.

Fig. 16 is a plan view showing a case where the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 in the inspection pattern of modification 2 of embodiment 1.

Fig. 17 is a plan view showing a case where the conductive portion T1 is displaced leftward from the inspection electrode T2 in the inspection pattern according to modification 2 of embodiment 1.

Fig. 18 is a cross-sectional view showing an inspection pattern TPc according to modification 3 of embodiment 1.

Fig. 19 is a plan view showing an example of the structure of the inspection pattern according to modification 4 of embodiment 1.

Fig. 20 is a cross-sectional view taken along line XX-XX' of the top view shown in fig. 19.

Fig. 21 is a cross-sectional view showing a configuration example of an inspection pattern of a comparative example.

Fig. 22 is a plan view showing an example of the structure of the inspection pattern according to embodiment 2.

Fig. 23 is a plan view showing a case where the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 in the inspection pattern of embodiment 2.

Fig. 24 is a plan view showing an example of the structure of the inspection pattern according to embodiment 3.

Fig. 25 is a plan view showing a case where the conductive portion T1 is displaced leftward from the inspection electrode T2 in the inspection pattern of embodiment 3.

Fig. 26 is a plan view showing a case where the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 in the inspection pattern of embodiment 3.

Fig. 27 is a plan view showing an example of the structure of an inspection pattern according to a modification of embodiment 3.

Fig. 28 is a plan view showing a case where the conductive portion T1 is displaced leftward from the inspection electrode T2 in the inspection pattern according to the modification of embodiment 3.

Fig. 29 is a plan view showing a case where the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 in the inspection pattern according to the modification of embodiment 3.

The reference numerals are explained below:

1 film base Material

5 IC chip

8 ACF

12 first FOF terminal

60 TFT substrate

61 extension part

90 relative base plate

100 first wiring board (first resin substrate)

110 second wiring substrate (second resin substrate)

112 second FOF terminal

120 drive circuit

130 driven element

140 third wiring board

150 display panel

200 display device

300 substrate unit

PN probe

T1 conductive part

First sites of T11 and T11

Second site of T12 or T12

Third site of T13

T2 checking electrode

T21, T21' first check electrode

T22, T22' second checking electrode

T23 third checking electrode

T24 fourth checking electrode

T25 dummy electrode

TP, TPa, TPb, TPc, TPd, TPe, TPf, TPg, TP' inspection pattern

Detailed Description

The embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. The components described below include substantially the same components as those easily conceivable by those skilled in the art. The following constituent elements can be appropriately combined. The present disclosure is merely an example, and appropriate modifications that can be easily made by those skilled in the art while maintaining the spirit of the present invention are naturally included in the scope of the present invention. In addition, in order to make the description more clear, the drawings schematically show the width, thickness, shape, and the like of each part as compared with the actual form, but this is merely an example and does not limit the explanation of the present invention. In the present specification and the drawings, the same reference numerals are given to the same elements as those described above in the conventional drawings, and detailed description thereof may be omitted as appropriate.

(embodiment mode 1)

Fig. 1 is a plan view showing an example of the configuration of a display device according to the embodiment. In the following description, an XYZ rectangular coordinate system is set, and the positional relationship of each member is described with reference to the XYZ rectangular coordinate system. The first direction is taken as the X-axis direction, the second direction orthogonal to the first direction is taken as the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (i.e., the direction perpendicular to the X-Y plane) is taken as the Z-axis direction.

As shown in fig. 1, the display device 200 includes: a display panel 150, a first wiring substrate 100, a second wiring substrate 110, a third wiring substrate 140, and a resin layer (not shown) electrically connected to the display panel 150. Note that, in addition to the first wiring board 100, the second wiring board 110, and the third wiring board 140, the display panel 150 is provided with an illumination device such as a backlight, a touch panel, and other accessory devices as necessary, but these elements are not illustrated in fig. 1.

The display panel 150 is, for example, a liquid crystal panel. The display panel 150 has: the TFT substrate 60, the counter substrate 90 disposed to face the TFT substrate 60, a sealing material (not shown) for bonding the TFT substrate 60 and the counter substrate 90, and a liquid crystal layer (not shown) sealed between the TFT substrate 60 and the counter substrate 90. For example, a plurality of wirings (not shown) extending in the X-axis direction and the Y-axis direction are provided in a region of the TFT substrate 60 facing the counter substrate 90. In the TFT substrate 60, a portion where wirings intersect corresponds to a pixel which is a minimum unit of display. A plurality of the pixels are arranged in a matrix to form an entire display region. Further, although not shown, a color filter is disposed between the liquid crystal layer and the counter substrate 90, for example. The color filter may be printed on the surface of the counter substrate 90 facing the TFT substrate 60.

In the present embodiment, the display panel 150 is not limited to a liquid crystal panel. For example, the display panel 150 may be an organic EL (Electro Luminescence) panel, an electrophoretic display, or another Electro-optical device.

The TFT substrate 60 has a protruding portion 61 protruding outward of the counter substrate 90. On the one surface 61a side of the protruding portion 61, a panel terminal (not shown) directly or indirectly connected to a wiring provided in the display region is provided. The plurality of panel terminals are arranged along the outer edge of the protruding portion 61, thereby constituting a panel terminal group.

As shown in fig. 1, the first wiring substrate 100 and the extension portion 61 are bonded in a FOG (Film On Glass) region R11. The FOG region R11 is covered with a resin layer (not shown) applied to the surface 61a and the side surface of the extension portion 61. Thereby, the FOG terminal (not shown) of the first wiring substrate 100 is sealed. The first wiring substrate 100 and the second wiring substrate 110 are bonded to each other in a FOF (Film On Film) region R12.

The second wiring substrate 110 is a flexible printed circuit substrate (fpc). A driver circuit 120 for driving a touch panel (not shown) and a passive element 130 are mounted on the second wiring substrate 110. The second wiring substrate 110 is connected to the touch panel. In addition, a connector CNT for connecting the display device 200 to another device is provided on the second wiring substrate 110.

The third wiring substrate 140 is an FPC. The third wiring substrate 140 is connected to a backlight. The third wiring board 140 is soldered to the second wiring board 110, or bonded to the fof (film On film) region R13 by a connector or the like.

Fig. 2 is a cross-sectional view showing a state before the first wiring substrate and the second wiring substrate are joined. Fig. 3 is a cross-sectional view showing a state after the first wiring substrate and the second wiring substrate are joined. FIGS. 2 and 3 are enlarged views showing a cross section obtained by cutting FIG. 1 along line II-II'. FIG. 4 is a plan view showing an enlarged FOF region shown in FIG. 1.

The first wiring board 100 shown in fig. 2 to 4 is formed by mounting an IC chip 5 (see fig. 1) on, for example, a long film-like base material (hereinafter referred to as a film base material) 1 in a surface-mount manner, and punching the film base material 1 on which the IC chip 5 is mounted in a surface-mount manner along outline dicing lines. The first wiring substrate 100 is, for example, a Chip On Film (COF) substrate. The first wiring substrate 100 includes: the film substrate 1, a plurality of FOG terminals (not shown) and a plurality of first FOF terminals 12 provided on one surface 1a side of the film substrate 1, an IC chip 5 mounted on the one surface 1a side of the film substrate 1 in a surface mounting manner, and a solder resist 7 covering the periphery of the IC chip 5 on the one surface 1a of the film substrate 1. For example, the film base 1 is formed of a flexible resin material, and the first wiring board 100 can also be referred to as a first resin board 100.

The second wiring substrate 110 has a film base 111, a second FOF terminal 112 provided on one surface 111a side of the film base 111, adhesive layers 113 and 115, and cover films 114 and 116. The second FOF terminal 112, the adhesive layer 113, and the cover film 114 are provided on the one surface 111a side of the film base 111. The cover film 114 is attached to the film base 111 via the adhesive layer 113. The adhesive layer 115 and the cover film 116 are provided on the other surface 111b side of the film base 111. The cover film 116 is attached to the film base 111 via the adhesive layer 115. For example, the film base 111 is formed of a flexible resin material, and the second wiring board 110 can also be referred to as a second resin board 110.

The first FOF terminal 12 of the first wiring substrate 100 and the second FOF terminal 112 of the second wiring substrate 110 are connected via Conductive particles 81 contained in an anisotropic Conductive film (hereinafter, written as acf) 8. Although not shown, the FOG terminals of the first wiring substrate 100 and the panel terminals of the extension portions 61 (see fig. 1) are also connected via the conductive particles 81 contained in the ACF 8. The FOG terminal, the first FOF terminal 12, and the second FOF terminal 112 are made of a metal film such as copper (Cu), and the surface of the metal film is plated with tin (Sn), gold (Au), or nickel (Ni).

As shown in FIG. 4, a plurality of first FOF terminals 12 are arranged at intervals in the X-axis direction. The plurality of first FOF terminals 12 are connected to electronic components, respectively. Conductive portions T1A and T1B are provided at both ends of the first wiring board 100. The conductive portions T1A and T1B are not connected to the electronic component.

The second FOF terminals 112 are arranged at intervals in the X-axis direction. The plurality of second FOF terminals 112 are connected to the electronic components, respectively. Further, inspection electrodes T2A and T2B are provided at both ends of the second wiring board 110, respectively. The inspection electrodes T2A, T2B are not connected to the electronic components.

The check electrode T2A has a first check electrode T21A, and a second check electrode T22A disposed apart from the first check electrode T21A in the X-axis direction. One end of the first check electrode T21A is connected to the conductive part T1A via the ACF 8. The other end of the first inspection electrode T21A is a measurement pad P21A. Similarly, the check electrode T2B includes a first check electrode T21B and a second check electrode T22B disposed apart from the first check electrode T21B in the X-axis direction. One end of the first check electrode T21B is connected to the conductive part T1B via the ACF 8. The other end of the first inspection electrode T21B is a measurement pad P21B.

In the present embodiment, the inspection pattern TPA is formed by the conductive portion T1A and the inspection electrode T2A. Further, the conductive portion T1B and the inspection electrode T2B constitute an inspection pattern TPB.

Hereinafter, when it is not necessary to separately explain the conductive portions T1A and T1B, the conductive portions T1A and T1B are both referred to as conductive portions T1. In addition, when the inspection patterns TPA and TPB need not be described separately, the inspection patterns TPA and TPB are referred to as inspection patterns TP. Similarly, when the inspection electrodes T2A and T2B need not be described separately, the inspection electrodes T2A and T2B are referred to as inspection electrodes T2. In a case where it is not necessary to separately explain the first check electrodes T21A, T21B, the first check electrodes T21A, T21B are referred to as first check electrodes T21. In a case where the second check electrodes T22A, T22B need not be described separately, the second check electrodes T22A, T22B are referred to as second check electrodes T22. When it is not necessary to separately explain the measurement pads P21A and P21B, the measurement pads P21A and P21B are referred to as measurement pads P21. When it is not necessary to separately describe the measurement pads P22A and P22B, the measurement pads P22A and P22B are referred to as measurement pads P22.

Fig. 5 is a plan view showing an example of the structure of the test pattern TP in embodiment 1. Fig. 6 is a sectional view taken along line VI-VI' and taken along the top view of fig. 5. As shown in fig. 5 and 6, the inspection pattern TP has a conductive portion T1 and an inspection electrode T2. In addition, the check electrode T2 has a first check electrode T21 and a second check electrode T22. The conductive portion T1 includes a first portion T11, a second portion T12, and a connecting portion T10.

The first portion T11 is a conductive film extending in the Y-axis direction, for example. When the amount of relative positional displacement of the second wiring substrate 110 with respect to the first wiring substrate 100 is equal to or less than a predetermined value (hereinafter referred to as a predetermined value), at least a part of the first portion T11 is disposed at a position facing the first inspection electrode T21 in the Z-axis direction. The positional deviation may be referred to as mounting deviation.

The second portion T12 is a conductive film extending in the Y-axis direction, for example. When the amount of positional deviation is equal to or less than the predetermined value, at least a part of the second portion T12 is disposed at a position facing the second test electrode T22 in the Z-axis direction.

The connection portion T10 is a conductive film extending in the X-axis direction, for example. The connection portion T10 is disposed at a position not facing the first test electrode T21 and the second test electrode T22 in the Z-axis direction. The connection portion T10 connects the first portion T11 and the second portion T12 at a position not overlapping the first check electrode T21 and the second check electrode T22 in a plan view.

As shown in fig. 5, the first inspection electrode T21 is a conductive film extending in the Y-axis direction. The first check electrode T21 has a first edge portion 211 located on the side of the first check electrode T21 adjacent to the second check electrode T22 in the X-axis direction (that is, located inside the check electrode T2), and a second edge portion 212 located on the opposite side of the first check electrode T21 adjacent to the second check electrode T22 in the X-axis direction (that is, located outside the check electrode T2). The distance W21 between the first edge portion 211 and the second edge portion 212 is the width of the first check electrode T21. The width W21 of the first check electrode T21 is greater than the width W11 of the first site T11. For example, the width W11 of the first site T11 is 1/2 of the width W21 of the first check electrode T21.

When the relative positional deviation amount of the second wiring substrate 110 (see fig. 4) with respect to the first wiring substrate 100 (see fig. 4) is equal to or less than the predetermined value, the first portion T11 of the conductive portion T1 is located closer to the second edge portion 212 than the first edge portion 211 of the first check electrode T21. That is, the first site T11 is located closer to the outer side of the inspection electrode T2. In this case, the edge of the first site T11 and the second edge 212 of the first check electrode T21 overlap or substantially overlap in a plan view.

Similarly, the second inspection electrode T22 is a conductive film extending in the Y-axis direction. The second check electrode T22 has a first edge portion 221 and a second edge portion 222, the first edge portion 221 being located on a side adjacent to the first check electrode T21 in the X-axis direction (that is, located inside the check electrode T2), and the second edge portion 222 being located on an opposite side to the side adjacent to the first check electrode T21 in the X-axis direction (that is, located outside the check electrode T2). The distance W22 between the first edge portion 221 and the second edge portion 222 is the width of the second check electrode T22. The width W22 of the second check electrode T22 is greater than the width W12 of the second site T12. For example, the width W12 of the second site T12 is a length of 1/2 of the width W22 of the second check electrode T22.

When the relative positional deviation amount of the second wiring substrate 110 (see fig. 4) with respect to the first wiring substrate 100 (see fig. 4) is equal to or less than the predetermined value, the second portion T12 of the conductive portion T1 is located closer to the second edge portion 222 than the first edge portion 221 of the second check electrode T22. That is, the second site T12 is located closer to the outer side of the inspection electrode T2. In this case, the edge of the second site T12 and the second edge 222 of the second inspection electrode T22 overlap or substantially overlap in a plan view.

As shown in fig. 5, the width W11 of the first portion of the conductive portion T1 is the same length as the width W12 of the second portion T12. In addition, the width W21 of the first check electrode T21 is the same length as the width W22 of the second check electrode T22. As shown in fig. 6, the distance L1 between the centers of the first portion T11 and the second portion T12 and the distance L2 between the centers of the first check electrode T21 and the second check electrode T22 are different from each other in the X-axis direction, and L1 is longer than L2, for example.

As shown in fig. 6, the first wiring substrate 100 and the second wiring substrate 110 are bonded via the ACF8 in the FOF region R12 (refer to fig. 1). When the amount of relative positional displacement of the second wiring substrate 110 with respect to the first wiring substrate 100 is equal to or less than the predetermined value, the first site T11 and the first check electrode T21 face each other in the Z-axis direction and are connected to each other via the conductive particles 81 included in the ACF 8. When the amount of positional deviation is equal to or less than the predetermined value, the second site T12 and the second check electrode T22 face each other in the Z-axis direction and are connected to each other via the conductive particles 81 included in the ACF 8. Hereinafter, a structure in which the first wiring substrate 100 and the second wiring substrate 110 are bonded via the ACF8 is referred to as a substrate unit 300 (see fig. 4).

The manufacturing process and the inspection process of the substrate unit 300 will be described below. Fig. 7 is a flowchart showing a manufacturing process and an inspection process of the substrate unit according to embodiment 1. Fig. 8 is a plan view showing a case where the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 in the inspection pattern of embodiment 1. Fig. 9 is a plan view showing a case where the conductive portion T1 is displaced leftward from the inspection electrode T2 in the inspection pattern of embodiment 1.

As shown in fig. 7, the manufacturing apparatus (not shown) attaches ACF8 to first wiring board 100 or second wiring board 110 (see fig. 4) (step ST 1). Next, the manufacturing apparatus aligns the first wiring substrate 100 and the second wiring substrate 110 using the alignment mark. Next, the manufacturing apparatus bonds the first wiring substrate 100 and the second wiring substrate 110 via the ACF8 (step ST 2). The ACF8 includes an adhesive 82 (see fig. 6) and a large number of conductive particles 81 (see fig. 6) dispersed in the adhesive 82. The ACF8 has a function of bonding the first wiring substrate 100 and the second wiring substrate 110 with the adhesive 82. The ACF8 has a function of insulating between terminals that are not opposed to each other and connecting between the opposed terminals with the conductive particles 81. The terminals include, for example, a first FOF terminal 12 and a second FOF terminal 112, and a conductive portion T1 and a check electrode T2 (see FIG. 6). Thereby, the substrate unit 300 is completed (see fig. 4).

Next, the inspection apparatus (not shown) performs a conduction inspection between the first inspection electrode T21 and the second inspection electrode T22 (step ST 3). For example, the inspection apparatus brings the probe PN (see fig. 5) into contact with the measurement pads P21, P22 disposed on the second wiring board 110, and measures whether or not a current flows between the measurement pads P21, P22. In this measurement, a current detection device CDA (see fig. 5) connected to the probe PN is used. At this time, when the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100 (i.e., the relative positional displacement amount of the check electrode T2 with respect to the conductive portion T1) is equal to or less than a predetermined value, the first check electrode T21 and the second check electrode T22 are connected via the conductive portion T1.

For example, when the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100 is zero or substantially zero, the edge portion of the first portion T11 and the second edge portion 212 of the first inspection electrode T21 overlap or substantially overlap in a plan view. In addition, the edge of the second portion T12 and the second edge 222 of the second inspection electrode T22 overlap or substantially overlap in a plan view. Thus, the first check electrode T21 and the first site T11 are connected via the conductive particles 81 contained in the ACF8, and the second check electrode T22 and the second site T12 are connected via the conductive particles 81 contained in the ACF 8. Thereby, a current flows between the measurement pads P21 and P22. The current value of the current flowing between the measurement pads P21 and P22 is detected by the current detection device CDA.

On the other hand, when the amount of relative positional displacement of the second wiring substrate 110 with respect to the first wiring substrate 100 exceeds the predetermined value, the first check electrode T21 and the second check electrode T22 are not connected via the conductive portion T1, and therefore no current flows between the measurement pads P21 and P22.

For example, as shown in fig. 8, when the conductive portion T1 is shifted in position to the right with respect to the test electrode T2 and the amount of shift in position of the conductive portion T1 exceeds the width W11 of the first site T11 (or the width W12 of the second site T12), a space S is formed between the second site T12 and the second test electrode T22 in a plan view. That is, when the above-described amount of positional deviation exceeds 1/2 of the width W22 of the second check electrode T22, a space S is generated between the second site T12 and the second check electrode T22 in a plan view. In this case, since the second site T12 and the second check electrode T22 are not connected to each other, no current flows between the measurement pads P21 and P22.

As shown in fig. 9, when the conductive portion T1 is positionally offset leftward with respect to the inspection electrode T2 and the amount of positional offset of the conductive portion T1 exceeds the width W11 of the first site T11 (or the width W12 of the second site T12), a space S is formed between the first site T11 and the first inspection electrode T21 in a plan view. That is, when the above-described amount of positional deviation exceeds 1/2 of the width W21 of the first check electrode T21, a space S is generated between the first site T11 and the first check electrode T21 in a plan view. In this case, since the first site T11 and the first check electrode T21 are not connected to each other, no current flows between the measurement pads P21 and P22.

When a current flows between the measurement pads P21 and P22, the inspection device determines that the amount of positional deviation is equal to or less than a predetermined value (step ST 4: yes), and determines that the connection state between the first wiring board 100 and the second wiring board 110 is good (step ST 5). On the other hand, when no current flows between the measurement pads P21 and P22, the inspection device determines that the amount of positional deviation exceeds the predetermined value (NO in step ST 4) and determines that the connection state between the first wiring board 100 and the second wiring board 110 is defective (step ST 6). Through the above steps, the manufacturing process and the inspection process of the substrate unit are completed.

As described above, the substrate unit 300 of embodiment 1 includes: a first substrate (e.g., a first wiring substrate 100) having a first wiring (e.g., a first FOF terminal 12), a second substrate (e.g., a second wiring substrate 110) having a second wiring (a second FOF terminal 112) connected to the first FOF terminal 12, and an inspection pattern TP for inspecting a relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100. The inspection pattern TP has: the conductive portion T1 provided on the first wiring substrate 100, the first electrode (e.g., the first inspection electrode T21) provided on the second wiring substrate 110, and the second electrode (e.g., the second inspection electrode T22) provided on the second wiring substrate 110 and arranged apart from the first inspection electrode TP21 in the first direction (e.g., the X-axis direction). The conductive portion T1, the first check electrode T21, and the second check electrode T22 function as a check pattern TP. The conductive portion T1 includes: a first site T11 for connecting to the first test electrode T21 in an opposed manner, a second site T12 arranged apart from the first site T11 in the X-axis direction and for connecting to the second test electrode T22 in an opposed manner, and a connecting portion T10 for connecting the first site T11 to the second site T12. In the X-axis direction, the inter-center distance L1 of the first site T11 and the second site T12, and the inter-center distance L2 of the first check electrode T21 and the second check electrode T22 are different from each other.

Accordingly, when the amount of positional deviation is equal to or less than a predetermined value (for example, 1/2 of the width W21 of the first check electrode T21), the first site T11 is disposed at a position facing the first check electrode T21. When the amount of positional deviation is equal to or less than the predetermined value, the second site T12 is disposed at a position facing the second check electrode T22. Thus, it is possible to determine whether or not the relative positional deviation of the second wiring substrate 110 with respect to the first wiring substrate 100 is good based on the presence or absence of a current between the measurement pads P21 connected to the first inspection electrode T21 and the measurement pads P22 connected to the second inspection electrode T22, instead of based on the resistance value between the measurement pads P21 and P22. For example, when the positional deviation amount is equal to or less than a predetermined value and the first check electrode T21 and the first site T11 and the second site T12 and the second check electrode T22 are electrically connected (short-circuited), a current flows between the measurement pads P21 and P22. On the other hand, if the amount of positional deviation exceeds the predetermined value and at least one of the first check electrode T21 and the first site T11 and the second site T12 and the second check electrode T22 is nonconductive (open), no current flows between the measurement pads P21 and P22. In this way, since the threshold for determining whether the positional deviation is good is clear, the inspection apparatus can inspect the connection state between the first wiring substrate 100 and the second wiring substrate 110 with high accuracy.

Here, a case will be described in which whether or not the positional deviation is good is determined based on the resistance value between the measurement pads P21 and P22. The resistance values include a wiring resistance value of the first check electrode T21, a connection resistance value between the first check electrode T21 and the first portion T11, a wiring resistance value of the first portion T11, a wiring resistance value of the connecting portion T10, a wiring resistance value of the second portion T12, a connection resistance value between the second portion T12 and the second check electrode T22, and a wiring resistance value of the second check electrode T22. Each wiring resistance value and each connection resistance value have a variation. Therefore, if it is determined whether the resistance value is good or not, the threshold value is easily unclear. For example, the minimum value of the resistance when the amount of positional deviation exceeds a predetermined value may be larger than the maximum value of the resistance when the amount of positional deviation is equal to or smaller than the predetermined value. In this way, it is difficult to appropriately set the threshold value in the determination of the presence or absence of the defect based on the resistance value.

In contrast, the present embodiment determines whether the current is good or not based on the presence or absence of the current. When the amount of positional deviation exceeds a predetermined value, the current path between the measurement pads P21 and P22 is opened, and no current flows. The threshold for determining whether or not the current is good is determined by whether or not the current flows.

The first site T11 and the first inspection electrode T21 extend in the Y-axis direction intersecting the X-axis direction in a plan view. The width W11 of the first site T11 is smaller than the width W21 of the first check electrode T21 in the X-axis direction. Accordingly, the amount of positional displacement to be detected can be set smaller than the width W21 of the first check electrode T21. For example, a positional shift of the length of 1/2 in the width W21 can be detected by setting the width W11 of the first site T11 to 1/2 of the width W21 of the first check electrode T21.

In addition, the second site T12 and the second check electrode T22 are respectively provided to extend in the Y-axis direction. The width W12 of the second site T12 is smaller than the width W22 of the second check electrode T22 in the X-axis direction. Accordingly, the amount of positional displacement to be detected can be set smaller than the width W22 of the second check electrode T22. For example, the amount of positional displacement of 1/2 in the width W22 can be detected by setting the width W12 of the second portion T12 to 1/2 in the width W22 of the second check electrode T22.

The board unit 300 further includes a first pad (e.g., a measurement pad P21) connected to the first test electrode T21, and a second pad (e.g., a measurement pad P22) connected to the second test electrode T22. Accordingly, the inspection apparatus can measure the current value by bringing the probe PN into contact with the measurement pads P21 and P22, respectively.

In addition, the substrate unit 300 further includes an ACF8 disposed between the first wiring substrate 100 and the second wiring substrate 110. The ACF8 has an adhesive 82 and conductive particles 81 dispersed in the adhesive 82. Accordingly, the first wiring substrate 100 and the second wiring substrate 110 can be bonded via the ACF8, and the first portion T11 and the first check electrode T21 and the second portion T12 and the second check electrode T22 can be connected via the conductive particles 81 contained in the ACF 8.

The display device 200 of the present embodiment includes a substrate unit 300 and a display panel 150 on which the substrate unit 300 is mounted. Accordingly, the display device 200 can be provided in which the connection state between the first wiring substrate 100 and the second wiring substrate 110 is inspected with high accuracy.

(modification example)

In embodiment 1 described above, a case where the first site T11 and the second site T12 of the conductive portion T1 are located respectively close to the outer sides of the inspection electrodes T2 when the amount of relative positional deviation of the second wiring substrate 110 (see fig. 4) with respect to the first wiring substrate 100 (see fig. 4) is zero or substantially zero is explained (see fig. 5). However, the present embodiment is not limited to this.

Fig. 10 is a plan view showing an inspection pattern in modification 1 of embodiment 1. Fig. 11 is a sectional view of the top view shown in fig. 10, taken along line XI-XI'. As shown in fig. 10 and 11, in the inspection pattern TPa of modification 1 of embodiment 1, when the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100 is zero or substantially zero, the first portion T11 of the conductive portion T1 is located closer to the first edge portion 211 than the second edge portion 212 of the first inspection electrode T21. That is, the first site T11 is located close to the inner side of the inspection electrode T2. In this case, the edge of the first site T11 and the first edge 211 of the first inspection electrode T21 overlap or substantially overlap in a plan view.

Similarly, in the inspection pattern TPa, when the above-described positional deviation amount is zero or substantially zero, the second portion T12 of the conductive portion T1 is located closer to the first edge portion 221 than the second edge portion 222 of the second inspection electrode T22. That is, the second site T12 is located inward of the inspection electrode T2. In this case, the edge of the second site T12 and the first edge 221 of the second check electrode T22 overlap or substantially overlap in a plan view.

As shown in fig. 10, in the inspection pattern TPa, the width W11 of the first site T11 of the conductive portion T1 is also the same length as the width W12 of the second site T12. In addition, the width W21 of the first check electrode T21 is also the same length as the width W22 of the second check electrode T22. In fig. 10, W11 is the length of 1/2 of W21. W12 is the length of 1/2 of W22. In addition, as shown in fig. 11, the inter-center distance L1 between the first site T11 and the second site T12 and the inter-center distance L2 between the first check electrode T21 and the second check electrode T22 are different lengths from each other. For example, L1 is shorter than L2.

Fig. 12 is a plan view showing a case where the conductive portion T1 is shifted in position to the right with respect to the inspection electrode T2 in the inspection pattern of modification 1 of embodiment 1. Fig. 13 is a plan view showing a case where the conductive portion T1 is displaced leftward from the inspection electrode T2 in the inspection pattern according to modification 1 of embodiment 1.

As shown in fig. 12, when the conductive portion T1 is shifted in position to the right with respect to the inspection electrode T2 and the amount of the shift exceeds the width W11 of the first portion T11 (or the width W12 of the second portion T12), a space S is created between the first portion T11 and the first inspection electrode T21 in a plan view. That is, when the above-described amount of positional deviation exceeds 1/2 of the width W21 of the first check electrode T21 (or the width W22 of the second check electrode T22), a space S is generated between the first portion T11 and the first check electrode T21 in a plan view. In this case, since the first site T11 and the first check electrode T21 are not connected to each other, no current flows between the measurement pads P21 and P22.

As shown in fig. 13, when the conductive portion T1 is positionally offset leftward with respect to the inspection electrode T2 and the amount of this positional offset exceeds the width W11 of the first portion T11 (or the width W12 of the second portion T12), a space S is created between the second portion T12 and the second inspection electrode T22 in a plan view. That is, when the above-described amount of positional deviation exceeds 1/2 of the width W21 of the first check electrode T21 (or the width W22 of the second check electrode T22), a space S is generated between the second portion T12 and the second check electrode T22 in a plan view. In this case, since the second site T12 and the second check electrode T22 are not connected to each other, no current flows between the measurement pads P21 and P22.

In modification 1 of embodiment 1, when a current flows between the measurement pads P21 and P22, the inspection device (not shown) determines that the amount of positional deviation is equal to or less than a predetermined value and determines that the connection state between the first wiring board 100 and the second wiring board 110 is good. When no current flows between the measurement pads P21 and P22, the inspection device determines that the amount of positional deviation exceeds a predetermined value and determines that the connection state between the first wiring board 100 and the second wiring board 110 is defective.

In embodiment 1 described above, the case where the width W11 of the first portion T11 of the conductive portion T1 is the length of 1/2 of the width W21 of the first check electrode T21 is explained. The case where the width W12 of the second portion T12 of the conductive portion T1 is the length of 1/2 of the width W22 of the second check electrode T22 is described. However, the present embodiment is not limited to this. In the present embodiment, the width W11 of the first portion T11 and the width W12 of the second portion T12 may be arbitrarily set based on the amount of positional deviation to be detected.

Fig. 14 is a plan view showing an inspection pattern according to modification 2 of embodiment 1. Fig. 15 is a cross-sectional view taken along line XV-XV' and taken from the top view shown in fig. 14. As shown in fig. 14 and 15, in the inspection pattern TPb of modification 2 of embodiment 1, when the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100 is zero or substantially zero, the first portion T11 of the conductive portion T1 is located further to the outside than the inspection electrode T2. For example, the edge of the first portion T11 and the second edge 212 of the first inspection electrode T21 overlap or substantially overlap in a plan view.

Similarly, in the inspection pattern TPb, when the above-described positional displacement amount is zero or substantially zero, the second site T12 of the conductive portion T1 is positioned further to the outside of the inspection electrode T2. For example, the edge of the second portion T12 and the second edge 222 of the second inspection electrode T22 overlap or substantially overlap in a plan view.

As shown in fig. 14, in the inspection pattern TPb, the width W11 of the first site T11 of the conductive portion T1 is also the same length as the width W12 of the second site T12. In addition, the width W21 of the first check electrode T21 is also the same length as the width W22 of the second check electrode T22. In fig. 14, W11 is the length of 2/3 of W21. W12 is the length of 2/3 of W22. In addition, as shown in fig. 15, the inter-center distance L1 between the first site T11 and the second site T12 and the inter-center distance L2 between the first check electrode T21 and the second check electrode T22 are different lengths from each other. In the inspection pattern TPb, L1 is longer than L2.

Fig. 16 is a plan view showing a case where the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 in the inspection pattern of modification 2 of embodiment 1. Fig. 17 is a plan view showing a case where the conductive portion T1 is displaced leftward from the inspection electrode T2 in the inspection pattern according to modification 2 of embodiment 1.

As shown in fig. 16, when the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 and the amount of displacement exceeds a predetermined value, a space S is created between the second portion T12 and the second inspection electrode T22 in a plan view. In this case, since the second site T12 and the second check electrode T22 are not connected to each other, no current flows between the measurement pads P21 and P22. As shown in fig. 17, when the conductive portion T1 is displaced leftward with respect to the inspection electrode T2 and the amount of displacement exceeds a predetermined value, a space S is formed between the first portion T11 and the first inspection electrode T21 in a plan view. In this case, since the first site T11 and the first check electrode T21 are not connected to each other, no current flows between the measurement pads P21 and P22.

In modification 2 of embodiment 1, the predetermined value of the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100 is the same length as the width W11 of the first portion T11 (or the width W12 of the second portion T12), that is, the length 2/3 of the width W21 of the first check electrode T21 (or the width W22 of the second check electrode T22).

In this way, the width W11 of the first portion T11 is narrower than the width W21 of the first check electrode T21, and the width W12 of the second portion T12 is narrower than the width W22 of the second check electrode T22, according to the amount of positional displacement to be detected. For example, in the case where the predetermined value is 2/3 of the width W21 of the first check electrode T21, the width W11 of the first site T11 is a length of 2/3 of the width W21 of the first check electrode T21, and the width W12 of the second site T12 is a length of 2/3 of the width W22 of the second check electrode T22.

In the above-described embodiment, the case where the width W11 of the first portion T11 of the conductive portion T1 is smaller than the width W21 of the first check electrode T21, and the width W12 of the second portion T12 of the conductive portion T1 is smaller than the width W22 of the second check electrode T22 has been described. However, the present embodiment is not limited to this.

Fig. 18 is a cross-sectional view showing an inspection pattern TPc according to modification 3 of embodiment 1. As shown in fig. 18, in the inspection pattern TPc of modification 3 of embodiment 1, the width W11 of the first portion T11 of the conductive portion T1 is the same length as the width W21 of the first inspection electrode T21. The width W12 of the second portion T12 of the conductive portion T1 is the same length as the width W22 of the second check electrode T22. In addition, the distance L1 between the centers of the first and second portions T11 and T12 and the distance L2 between the centers of the first and second check electrodes T21 and T22 are different lengths from each other. For example, L1 is longer than L2. Even with such a configuration, the inspection apparatus can accurately inspect the connection state between the first wiring board 100 and the second wiring board 110 based on the conduction or non-conduction between the measurement pads P21 and P22.

In the above embodiment, the case where the width W11 of the first portion T11 of the conductive portion T1 is the same length as the width W12 of the second portion T12 has been described. However, in the present embodiment, the width W11 of the first portion T11 and the width W12 of the second portion T12 may be different lengths from each other. The inspection pattern of the present embodiment may be composed of a plurality of inspection patterns.

Fig. 19 is a plan view showing an example of the structure of the inspection pattern according to modification 4 of embodiment 1. In addition, FIG. 20 is a sectional view taken along line XX-XX' and taken along the top view shown in FIG. 19. As shown in fig. 19 and 20, the inspection pattern TPd of modification 4 of embodiment 1 includes a first inspection pattern TPd1 and a second inspection pattern TPd 2.

In the first inspection pattern TPd1, the width W11 of the first portion T11 of the conductive portion T1 is smaller than the width W21 of the first inspection electrode T21. For example, the width W11 of the first site T11 is 1/2 of the width W21 of the first check electrode T21. The width W12 of the second portion T12 of the conductive portion T1 is the same length as the width W22 of the second check electrode T22. In addition, the distance L1 between the centers of the first and second portions T11 and T12 and the distance L2 between the centers of the first and second check electrodes T21 and T22 are different lengths from each other. For example, L1 is longer than L2. The first site T11 is located outside the first check electrode T21.

In the second inspection pattern TPd2, the width W11 of the first portion T11 of the conductive portion T1 is the same length as the width W21 of the first inspection electrode T21. In addition, the width W12 of the second portion T12 of the conductive portion T1 is smaller than the width W22 of the second check electrode T22. For example, the width W12 of the second portion T12 is 1/2 of the width W22 of the second check electrode T22. In addition, the distance L1 between the centers of the first and second portions T11 and T12 and the distance L2 between the centers of the first and second check electrodes T21 and T22 are different lengths from each other. For example, L1 is longer than L2. The second site T12 is located outside the second check electrode T22.

In fig. 20, it is assumed that the first wiring board 100 is shifted in position to the left with respect to the second wiring board 110. In the first inspection pattern TPd1, when the amount of positional deviation to the left exceeds the length of the width W11 of the first site T11, a space S is generated between the first site T11 and the first inspection electrode T21 in a plan view (see fig. 17). In the first test pattern TPd1, since the first site T11 and the first test electrode T21 are not connected to each other, no current flows between the measurement pads P21 and P22 (see fig. 17). The inspection device determines that the first inspection pattern TPd1 is in a non-conductive state. On the other hand, in the second inspection pattern TPd2, the second site T12 is located outside the second inspection electrode T22. Therefore, the second site T12 is connected to the second check electrode T22. The inspection device determines that the second inspection pattern TPd2 is in the on state.

Next, in fig. 20, it is assumed that the first wiring board 100 is shifted in position to the right with respect to the second wiring board 110. In the second inspection pattern TPd2, when the amount of positional deviation to the right side exceeds the length of the width W12 of the second site T12, a space S is generated between the second site T12 and the second inspection electrode T22 in a plan view (see fig. 16). In the second test pattern TPd2, since the second site T12 and the second test electrode T22 are not connected to each other, no current flows between the measurement pads P21 and P22 (see fig. 16). The inspection device determines that the second inspection pattern TPd2 is in a non-conductive state. On the other hand, in the first inspection pattern TPd1, the first site T11 is located outside the first inspection electrode T21. Therefore, the first site T11 is connected to the first check electrode T21. The inspection device determines that the first inspection pattern TPd1 is in the on state.

When the first inspection pattern TPd1 is determined to be in the non-conductive state and the second inspection pattern TPd2 is determined to be in the conductive state, the inspection apparatus determines that the direction of the positional deviation of the first wiring substrate 100 with respect to the second wiring substrate 110 is the left side. In addition, when the first inspection pattern TPd1 is determined to be in the conductive state and the second inspection pattern TPd2 is determined to be in the non-conductive state, the inspection apparatus determines that the direction of the positional deviation of the first wiring substrate 100 with respect to the second wiring substrate 110 is the right side.

Comparative example

Fig. 21 is a cross-sectional view showing a configuration example of an inspection pattern of a comparative example. As shown in fig. 21, in the inspection pattern TP ' of the comparative example, the width W11 ' of the first site T11 ' and the width W21 ' of the first inspection electrode T21 ' are the same length as each other. In addition, the width W12 'of the second site T12' and the width W22 'of the second check electrode T22' are the same length as each other. In addition, the distance L1 'between the centers of the first and second sites T11' and T12 'and the distance L2' between the centers of the first and second check electrodes T21 'and T22' are the same length as each other. In the test pattern TP ' of the comparative example, a positional deviation of a length shorter than the width W21 ' of the first test electrode T21 ' and a positional deviation of a length shorter than the width W22 ' of the second test electrode T22 ' could not be detected.

(embodiment mode 2)

In embodiment 1 and its modified examples described above, the conduction between the measurement pads P21 and P22 is described when the amount of relative positional deviation of the second wiring board 110 with respect to the first wiring board 100 is equal to or less than a predetermined value. In addition, the description has been given of the non-conduction between the measurement pads P21 and P22 when the amount of positional deviation described above exceeds a predetermined value. However, the present embodiment is not limited to this. In the present embodiment, when the amount of positional deviation is equal to or less than a predetermined value, no current may flow between the measurement pads, and when the amount of positional deviation exceeds a predetermined value, a current may flow between the measurement pads.

Fig. 22 is a plan view showing an example of the structure of the inspection pattern according to embodiment 2. As shown in fig. 22, inspection pattern TPe of embodiment 2 includes conductive portion T1 provided on first wiring substrate 100 (see fig. 4) and inspection electrode T2 provided on second wiring substrate 110 (see fig. 4). In addition, the check electrode T2 has a first check electrode T21, a second check electrode T22, and a dummy electrode T25.

In the inspection pattern TPe, the conductive portion T1 is a conductive film extending in the Y-axis direction. When the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100 is equal to or less than the predetermined value, at least a part of the conductive portion T1 is arranged at a position facing the dummy electrode T25 in the Z-axis direction. One end of the conductive portion T1 serves as a measurement pad P1.

In the inspection pattern TPe, the first inspection electrode T21, the second inspection electrode T22, and the dummy electrode T25 are conductive films extending in the Y-axis direction, respectively. The first check electrode T21, the second check electrode T22, and the dummy electrode T25 are arranged in the X-axis direction. A dummy electrode T25 is disposed between the first check electrode T21 and the second check electrode T22 in the X-axis direction. The first check electrode T21, the second check electrode T22, and the dummy electrode T25 are disposed separately from each other.

As shown in fig. 22, the width (length in the X-axis direction) of the conductive portion T1 is W1. The width of the dummy electrode T25 was set to W25. A width of the first space region S1 between the first check electrode T21 and the dummy electrode T25 is set to WS 1. A width of the second space region S2 between the second check electrode T22 and the dummy electrode T25 is set to WS 2. For example, the width W1 of the conductive portion T1 and the width of the dummy electrode T25 are the same length as each other. In addition, the width WS1 of the first space region S1 and the width WS2 of the second space region S2 are the same length as each other. In addition, the width W1 of the conductive portion T1 is larger than the width WS1 of the first space region S1 and larger than the width WS2 of the second space region S2. In addition, the width W1 of the conductive portion T1 is smaller than the width W21 of the first check electrode T21 and smaller than the width W22 of the second check electrode T22. Further, the width W1 of the conductive portion T1 is smaller than the separation distance D2 between the first check electrode T21 and the second check electrode T22.

For example, the first check electrode T21 has a widened portion T211 that is widened toward the dummy electrode T25. The width of the first check electrode T21 is wider than the width of the dummy electrode T25 by an amount corresponding to the width W211 of the widened portion T211. Similarly, the second check electrode T22 has a widened portion T221 that is widened toward the dummy electrode T25. The width of the second check electrode T22 is wider than the width of the dummy electrode T25 by an amount corresponding to the width W221 of the widened portion T221. In the check pattern TPe, the sum of the width W211 of the widened portion T211 and the width WS1 of the first space region S1 is the width W1 of the conductive portion T1. Similarly, the sum of the width W221 of the widened portion T221 and the width WS2 of the second space region S2 is the width W1 of the conductive portion T1.

When the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100 is zero or substantially zero, the conductive portion T1 and the dummy electrode T25 face each other in the Z-axis direction. In this case, the conductive portion T1 is not connected to either one of the first check electrode T21 and the second check electrode T22. Therefore, no current flows between the measurement pads P1 and P21 and between the measurement pads P1 and P22.

Fig. 23 is a plan view showing a case where the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 in the inspection pattern of embodiment 2. As shown in fig. 23, in the case where the conductive portion T1 is positionally offset to the right with respect to the check electrode T2, and the amount of positional offset exceeds the width WS2 of the second space region S2, a part of the conductive portion T1 is opposed to the second check electrode T22 in the Z-axis direction. When the first wiring substrate 100 and the second wiring substrate 110 are bonded in this state, the conductive portion T1 and the second check electrode T22 are connected via the conductive particles 81 (see fig. 6) contained in the ACF 8. Therefore, in the inspection step, a current flows between the measurement pads P1 and P22.

When a current flows between the measurement pads P1 and P22, the inspection device, not shown, determines that the amount of positional deviation exceeds a predetermined value, and determines that the board unit 300 (see fig. 4) is a defective product. On the other hand, when no current flows between the measurement pads P1 and P22, the inspection apparatus determines that the amount of positional deviation is equal to or less than the predetermined value, and determines that the board unit 300 is good.

Although not shown, when the conductive portion T1 is displaced leftward with respect to the inspection electrode T2, the inspection apparatus can determine whether the amount of displacement is equal to or less than a predetermined value by the same method as described above. For example, in a case where the conductive portion T1 is positionally offset leftward with respect to the check electrode T2, and the amount of positional offset exceeds the width WS1 of the first space region S1, a part of the conductive portion T1 is opposed to the first check electrode T21 in the Z-axis direction. In this case, the conductive portion T1 and the first check electrode T21 are connected via the conductive particles 81 (see fig. 6) contained in the ACF 8. Therefore, in the inspection step, a current flows between the measurement pads P1 and P21.

When a current flows between the measurement pads P1 and P21, an inspection device (not shown) determines that the amount of positional deviation exceeds a predetermined value and determines that the connection state between the first wiring board 100 (see fig. 4) and the second wiring board 110 (see fig. 4) is defective. On the other hand, when a current flows between the measurement pads P1 and P22, the inspection device determines that the amount of positional deviation is equal to or less than a predetermined value, and determines that the connection state between the first wiring board 100 and the second wiring board 110 is good.

As described above, the substrate unit 300 of embodiment 2 includes: a first wiring substrate 1 having a first FOF terminal 12; a second wiring substrate 110 having a second FOF terminal 112 connected to the first FOF terminal 12; and an inspection pattern TPe for inspecting a relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100. The inspection pattern TPe has: a conductive portion T1 provided on the first wiring substrate 100; a first check electrode T21 provided on the second wiring substrate 110; a second check electrode T22 provided on the second wiring substrate 110 and disposed apart from the first check electrode T21 in the first direction; a first pad (for example, a pad P21 for measurement) connected to the first check electrode T21; a second pad (for example, a pad P22 for measurement) connected to the second inspection electrode T22; and a third pad (for example, a measurement pad P1) connected to the conductive portion T1. The conductive portion T1, the first check electrode T21, the second check electrode T22, and the measurement pads P21, P22, and P1 function as check patterns TPe. The spacing distance D2 between the first check electrode T21 and the second check electrode T22 in the X-axis direction is larger than the width W1 of the conductive portion T1.

Accordingly, when the amount of positional deviation is equal to or less than the predetermined value, the conductive portion T1 is disposed at a position not facing both the first check electrode T1 and the second check electrode T2. When the amount of positional deviation exceeds a predetermined value, the conductive portion T1 is disposed at a position facing one of the first check electrode T1 and the second check electrode T2. Thus, when the amount of positional deviation is equal to or less than a predetermined value (for example, the width WS1 of the first space region S1), the conductive portion T1 is not conductive to the first check electrode T21 and the second check electrode T22; when the amount of positional deviation exceeds a predetermined value, the conductive portion T1 can be electrically connected to the first check electrode T21 (or the second check electrode T22). The inspection apparatus can determine whether or not the relative positional displacement of the second wiring substrate 110 with respect to the first wiring substrate 100 is good based on the presence or absence of a current between the measurement pad P1 connected to the conductive portion T1 and the measurement pad P21 connected to the first inspection electrode T21. Alternatively, the inspection apparatus can determine whether or not the inspection is satisfactory based on the presence or absence of a current between the measurement pad P1 and the measurement pad P22 connected to the second inspection electrode T22. As in embodiment 1, the threshold value for determining whether or not the positional deviation is good is not a resistance value, but is the presence or absence of a current. Thus, the inspection apparatus can inspect the connection state between the first wiring substrate 100 and the second wiring substrate 110 with high accuracy.

The inspection pattern TPe has a dummy electrode T25, and the dummy electrode T25 is disposed between the first inspection electrode T21 and the second inspection electrode T22. In the X-axis direction, the spaced distance of the first check electrode T21 from the dummy electrode T25 (i.e., the width WS1 of the first space region S1) and the spaced distance of the second check electrode T22 from the dummy electrode T25 (i.e., the width WS2 of the second space region S2) are the same length. Accordingly, the spacing distance WS1 between the first check electrode T21 and the dummy electrode T25 and the spacing distance WS2 between the second check electrode T22 and the dummy electrode T25 can be made close to the spacing distance between the second FOF terminals 112 (refer to fig. 4) adjacent to each other. Thus, in the process of manufacturing the second wiring substrate 110, it is possible to prevent the widths W21 and W22 from being unexpectedly formed to be excessively thin due to excessive etching of the first and second check electrodes T21 and T22, respectively, caused by the separation distance.

(embodiment mode 3)

The inspection pattern of the present embodiment may be composed of a plurality of inspection patterns. Fig. 24 is a plan view showing an example of the structure of the inspection pattern according to embodiment 3. As shown in fig. 24, the check pattern TPf of embodiment 3 has a first check pattern TPf1 and a second check pattern TPf 2. In the first check pattern TPf1, the conductive portion T1 includes a first portion T11, a second portion T12, and a connecting portion T10. The width W11 of the first portion T1 and the width W12 of the second portion T12 are the same length as each other.

In addition, in the first check pattern TPf1, the width W11 of the first site T1 is the same length as the width W25 of the dummy electrode T25. In addition, the width W11 of the first portion T11 is greater than the width WS1 of the first space region S1. The width W12 of the second portion T12 is greater than the width WS2 of the second space region S2.

As shown in fig. 24, the second check pattern TPf2 also has the same structure as the first check pattern TPf 1. However, the positional relationships of the conductive portion T1 and the check electrode T2 are different from each other in the first check pattern TPf1 and the second check pattern TPf 2. For example, when the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100 is zero or substantially zero, in the first inspection pattern TPf1, the first portion T11 of the conductive portion T1 and the dummy electrode T25 oppose each other in the Z-axis direction, and the second portion T12 of the conductive portion T1 and the second inspection electrode T22 oppose each other in the Z-axis direction. On the other hand, when the above-described amount of positional deviation is zero or substantially zero, in the second inspection pattern TPf2, the first portion T11 of the conductive portion T1 faces the first inspection electrode T21 in the Z-axis direction, and the second portion T12 of the conductive portion T1 faces the dummy electrode T25 in the Z-axis direction.

When the amount of relative positional displacement of the second wiring substrate 110 with respect to the first wiring substrate 100 is zero or substantially zero, no current flows between the measurement pads P21 and P22 in either the first check pattern TPf1 or the second check pattern TPf 2. In this case, the inspection apparatus, not shown, determines that the relative positional deviation amount of the second wiring substrate 110 with respect to the first wiring substrate 100 is equal to or less than a predetermined value, and determines that the connection state between the first wiring substrate 100 and the second wiring substrate 110 is good.

Fig. 25 is a plan view showing a case where the conductive portion T1 is displaced leftward from the inspection electrode T2 in the inspection pattern of embodiment 3. As shown in fig. 25, in the first check pattern TPf1, in the case where the amount of positional displacement to the left side exceeds the length of the width WS1 of the first space region S1, a part of the first site T11 is opposed to the first check electrode T21 in the Z-axis direction, and a part of the second site T12 is opposed to the second check electrode T22 in the Z-axis direction. In this state, when the first wiring substrate 100 and the second wiring substrate 110 are bonded, the first portion T11 and the first check electrode T21 are connected via the conductive particles 81 (see fig. 6) contained in the ACF8, and the second portion T12 and the second check electrode T22 are connected via the conductive particles 81. Thus, in the inspection step, a current flows between the measurement pads P21 and P22.

On the other hand, in the second check pattern TPf2, the conductive portion T1 and the second check electrode T22 do not oppose each other in the Z-axis direction. Therefore, in the inspection step, no current flows between the measurement pads P21 and P22.

When a current flows between the measurement pads P21 and P21 of the first inspection pattern TPf1, an inspection apparatus, not shown, determines that the amount of positional deviation exceeds a predetermined value and determines that the connection state between the first wiring board 100 and the second wiring board 110 is defective. When a current flows between the measurement pads P21 and P22 of the first inspection pattern TPf1 and a current does not flow between the measurement pads P21 and P22 of the second inspection pattern TPf2, the inspection apparatus determines that the direction of the relative positional displacement of the conductive portion T1 with respect to the inspection electrode T2 is the left side.

Fig. 26 is a plan view showing a case where the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 in the inspection pattern of embodiment 3. As shown in fig. 26, in the case where the position shift amount to the right side in the second check pattern TPf2 exceeds the length of the width WS2 of the second space region S2, a part of the second site T12 is opposed to the second check electrode T22 in the Z-axis direction, and a part of the first site T11 is opposed to the first check electrode T21 in the Z-axis direction. In this state, when the first wiring substrate 100 and the second wiring substrate 110 are bonded, the second portion T12 and the second check electrode T22 are connected via the conductive particles 81 (see fig. 6) contained in the ACF8, and the first portion T11 and the first check electrode T21 are connected via the conductive particles 81. Therefore, in the inspection step, a current flows between the measurement pads P21 and P22.

On the other hand, in the first check pattern TPf1, the conductive portion T1 and the first check electrode T21 do not oppose in the Z-axis direction. Therefore, in the inspection step, a current flows between the measurement pads P21 and P22.

When a current flows between the measurement pads P21 and P21 of the second inspection pattern TPf2, an inspection apparatus, not shown, determines that the amount of positional deviation exceeds a predetermined value and determines that the connection state between the first wiring board 100 and the second wiring board 110 is defective. When a current flows between the measurement pads P21 and P22 of the second inspection pattern TPf2 and a current does not flow between the measurement pads P21 and P22 of the first inspection pattern TPf1, the inspection apparatus determines that the direction of the relative positional displacement of the conductive portion T1 with respect to the inspection electrode T2 is the right side.

As described above, the substrate unit 300 according to embodiment 3 includes the inspection pattern TPf, and the inspection pattern TPf is used to inspect the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100. The check pattern TPf has a first check pattern TPf1 and a second check pattern TPf 2. The first check pattern TPf1 has: a conductive portion T1 provided on the first wiring substrate 100; a first check electrode T21 provided on the second wiring substrate 110; and a second inspection electrode T22 provided on the second wiring substrate 110 and disposed apart from the first inspection electrode TP21 in the X-axis direction. The second check pattern TPf2 also has a conductive portion T1, a first check electrode T21, and a second check electrode T22. The conductive portion T1, the first check electrode T21, and the second check electrode T22 function as a check pattern TPf. The conductive portion T1 includes: a first site T11 for opposing connection with the first check electrode T21; a second portion T12 disposed apart from the first portion T11 in the X-axis direction; and a connection portion T10 connecting the first portion T11 and the second portion T12. The first and second check electrodes T21 and T22 are spaced apart by a distance D2 in the X-axis direction greater than the width W12 of the second portion T12.

Accordingly, when the amount of positional deviation is equal to or less than the predetermined value, the conductive portion T1 is disposed at a position that does not face the first check electrode T21 and does not face the second check electrode T22. When the amount of positional deviation exceeds a predetermined value, the conductive portion T1 is disposed at a position facing both the first check electrode T21 and the second check electrode T22. Thus, when the amount of positional deviation is equal to or less than the predetermined value, the conductive portion T1 can make the first check electrode T21 and the second check electrode T22 in a non-conductive state, and when the amount of positional deviation exceeds the predetermined value, the conductive portion T1 can make the first check electrode T21 and the second check electrode T22 in a conductive state. The inspection apparatus can determine whether or not the relative positional displacement of the second wiring substrate 110 with respect to the first wiring substrate 100 is good based on the presence or absence of a current between the measurement pad P21 connected to the first inspection electrode T21 and the measurement pad P22 connected to the second inspection electrode T22. As in embodiment 1, the threshold value for determining whether or not the positional deviation is good is not a resistance value, but is the presence or absence of a current. Thus, the inspection apparatus can inspect the connection state between the first wiring substrate 100 and the second wiring substrate 110 with high accuracy.

Further, the conductive portion T1 includes: a first site T11 disposed at a position facing the first inspection electrode T21; a second portion T12 arranged at a position not facing the second check electrode T22 when the amount of positional deviation is equal to or less than a predetermined value; the connection portion T10 connects the first portion T11 and the second portion T12. Accordingly, when the amount of positional deviation is equal to or less than the predetermined value, the conductive portion T1 can make the first check electrode T21 and the second check electrode T22 in a non-conductive state.

(modification example)

Fig. 27 is a plan view showing an example of the structure of an inspection pattern according to a modification of embodiment 3. As shown in fig. 27, in an inspection pattern TPg according to a modification of embodiment 3, a conductive portion T1 includes: a first portion T11, a second portion T12, a third portion T13, and a connecting portion T10. The third portion T13 is a conductive film extending in the Y-axis direction. The connection portion T10 connects the first portion T11, the second portion T12, and the third portion T13. The width W11 of the first portion T1, the width W12 of the second portion T12, and the width W13 of the third portion T3 of the conductive portion 10 are the same length.

In the inspection pattern TPg, the inspection electrode T2 has a first inspection electrode T21, a second inspection electrode T22, a dummy electrode T25, a third inspection electrode T23, and a fourth inspection electrode T24. The first check electrode T21, the second check electrode T22, the dummy electrode T25, the third check electrode T23, and the fourth check electrode T24 are conductive films extending in the Y-axis direction, respectively. The first check electrode T21, the second check electrode T22, the dummy electrode T25, the third check electrode T23, and the fourth check electrode T24 are arranged in this order in the X-axis direction.

The end of the first test electrode T21 serves as a measurement pad P21. The end of the second test electrode T22 serves as a measurement pad P22. The end of the third test electrode T23 serves as a measurement pad P23. The end of the fourth test electrode T24 serves as a measurement pad P24.

In the inspection pattern TPg, the width W11 of the first site T1 is the same as the width W21 of the first inspection electrode, the width W25 of the dummy electrode T25, and the width W24 of the fourth inspection electrode T24, respectively. In addition, the width W22 of the second check electrode T22 and the width W23 of the third check electrode T23 are the same length as each other. The width W22 of the second check electrode is greater than the width W21 of the first check electrode.

For example, the second check electrode T22 has a widened portion T221 that is widened toward the dummy electrode T25. The width of the second check electrode T22 is wider than the width of the first check electrode T21 by an amount corresponding to the width W221 of the widened portion T221. Similarly, the third check electrode T23 has a widened portion T231 that is widened toward the dummy electrode T25. The width of the third check electrode T23 is wider than the width of the fourth check electrode T24 by an amount corresponding to the width W231 of the widened portion T231.

In addition, a first space region S1 is provided between the first and second check electrodes T21 and T22. A second space region S2 is disposed between the second check electrode T22 and the dummy electrode T25. A third space region S3 is provided between the dummy electrode T25 and the third check electrode T23. A fourth space region S4 is provided between the third check electrode T23 and the fourth check electrode T24. The width WS1 of the first space region S1 and the width WS4 of the fourth space region S4 are the same length as each other. In addition, the width WS2 of the second space region S2 and the width WS3 of the third space region S3 are the same length as each other. The width WS2 of the second spatial region S2 is smaller than the width WS1 of the first spatial region S1. In addition, the width WS2 of the second space region S2 is smaller than the width W12 of the second portion T12.

In the check pattern TPg, the sum of the width W221 of the widened portion T221 and the width WS2 of the second space region S2 is the width W12 of the second portion T12. Similarly, the sum of the width W231 of the widened portion T231 and the width WS3 of the third space region S3 is the width W12 of the second portion T12.

When the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100 is zero or substantially zero, the first portion T11 of the conductive portion T1 and the first check electrode T21 face each other in the Z-axis direction in a plan view. In the above case, the second portion T12 of the conductive portion T1 faces the dummy electrode T25 in the Z-axis direction. In the above case, the third site T13 of the conductive portion T1 faces the fourth test electrode T24 in the Z-axis direction. In this case, the measurement pads P21 and P22 and the measurement pads P23 and P24 are in a non-conductive state, and no current flows. The inspection apparatus determines that the relative positional displacement amount of the second wiring substrate 110 with respect to the first wiring substrate 100 is equal to or less than a predetermined value based on the result of the non-conduction, and determines that the connection state between the first wiring substrate 100 and the second wiring substrate 110 is good.

Fig. 28 is a plan view showing a case where the conductive portion T1 is displaced leftward from the inspection electrode T2 in the inspection pattern according to the modification of embodiment 3. As shown in fig. 28, when the conductive portion T1 is positionally offset leftward with respect to the check electrode T2, and the amount of positional offset exceeds the width WS2 of the second space region S2, a part of the second site T12 of the conductive portion T1 is opposed to the second check electrode T22 in the Z-axis direction. In this state, when the first wiring substrate 100 and the second wiring substrate 110 are bonded, the second site T12 and the second check electrode T22 are connected via the conductive particles 81 (see fig. 6) contained in the ACF 8. Therefore, in the inspection step, a current flows between the measurement pads P21 and P22.

On the other hand, the width WS4 of the fourth spatial region S4 is the same length as the width W13 of the third portion 13 of the conductive portion T1. Thus, the third site 13 does not connect the third inspection electrode 23 and the fourth inspection electrode 24. Therefore, even when the conductive portion T1 is displaced leftward with respect to the inspection electrode T2, no current flows between the measurement pads P23 and P24 in the inspection step.

When a current flows between the measurement pads P21 and P22, an inspection device, not shown, determines that the amount of positional deviation exceeds a predetermined value and determines that the connection state between the first wiring board 100 and the second wiring board 110 is defective. In the inspection pattern TPg, when a current flows between the measurement pads P21 and P22 and a current does not flow between the measurement pads P23 and P24, the inspection apparatus determines that the direction of the relative positional displacement of the conductive portion T1 with respect to the inspection electrode T2 is the left side.

Fig. 29 is a plan view showing a case where the conductive portion T1 is displaced to the right with respect to the inspection electrode T2 in the inspection pattern according to the modification of embodiment 3. As shown in fig. 29, when the conductive portion T1 is positionally offset to the right with respect to the check electrode T2 and the amount of this positional offset exceeds the width WS3 of the third spatial region S3, a part of the second portion T12 of the conductive portion T1 and the third check electrode T23 face each other in the Z-axis direction. In this state, when the first wiring substrate 100 and the second wiring substrate 110 are bonded, the second portion T12 and the third check electrode T23 are connected via the conductive particles 81 (see fig. 6) contained in the ACF 8. Therefore, in the inspection step, a current flows between the measurement pads P23 and P24.

On the other hand, the width WS1 of the first space region S1 is the same length as the width W11 of the first portion 11 of the conductive portion T1. Thus, the first site 11 does not connect the first and second inspection electrodes T21 and T22. Therefore, even when the conductive portion T1 is displaced to the right with respect to the inspection electrode T2, no current flows between the measurement pads P21 and P22 in the inspection step.

When a current flows between the measurement pads P23 and P24, an inspection device, not shown, determines that the amount of positional deviation exceeds a predetermined value and determines that the connection state between the first wiring board 100 and the second wiring board 110 is defective. In the inspection pattern TPg, when a current flows between the measurement pads P23 and P24 and a current does not flow between the measurement pads P21 and P22, the inspection apparatus determines that the direction of relative positional displacement of the conductive portion T1 with respect to the inspection electrode T2 is the right side.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to such embodiments. For example, the inspection patterns TP, TPa, TPb, TPc, TPd, TPe, TPf, TPg are not limited to the case of bonding the first wiring substrate 100 and the second wiring substrate 110 in the FOF region R12. The above-described inspection patterns TP, TPa, TPb, TPc, TPd, TPe, TPf, TPg may also be used to bond the TFT substrate 60 and the first wiring substrate 100 in the FOG region R11, and may also be used to bond the third wiring substrate 140 and the second wiring substrate 110 in the FOF region R13. The disclosure of the embodiments is merely an example, and various modifications can be made without departing from the scope of the present invention. It is needless to say that appropriate modifications can be made without departing from the scope of the present invention and the technical scope of the present invention is included.

Claims (12)

1. A substrate unit is characterized by comprising:

a first resin substrate;

a second resin substrate connected to the first resin substrate;

a conductive portion provided on the first resin substrate;

a first electrode provided on the second resin substrate; and

a second electrode provided on the second resin substrate and spaced apart from the first electrode in a first direction,

the conductive part has:

a first portion for opposing and connecting to the first electrode;

a second portion which is disposed apart from the first portion in the first direction and is opposed to and connected to the second electrode; and

a connecting portion connecting the first portion and the second portion,

in the first direction, an inter-center distance between the first portion and the second portion, and an inter-center distance between the first electrode and the second electrode are different from each other.

2. The substrate unit of claim 1,

the substrate unit has an inspection pattern for inspecting a positional displacement amount of the second resin substrate with respect to the first resin substrate,

the conductive portion, the first electrode, and the second electrode function as the inspection pattern.

3. The substrate unit of claim 2,

the first portion and the first electrode are respectively extended in a second direction intersecting the first direction in a plan view,

the width of the first portion is smaller than the width of the first electrode in the first direction.

4. The substrate unit of claim 3,

the second portion and the second electrode are respectively extended in a second direction,

the width of the second portion is smaller than the width of the second electrode in the first direction.

5. The substrate unit according to claim 4, further comprising:

a first pad connected to the first electrode; and

a second pad connected to the second electrode.

6. The substrate unit of claim 5,

further comprising an adhesive layer disposed between the first resin substrate and the second resin substrate,

the adhesive layer has:

a binder; and

conductive particles dispersed in the binder.

7. A substrate unit is characterized by comprising:

a first resin substrate;

a second resin substrate connected to the first resin substrate;

a conductive portion provided on the first resin substrate;

a first electrode provided on the second resin substrate;

a second electrode provided on the second resin substrate and spaced apart from the first electrode in a first direction;

a first pad connected to the first electrode;

a second pad connected to the second electrode; and

a third pad connected to the conductive portion,

in the first direction, the first electrode is spaced apart from the second electrode by a distance greater than a width of the conductive portion.

8. The substrate unit of claim 7,

the substrate unit has an inspection pattern for inspecting a positional displacement amount of the second resin substrate with respect to the first resin substrate,

the conductive portion, the first electrode, the second electrode, the first pad, the second pad, and the third pad function as the inspection pattern.

9. A substrate unit is characterized by comprising:

a first resin substrate;

a second resin substrate connected to the first resin substrate;

a conductive portion provided on the first resin substrate;

a first electrode provided on the second resin substrate; and

a second electrode provided on the second resin substrate and spaced apart from the first electrode in a first direction,

the conductive part has:

a first portion for opposing and connecting to the first electrode;

a second portion disposed apart from the first portion in the first direction; and

a connecting portion connecting the first portion and the second portion,

in the first direction, the first electrode is spaced apart from the second electrode by a distance greater than a width of the second portion.

10. The substrate unit of claim 9,

the substrate unit has an inspection pattern for inspecting a positional displacement amount of the second resin substrate with respect to the first resin substrate,

the conductive portion, the first electrode, and the second electrode function as the inspection pattern.

11. The substrate unit according to claim 8 or 10,

the inspection pattern has a dummy electrode disposed between the first electrode and the second electrode,

in the first direction, a spacing distance between the first electrode and the dummy electrode is the same length as a spacing distance between the second electrode and the dummy electrode.

12. A display device is characterized by comprising:

a substrate unit according to any one of claims 1 to 11; and

a display panel on which the substrate unit is mounted.

Images