CN210429759U - Adjustable packaging machine for semiconductor - Google Patents
Adjustable packaging machine for semiconductor Download PDFInfo
- Publication number
- CN210429759U CN210429759U CN201921799576.3U CN201921799576U CN210429759U CN 210429759 U CN210429759 U CN 210429759U CN 201921799576 U CN201921799576 U CN 201921799576U CN 210429759 U CN210429759 U CN 210429759U
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- packaging machine
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Abstract
The utility model discloses an adjustable packaging machine for semiconductor relates to semiconductor manufacturing technical field. The utility model discloses a controller main part, the top fixed mounting of controller main part has operation platform, and operation platform's last fixed surface installs the bottom plate, and operation platform's the equal fixed mounting in both sides has high adjustment mechanism, and high adjustment mechanism's middle part swing joint has the semiconductor fixed plate, and one side fixed mounting of operation platform upper surface has the riser, and one side bolted connection of riser has automatic clamp plate mechanism, and the lower part fixed mounting of automatic clamp plate mechanism has the apron. The utility model discloses a series of structural transformation make the device can conveniently adjust the high position of semiconductor, and then effectively adjust the leakproofness of upper cover and lower cover encapsulation, improved semiconductor package's qualification rate, and the device can encapsulate a plurality of semiconductors simultaneously, has improved machining efficiency.
Description
Technical Field
The utility model relates to a semiconductor manufacturing technical field, more specifically say, relate to an adjustable packaging machine for semiconductor.
Background
Semiconductor package is the process that will obtain independent chip according to product model and functional requirement processing through the wafer of test, CPU and other very large scale integrated circuit are constantly developing, and corresponding adjustment change is also constantly made to integrated circuit's packaging form, and packaging form's progress will promote the chip technique to develop forward in reverse again, and current device can not conveniently adjust the high position of semiconductor, and semiconductor package's qualification rate is lower, and the device can not encapsulate a plurality of semiconductors simultaneously, and machining efficiency is lower, the utility model discloses a new solution is proposed to above problem.
SUMMERY OF THE UTILITY MODEL
The invention aims to provide an adjustable semiconductor packaging machine, which aims to solve the technical problems in the background art, namely a variable-power water jet cutter for removing rust, wherein the length of the connection of a reed is controlled by moving a copper ring, so that the resistance value is controlled, and the aim of adjusting power is finally fulfilled, so that the problems in the background art are solved.
Aiming at the problems in the prior art, the utility model aims to provide an adjustable semiconductor packaging machine, which comprises a controller main body, wherein the top of the controller main body is fixedly provided with an operating platform, the upper surface of the operating platform is fixedly provided with a bottom plate, both sides of the operating platform are fixedly provided with a height adjusting mechanism, the middle part of the height adjusting mechanism is movably connected with a semiconductor fixing plate, one side of the upper surface of the operating platform is fixedly provided with a vertical plate, one side of the vertical plate is connected with an automatic pressing plate mechanism through a bolt, and the lower part of the automatic pressing plate mechanism is fixedly provided with a cover plate;
the height adjusting mechanism comprises a shell mounting block, a first mounting plate, a protective cover, a mounting bracket, a transmission screw rod, a shaft sleeve and a hand wheel, wherein the protective cover is fixedly connected to the upper part of the shell mounting block, the first mounting plate is welded to one side of the protective cover, the mounting bracket is fixedly arranged at the upper end and the lower end of the inner part of the protective cover, the transmission screw rod is rotatably connected to the inner part of the mounting bracket, the shaft sleeve is in threaded connection with the middle part of the transmission screw rod, and the hand wheel is fixedly arranged on a bolt at the top of the transmission;
automatic pressure plate mechanism includes backplate, second mounting panel, cylinder and connecting axle, the upper end and the equal bolt fastening of lower extreme of backplate one side have the second mounting panel, two one side bolt fastening of second mounting panel has the cylinder, the output fixed mounting of cylinder has the connecting axle.
Preferably, both sides of the vertical plate are provided with T-shaped grooves, one side of the semiconductor fixing plate is provided with two T-shaped blocks, and the T-shaped grooves are in clearance fit with the T-shaped blocks.
In any of the above aspects, preferably, the upper surface of the bottom plate and the lower surface of the cover plate are both provided with a placing groove.
In any one of the above aspects, it is preferable that a semiconductor fixing groove is provided at a middle portion of the semiconductor fixing plate.
In any of the above schemes, preferably, the mounting bracket is coaxial with the transmission screw rod, and the mounting bracket is connected with the transmission screw rod through a bearing.
In any of the above aspects, preferably, the end surfaces of the base plate are parallel to the end surfaces of the semiconductor fixing plate and the cover plate, respectively.
Compared with the prior art, the utility model has the advantages of:
(1) the utility model discloses to the semiconductor of different specification thickness, need adjust the interval of bottom plate and semiconductor fixed plate and apron respectively, hand-held hand wheel rotates drive screw, because the middle part threaded connection of drive screw has the axle sleeve, and the installing support passes through the bearing with drive screw and is connected, make drive screw drive the axle sleeve motion, because the axle sleeve is welded connection with the both sides of semiconductor fixed plate respectively, make the axle sleeve drive the semiconductor fixed plate up-and-down motion, adjust semiconductor fixed plate to the suitable position, accomplish the fixed of semiconductor chip, make the device can conveniently adjust the high position of semiconductor, and then effectively adjust the leakproofness of upper cover and lower cover encapsulation, the qualification rate of semiconductor encapsulation has been improved;
(2) the utility model discloses a controller main part starts automatic clamp plate mechanism work, because the last fixed surface of bottom plate has the plastics lower cover, the lower fixed surface of apron has the plastics upper cover, and the terminal surface of bottom plate is parallel with the terminal surface of semiconductor fixed plate and the terminal surface of apron respectively for the plastics lower cover of semiconductor laminates completely with the terminal surface of plastics upper cover, accomplishes the encapsulation to the semiconductor through the heating of fixed time, makes the device can encapsulate a plurality of semiconductors simultaneously, has improved machining efficiency.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of the height adjusting mechanism of the present invention;
fig. 3 is a schematic structural diagram of the automatic pressing plate mechanism of the present invention.
The reference numbers in the figures illustrate:
1. a controller main body; 2. an operating platform; 3. a base plate; 4. a height adjustment mechanism; 5. a semiconductor fixing plate; 6. a vertical plate; 7. a cover plate; 8. an automatic platen mechanism; 9. a housing mounting block; 10. a first mounting plate; 11. a protective cover; 12. mounting a bracket; 13. a transmission screw rod; 14. a shaft sleeve; 15. a hand wheel; 16. a back plate; 17. a second mounting plate; 18. a cylinder; 19. and (7) connecting the shafts.
Detailed Description
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are used in a broad sense, and for example, "connected," may be fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediate medium, or connected between two elements.
The specific embodiment is as follows:
referring to fig. 1-3, an adjustable semiconductor packaging machine includes a controller main body 1, an operation platform 2 is fixedly installed on the top of the controller main body 1, a bottom plate 3 is fixedly installed on the upper surface of the operation platform 2, height adjusting mechanisms 4 are fixedly installed on both sides of the operation platform 2, a semiconductor fixing plate 5 is movably connected to the middle of the height adjusting mechanisms 4, a vertical plate 6 is fixedly installed on one side of the upper surface of the operation platform 2, an automatic pressing plate mechanism 8 is connected to one side of the vertical plate 6 through a bolt, and a cover plate 7 is fixedly installed on the lower portion of the automatic pressing plate mechanism 8;
the height adjusting mechanism 4 comprises a shell mounting block 9, a first mounting plate 10, a protective cover 11, a mounting bracket 12, a transmission screw rod 13, a shaft sleeve 14 and a hand wheel 15, wherein the protective cover 11 is fixedly connected to the upper part of the shell mounting block 9, the first mounting plate 10 is welded to one side of the protective cover 11, the mounting bracket 12 is fixedly arranged at the upper end and the lower end of the inner part of the protective cover 11, the transmission screw rod 13 is rotatably connected to the inner part of the mounting bracket 12, the shaft sleeve 14 is in threaded connection with the middle part of the transmission screw rod 13, and the hand wheel 15 is fixedly arranged on a top;
the automatic pressing plate mechanism 8 comprises a back plate 16, a second mounting plate 17, a cylinder 18 and a connecting shaft 19, the second mounting plate 17 is fixed at the upper end and the lower end of one side of the back plate 16 through bolts, the cylinder 18 is fixedly mounted between the two second mounting plates 17, and the connecting shaft 19 is fixedly mounted at the output end of the cylinder 18.
In this embodiment, in order to enable the semiconductor fixing plate 5 to vertically move along the direction of the vertical plate 6, T-shaped grooves are formed on both sides of the vertical plate 6, two T-shaped blocks are arranged on one side of the semiconductor fixing plate 5, and the T-shaped grooves are in clearance fit with the T-shaped blocks.
In the present embodiment, in order to fix the plastic lower cover on the upper surface of the bottom plate 3, the plastic upper cover is fixed on the lower surface of the cover plate 7, and the placing grooves are provided on both the upper surface of the bottom plate 3 and the lower surface of the cover plate 7.
In the present embodiment, in order to fix the semiconductor chip more stably, a semiconductor fixing groove is provided at the middle portion of the semiconductor fixing plate 5.
In the embodiment, in order to make the transmission screw 13 rotate flexibly under the action of the hand wheel 15, the mounting bracket 12 is coaxial with the transmission screw 13, and the mounting bracket 12 is connected with the transmission screw 13 through a bearing.
In this embodiment, the end surfaces of the base plate 3 are parallel to the end surfaces of the semiconductor fixing plate 5 and the cover plate 7, respectively, for better sealing of the package.
The working principle is as follows:
when the device is used, firstly, the conditions of each mechanism of the device are checked, after no special condition is confirmed, for semiconductors with different specifications and thicknesses, the distances between the base plate 3 and the semiconductor fixing plate 5 and between the semiconductor fixing plate 5 and the cover plate 7 are respectively adjusted, the hand-held hand wheel 15 rotates the transmission screw 13, the middle part of the transmission screw 13 is in threaded connection with the shaft sleeve 14, the mounting bracket 12 is connected with the transmission screw 13 through the bearing, so that the transmission screw 13 drives the shaft sleeve 14 to move, the shaft sleeve 14 is respectively in welded connection with the two sides of the semiconductor fixing plate 5, the shaft sleeve 14 drives the semiconductor fixing plate 5 to move up and down, the semiconductor fixing plate 5 is adjusted to a proper position, the fixing of a semiconductor chip is completed, the automatic pressing plate mechanism 8 is started to work through the controller main body 1, the upper surface of the base plate 3 is fixedly provided, and the end face of the bottom plate 3 is respectively parallel to the end face of the semiconductor fixing plate 5 and the end face of the cover plate 7, so that the plastic lower cover of the semiconductor and the end face of the plastic upper cover of the semiconductor are completely attached, and the semiconductor is packaged by heating for a fixed time.
The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.
Claims (6)
1. An adjustable packaging machine for semiconductors comprises a controller main body (1), and is characterized in that an operating platform (2) is fixedly mounted at the top of the controller main body (1), a bottom plate (3) is fixedly mounted on the upper surface of the operating platform (2), height adjusting mechanisms (4) are fixedly mounted on two sides of the operating platform (2), a semiconductor fixing plate (5) is movably connected to the middle of each height adjusting mechanism (4), a vertical plate (6) is fixedly mounted on one side of the upper surface of the operating platform (2), an automatic pressing plate mechanism (8) is connected to one side of the vertical plate (6) through a bolt, and a cover plate (7) is fixedly mounted on the lower portion of the automatic pressing plate mechanism (8);
the height adjusting mechanism (4) comprises a shell mounting block (9), a first mounting plate (10), a protective cover (11), a mounting bracket (12), a transmission screw rod (13), a shaft sleeve (14) and a hand wheel (15), wherein the protective cover (11) is fixedly connected to the upper portion of the shell mounting block (9), the first mounting plate (10) is welded to one side of the protective cover (11), the mounting bracket (12) is fixedly arranged at the upper end and the lower end of the inner portion of the protective cover (11), the transmission screw rod (13) is rotatably connected to the inner portion of the mounting bracket (12), the shaft sleeve (14) is in threaded connection with the middle of the transmission screw rod (13), and the hand wheel (15) is fixedly arranged on a top bolt of the transmission screw rod (13);
automatic clamp plate mechanism (8) include backplate (16), second mounting panel (17), cylinder (18) and connecting axle (19), the upper end and the equal bolt fastening of lower extreme of backplate (16) one side have second mounting panel (17), two one side bolt fastening of second mounting panel (17) has cylinder (18), the output fixed mounting of cylinder (18) has connecting axle (19).
2. An adjustable semiconductor packaging machine as claimed in claim 1, characterized in that: the two sides of the vertical plate (6) are provided with T-shaped grooves, one side of the semiconductor fixing plate (5) is provided with two T-shaped blocks, and the T-shaped grooves are in clearance fit with the T-shaped blocks.
3. An adjustable semiconductor packaging machine as claimed in claim 1, characterized in that: the upper surface of the bottom plate (3) and the lower surface of the cover plate (7) are provided with placing grooves.
4. An adjustable semiconductor packaging machine as claimed in claim 1, characterized in that: and a semiconductor fixing groove is formed in the middle of the semiconductor fixing plate (5).
5. An adjustable semiconductor packaging machine as claimed in claim 1, characterized in that: the mounting bracket (12) is coaxial with the transmission screw rod (13), and the mounting bracket (12) is connected with the transmission screw rod (13) through a bearing.
6. An adjustable semiconductor packaging machine as claimed in claim 1, characterized in that: the end face of the bottom plate (3) is parallel to the end face of the semiconductor fixing plate (5) and the end face of the cover plate (7) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921799576.3U CN210429759U (en) | 2019-10-24 | 2019-10-24 | Adjustable packaging machine for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921799576.3U CN210429759U (en) | 2019-10-24 | 2019-10-24 | Adjustable packaging machine for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210429759U true CN210429759U (en) | 2020-04-28 |
Family
ID=70368653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921799576.3U Expired - Fee Related CN210429759U (en) | 2019-10-24 | 2019-10-24 | Adjustable packaging machine for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210429759U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111681971A (en) * | 2020-06-19 | 2020-09-18 | 北京正兴天宝自动化科技有限公司 | Automatic chip packaging machine |
-
2019
- 2019-10-24 CN CN201921799576.3U patent/CN210429759U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111681971A (en) * | 2020-06-19 | 2020-09-18 | 北京正兴天宝自动化科技有限公司 | Automatic chip packaging machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200428 Termination date: 20211024 |
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| CF01 | Termination of patent right due to non-payment of annual fee |