CN210405981U - Heat conduction silica gel sheet - Google Patents

Heat conduction silica gel sheet Download PDF

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Publication number
CN210405981U
CN210405981U CN201822033731.2U CN201822033731U CN210405981U CN 210405981 U CN210405981 U CN 210405981U CN 201822033731 U CN201822033731 U CN 201822033731U CN 210405981 U CN210405981 U CN 210405981U
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silica gel
layer
heat
adhesive layer
auxiliary adhesive
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CN201822033731.2U
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薛仁宾
李小龙
李亮
薛刚
袁小军
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Shenzhen 3ks Electronic Material Co ltd
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Shenzhen 3ks Electronic Material Co ltd
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Abstract

The utility model discloses a heat-conducting silica gel sheet, which comprises a silica gel sheet body, wherein the front surface and the back surface of the silica gel sheet body are respectively provided with a first auxiliary adhesive layer and a second auxiliary adhesive layer; the silica gel piece is internally embedded with a plurality of supports arranged along the thickness direction, and the plurality of supports penetrate through the front and the back of the silica gel piece body, and the two ends of the supports respectively extend to the interiors of the first auxiliary adhesive layer and the second auxiliary adhesive layer. In this technique, at the embedded support of heat conduction silica gel piece, this support can support the radiator and treat the pressure that the heat dissipation device produced to it at the use, protects silica gel piece body, first supplementary glue film and the supplementary glue film of second can not take place excessive deformation. The mechanical strength of the whole heat-conducting silica gel sheet is improved, and the heat-conducting performance of the whole heat-conducting silica gel sheet is ensured not to be reduced.

Description

Heat conduction silica gel sheet
Technical Field
The utility model belongs to the technical field of the silica gel piece technique and specifically relates to a heat conduction silica gel piece of reinforceing.
Background
With the development of integration technology and the densification of microelectronic packages, the heat generated by electronic devices is rapidly accumulated and increased. The performance and reliability of the electronic components are directly reduced along with the temperature rise of the electronic components, so whether the electronic components can dissipate heat in time becomes an important factor influencing the service life of the electronic components. In order to ensure that the electronic components can still keep a normal working state at the temperature of the use environment, a layer of heat-conducting insulating film is usually arranged on a heat exchange interface of the related components to be used as a heat-conducting interface material, so that the heat of a heating element is rapidly transferred to heat dissipation equipment, and the normal operation of the electronic equipment is ensured.
The heat-conducting silica gel sheet is a heat-conducting medium material synthesized by a special process by taking silica gel as a base material and adding various auxiliary materials such as metal oxides, is produced by a special design scheme of utilizing gaps to transfer heat, can fill the gaps, completes heat transfer between a heating part and a radiating part, has the effects of insulation, shock absorption, sealing and the like, can meet the design requirements of equipment miniaturization and ultrathin, and is extremely high in manufacturability and usability, wide in thickness application range and extremely good in heat-conducting filling material.
The heat-conducting silica gel gasket is widely used as a gap filling material in electronic products. In the use, heat conduction silica gel gasket often receives certain pressure, leads to each laminated structure to take place too big deformation easily in the use, leads to the heat conductivility to worsen. Aiming at the problems, the reinforced heat-conducting silica gel sheet exists in the prior art, and the silica gel sheet is reinforced by respectively reinforcing each laminated structure, for example, a glass fiber layer is adopted, and finally, the whole heat-conducting silica gel sheet is formed by lamination, so that the strength of the heat-conducting silica gel sheet can be improved, and the condition that excessive deformation is not easily generated in the using process is ensured. However, there are some problems that this kind of technical means needs to add some laminated structures, so that the thickness of the silicone sheet is increased, or a reinforcing structure is added to each laminated structure, but this weakens the heat conducting performance of each laminated structure to some extent.
Therefore, the above technical problem needs to be solved.
SUMMERY OF THE UTILITY MODEL
In order to overcome the not enough of prior art, the utility model provides a heat conduction silica gel piece, aim at realizes improving the purpose of heat conduction silica gel piece under the heat conductivility prerequisite that does not change laminated structure.
In order to solve the technical problem, the utility model provides a basic technical scheme does:
the utility model provides a heat conduction silica gel piece, includes the silica gel piece body, and the front and the back of this silica gel piece body set up first supplementary glue film and the supplementary glue film of second respectively, and wherein, this internal a plurality of supports that set up along the thickness direction of inlaying of silica gel piece, these a plurality of supports run through the front and the back and both ends of this silica gel piece body and extend to respectively the inside of first supplementary glue film and the supplementary glue film of second.
Further, the support appearance is the cylinder shape, and this support is including cup jointing at the somatic part of silica gel piece, extending to the inside first extension of first supplementary glue film and extending to the inside second extension of second supplementary glue film, and this first, two extensions all set up along the inside sunken draw-in groove of radial.
Furthermore, the clamping groove is a ring groove with a U-shaped cross section.
Further, the first auxiliary adhesive layer comprises a heat conducting rubber layer and a flexible heat conducting layer which are laminated from one side of the attaching silica gel sheet body to the outer side direction; the first extending part extends to the joint surface of the heat conducting rubber layer and the flexible heat conducting layer.
Further, the second auxiliary adhesive layer comprises a silica sol heat absorption layer, an epoxy resin layer and a strippable paper layer which are laminated from one side of the attaching silica gel sheet body to the outside; the second extending part extends to the joint face of the silica sol heat absorption layer and the epoxy resin layer.
Further, the end surfaces of the first extension part and the second extension part are in a reticulate pattern shape.
Furthermore, the peripheral side of the body part is a reticulate pattern or a spiral pattern.
The utility model has the advantages that:
the technical scheme of the utility model is that the heat-conducting silica gel sheet comprises a silica gel sheet body, wherein the front surface and the back surface of the silica gel sheet body are respectively provided with a first auxiliary adhesive layer and a second auxiliary adhesive layer; the silica gel piece is internally embedded with a plurality of supports arranged along the thickness direction, and the plurality of supports penetrate through the front and the back of the silica gel piece body, and the two ends of the supports respectively extend to the interiors of the first auxiliary adhesive layer and the second auxiliary adhesive layer. In this technique, at the embedded support of heat conduction silica gel piece, this support can support the radiator and treat the pressure that the heat dissipation device produced to it at the use, protects silica gel piece body, first supplementary glue film and the supplementary glue film of second can not take place excessive deformation. The mechanical strength of the whole heat-conducting silica gel sheet is improved, and the heat-conducting performance of the whole heat-conducting silica gel sheet is ensured not to be reduced.
Drawings
Fig. 1 is a schematic structural view of a heat-conductive silicone sheet of the present invention;
FIG. 2 is a schematic structural view of a circular heat-conducting silica gel sheet;
FIG. 3 is a schematic structural view of a stent;
fig. 4 is a schematic structural diagram of a heat-conducting silicone sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to fig. 1 to 4, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly. Specifically, as shown in fig. 1, the front surface in the following embodiments is an upper end surface of the silicon sheet body 10, and the back surface is a lower end surface of the silicon sheet body 10.
Referring to fig. 1, the utility model relates to a heat conduction silica gel piece, including silica gel piece body 10, the front and the back of this silica gel piece body 10 set up first supplementary glue film 20 and the supplementary glue film 30 of second respectively, and wherein, a plurality of supports 40 that set up along the thickness direction are embedded in silica gel piece body 10, and these a plurality of supports 40 run through the front and the back and both ends of this silica gel piece body 10 extend to respectively the inside of first supplementary glue film 20 and the supplementary glue film 30 of second.
In this technique, the both ends of a plurality of supports 40 do not pass the outer terminal surface of first auxiliary glue film 20 and the auxiliary glue film 30 of second, a plurality of supports 40 all are located the inside of whole heat conduction silica gel piece promptly, when in the use, take place deformation and extrude inside silica gel piece body 10 and take place the deformation of certain degree when the first auxiliary glue film 20 of heat conduction silica gel piece and the auxiliary glue film 30 pressurized of second, when extruding to certain degree, the radiator is not taking place too much deformation with the supporting role that takes the heat dissipation device to receive a plurality of supports 40. This technique has protected heat conduction silica gel piece, and it can not take place too big deformation so that damage heat conduction silica gel piece, and this technique need not change the component structure of each heat conduction silica gel piece, guarantees the sufficient heat behavior.
Referring to fig. 2, in the embodiment, a circular heat conductive silicone sheet is taken as an example for description, four supports 40 are uniformly distributed on the periphery of the circular heat conductive silicone sheet, that is, an included angle between circle centers of adjacent supports 40 is 90 °, and further, one support 40 may be further disposed at the position of the circle center. Of course, without limitation, suitable brackets 40 may be provided according to different applications, such as one, two, three, five, or even more. Any solution that merely changes the number of the brackets 40 is within the scope of the present invention.
In detail, referring to fig. 3, a structural diagram of the bracket 40 is shown. The shape of the bracket 40 is a cylinder, the bracket 40 includes a body 401 sleeved on the silicon sheet body 10, a first extension 402 extending to the inside of the first auxiliary adhesive layer 20, and a second extension 403 extending to the inside of the second auxiliary adhesive layer 30, and the first and second extensions 402, 403 are both provided with a slot 404 recessed inwards along the radial direction. The body 401 is substantially cylindrical, the body 401 is fixed with the silicon sheet body 10, and the thickness of the body 401 is the same as that of the silicon sheet body 10. Of course, the length of the main body 401 may be slightly longer than the thickness of the silicone sheet body 10. It should be understood that, the clamping groove 404 is recessed, and it can constrain the first auxiliary adhesive layer 20 and the third auxiliary adhesive layer 30, so as to improve the tightness between the first auxiliary adhesive layer 20 and the silicone sheet body 10 and the second auxiliary adhesive layer 30, and strengthen the adhesive force. Preferably, the locking groove 404 is a ring groove with a U-shaped cross section, but may have any other suitable shape. In addition, in the present embodiment, the maximum outer diameters of the first extension portion 402 and the second extension portion 403 are smaller than or equal to the outer diameter of the body portion 401.
Referring to fig. 4, a specific structure of the thermal silicone rubber sheet is schematically shown. The figure shows that the first auxiliary adhesive layer 20 comprises a heat conducting rubber layer 201 and a flexible heat conducting layer 202 which are laminated from one side of the attaching silicone sheet body 10 to the outer side; wherein the first extension 402 extends to the bonding surface of the heat conducting rubber layer and the flexible heat conducting layer 202. In the figure, the first auxiliary adhesive layer 20 is located on the upper end surface of the silicone sheet body 10. The heat conduction rubber layer 201 can be fine to realize heat conduction, and the flexible heat conduction layer 202 can contact with the device to be cooled to realize heat conduction. In this scheme, the end of the first extension portion 402 is disposed at the joint surface of the heat-conducting rubber layer 201 and the flexible heat-conducting layer 202, so that the heat-conducting silicone sheet can be better protected, especially in some occasions where excessive deformation is not allowed. Of course, the end face of the first extension 402 also extends only to the inside of the heat-conducting rubber layer 201, which allows sufficient elastic deformation to meet the requirements of some special applications.
Similarly, the second auxiliary adhesive layer 30 includes a silica sol heat absorbing layer 301, an epoxy resin layer 302 and a peelable paper layer 303 laminated from one side of the attached silica gel sheet body 10 to the outside; wherein, the second extension part 403 extends to the joint surface of the silica sol heat absorption layer 301 and the epoxy resin layer 302. The strippable paper layer 303 can be bonded to the heat sink after the outer protective layer is torn off. Here, the second extension 403 is extended to the junction surface of the silica sol heat absorbing layer 301 and the epoxy resin layer 302 to ensure that excessive deformation does not occur. When it is desired to use in a smaller gap (i.e., a larger deformation is desired), the end of the second extension 403 may be disposed inside the silica sol heat sink layer 301.
Preferably, in order to ensure the close combination of the added bracket 40 and the contact position, the end surfaces of the first extension part 402 and the second extension part 403 are in a reticulate pattern; the peripheral side of the body portion 401 is a cross-hatched or spiral pattern. Through the design, the friction force at the joint surface can be improved, and the separation can not occur in the using process.
In a word, the technical scheme of the utility model under the heat conductivility of guaranteeing traditional heat conduction silica gel piece, improved the intensity of heat conduction silica gel piece, satisfied user's user demand.
Variations and modifications to the above-described embodiments may occur to those skilled in the art, in light of the above teachings and teachings. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should fall within the protection scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims (7)

1. A heat conduction silica gel sheet is characterized in that: including silica gel piece body (10), the front and the back of this silica gel piece body (10) set up first supplementary glue film (20) and second supplementary glue film (30) respectively, and wherein, a plurality of supports (40) that set up along thickness direction are embedded in silica gel piece body (10), and these a plurality of supports (40) run through the front and the back and both ends of this silica gel piece body (10) and extend to respectively the inside of first supplementary glue film (20) and second supplementary glue film (30).
2. A thermally conductive silicone sheet according to claim 1, wherein:
the outer shape of the support (40) is in a cylindrical shape, the support (40) comprises a body part (401) sleeved on the silicon sheet body (10), a first extending part (402) extending to the inside of the first auxiliary adhesive layer (20) and a second extending part (403) extending to the inside of the second auxiliary adhesive layer (30), and the first extending part and the second extending part (402 and 403) are both provided with clamping grooves (404) which are inwards recessed along the radial direction.
3. A thermally conductive silicone sheet according to claim 2, wherein:
the clamping groove (404) is a ring groove with a U-shaped cross section.
4. A thermally conductive silicone sheet according to claim 2, wherein:
the first auxiliary adhesive layer (20) comprises a heat conducting rubber layer (201) and a flexible heat conducting layer (202), wherein the heat conducting rubber layer (201) and the flexible heat conducting layer are laminated from one side of the attaching silica gel sheet body (10) to the outer side; wherein the first extension part (402) extends to the joint surface of the heat conducting rubber layer and the flexible heat conducting layer (202).
5. A thermally conductive silicone sheet according to claim 4, wherein:
the second auxiliary adhesive layer (30) comprises a silica sol heat absorption layer (301), an epoxy resin layer (302) and a strippable paper layer (303) which are laminated from one side of the attaching silica gel sheet body (10) to the outer side; wherein the second extension part (403) extends to the joint surface of the silica sol heat absorption layer (301) and the epoxy resin layer (302).
6. A thermally conductive silicone sheet according to claim 5, wherein:
the end surfaces of the first extension part (402) and the second extension part (403) are in a reticulate pattern shape.
7. A thermally conductive silicone sheet according to claim 2, wherein:
the peripheral side of the body part (401) is reticulate patterns or spiral patterns.
CN201822033731.2U 2018-12-05 2018-12-05 Heat conduction silica gel sheet Active CN210405981U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822033731.2U CN210405981U (en) 2018-12-05 2018-12-05 Heat conduction silica gel sheet

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Application Number Priority Date Filing Date Title
CN201822033731.2U CN210405981U (en) 2018-12-05 2018-12-05 Heat conduction silica gel sheet

Publications (1)

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CN210405981U true CN210405981U (en) 2020-04-24

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112303073A (en) * 2020-10-20 2021-02-02 深圳市诺丰电子科技有限公司 Heat conduction silica gel sheet that suitability is strong
CN113115557A (en) * 2021-02-05 2021-07-13 吕建忠 Heat dissipation silica gel piece of embedded heat conduction group

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112303073A (en) * 2020-10-20 2021-02-02 深圳市诺丰电子科技有限公司 Heat conduction silica gel sheet that suitability is strong
CN113115557A (en) * 2021-02-05 2021-07-13 吕建忠 Heat dissipation silica gel piece of embedded heat conduction group
CN113115557B (en) * 2021-02-05 2022-07-26 中山市鼎兴有机硅科技有限公司 Heat dissipation silica gel piece of embedded heat conduction group

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