CN210394507U - Magnetron sputtering plating metal electrode tool - Google Patents
Magnetron sputtering plating metal electrode tool Download PDFInfo
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- CN210394507U CN210394507U CN201921196711.5U CN201921196711U CN210394507U CN 210394507 U CN210394507 U CN 210394507U CN 201921196711 U CN201921196711 U CN 201921196711U CN 210394507 U CN210394507 U CN 210394507U
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- coating film
- coating
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- magnetron sputtering
- layering
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Abstract
The utility model discloses a magnetron sputtering plating metal electrode tool, including the coating film base be provided with a plurality of recesses on the upper surface of coating film base, all be provided with a plurality of pressure components around the recess, pressure components includes screw and layering the one end of layering is provided with the through-hole, the pole portion end of screw pass behind the through-hole with coating film base threaded connection, the upper and lower surface of layering respectively with the head of screw and the last surface contact of coating film base, and the other end of layering is located the top of recess. The utility model discloses a tool satisfies multi-disc wafer coating film simultaneously for but the wafer sample mass ground is put and is carried out the coating film operation in the tool, and carries out bearing of wafer through the coating film base that independently comes out from coating film equipment, so that during production, can be at the in-process of coating film, with next batch with the wafer installation coating film base of coating film on, improve production efficiency and improve time utilization, reduce the time of prepareeing material.
Description
Technical Field
The utility model relates to a wafer field, in particular to magnetron sputtering plating metal electrode tool.
Background
The jig is a tool for carpenters, ironmen, pincers, machines, electric controls and other handicrafts, and is mainly used as a tool for assisting in controlling positions or actions or combining the positions and the actions. The jig can be divided into three types, namely a process assembly type jig, a project test type jig and a circuit board test type jig
In wafer production, it is necessary to plate the wafer surface with metal electrodes. The prior art can only plate a single wafer at a time, and has low efficiency. Therefore, how to improve the efficiency of plating the metal electrode on the wafer, the main technical problem to be solved by the utility model is that a plurality of wafers can be plated at one time.
Disclosure of Invention
The utility model aims to provide a: provides a magnetron sputtering metal plating electrode jig, and solves the technical problem of how to improve the efficiency of wafer metal plating electrodes. The utility model discloses a dedicated tool when setting up a wafer metallization electrode to make when the metallization electrode, can install, fix a position many copies wafer simultaneously, improve wafer material loading efficiency and machining efficiency.
The utility model adopts the technical scheme as follows:
the utility model provides a magnetron sputtering metallisation electrode tool, includes the coating film base be provided with a plurality of recesses on the upper surface of coating film base, all be provided with a plurality of subassemblies that compress tightly around the recess, the subassembly that compresses tightly includes screw and layering the one end of layering is provided with the through-hole, the pole portion end of screw pass behind the through-hole with coating film base threaded connection, the upper and lower surface of layering respectively with the head of screw and the upper surface contact of coating film base, and the other end of layering is located the top of recess.
Preferably, the shape and size of the groove are consistent with the shape and size of the wafer needing the metal-plated electrode.
When the metal electrode is plated on the wafer, the screw is loosened to unload the pressing load of the screw head to the pressing strip, so that the pressing strip can rotate around the axis of the screw matched with the pressing strip, and the end of the pressing strip far away from the screw is moved to one side of the groove from the upper part of the groove, so that the wafer can be placed conveniently. Then, the wafer to be coated is sequentially placed in each groove, and then the pressing strip can rotate around the axis of the screw matched with the pressing strip until one end of the pressing strip, far away from the screw, is positioned above the groove. The screws are then tightened so that the upper surface of the bead is in contact with the head of the screw, thereby securing the wafer by the screw and bead. And then assembling the coating base fixed with the wafer on coating equipment to perform a subsequent coating process.
The utility model discloses a tool satisfies multi-disc wafer coating film simultaneously for but the wafer sample mass ground is put and is carried out the coating film operation in the tool, and carries out bearing of wafer through the coating film base that independently comes out from coating film equipment, so that during production, can be at the in-process of coating film, with next batch with the wafer installation coating film base of coating film on, improve production efficiency and improve time utilization, reduce the time of prepareeing material.
The arrangement of the grooves and the pressing strips ensures that the wafer is not obviously displaced and damaged in the film coating process; and the utility model has the advantages that the whole structure is simple, the cleaning of the jig and the taking and placing of the jig are convenient, and the jig can be independently taken out from the coating equipment and can be disassembled, and the operation is convenient.
The utility model can be matched with wafers with different shapes and sizes in actual use, so as to meet the coating of wafers with different specifications.
Due to the adoption of the technical scheme, the beneficial effects of the utility model are that:
1. the utility model relates to a magnetron sputtering plating metal electrode tool satisfies the simultaneous coating of multi-disc wafer, makes the wafer sample can be put in the tool in batches and carry out the coating operation, and carries out the bearing of wafer through the coating film base that comes out from coating equipment independently to when so that when producing, can be in the coating film in-process, install the wafer of next batch coating film on the coating film base, improve production efficiency and improve time utilization, reduce the time of prepareeing material;
2. the utility model relates to a magnetron sputtering plating metal electrode tool, the arrangement of a groove and a pressing bar ensures that the wafer does not generate obvious displacement and damage in the film plating process; and the utility model has the advantages that the whole structure is simple, the cleaning of the jig and the taking and placing of the jig are convenient, and the jig can be independently taken out from the coating equipment and can be disassembled, and the operation is convenient.
Drawings
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
fig. 1 is a top view of the present invention;
FIG. 2 is a cross-sectional view taken along A-A in FIG. 1;
FIG. 3 is a top view of a coated base;
FIG. 4 is a cross-sectional view taken along line B-B of FIG. 3;
reference numerals in the drawings indicate:
1-coating film base, 2-groove, 3-screw, 4-batten, 5-arc structure, 6-first positioning groove, 7-second positioning groove, 8-threaded hole matched with screw.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
The present invention will be described in detail with reference to fig. 1 to 4.
Example 1
As shown in fig. 1-4, the utility model relates to a magnetron sputtering metallization electrode tool, including coating film base 1 be provided with a plurality of recesses 2 on coating film base 1's the upper surface, all be provided with a plurality of subassemblies that compress tightly around recess 2, it includes screw 3 and layering 4 to compress tightly the subassembly the one end of layering 4 is provided with the through-hole, screw 3's pole end pass behind the through-hole with coating film base 1 threaded connection, the upper and lower surface of layering 4 respectively with the head of screw 3 and coating film base 1's upper surface contact, and the other end of layering 4 is located recess 2's top.
Preferably, the shape and size of the groove 2 are consistent with the shape and size of the wafer needing the metal-plated electrode.
Preferably, four hold-down assemblies are arranged around each of the grooves 2.
When the metal electrode is plated on the wafer, the screw 3 is loosened to unload the pressing load of the head of the screw 3 on the pressing strip 4, so that the pressing strip 4 can rotate around the axis of the screw 3 matched with the pressing strip 4, and the end of the pressing strip 4 far away from the screw 3 is moved to one side of the groove 2 from the upper part of the groove 2 to be convenient for placing the wafer. Then, the wafer to be coated is sequentially placed in each groove 2, and then the pressing strip 4 can rotate around the axis of the screw 3 matched with the pressing strip 4 until one end of the pressing strip 4, far away from the screw, is positioned above the groove 2. The screws are then tightened to bring the upper surface of the bead 4 into contact with the heads of the screws 3, thereby fixing the wafer by the screws and the bead. And then the coating base 1 with the wafer fixed thereon is assembled on a coating device to perform a subsequent coating process.
The utility model discloses a tool satisfies multi-disc wafer coating film simultaneously for but the wafer sample mass ground is put and is carried out the coating film operation in the tool, and carries out bearing of wafer through the coating film base that independently comes out from coating film equipment, so that during production, can be at the in-process of coating film, with next batch with the wafer installation coating film base of coating film on, improve production efficiency and improve time utilization, reduce the time of prepareeing material.
The arrangement of the grooves and the pressing strips ensures that the wafer is not obviously displaced and damaged in the film coating process; and the utility model has the advantages that the whole structure is simple, the cleaning of the jig and the taking and placing of the jig are convenient, and the jig can be independently taken out from the coating equipment and can be disassembled, and the operation is convenient.
The utility model can be matched with wafers with different shapes and sizes in actual use, so as to meet the coating of wafers with different specifications.
Example 2
This example illustrates the shape of the base 1 for coating film in example 1.
As shown in fig. 1-4, in the present invention, the coating base 1 is a circular plate. The coating base 1 can also be made into a rectangular plate, a polygonal plate and the like, and the specific shape of the coating base can be adaptively and optimally adjusted according to the shape and the size of the required groove.
Example 3
The present embodiment is to explain the number of the grooves 5 implemented.
As shown in fig. 1-4, in the present invention, there are five grooves 2, one of the grooves 2 is located at the center of the coating base 1, and the grooves and the four grooves are distributed at the edge of the coating base 1 symmetrically along the center of the coating base 1. The center and the periphery of the coating base 1 are provided with grooves 5, so that the coating base 1 with a circular structure can be utilized to the maximum.
Example 4
The present embodiment is explained about the structure of the groove 5.
As shown in fig. 1-4, in the present invention, the groove 2 is a rectangular groove. When the wafer to be coated is circular, then the grooves are preferably circular.
Further, all set up circular arc structure 5 on four angles of recess 2, circular arc structure 5's interior concave surface is inside towards recess 2, in two adjacent cell walls on recess 2, a cell wall passes through circular arc structure 5 and is connected with another cell wall.
In order to match the wafers cut after CNC machining, it is therefore necessary to provide the circular arc structure 5. In the CNC processing, in order to prevent the corners of the rectangular wafer from being damaged by cutting, convex circular arc structures corresponding to the circular arc structures 5 are provided at each of the four corners of the rectangular wafer.
Example 5
The present embodiment is to explain the positioning structure of the coating base 1 mounted on the coating apparatus.
As shown in fig. 1-4, in the present invention, the two ends of the upper surface of the coating base 1 are respectively provided with a first positioning groove 6 and a second positioning groove 7, and one side of the first positioning groove 6 and the second positioning groove 7, which is far away from the central point of the coating base 1, all extends outwards and is communicated with the side wall of the coating base 1.
When the coating base 1 is assembled on the coating equipment, the coating base 1 is stably fixed on the coating equipment by arranging the stop lever type component matched with the first positioning groove 6 and the second positioning groove 7 on the coating equipment, so that the vertical and circumferential limiting of the coating base 1 is realized.
The coating equipment is provided with an installation groove with the shape and the size consistent with the shape and the size of the appearance of the coating base 1, and the coating base 1 is installed in the installation groove.
Example 6
This embodiment is to make an implementation description to the specific parameter requirements of the present invention.
The flatness requirement of the groove bottom of the groove 2 is 0.06mm, and the surface roughness is Ra3.2 mu m; the flatness of the surface of the coating base 1 is 0.06 mm;
the above description is only for the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can be covered within the protection scope of the present invention without the changes or substitutions conceived by the inventive work within the technical scope disclosed by the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (7)
1. The utility model provides a magnetron sputtering metal coating electrode tool which characterized in that: including coating film base (1) be provided with a plurality of recesses (2) on the upper surface of coating film base (1), all be provided with a plurality of subassemblies that compress tightly around recess (2), the subassembly that compresses tightly includes screw (3) and layering (4) the one end of layering (4) is provided with the through-hole, the pole portion end of screw (3) pass behind the through-hole with coating film base (1) threaded connection, the upper and lower surface of layering (4) respectively with the head of screw (3) and the last surface contact of coating film base (1), and the other end of layering (4) is located the top of recess (2).
2. The magnetron sputtering metal plating electrode jig according to claim 1, characterized in that: the coating film base (1) is a circular plate.
3. The magnetron sputtering metal plating electrode jig according to claim 2, characterized in that: the number of the grooves (2) is five, one groove (2) is positioned at the center of the circle of the film coating base (1), and the grooves and the four grooves are distributed at the edge of the film coating base (1) in a manner of being symmetrical with the center of the circle of the film coating base (1).
4. The magnetron sputtering metal plating electrode jig according to claim 1, characterized in that: the groove (2) is a rectangular groove.
5. The magnetron sputtering metal plating electrode jig according to claim 4, characterized in that: all set up circular arc structure (5) on four angles of recess (2), the concave surface of circular arc structure (5) is inside towards recess (2), in two adjacent cell walls on recess (2), a cell wall passes through circular arc structure (5) and is connected with another cell wall.
6. The magnetron sputtering metal plating electrode jig according to any one of claims 1 to 5, characterized in that: the two ends of the upper surface of the coating base (1) are respectively provided with a first positioning groove (6) and a second positioning groove (7), and one sides of the first positioning groove (6) and the second positioning groove (7) far away from the central point of the coating base (1) extend outwards and are communicated with the side wall of the coating base (1).
7. The magnetron sputtering metal plating electrode jig according to any one of claims 1 to 5, characterized in that: four pressing components are arranged around each groove (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921196711.5U CN210394507U (en) | 2019-07-26 | 2019-07-26 | Magnetron sputtering plating metal electrode tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921196711.5U CN210394507U (en) | 2019-07-26 | 2019-07-26 | Magnetron sputtering plating metal electrode tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210394507U true CN210394507U (en) | 2020-04-24 |
Family
ID=70356841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921196711.5U Active CN210394507U (en) | 2019-07-26 | 2019-07-26 | Magnetron sputtering plating metal electrode tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210394507U (en) |
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2019
- 2019-07-26 CN CN201921196711.5U patent/CN210394507U/en active Active
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