CN219151745U - Linear cutting machining fixing device for non-conductive target - Google Patents

Abstract

The utility model relates to a target processing technology field, concretely relates to line of non-conductive target cuts processing fixing device, this line cut processing fixing device include the base plate and are used for installing the revolving stage of base plate, be provided with the constant head tank with the base plate looks adaptation on the revolving stage, detachably installs at least one clamp plate on the revolving stage, the base plate is put into behind the constant head tank pass through the clamp plate is fixed. Compared with the prior art, this application is through adopting clamp plate + constant head tank's mode, is fixed the base plate on the revolving stage with the base plate bite, uses the mixed glue to scribble the fixed mode that makes the base plate paste on the revolving stage for among the conventional scheme, and the fixed mode of this application is detachable and more efficient, has omitted the step that makes the revolving stage degum, simultaneously, also can save the loss of degumping to the base plate and the consumption of mixed colloid, and the dismouting operation is also more convenient, and the person of facilitating the use is in target processing saving the consumptive material, promoting machining efficiency, has good commercial value.

Description

Linear cutting machining fixing device for non-conductive target

Technical Field

The application relates to the technical field of target processing, in particular to a wire cutting processing fixing device for a non-conductive target.

Background

The coating target is a sputtering source which is sputtered on the substrate by magnetron sputtering, multi-arc ion plating or other types of coating systems under proper process conditions to form various functional films. In short, the target material is the target material bombarded by high-speed charged particles, and different target materials (such as aluminum, copper, stainless steel, titanium, nickel targets and the like) are replaced, so that different film systems (such as superhard, wear-resistant and corrosion-resistant alloy films and the like) can be obtained. In the 90 s of the 20 th century, along with the synchronous development of sputtering targets and sputtering technologies, the requirements of development of various novel electronic components are greatly met.

The target material can be divided into a metal target material, a ceramic target material and an alloy target material according to the material, the ceramic target material can be further divided into a conductive ceramic target material and a non-conductive ceramic target material, when the conductive ceramic target material is processed, molybdenum wires can be selected to be firstly cut and roughly processed by a wire cutting machine and then finely processed by a grinding machine, and the conductive target material can be fixed on a tool in a magnetic attraction mode; however, when the non-conductive ceramic target material does not have conductivity, a special fixing mode can only be selected, for example, when diamond is used for wire saw processing of the non-conductive target material, the target material is usually fixed on a substrate by an adhesive mode, then the substrate is fixed on a cutting table by an adhesive mode and then wire cutting is performed, and the fixing mode has many problems, such as low processing efficiency caused by repeated adhesive and degumming processes, high material loss and poor disassembly and assembly convenience.

Disclosure of Invention

The technical problem to be solved in the application is to the defect of the prior art, and a wire cutting processing fixing device for non-conductive targets, which is material-saving, high in efficiency and convenient to assemble and disassemble, is provided.

In order to achieve the above purpose, the present application adopts the following technical scheme:

the utility model provides a line cutting processing fixing device of non-conductive target, includes base plate and revolving stage, be provided with on the revolving stage with the constant head tank of base plate looks adaptation, detachably installs at least one clamp plate on the revolving stage, the base plate is put into behind the constant head tank through the constant head tank with the cooperation of clamp plate realizes locking fixedly.

Further, the positioning groove comprises a first groove wall and a second groove wall which are matched with two adjacent side surfaces of the substrate, the pressing plates comprise a first pressing plate and a second pressing plate which are respectively matched with the two remaining side surfaces of the substrate, and the first pressing plate and the second pressing plate enable the substrate to be fixed in the positioning groove by pressing the two side surfaces of the substrate.

Further, the base plate comprises a first vertex angle and a second vertex angle which are opposite, the positioning groove comprises a groove wall matched with the first vertex angle, the pressing plate comprises a groove matched with the second vertex angle, and the base plate is clamped between the positioning groove and the groove of the pressing plate.

Further, the first pressing plate and the second pressing plate are mounted on the rotating table through bolts.

Further, waist-shaped grooves are formed in the first pressing plate and the second pressing plate along the length direction and the width direction of the substrate respectively, bolts penetrate through the waist-shaped grooves to be mounted on the rotary table, and the mounting positions of the first pressing plate/the second pressing plate on the rotary table are adjusted through the waist-shaped grooves.

Further, the depth of the positioning groove is matched with the thickness of the substrate.

Further, the substrate is any one of a bakelite plate, an acrylic plate, a polypropylene plate, a polyethylene plate and a polycarbonate plate.

Furthermore, the target material and the substrate are connected in an adhesive mode.

The beneficial effects of this application are:

compared with the prior art, this application is through adopting clamp plate + constant head tank's mode, bites the base plate with detachable mode and fixes on the revolving stage, use the mixed glue to scribble the fixed mode that makes the base plate paste and be fixed in on the revolving stage for among the prior art, the fixed mode of this application is more high-efficient, omitted the step that makes revolving stage rubber coating, come unstuck, simultaneously, also can save the loss of coming unstuck to the base plate and the consumption of mixed colloid, the dismouting operation is also more convenient, the person of facilitating the use saves the consumptive material in target processing, promote machining efficiency, have good commercial value.

Drawings

FIG. 1 illustrates a schematic structural view of a wire-cut tooling fixture for a non-conductive target, according to some embodiments of the present application;

FIG. 2 illustrates an exploded view of FIG. 1, according to some embodiments of the present application;

FIG. 3 illustrates a schematic diagram of a rotational stage, according to some embodiments of the present application;

FIG. 4 illustrates a schematic view of a configuration of a substrate mated with a turntable, platen, according to some embodiments of the present application;

fig. 5 illustrates a schematic structural view of another form of a substrate mated with a turntable, platen, according to some embodiments of the present application.

Detailed Description

The technical features and advantages of the present application are described in more detail below with reference to the accompanying drawings so that the advantages and features of the present application may be more readily understood by those skilled in the art, thereby making clear and defining the scope of the present utility model.

It should be understood by those skilled in the art that these embodiments are merely for explaining the technical principles of the present application, and are not intended to limit the scope of the present application.

It should be noted that, in the description of the present application, terms such as "upper," "lower," "left," "right," "inner," "outer," and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model.

The terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying an importance of the illustrated technical features.

Furthermore, it should be noted that, in the description of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those skilled in the art according to the specific circumstances.

The embodiment of the application provides a line cutting processing fixing device of a non-conductive target, which is matched with a diamond rope sawing machine to be used for carrying out line cutting processing of the non-conductive target, when the device is used, a substrate arranged on a rotary table and the target fixed on the substrate are subjected to line cutting processing by utilizing a diamond rope tightly stretched on a saw frame, in the past, the substrate and the rotary table are connected and fixed in an adhesive mode, after the line cutting is finished, degumming treatment is needed between the substrate and the rotary table, and then new targets can be installed for continuous processing, on one hand, the degumming needs to take a long time, and the overall production efficiency is reduced; on the other hand, the degumming process is easy to cause abrasion of the base plate, the material cost is increased, and the material cost is further increased due to the mixed glue used in a large amount.

In view of this, referring to fig. 1 to 5, the fixing device for wire cutting of a non-conductive target provided in the embodiment of the present application specifically includes a rotary table 100, a substrate 200 and a pressing plate 300, wherein a positioning groove 110 is formed on the rotary table 100, and the substrate 200 is detachably locked and fixed on the rotary table 100 by cooperation of the positioning groove 110 and the pressing plate 300. In this fixing manner, the turntable 100 and the substrate 200 do not need to undergo a glue spreading step and a glue removing step, so that the processing time is greatly saved.

Referring to fig. 5, in one of the structures of the pressing plate 300, the substrate 200 and the rotating table 100, the positioning groove 110 of the rotating table 100 is matched with the first vertex angle 230 of the substrate 200, the pressing plate 300 is matched with the second vertex angle 240 of the substrate 200, and the substrate 200 is clamped between the positioning groove 110 and the pressing plate 300 to realize locking and fixing.

The substrate 200 is snapped and fixed in a mode of positioning the groove 110 and the pressing plate 300, on one hand, quick installation or disassembly between the substrate 200 and the rotary table 100 can be facilitated, glue spreading and degumming time and the use amount of mixed glue are saved, and on the other hand, limitation on the installation position of the substrate 200 can be realized, and no other positioning devices are needed for limiting the substrate 200.

Alternatively, in some preferred embodiments, referring to fig. 1-4, the first groove wall 111 and the second groove wall 112 of the positioning groove 110 are respectively matched with two adjacent sides 210 and 220 of the substrate 200, the groove bottom 113 of the positioning groove 110 is matched with the lower side of the substrate 200, the other two groove surfaces of the positioning groove 110 are open and are respectively provided with a first pressing plate 310 and a second pressing plate 320 in a detachable manner, after the substrate 200 is placed into the positioning groove 110, the first side 210 and the second side 220 of the substrate 200 are positioned by pressing the first groove wall 111 and the second groove wall 112, and the first pressing plate 310 and the second pressing plate 320 respectively press the other two sides of the substrate 200 upwards and rightwards to fix the substrate 200 in the positioning groove 110.

In order to facilitate the disassembly and assembly of the user, the first pressing plate 310, the second pressing plate 320 and the rotating platform 100 can be fixed by bolts, referring to fig. 2-3, the rotating platform 100 is provided with threaded holes 120, the first pressing plate 310/the second pressing plate 320 are correspondingly provided with through holes 311, after the substrate 200 is placed in the positioning groove 110, the first pressing plate 310 and the second pressing plate 320 are mounted on the rotating platform 100, and the bolts 500 are screwed into the threaded holes 120 through the through holes 311, so as to fix the first pressing plate 310/the second pressing plate 320.

In order to reduce the installation difficulty, the through holes 311 may be configured as a waist-shaped groove structure, and the waist-shaped grooves on the first and second pressing plates 310 and 320 extend along the length and width directions of the substrate 200, so that the installation positions of the first and second pressing plates 310 and 320 can be conveniently adjusted when the substrate 200 is fixed, and meanwhile, the installation of the first and second pressing plates 310 and 320 can be prevented from being affected by small dimensional errors of the substrate 200. Another effect of setting the through hole 311 to be a waist-shaped groove is that the first pressing plate 310/the second pressing plate 320 can be adapted to the substrates 200 with different sizes for use, and the mounting positions of the first pressing plate 310/the second pressing plate 320 can be adjusted through the waist-shaped groove to adapt to the substrates 200 with different length x width sizes, so that the universality of the application is improved, and the material cost is further saved.

Preferably, the waist-shaped groove may be designed as a countersunk hole, the bolt 500 is screwed into the waist-shaped groove, and then the first pressing plate 310 and the second pressing plate 320 are fixed by pressing the countersunk portion, and the position of the first pressing plate 310 and the second pressing plate 320 can be adjusted along the length or the width direction of the substrate 200 by slightly unscrewing the bolt 500.

In order to improve the connection strength, the depth of the positioning groove 110 should not be set too shallow, and it is preferable that the depth of the positioning groove 110 is slightly smaller than or flush with the thickness of the substrate 200.

The specific using method of the wire cutting machining fixing device is as follows:

(1) Fixation of target 400 to substrate 200: cleaning the front and back surfaces of the substrate 200 and cleaning the surface to be bonded of the target 400;

(2) Colloid preparation: preparing a proper amount of mixed colloid according to the material and the area of the target 400;

(3) Primary fixation: uniformly coating the colloid on the upper side surface of the substrate 200, taking out the target 400, vertically placing the surface to be bonded on the glue-coated surface of the substrate 200, combining the two surfaces, and curing to finish the positioning of the target 400 and the substrate 200;

(4) Secondary fixation: the combination of the target 400 and the substrate 200, which have been once fixed, is placed in the positioning groove 110 of the rotary table 100, the first and second pressing blocks 310 and 320 are fastened using the bolts 500, the first pressing block 310 is moved rightward, and the second pressing block 320 is moved upward to bite the left and lower sides of the substrate 200, thereby completing the secondary fixation.

After the non-conductive target is fixed in the above manner, the wire saw machine can be started to perform wire cutting processing on the target 400, and as the substrate 200 is detachably connected with the rotary table 100, the steps of gluing and degumming of the rotary table 100 can be omitted, and the processing time and the use amount of mixed colloid are saved; meanwhile, by adjusting the mounting positions of the first pressing plate 310 and the second pressing plate 320, the substrate 200 and the target 400 with different sizes can be adapted for clamping, so that the fixing device of the embodiment has better universality. The wire cutting machining fixing device is simple in structure, but saves a large amount of operation time and material cost in actual use of the applicant, and the wire cutting machining efficiency of the target is greatly improved.

The foregoing description is only exemplary embodiments of the present application and is not intended to limit the scope of the present application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application, or direct or indirect application in other related technical fields are included in the scope of the present application.

Claims (8)

1. The utility model provides a line cutting processing fixing device of non-conductive target, includes base plate and revolving stage, its characterized in that, be provided with on the revolving stage with the constant head tank of base plate looks adaptation, detachably installs at least one clamp plate on the revolving stage, the base plate is put into behind the constant head tank through the constant head tank with the cooperation of clamp plate realizes locking fixedly.

2. The fixture of claim 1, wherein the positioning groove comprises a first groove wall and a second groove wall which are matched with two adjacent side surfaces of the substrate, the pressing plate comprises a first pressing plate and a second pressing plate which are respectively matched with the two remaining side surfaces of the substrate, and the first pressing plate and the second pressing plate enable the substrate to be fixed in the positioning groove by pressing the two side surfaces of the substrate.

3. The fixture of claim 1, wherein the base plate comprises a first apex angle and a second apex angle opposite each other, the positioning groove comprises a groove wall matching the first apex angle, the press plate comprises a groove matching the second apex angle, and the base plate is clamped between the positioning groove and the groove of the press plate.

4. The fixture of claim 2, wherein the first and second platens are mounted to the turntable by bolts.

5. The fixture of claim 4, wherein the first and second pressing plates are provided with waist-shaped grooves along the length and width directions of the substrate, respectively, the bolts are mounted on the turntable through the waist-shaped grooves, and the mounting positions of the first and second pressing plates on the turntable are adjusted through the waist-shaped grooves.

6. The fixture of claim 2, wherein the depth of the detent recess matches the thickness of the substrate.

7. The fixture of claim 1, wherein the substrate is any one of a bakelite plate, an acrylic plate, a polypropylene plate, a polyethylene plate, and a polycarbonate plate.

8. The fixture of claim 1, wherein the target is adhesively attached to the substrate.

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