CN210367890U

CN210367890U - Magnetron sputtering plating metal electrode tool base and tool subassembly thereof

Info

Publication number: CN210367890U
Application number: CN201921187849.9U
Authority: CN
Inventors: 李辉; 陆旺; 宋嵩
Original assignee: Sichuan Timemaker Technology Co ltd
Current assignee: Sichuan Timemaker Technology Co ltd
Priority date: 2019-07-26
Filing date: 2019-07-26
Publication date: 2020-04-21
Anticipated expiration: 2029-07-26

Abstract

The utility model discloses a magnetron sputtering plating metal electrode tool base and tool subassembly thereof, the tool base includes supporting baseplate, is provided with the back shaft on supporting baseplate's upper surface, and the back shaft is second grade shoulder shaft, and its big footpath end is connected with supporting baseplate. The jig assembly comprises a jig base and a jig arranged above the base, the jig comprises a film coating base, a matching hole is formed in the film coating base, the small-diameter section of the supporting shaft is inserted into the matching hole, and the lower surface of the film coating base is in contact with the end surface, far away from the supporting bottom plate, of the large-diameter section of the supporting shaft; a plurality of coating grooves are arranged on the upper surface of the coating base. The utility model discloses its simple structure, material loading, unloading are convenient fast, and can carry out the coating of a plurality of wafers by the wholesale nature, improve production efficiency and improve time utilization, reduce the time of prepareeing material.

Description

Magnetron sputtering plating metal electrode tool base and tool subassembly thereof

Technical Field

The utility model relates to a wafer field, in particular to magnetron sputtering plating metal electrode tool base and tool subassembly thereof.

Background

The jig is a tool for carpenters, ironmen, pincers, machines, electric controls and other handicrafts, and is mainly used as a tool for assisting in controlling positions or actions or combining the positions and the actions. The jig can be divided into three types, namely a process assembly type jig, a project test type jig and a circuit board test type jig

In wafer production, it is necessary to plate the wafer surface with metal electrodes. The prior art can only plate a single wafer at a time, and has low efficiency. Therefore, it is necessary to redesign a jig for plating the metal electrodes on the plating equipment in batches and a base for fixing the jig on the plating equipment.

Disclosure of Invention

The utility model aims to provide a: the utility model provides a magnetron sputtering metallisation electrode tool base and tool subassembly thereof has solved how to install the tool of metallisation electrode on the coating equipment fast, and redesigned a new coating film tool to the coating film of wafer can be carried out in batches in the coating film technology, improves work efficiency, reduces time cost.

The utility model adopts the technical scheme as follows:

the utility model provides a magnetron sputtering metallisation electrode tool base, includes supporting baseplate be provided with a plurality of back shafts on supporting baseplate's the upper surface, the axis perpendicular to supporting baseplate's of back shaft axis, and the back shaft is the second grade ladder shaft, and its big footpath end is connected with supporting baseplate.

When in use, the supporting bottom plate is fixed on the coating equipment and is positioned below the coating jig; preferably, the support bottom plate is detachably clamped or fixed on the coating equipment in a threaded connection manner; then, a jig for coating the wafer is placed above the supporting base plate, and a through hole matched with the small-diameter section shaft of the supporting shaft is processed on the jig, so that the small-diameter section of the supporting shaft is inserted into the jig, and the jig is supported by the end face of the large-diameter section.

The utility model discloses in, through setting up simple structure's tool base, adopt the vertical stay location, can not only install fast, support the tool, still be convenient for take off the tool from the tool base fast, improved coating process's material loading, unloading efficiency. The utility model discloses a tool base simple structure makes things convenient for getting of tool to put.

A magnetron sputtering metal plating electrode jig assembly comprises a jig base and a jig arranged above the base, wherein the jig base is the jig base in any one of claims 1 to 4, the jig comprises a film coating base, a plurality of matching holes are formed in the film coating base, the layout structure of the matching holes is consistent with that of a supporting shaft, the aperture of each matching hole is consistent with that of a small-diameter section of the supporting shaft, the small-diameter section of the supporting shaft is inserted into the matching hole, and the lower surface of the film coating base is in contact with the end surface, far away from a supporting base plate, of a large-diameter section of the supporting shaft;

the upper surface of the coating base is provided with a plurality of coating grooves.

When a metal electrode is plated on the wafer, the supporting base plate is fixed on the film plating equipment, the wafer to be plated is sequentially placed into each film plating groove, then the film plating base is clamped above the supporting base plate through the matching of the supporting shaft and the matching hole, and then the subsequent film plating process is carried out.

The utility model discloses a tool satisfies multi-disc wafer coating film simultaneously for but the wafer sample mass ground is put and is carried out the coating film operation in the tool, and carries out bearing of wafer through the coating film base that independently comes out from coating film equipment, so that during production, can be at the in-process of coating film, with next batch with the wafer installation coating film base of coating film on, improve production efficiency and improve time utilization, reduce the time of prepareeing material.

Meanwhile, the jig can be quickly installed on the supporting base and can be quickly disassembled from the supporting base, so that the loading and unloading efficiency of the coating process is improved.

In conclusion, the magnetron sputtering metal plating electrode jig assembly is simple in structure, quick and convenient in feeding and discharging, capable of performing film plating on a plurality of wafers in batch, capable of improving production efficiency and time utilization rate and capable of reducing material preparation time.

The utility model can be matched with wafers with different shapes and sizes in actual use, so as to meet the coating of wafers with different specifications.

Due to the adoption of the technical scheme, the beneficial effects of the utility model are that:

1. the utility model relates to a magnetron sputtering plating metal electrode tool base and tool subassembly thereof through setting up simple structure's tool base, adopts the vertical stay location, can not only install fast, support the tool, still is convenient for take off the tool from the tool base fast, has improved coating process's material loading, unloading efficiency. The utility model has simple structure, which is convenient for taking and placing the jig;

2. the utility model relates to a magnetron sputtering metallization electrode tool base and tool subassembly thereof satisfies multi-disc wafer coating film simultaneously for but the wafer sample mass ground is put and is carried out the coating film operation in the tool, and carry out bearing of wafer through the coating film base that independently comes out from coating film equipment, so that when producing, can be at the in-process of coating film, on installing the coating film base with the wafer of coating film next batch, improve production efficiency and improve time utilization, reduce the time of getting ready.

Drawings

The invention will now be described, by way of example, with reference to the accompanying drawings, in which:

FIG. 1 is a schematic structural view of a jig base;

FIG. 2 is a top view of the fixture base;

fig. 3 is a front view of the jig base;

FIG. 4 is a top view of the jig assembly;

fig. 5 is a sectional view taken along a-a in fig. 4.

Reference numerals in the drawings indicate:

1-supporting bottom plate, 2-supporting shaft, 3-fixing shaft, 4-plane, 5-coating base, 6-matching hole and 7-coating groove.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

The present invention will be described in detail with reference to fig. 1 to 5.

Example 1

As shown in fig. 1-3, the utility model relates to a magnetron sputtering metallization electrode tool base, including supporting baseplate 1 be provided with a plurality of back shafts 2 on supporting baseplate 1's the upper surface, the axis perpendicular to supporting baseplate 1's of back shaft 2 axis, and back shaft 2 is the second grade ladder shaft, and its big footpath end is connected with supporting baseplate 1.

When in use, the supporting base plate 1 is fixed on the coating equipment and is positioned below the coating jig; preferably, the support base plate 1 is detachably clamped or fixed on the coating equipment in a threaded connection manner; then, a jig for coating the wafer is placed above the supporting base plate 1, and a through hole matched with the small-diameter section shaft of the supporting shaft 2 is processed on the jig, so that the small-diameter section of the supporting shaft 2 is inserted into the jig, and the jig is supported by the end face of the large-diameter section.

Example 2

This embodiment is an explanation of an implementation structure of the support base plate 1 in embodiment 1.

As shown in fig. 1-2, in the present invention, the supporting base plate 1 is a circular plate, and the fixing shaft 3 is disposed on both sides of the circular plate, the axes of the fixing shaft 3 are coaxial with each other and intersect with the perpendicular bisector of the supporting base plate 1, and one end of the fixing shaft 3 is connected with the side wall of the supporting base plate 1.

The support base plate 1 can also be made into a rectangular plate, a polygonal plate and the like, and the specific shape of the support base plate can be adaptively and optimally adjusted according to the shape and the size of the groove required to be arranged.

The supporting bottom plate 1 is clamped on the coating equipment through a fixed shaft 3. The fixing block is provided with a hole matched with the fixing shaft 3, the fixing block is driven by a linear driving mechanism, and the moving track of the fixing block is consistent with the axis of the fixing shaft 3. The clamping structure can also adopt other existing structures.

Furthermore, a plane 4 is milled at a position on the side wall of the support base plate 1, which is connected with the fixed shaft 3, and the fixed shaft 3 is fixed on the plane 4.

The flat surfaces 4 facilitate radial positioning of the support base 1. The parallel planes on the two sides of the supporting base plate 1 can better machine the distance between the planes 4 of the supporting base plate 1 with high precision, so that the supporting base plate 1 can be conveniently installed and positioned through the planes 4 machined with high precision.

Further, bevel chamfers are arranged between the upper surface and the side walls and between the lower surface and the side walls of the support base plate 1. The chamfer angle can eliminate stress concentration at the sharp corner part and improve the stress environment of the supporting base plate 1.

Example 3

A magnetron sputtering metal plating electrode jig assembly comprises a jig base and a jig arranged above the base, wherein the jig base is the jig base of any one of claims 1 to 4, the jig comprises a coating base 5, a plurality of matching holes 6 are formed in the coating base 5, the layout structure of the matching holes 6 is consistent with that of a supporting shaft 2, the aperture of each matching hole 6 is consistent with that of a small-diameter section of the supporting shaft 2, the small-diameter section of the supporting shaft 2 is inserted into the matching hole 6, and the lower surface of the coating base 5 is in contact with the end surface, far away from a supporting base plate 1, of a large-diameter section of the supporting shaft 2;

a plurality of coating grooves 7 are arranged on the upper surface of the coating base 5.

When plating metal electrodes on the wafer, the supporting base plate 1 is fixed on a plating device, the wafer to be plated is sequentially placed into each plating groove 7, then the plating base 5 is clamped above the supporting base plate 1 through the matching of the supporting shaft and the matching hole, and then the subsequent plating process is carried out.

Example 4

This embodiment is based on embodiment 3, and the description is made on the arrangement of the plating groove 7.

As shown in fig. 4, in the present invention, there are five coating grooves 7, one of which is located at the perpendicular bisector of the upper surface of the coating base 5 and is symmetrically distributed with four grooves along the center of the perpendicular bisector.

Further, the coating groove 7 is a rectangular groove.

Example 5

The present embodiment is an explanation of a layout structure of support columns.

As shown in fig. 1-2 and 4, in the present invention, there are four support shafts 2, which are symmetrically distributed along the center of the perpendicular bisector on the upper surface of the coating base 5, and the support shafts 2 and the four coating grooves 7 symmetrically distributed along the center of the perpendicular bisector are sequentially distributed in a staggered manner.

The above description is only for the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can be covered within the protection scope of the present invention without the changes or substitutions conceived by the inventive work within the technical scope disclosed by the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. The utility model provides a magnetron sputtering metal coating electrode tool base which characterized in that: including supporting baseplate (1) be provided with a plurality of back shafts (2) on supporting baseplate (1)'s the upper surface, the axis perpendicular to supporting baseplate (1)'s of back shaft (2) axis, and back shaft (2) are the second grade shoulder shaft, and its major diameter end is connected with supporting baseplate (1).

2. The magnetron sputtering metal plating electrode jig base of claim 1, characterized in that: supporting baseplate (1) is the circular slab, all is provided with fixed axle (3) in its both sides, the axis of fixed axle (3) coaxial line each other and with supporting baseplate (1) the perpendicular bisector just crossing, the one end of fixed axle (3) is connected with supporting baseplate (1)'s lateral wall.

3. The magnetron sputtering metal plating electrode jig base of claim 2, characterized in that: a plane (4) is milled at the position, connected with the fixed shaft (3), on the side wall of the supporting base plate (1), and the fixed shaft (3) is fixed on the plane (4).

4. The magnetron sputtering metal plating electrode jig base of claim 1, characterized in that: bevel chamfers are arranged between the upper surface and the side wall of the supporting bottom plate (1) and between the lower surface and the side wall.

5. The magnetron sputtering metal plating electrode tool assembly based on any one of claims 1 to 4, characterized in that: the jig comprises a jig base and a jig arranged above the jig base, wherein the jig base is the jig base of any one of claims 1 to 4, the jig comprises a coating base (5), a plurality of matching holes (6) are formed in the coating base (5), the layout structure of the matching holes (6) is consistent with that of a supporting shaft (2), the aperture of each matching hole (6) is consistent with that of a small-diameter section of the supporting shaft (2), the small-diameter section of the supporting shaft (2) is inserted into the matching holes (6), and the lower surface of the coating base (5) is in contact with the end surface, far away from a supporting base plate (1), of the large-diameter section of the supporting shaft (2);

a plurality of coating grooves (7) are arranged on the upper surface of the coating base (5).

6. The magnetron sputtering metal plating electrode tool assembly according to claim 5, characterized in that: five coating grooves (7) are arranged, one of the five coating grooves is positioned at the perpendicular bisector of the upper surface of the coating base (5), and the four coating grooves are symmetrically distributed along the center of the perpendicular bisector.

7. The magnetron sputtering metal plating electrode tool assembly according to claim 6, characterized in that: the number of the support shafts (2) is four, the support shafts are distributed along the center symmetry of the perpendicular bisector of the upper surface of the film coating base (5), and the support shafts (2) and the four film coating grooves (7) distributed along the center symmetry of the perpendicular bisector are distributed in a staggered mode in sequence.

8. The magnetron sputtering metal plating electrode tool assembly according to claim 5, characterized in that: the coating groove (7) is a rectangular groove.