CN210362521U - Excess material continuous-connection device of fused deposition rapid forming machine - Google Patents
Excess material continuous-connection device of fused deposition rapid forming machine Download PDFInfo
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- CN210362521U CN210362521U CN201921247870.3U CN201921247870U CN210362521U CN 210362521 U CN210362521 U CN 210362521U CN 201921247870 U CN201921247870 U CN 201921247870U CN 210362521 U CN210362521 U CN 210362521U
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Abstract
A remainder splicing device of a fused deposition rapid prototyping machine comprises an upper base, a lower base, a blowing device, a heat dissipation plate and a semiconductor refrigeration plate; the upper base is connected with the lower base through a fastening assembly, and clamping plates are arranged in first grooves formed in the upper base side by side; the clamping plate is provided with a clamping groove; the lower base is provided with a first mounting groove and a second groove; the bottom surface of the second groove is provided with a first placing groove for placing the heat conducting plate; the bottom surface of the first placing groove is provided with a first through hole used for communicating the first mounting groove; the first placing groove, the clamping plate and the inner wall of the first groove form a working bin; an electric heating pipe and a temperature sensor are arranged in the working bin; the cold ends of the semiconductor refrigeration pieces are respectively positioned in the first through holes, the cold ends of the semiconductor refrigeration pieces are respectively pressed against the heat conducting plates, and the hot ends of the semiconductor refrigeration pieces are respectively arranged on the heat radiating plates; the radiating plate is provided with radiating fins; the blowing devices are respectively arranged in the first mounting grooves. The utility model discloses can continue to connect two disk silk materials fast.
Description
Technical Field
The utility model relates to an additive manufacturing and fused deposition rapid prototyping technical field especially relate to a device is continuously connect to clout of fused deposition rapid prototyping machine.
Background
Fused deposition modeling is a method of heating and fusing various hot-melt filamentous materials (wax, ABS, nylon, and the like), and is one of 3D printing techniques. The rapid prototyping technology is a general technical name for rapidly generating a model and a solid part by using three-dimensional modeling software. The method is a novel part manufacturing mode, and the processed parts are produced by means of layer-by-layer stacking and additive manufacturing. Compared with the traditional methods such as casting and machining, the 3D printing method is more easily suitable for the change of product design, and the product development period is shortened.
The wire materials used by the existing fused deposition rapid forming machine are all disc-shaped wire materials; when the remaining disc-shaped silk materials are not enough to meet the printing task of the next product after a certain disc-shaped silk material is used for 3D printing for a plurality of times, the disc-shaped silk materials need to be replaced in time; the replaced disc-shaped silk material as the excess material can not be used continuously, so that great material waste is caused; therefore, the application provides a residual material splicing device of a fused deposition rapid forming machine, and the residual disk-shaped wire materials and the wire materials with the same type are rapidly spliced through the device so as to be continuously used.
SUMMERY OF THE UTILITY MODEL
Objects of the invention
For the technical problem who exists among the solution background art, the utility model provides a clout of fused deposition rapid prototyping machine continues to connect the device, the utility model provides a clout is continuously connected the device and can be carried out two disk silk materials fast and continue to connect, and easy operation convenient to use.
(II) technical scheme
The utility model provides a remainder splicing device of a fused deposition rapid forming machine, which comprises an upper base, a lower base, a fastening component, a radiating fin, a blowing device, a radiating plate, a semiconductor refrigerating piece, a heat conducting plate, a clamping plate, an electric heating pipe and a temperature sensor;
one end of the upper base is rotatably connected with the lower base, the other end of the upper base is connected with the lower base through a fastening assembly, and a first groove is formed in the end face, facing the lower base, of the upper base; clamping plates are arranged in the first groove side by side; the shape of the clamping plate is respectively matched with that of the first groove, and the end faces, far away from the upper base, of the clamping plate are respectively provided with a clamping groove for the disc-shaped silk material to pass through;
the end surface of the lower base, which is far away from the upper base, is provided with a first mounting groove, and the end surface of the lower base, which faces the upper base, is provided with a second groove; the bottom surface of the second groove is provided with a first placing groove for placing the heat conducting plate; the bottom surface of the first placing groove is provided with a first through hole used for communicating the first mounting groove; the end faces, facing the upper base, of the lower base are tightly pressed on the upper base respectively, the first groove and the second groove form a cylindrical channel for placing the disc-shaped wire materials, and the inner walls of the first placing groove, the clamping plate and the first groove form a working bin; an electric heating pipe and a temperature sensor are arranged in the working bin;
the cold ends of the semiconductor refrigeration pieces are respectively positioned in the first through holes, the cold ends of the semiconductor refrigeration pieces are respectively pressed against the heat conducting plates, and the hot ends of the semiconductor refrigeration pieces are respectively arranged on the heat radiating plates; the heat dissipation plates are arranged in the first mounting grooves through the fastening pieces respectively, and heat dissipation fins are uniformly arranged at one ends of the heat dissipation plates, which are far away from the semiconductor refrigeration pieces; the blowing devices are respectively arranged in the first mounting grooves.
Preferably, the arc length corresponding to the second groove is not greater than the arc length corresponding to the first groove.
Preferably, the lower end surface of the lower base is provided with supporting legs.
Preferably, the supporting legs are made of rubber materials.
Preferably, a heat-conducting silica gel layer is arranged on the end face of the heat-conducting plate, which is in contact with the cold end of the semiconductor refrigerating sheet.
Preferably, the fastening assembly comprises a clamping block, a T-shaped rod, a U-shaped plate and a spring;
the clamping blocks are respectively arranged on the upper base, and second through holes are respectively formed in the clamping blocks;
the U-shaped plates are respectively arranged on the lower base, second mounting grooves are respectively formed in the U-shaped plates, and second placing grooves are respectively formed in the U-shaped plates; the second placing groove is provided with third through holes on two sides of the U-shaped plate respectively, and the second placing groove, the third through holes and the second mounting groove are communicated;
the clamping blocks are respectively positioned in the second placing grooves, and the T-shaped rods respectively extend into the second placing grooves from the second mounting grooves and respectively penetrate through the second through holes; the springs are respectively sleeved on the outer sides of the T-shaped rods, one ends of the springs are respectively connected with the bottom surfaces of the second mounting grooves, and the other ends of the springs are respectively connected with the T-shaped rods.
Preferably, the end faces of the upper base and the lower base which are tightly pressed are respectively provided with a rubber pad.
Preferably, the device further comprises a controller and a display screen; the display screen is arranged on the upper base; the controller is arranged on the lower base and is respectively connected with the blowing device, the display screen, the temperature sensor and the electric heating pipe.
The above technical scheme of the utility model has following profitable technological effect:
in the utility model, the break points of the two disk-shaped silk materials are respectively stacked on the heat conducting plate when in use, and the two disk-shaped silk materials are respectively placed in the cylindrical channel; the upper base is pressed against the lower base, and the upper base and the lower base are tightly fixed through a fastening assembly; the electric heating pipe is electrified to operate to heat the working bin so as to complete the welding of the break points of the two disc-shaped wire materials; after welding is finished, the semiconductor refrigerating sheet is electrified to operate to cool the heat conducting plate until the wire materials welded on the heat conducting plate are cooled to room temperature, and the hot end of the semiconductor refrigerating sheet transmits high temperature to the heat dissipation plate and the heat dissipation sheet; the blowing device is electrified to blow air to the heat dissipation plate and the heat dissipation fins to accelerate heat dissipation; the temperature sensor is arranged for detecting the temperature in the working bin; the temperature value can be directly checked on the display screen; after cooling is completed, the upper base is opened to take out the welded wire material, and the operation is simple and the use is convenient.
Drawings
Fig. 1 is a schematic structural view of a remainder splicing device of a fused deposition rapid prototyping machine according to the present invention.
Fig. 2 is a schematic structural view of a local enlargement at a position a in a remainder feeding device of a fused deposition rapid prototyping machine according to the present invention.
Fig. 3 is a schematic structural view of a local enlargement at the position B in the remainder feeding device of the fused deposition rapid prototyping machine according to the present invention.
Fig. 4 is a left side view of the remainder connecting device of the fused deposition rapid prototyping machine according to the present invention.
Fig. 5 is a top view of the upper base of the remainder splicing device of the fused deposition rapid prototyping machine according to the present invention.
Fig. 6 is a top view of the lower base of the remainder splicing device of the rapid fused deposition modeling machine according to the present invention.
Reference numerals: 1. an upper base; 2. a first groove; 3. a second groove; 4. a lower base; 5. supporting legs; 6. a first mounting groove; 7. a heat sink; 8. a tightening piece; 9. a blowing device; 10. a controller; 11. a heat dissipation plate; 12. a semiconductor refrigeration sheet; 13. a heat conducting plate; 14. a heat conductive silica gel layer; 15. a clamping plate; 16. an electric heating tube; 17. a temperature sensor; 18. a display screen; 19. a clamping groove; 20. a clamping block; 21. a T-shaped rod; 22. a U-shaped plate; 23. a spring; 24. a second placing groove; 25. a second mounting groove; 26. a second through hole; 27. a first through hole; 28. a first placing groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-6, the excess material splicing device of the fused deposition rapid prototyping machine provided by the utility model comprises an upper base 1, a lower base 4, a fastening component, a heat sink 7, a blowing device 9, a heat sink 11, a semiconductor refrigeration piece 12, a heat conducting plate 13, a clamping plate 15, an electric heating tube 16 and a temperature sensor 17;
one end of the upper base 1 is rotatably connected with the lower base 4, the other end of the upper base 1 is connected with the lower base 4 through a fastening assembly, and a first groove 2 is formed in the end face, facing the lower base 4, of the upper base 1; further, the bottom surface of the first groove 2 is a curved surface;
clamping plates 15 are arranged in the first groove 2 side by side; the shape of the clamping plate 15 is respectively matched with that of the first groove 2, the end surfaces, far away from the upper base 1, of the clamping plate 15 are respectively provided with a clamping groove 19 for disk-shaped silk materials to pass through, and the clamping plate 15 is in a fan-ring shape; the bottom surface of the clamping groove 19 is a curved surface;
a first mounting groove 6 is arranged on the end surface of the lower base 4 far away from the upper base 1, and a second groove 3 is arranged on the end surface of the lower base 4 facing the upper base 1; further, the bottom surface of the second groove 3 is a curved surface;
the bottom surface of the second groove 3 is provided with a first placing groove 28 for placing the heat conducting plate 13; the bottom surface of the first placing groove 28 is provided with a first through hole 27 for communicating with the first mounting groove 6;
the end surfaces of the lower base 4 facing the upper base 1 respectively press the upper base 1, the first groove 2 and the second groove 3 form a cylindrical channel for placing the disc-shaped silk material, and the inner walls of the first placing groove 28, the clamping plate 15 and the first groove 2 form a working bin; an electric heating pipe 16 and a temperature sensor 17 are arranged in the working bin;
the cold ends of the semiconductor refrigeration pieces 12 are respectively positioned in the first through holes 27, the cold ends of the semiconductor refrigeration pieces 12 are respectively pressed against the heat conducting plates 13, and the hot ends of the semiconductor refrigeration pieces 12 are respectively arranged on the heat radiating plates 11;
the heat dissipation plates 11 are respectively arranged in the first mounting grooves 6 through the fastening pieces 8, mounting holes are formed in the heat dissipation plates 11, and the fastening pieces are respectively screwed into the mounting holes and threaded blind holes formed in the inner walls of the first mounting grooves 6; the end of the heat dissipation plate 11 far away from the semiconductor refrigeration plate 12 is uniformly provided with heat dissipation fins 7; the air blowing devices 9 are respectively arranged in the first mounting grooves 6, and the air blowing devices 9 are selected from air blowers.
In an alternative embodiment, a controller 10 and a display screen 18 are also included; the display screen 18 is arranged on the upper base 1; the controller 10 is arranged on the lower base 4, and the controller 10 is respectively connected with the blowing device 9, the display screen 18, the temperature sensor 17 and the electric heating pipe 16.
In the utility model, the break points of the two disk-shaped silk materials are respectively stacked on the heat conducting plate 13 when in use, and the two disk-shaped silk materials are respectively placed in the cylindrical channel; the upper base 1 is pressed against the lower base 4, and the upper base 1 and the lower base 4 are fastened through a fastening component; the electric heating pipe 16 is electrified to operate to heat the working bin so as to complete the welding of the break points of the two disc-shaped wires; the temperature sensor 17 detects the temperature in the working chamber; the temperature value can be directly viewed on the display screen 18; after welding, the semiconductor refrigeration piece 12 is electrified to operate to cool the heat conduction plate 13 until the wire materials welded on the heat conduction plate 13 are cooled to room temperature, and the hot end of the semiconductor refrigeration piece 12 transmits high temperature to the heat dissipation plate 11 and the heat dissipation sheet 7; the blowing device 9 is electrified to operate to blow air to the heat dissipation plate 11 and the heat dissipation fins 7 to accelerate heat dissipation; after cooling, open the upper base 1 and take out the silk material that the welding was accomplished, easy operation convenient to use.
In an alternative embodiment, the second groove 3 corresponds to an arc length no greater than the arc length corresponding to the first groove 2.
In an alternative embodiment, the lower end surface of the lower base 4 is provided with a supporting foot 5; the supporting legs 5 are made of rubber materials; the lower base 4 is supported by supporting legs 5 made of rubber material to improve the stability of the device.
In an optional embodiment, a heat-conducting silica gel layer 14 is arranged on the end face of the heat-conducting plate 13, which is in contact with the cold end of the semiconductor refrigeration sheet 12; the heat-conducting silica gel layer 14 is arranged to improve the heat-radiating efficiency of the heat-conducting plate 13.
In an alternative embodiment the tightening assembly comprises a clamping block 20, a T-bar 21, a u-shaped plate 22 and a spring 23;
the clamping blocks 20 are respectively arranged on the upper base 1, and the clamping blocks 20 are respectively provided with second through holes 26;
the clamping blocks 20 are respectively positioned in the second placing grooves 24, the T-shaped rods 21 respectively extend into the second placing grooves 24 from the second mounting grooves 25 and respectively pass through the second through holes 26; the springs 23 are respectively sleeved on the outer sides of the T-shaped rods 21, one ends of the springs 23 are respectively connected with the bottom surfaces of the second mounting grooves 25, and the other ends of the springs 23 are respectively connected with the T-shaped rods 21;
when in use, the upper base 1 is covered on the lower base 4, and the clamping blocks 20 are respectively inserted into the second placing grooves 24; the T-shaped rods 21 are respectively arranged in the second through holes 26 in a matching mode, and the springs 23 are arranged to prevent the T-shaped rods 21 from being separated from the second through holes 26.
In an alternative embodiment, rubber pads are respectively arranged on the pressing end surfaces of the upper base 1 and the lower base 4; the arranged rubber pads improve the sealing performance of the end faces of the upper base 1 and the lower base 4.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (8)
1. The excess material continuous connection device of the fused deposition rapid forming machine is characterized by comprising an upper base (1), a lower base (4), a fastening assembly, a radiating fin (7), a blowing device (9), a radiating plate (11), a semiconductor refrigerating sheet (12), a heat conducting plate (13), a clamping plate (15), an electric heating pipe (16) and a temperature sensor (17);
one end of the upper base (1) is rotatably connected with the lower base (4), the other end of the upper base (1) is connected with the lower base (4) through a fastening assembly, and a first groove (2) is formed in the end face, facing the lower base (4), of the upper base (1); clamping plates (15) are arranged in the first groove (2) side by side; the shape of the clamping plate (15) is respectively matched with that of the first groove (2), and the end surfaces, far away from the upper base (1), of the clamping plate (15) are respectively provided with a clamping groove (19) for the disk-shaped silk material to pass through;
a first mounting groove (6) is formed in the end face, far away from the upper base (1), of the lower base (4), and a second groove (3) is formed in the end face, facing the upper base (1), of the lower base (4); a first placing groove (28) for placing the heat conducting plate (13) is formed in the bottom surface of the second groove (3); the bottom surface of the first placing groove (28) is provided with a first through hole (27) used for communicating the first mounting groove (6); the end faces, facing the upper base (1), of the lower base (4) respectively press the upper base (1), the first groove (2) and the second groove (3) form a cylindrical channel for placing the disc-shaped silk materials, and the inner walls of the first placing groove (28), the clamping plate (15) and the first groove (2) form a working bin; an electric heating pipe (16) and a temperature sensor (17) are arranged in the working bin;
the cold ends of the semiconductor refrigeration pieces (12) are respectively positioned in the first through holes (27), the cold ends of the semiconductor refrigeration pieces (12) are respectively pressed against the heat conducting plates (13), and the hot ends of the semiconductor refrigeration pieces (12) are respectively arranged on the heat radiating plates (11); the heat dissipation plates (11) are respectively arranged in the first mounting grooves (6) through the fastening pieces (8), and heat dissipation fins (7) are uniformly arranged at one ends of the heat dissipation plates (11) far away from the semiconductor refrigeration sheets (12); the blowing devices (9) are respectively arranged in the first mounting grooves (6).
2. The excess material splicing device of a fused deposition rapid prototyping machine as set forth in claim 1, wherein the arc length corresponding to the second groove (3) is not greater than the arc length corresponding to the first groove (2).
3. The excess material splicing device of a fused deposition rapid prototyping machine as set forth in claim 1, characterized in that the lower end surface of the lower base (4) is provided with a supporting foot (5).
4. The residual material splicing device of a fused deposition rapid prototyping machine as set forth in claim 3, wherein the supporting legs (5) are made of rubber.
5. The excess material continuous joint device of the fused deposition rapid prototyping machine of claim 1, characterized in that the heat conducting silica gel layer (14) is arranged on the end surface of the heat conducting plate (13) contacting with the cold end of the semiconductor refrigeration piece (12).
6. The residual joining device of a fused deposition rapid prototyping machine as claimed in claim 1, characterized in that the fastening element comprises a holding block (20), a T-shaped rod (21), a u-shaped plate (22) and a spring (23);
the clamping blocks (20) are respectively arranged on the upper base (1), and the clamping blocks (20) are respectively provided with second through holes (26);
u-shaped plates (22) are respectively arranged on the lower base (4), second mounting grooves (25) are respectively arranged on the U-shaped plates (22), and second placing grooves (24) are respectively arranged on the U-shaped plates (22); the second placing groove (24) is provided with third through holes on two sides of the U-shaped plate (22), and the second placing groove (24), the third through holes and the second mounting groove (25) are communicated;
the clamping blocks (20) are respectively positioned in the second placing grooves (24), and the T-shaped rods (21) respectively extend into the second placing grooves (24) from the second mounting grooves (25) and respectively penetrate through the second through holes (26); the springs (23) are respectively sleeved on the outer sides of the T-shaped rods (21), one ends of the springs (23) are respectively connected with the bottom surfaces of the second mounting grooves (25), and the other ends of the springs (23) are respectively connected with the T-shaped rods (21).
7. The residual material splicing device of a fused deposition rapid prototyping machine as claimed in claim 1, wherein the pressing end surfaces of the upper base (1) and the lower base (4) are respectively provided with a rubber pad.
8. The residual material splicing device of a fused deposition rapid prototyping machine as set forth in claim 1, further comprising a controller (10) and a display screen (18); the display screen (18) is arranged on the upper base (1); the controller (10) is arranged on the lower base (4), and the controller (10) is respectively connected with the blowing device (9), the display screen (18), the temperature sensor (17) and the electric heating pipe (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921247870.3U CN210362521U (en) | 2019-08-02 | 2019-08-02 | Excess material continuous-connection device of fused deposition rapid forming machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921247870.3U CN210362521U (en) | 2019-08-02 | 2019-08-02 | Excess material continuous-connection device of fused deposition rapid forming machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210362521U true CN210362521U (en) | 2020-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921247870.3U Expired - Fee Related CN210362521U (en) | 2019-08-02 | 2019-08-02 | Excess material continuous-connection device of fused deposition rapid forming machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210362521U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113001963A (en) * | 2021-04-15 | 2021-06-22 | 威海杰凯智能科技有限公司 | Convenient 3D printing equipment |
-
2019
- 2019-08-02 CN CN201921247870.3U patent/CN210362521U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113001963A (en) * | 2021-04-15 | 2021-06-22 | 威海杰凯智能科技有限公司 | Convenient 3D printing equipment |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200421 Termination date: 20210802 |
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| CF01 | Termination of patent right due to non-payment of annual fee |